KR20080080540A - InP 기판 상의 Ⅱ-Ⅵ/Ⅲ-Ⅴ족 층상 구성 - Google Patents
InP 기판 상의 Ⅱ-Ⅵ/Ⅲ-Ⅴ족 층상 구성 Download PDFInfo
- Publication number
- KR20080080540A KR20080080540A KR1020087014312A KR20087014312A KR20080080540A KR 20080080540 A KR20080080540 A KR 20080080540A KR 1020087014312 A KR1020087014312 A KR 1020087014312A KR 20087014312 A KR20087014312 A KR 20087014312A KR 20080080540 A KR20080080540 A KR 20080080540A
- Authority
- KR
- South Korea
- Prior art keywords
- group
- layer
- materials
- iii
- group iii
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 50
- 239000000463 material Substances 0.000 claims abstract description 135
- 238000002310 reflectometry Methods 0.000 claims abstract description 19
- 239000000203 mixture Substances 0.000 claims description 9
- 229910052698 phosphorus Inorganic materials 0.000 claims description 4
- 238000010276 construction Methods 0.000 claims 4
- 239000011574 phosphorus Substances 0.000 claims 2
- 229910045601 alloy Inorganic materials 0.000 abstract description 72
- 239000000956 alloy Substances 0.000 abstract description 72
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 21
- 229910017115 AlSb Inorganic materials 0.000 description 19
- 229910005542 GaSb Inorganic materials 0.000 description 19
- 229910000673 Indium arsenide Inorganic materials 0.000 description 19
- WPYVAWXEWQSOGY-UHFFFAOYSA-N indium antimonide Chemical compound [Sb]#[In] WPYVAWXEWQSOGY-UHFFFAOYSA-N 0.000 description 19
- RPQDHPTXJYYUPQ-UHFFFAOYSA-N indium arsenide Chemical compound [In]#[As] RPQDHPTXJYYUPQ-UHFFFAOYSA-N 0.000 description 19
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 description 17
- 229910015894 BeTe Inorganic materials 0.000 description 16
- 229910004613 CdTe Inorganic materials 0.000 description 16
- 229910017680 MgTe Inorganic materials 0.000 description 16
- 229910007709 ZnTe Inorganic materials 0.000 description 16
- UHYPYGJEEGLRJD-UHFFFAOYSA-N cadmium(2+);selenium(2-) Chemical compound [Se-2].[Cd+2] UHYPYGJEEGLRJD-UHFFFAOYSA-N 0.000 description 16
- 229910052980 cadmium sulfide Inorganic materials 0.000 description 15
- 229910052950 sphalerite Inorganic materials 0.000 description 15
- 229910052984 zinc sulfide Inorganic materials 0.000 description 15
- 238000001451 molecular beam epitaxy Methods 0.000 description 9
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 6
- 238000002128 reflection high energy electron diffraction Methods 0.000 description 5
- 239000000460 chlorine Substances 0.000 description 4
- 229910052738 indium Inorganic materials 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 229910052790 beryllium Inorganic materials 0.000 description 3
- 239000000969 carrier Substances 0.000 description 3
- 239000002019 doping agent Substances 0.000 description 3
- 229910052711 selenium Inorganic materials 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000002441 X-ray diffraction Methods 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 229910052793 cadmium Inorganic materials 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 238000005253 cladding Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000001747 exhibiting effect Effects 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000001000 micrograph Methods 0.000 description 2
- 238000004211 migration-enhanced epitaxy Methods 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 230000005693 optoelectronics Effects 0.000 description 2
- 238000001878 scanning electron micrograph Methods 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 229910052714 tellurium Inorganic materials 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 1
- 229910001634 calcium fluoride Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000002178 crystalline material Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000003795 desorption Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000013213 extrapolation Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 238000004943 liquid phase epitaxy Methods 0.000 description 1
- 229910001635 magnesium fluoride Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- PUZPDOWCWNUUKD-UHFFFAOYSA-M sodium fluoride Inorganic materials [F-].[Na+] PUZPDOWCWNUUKD-UHFFFAOYSA-M 0.000 description 1
- 238000000603 solid-source molecular beam epitaxy Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000000411 transmission spectrum Methods 0.000 description 1
- 238000000927 vapour-phase epitaxy Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F30/00—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors
