JP2012532453A - 調節可能な色温度を備えた白色光エレクトロルミネセンスデバイス - Google Patents
調節可能な色温度を備えた白色光エレクトロルミネセンスデバイス Download PDFInfo
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Abstract
【選択図】図6
Description
参照は次記の係属中及び/又は同時出願された米国特許出願に対して行われ、これらの内容は本明細書で開示される実施形態に組み込まれ得る:米国特許出願番号第61/175,640号「Re−Emitting Semiconductor Construction With Enhanced Extraction Efficiency」(代理人整理番号第64759US002号)(2009年5月5日出願);米国特許出願番号第61/175,632号「Semiconductor Devices Grown on Indium−Containing Substrates Utilizing Indium Depletion Mechanisms」(代理人整理番号第65434US002号)(2009年5月5日出願);米国特許出願番号第61/175,636号「Re−Emitting Semiconductor Carrier Devices For Use With LEDs and Methods of Manufacture」(代理人整理番号第65435US002号)(2009年5月5日出願);及び米国特許出願番号第61/221664号「Electroluminescent Devices With Color Adjustment Based on Current Crowding」(代理人整理番号第65331US002号)(本出願と同日に出願)。
本発明は全般に、ソリッドステート半導体光源、並びに関連するデバイス、システム、及び方法に関する。
Claims (23)
- ソリッドステート照明デバイスであって、
第1のポンプ光を放射する第1のエレクトロルミネセンス光源と、
前記第1のポンプ光の少なくとも一部を第1の再発光光構成成分に変換する第1の光変換素子と、を含んだ、第1のスペクトル分布を有する光を放射するよう構成された第1の発光素子と、
第2のポンプ光を放射する第2のエレクトロルミネセンス光源と、
前記第2のポンプ光の少なくとも一部を第2の再発光光構成成分に変換する第2の光変換素子と、を含んだ、第2のスペクトル分布を有する光を放射するよう構成された第2の発光素子と、を含み、
前記第1の及び前記第2の光変換素子のうち少なくとも1つが、第1のポテンシャル井戸を含む第1の半導体積層体を含み、
前記第1の及び前記第2の発光素子が、前記第1の及び前記第2の発光素子によって放射される光が組み合わせられてデバイス出力を供給するように配置され、
前記第1の及び前記第2のスペクトル分布は、標準CIE(x,y)色座標図上の線分上のそれぞれ第1の及び第2の終点によって表わすことができ、前記線分は、前記第1の発光素子によって放射された光と、前記第2の発光素子によって放射された光との、様々な相対量について、可能なデバイス出力の範囲を表わし、前記線分の少なくとも一部分が更に、少なくとも色温度範囲3000K(2727℃)〜5000K(4727℃)にわたって完全放射体軌跡に近似している、ソリッドステート照明デバイス。 - 前記線分が、色温度範囲3000K(2727℃)〜5000K(4727℃)にわたって、CIE(x,y)平面上において、完全放射体軌跡から離れている距離が0.04未満である、請求項1に記載のデバイス。
- 前記線分で表わされる前記可能なデバイス出力が、色温度範囲3000K(2727℃)〜5000K(4727℃)にわたって、演色評価数を少なくとも60に維持している、請求項1に記載のデバイス。
- 前記線分で表わされる前記の可能なデバイス出力が、色温度範囲3000K(2727℃)〜5000K(4727℃)にわたって、演色評価数を少なくとも70に維持している、請求項3に記載のデバイス。
- 前記線分で表わされる前記の可能なデバイス出力が、色温度範囲3000K(2727℃)〜5000K(4727℃)にわたって、演色評価数を少なくとも80に維持している、請求項4に記載のデバイス。
- 前記第1のポンプ光が第1のピーク波長λ1pを有し、前記第2のポンプ波長が第2のピーク波長λ2pを有し、λ1pは実質的にλ2pと同じである、請求項1に記載のデバイス。
- 前記第1の及び前記第2のポンプ光がそれぞれ、350〜500nmの範囲のピーク波長を呈する、請求項1に記載のデバイス。
- 前記第1の及び前記第2のエレクトロルミネセンス光源が、一体型半導体素子の中の異なる部分を構成する、請求項1に記載のデバイス。
- 前記第1の及び前記第2のエレクトロルミネセンス光源が、別個の半導体素子を構成する、請求項1に記載のデバイス。
- 前記第1の光変換素子が燐光体を含み、前記第2の光変換素子が、前記第1のポテンシャル井戸を含む前記第1の半導体積層体を含む、請求項1に記載のデバイス。
- 前記燐光体が黄色光を放射し、前記第1の半導体積層体がアンバー光を放射する、請求項10に記載のデバイス。