- H10F30/20—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors
- H10F30/21—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation
- H10F30/22—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes
- H10F30/221—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes the potential barrier being a PN homojunction
- H10F30/2212—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes the potential barrier being a PN homojunction the devices comprising active layers made of only Group II-VI materials, e.g. HgCdTe infrared photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F30/00—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors
- H10F30/20—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors
- H10F30/21—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation
- H10F30/22—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes
- H10F30/221—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes the potential barrier being a PN homojunction
- H10F30/2215—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes the potential barrier being a PN homojunction the devices comprising active layers made of only Group III-V materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/12—Active materials
- H10F77/123—Active materials comprising only Group II-VI materials, e.g. CdS, ZnS or HgCdTe
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/12—Active materials
- H10F77/124—Active materials comprising only Group III-V materials, e.g. GaAs
- H10F77/1248—Active materials comprising only Group III-V materials, e.g. GaAs having three or more elements, e.g. GaAlAs, InGaAs or InGaAsP
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/814—Bodies having reflecting means, e.g. semiconductor Bragg reflectors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/544—Solar cells from Group III-V materials
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
- Luminescent Compositions (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/275,237 | 2005-12-20 | ||
| US11/275,237 US7119377B2 (en) | 2004-06-18 | 2005-12-20 | II-VI/III-V layered construction on InP substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20080080540A true KR20080080540A (ko) | 2008-09-04 |
Family
ID=38188997
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020087014312A Ceased KR20080080540A (ko) | 2005-12-20 | 2006-10-31 | InP 기판 상의 Ⅱ-Ⅵ/Ⅲ-Ⅴ족 층상 구성 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7119377B2 (enExample) |
| EP (1) | EP1963094A4 (enExample) |
| JP (1) | JP2009520377A (enExample) |
| KR (1) | KR20080080540A (enExample) |
| CN (1) | CN101341022B (enExample) |
| TW (1) | TW200725933A (enExample) |
| WO (1) | WO2007073449A1 (enExample) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7244630B2 (en) * | 2005-04-05 | 2007-07-17 | Philips Lumileds Lighting Company, Llc | A1InGaP LED having reduced temperature dependence |
| TWI298555B (en) * | 2006-06-05 | 2008-07-01 | Epistar Corp | Light emitting device |
| US20080067370A1 (en) * | 2006-07-01 | 2008-03-20 | Mccaffrey John Patrick | Electron microscope and scanning probe microscope calibration device |
| EP2122695A4 (en) * | 2007-03-08 | 2013-09-11 | 3M Innovative Properties Co | NETWORK OF LUMINESCENT ELEMENTS |
| US8525021B2 (en) * | 2007-09-25 | 2013-09-03 | First Solar, Inc. | Photovoltaic devices including heterojunctions |
| WO2009148717A2 (en) * | 2008-06-05 | 2009-12-10 | 3M Innovative Properties Company | Light emitting diode with bonded semiconductor wavelength converter |
| WO2010027581A1 (en) | 2008-09-04 | 2010-03-11 | 3M Innovative Properties Company | Monochromatic light source |
| WO2010027648A1 (en) * | 2008-09-04 | 2010-03-11 | 3M Innovative Properties Company | I i-vi mqw vcsel on a heat sink optically pumped by a gan ld |
| CN102804411A (zh) * | 2009-05-05 | 2012-11-28 | 3M创新有限公司 | 利用铟耗尽机理在含铟衬底上生长的半导体器件 |
| JP2012526394A (ja) | 2009-05-05 | 2012-10-25 | スリーエム イノベイティブ プロパティズ カンパニー | Ledとともに使用するための再発光半導体キャリア素子及び製造方法 |
| CN102473817A (zh) | 2009-06-30 | 2012-05-23 | 3M创新有限公司 | 无镉再发光半导体构造 |
| CN102474932B (zh) | 2009-06-30 | 2015-12-16 | 3M创新有限公司 | 具有可调节色温的白光电致发光器件 |
| US8304976B2 (en) | 2009-06-30 | 2012-11-06 | 3M Innovative Properties Company | Electroluminescent devices with color adjustment based on current crowding |
| SE534345C2 (sv) * | 2009-09-24 | 2011-07-19 | Svedice Ab | Fotodiod av typen lavinfotodiod. |
| WO2011153141A2 (en) * | 2010-06-03 | 2011-12-08 | 3M Innovative Properties Company | Light converting and emitting device with suppressed dark-line defects |
| CN103597614B (zh) * | 2011-06-15 | 2017-03-01 | 3M创新有限公司 | 具有改善的转换效率的太阳能电池 |
| CN102280548A (zh) * | 2011-09-05 | 2011-12-14 | 厦门乾照光电股份有限公司 | 发光二极管结构及其制造方法 |
| US8895337B1 (en) * | 2012-01-19 | 2014-11-25 | Sandia Corporation | Method of fabricating vertically aligned group III-V nanowires |
| GB2504977B (en) | 2012-08-16 | 2017-10-04 | Airbus Defence & Space Gmbh | Laser power converter |
| US20180151301A1 (en) * | 2016-11-25 | 2018-05-31 | The Boeing Company | Epitaxial perovskite materials for optoelectronics |
| BR102017000116A2 (pt) * | 2017-01-03 | 2018-07-24 | Carolina Dias Machado Paula | tri diodo para laserterapia e equipamento baseado em tri diodo para emprego em laserterapia |
| CN107230734A (zh) * | 2017-05-23 | 2017-10-03 | 中国人民解放军63791部队 | 一种背对背肖特基结构的BeMgZnO基紫外探测器及其制备方法 |
| RU178900U1 (ru) * | 2017-12-15 | 2018-04-23 | Федеральное государственное бюджетное учреждение науки Научно-технологический центр микроэлектроники и субмикронных гетероструктур Российской академии наук (НТЦ микроэлектроники РАН) | Полупроводниковая гетероструктура для фотопреобразователей |
| US11585970B2 (en) * | 2019-10-04 | 2023-02-21 | Teledyne Scientific & Imaging, Llc | Low loss single crystal multilayer optical component and method of making same |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3202985B2 (ja) * | 1989-09-04 | 2001-08-27 | 日本オプネクスト株式会社 | 半導体レーザ装置 |
| US5206871A (en) | 1991-12-27 | 1993-04-27 | At&T Bell Laboratories | Optical devices with electron-beam evaporated multilayer mirror |
| JPH05343796A (ja) * | 1992-06-08 | 1993-12-24 | Nec Corp | 面出射形半導体レーザ |
| FR2699337B1 (fr) | 1992-12-15 | 1995-06-09 | Deveaud Pledran Benoit | Laser a cavite verticale de faible resistivite. |
| JPH07249835A (ja) | 1994-03-11 | 1995-09-26 | Hitachi Ltd | 半導体光素子 |
| JP3333330B2 (ja) * | 1994-09-30 | 2002-10-15 | 株式会社東芝 | 半導体発光素子及びその製造方法 |
| US5956362A (en) | 1996-02-27 | 1999-09-21 | Matsushita Electric Industrial Co., Ltd. | Semiconductor light emitting device and method of etching |
| US5732103A (en) | 1996-12-09 | 1998-03-24 | Motorola, Inc. | Long wavelength VCSEL |
| KR100237188B1 (ko) * | 1997-02-10 | 2000-02-01 | 정선종 | 튜너블 레이저 제조 방법 |
| JPH11145555A (ja) * | 1997-11-12 | 1999-05-28 | Oki Electric Ind Co Ltd | 面発光レーザ用ミラー構造およびその形成方法 |
| JP3334598B2 (ja) * | 1998-03-25 | 2002-10-15 | 日本電気株式会社 | InP基板上II−VI族化合物半導体薄膜 |
| JP2938445B1 (ja) | 1998-09-07 | 1999-08-23 | 株式会社日立製作所 | 量子井戸光変調器とそれを用いた光通信用モジュールおよび光通信システム |
| JP2001085790A (ja) * | 1999-09-16 | 2001-03-30 | Toshiba Corp | 発光増幅素子 |
| US20020158265A1 (en) | 2001-04-26 | 2002-10-31 | Motorola, Inc. | Structure and method for fabricating high contrast reflective mirrors |
| US6873638B2 (en) * | 2001-06-29 | 2005-03-29 | 3M Innovative Properties Company | Laser diode chip with waveguide |
| JP2003124508A (ja) | 2001-10-15 | 2003-04-25 | Sharp Corp | 発光ダイオード、デバイス、該デバイスを用いた表示または通信用光源装置 |
| WO2003067724A1 (en) * | 2002-02-08 | 2003-08-14 | Matsushita Electric Industrial Co., Ltd. | Semiconductor light-emitting device and its manufacturing method |
| US6801558B2 (en) * | 2002-06-14 | 2004-10-05 | Agilent Technologies, Inc. | Material systems for long wavelength lasers grown on InP substrates |
| US20050243887A1 (en) * | 2004-04-30 | 2005-11-03 | Honeywell International Inc. | DBR using the combination of II-VI and III-V materials for the application to 1.3-1.55 mum |
-
2005
- 2005-12-20 US US11/275,237 patent/US7119377B2/en not_active Expired - Fee Related
- 2005-12-22 TW TW094145960A patent/TW200725933A/zh unknown
-
2006
- 2006-10-31 CN CN200680048486XA patent/CN101341022B/zh not_active Expired - Fee Related
- 2006-10-31 KR KR1020087014312A patent/KR20080080540A/ko not_active Ceased
- 2006-10-31 JP JP2008547224A patent/JP2009520377A/ja active Pending
- 2006-10-31 WO PCT/US2006/042614 patent/WO2007073449A1/en not_active Ceased
- 2006-10-31 EP EP06827254.1A patent/EP1963094A4/en not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| WO2007073449A1 (en) | 2007-06-28 |
| US20060102916A1 (en) | 2006-05-18 |
| CN101341022A (zh) | 2009-01-07 |
| EP1963094A1 (en) | 2008-09-03 |
| EP1963094A4 (en) | 2014-03-19 |
| US7119377B2 (en) | 2006-10-10 |
| JP2009520377A (ja) | 2009-05-21 |
| TW200725933A (en) | 2007-07-01 |
| CN101341022B (zh) | 2012-01-11 |
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