- 前記第2のスペクトル分布が、500nm〜600nmの間にピーク放射を有する第1の発光バンドと、600nm〜700nmの間にピーク放射を有する第2の発光バンドとから本質的になる、請求項11に記載のデバイス。
- 前記第1の発光バンドが50nm以下のFWHM幅を有し、前記第2の発光バンドが50nm以下のFWHM幅を有する、請求項12に記載のデバイス。
- 前記線分で表わされる前記の可能なデバイス出力が、色温度範囲3000K(2727℃)〜5000K(4727℃)にわたって、演色評価数を少なくとも60に維持している、請求項13に記載のデバイス。
- 前記第1の光変換素子が前記第1の半導体積層体を含み、前記第2の光変換素子が、第2のポテンシャル井戸を含む第2の半導体積層体を含む、請求項1に記載のデバイス。
- 前記第1の半導体積層体が第3のポテンシャル井戸を含み、前記第2の半導体積層体が第4のポテンシャル井戸を含み、前記第1の、前記第2の、前記第3の、及び前記第4のポテンシャル井戸が、互いに少なくとも10nm離れているピーク波長の再発光光を生成することができる、請求項15に記載のデバイス。
- 前記第1のスペクトル分布がシアン色で特徴付けられ、前記第2のスペクトル分布がアンバー色で特徴付けられる、請求項16に記載のデバイス。
- 前記第1のスペクトル分布が、400nm〜500nmの間にピーク放射を有する第1の発光バンドと、500nm〜600nmの間にピーク放射を有する第2の発光バンドと、を含む、請求項16に記載のデバイス。
- 前記第2のスペクトル分布が、500nm〜600nmの間にピーク放射を有する第3の発光バンドと、600nm〜700nmの間にピーク放射を有する第4の発光バンドと、を含む、請求項18に記載のデバイス。
- 前記第1の、第2の、第3の、及び第4の発光バンドがそれぞれ、50nm以下のFWHMスペクトル幅を有し、前記線分で表わされる前記可能なデバイス出力が、色温度範囲3000K(2727℃)〜5000K(4727℃)にわたって、演色評価数を少なくとも60に維持している、請求項19に記載のデバイス。
- 前記線分で表わされる前記可能なデバイス出力が、色温度範囲3000K(2727℃)〜5000K(4727℃)にわたって、演色評価数を少なくとも70に維持している、請求項20に記載のデバイス。
- 前記線分で表わされる前記可能なデバイス出力が、色温度範囲3000K(2727℃)〜5000K(4727℃)にわたって、演色評価数を少なくとも80に維持している、請求項21に記載のデバイス。
- 前記線分が、色温度範囲3000K(2727℃)〜5000K(4727℃)にわたって、CIE(x,y)平面上において、完全放射体軌跡から離れている距離が0.02未満である、請求項1に記載のデバイス。
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US22166009P | 2009-06-30 | 2009-06-30 | |
US61/221,660 | 2009-06-30 | ||
PCT/US2010/040017 WO2011002686A1 (en) | 2009-06-30 | 2010-06-25 | White light electroluminescent devices with adjustable color temperature |
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Cited By (3)
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---|---|---|---|---|
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JP2017045928A (ja) * | 2015-08-28 | 2017-03-02 | 日亜化学工業株式会社 | 発光装置 |
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Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012526394A (ja) | 2009-05-05 | 2012-10-25 | スリーエム イノベイティブ プロパティズ カンパニー | Ledとともに使用するための再発光半導体キャリア素子及び製造方法 |
WO2010129409A1 (en) | 2009-05-05 | 2010-11-11 | 3M Innovative Properties Company | Semiconductor devices grown on indium-containing substrates utilizing indium depletion mechanisms |
CN102460741A (zh) | 2009-05-05 | 2012-05-16 | 3M创新有限公司 | 具有增大的提取效率的再发光半导体构造 |
US8304976B2 (en) | 2009-06-30 | 2012-11-06 | 3M Innovative Properties Company | Electroluminescent devices with color adjustment based on current crowding |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005101296A (ja) * | 2003-09-25 | 2005-04-14 | Osram-Melco Ltd | 可変色発光ダイオード素子及び可変色発光ダイオードモジュール及び可変色発光ダイオード照明器具 |
WO2007114614A1 (en) * | 2006-03-31 | 2007-10-11 | Seoul Semiconductor Co., Ltd. | Light emitting device and lighting system having the same |
JP2008523615A (ja) * | 2004-12-09 | 2008-07-03 | スリーエム イノベイティブ プロパティズ カンパニー | 多色、広帯域または「白色」発光用の適合型短波長led |
JP2009094517A (ja) * | 2007-10-10 | 2009-04-30 | Cree Inc | 複数変換材料発光ダイオードパッケージおよびその製造方法 |
Family Cites Families (61)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3526801A (en) | 1964-08-07 | 1970-09-01 | Honeywell Inc | Radiation sensitive semiconductor device |
JPH077847B2 (ja) | 1984-12-17 | 1995-01-30 | 株式会社東芝 | 半導体発光素子 |
US5048035A (en) | 1989-05-31 | 1991-09-10 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device |
JP2871477B2 (ja) | 1994-09-22 | 1999-03-17 | 信越半導体株式会社 | 半導体発光装置およびその製造方法 |
CN1150882A (zh) | 1995-03-10 | 1997-05-28 | 菲利浦电子有限公司 | 在日光级影响下控制人造光色温的照明系统 |
EP1010773A4 (en) | 1997-02-19 | 2004-08-25 | Kirin Brewery | METHOD AND DEVICE FOR PRODUCING PLASTIC CONTAINER COATED WITH CARBON FILM |
US6016038A (en) | 1997-08-26 | 2000-01-18 | Color Kinetics, Inc. | Multicolored LED lighting method and apparatus |
US7014336B1 (en) | 1999-11-18 | 2006-03-21 | Color Kinetics Incorporated | Systems and methods for generating and modulating illumination conditions |
JP3358556B2 (ja) | 1998-09-09 | 2002-12-24 | 日本電気株式会社 | 半導体装置及びその製造方法 |
WO2000076005A1 (en) | 1999-06-04 | 2000-12-14 | Trustees Of Boston University | Photon recycling semiconductor multi-wavelength light-emitting diodes |
FR2801814B1 (fr) | 1999-12-06 | 2002-04-19 | Cebal | Procede de depot d'un revetement sur la surface interne des boitiers distributeurs aerosols |
US6902987B1 (en) | 2000-02-16 | 2005-06-07 | Ziptronix, Inc. | Method for low temperature bonding and bonded structure |
TW497277B (en) | 2000-03-10 | 2002-08-01 | Toshiba Corp | Semiconductor light emitting device and method for manufacturing the same |
US7202613B2 (en) | 2001-05-30 | 2007-04-10 | Color Kinetics Incorporated | Controlled lighting methods and apparatus |
US6636003B2 (en) | 2000-09-06 | 2003-10-21 | Spectrum Kinetics | Apparatus and method for adjusting the color temperature of white semiconduct or light emitters |
IL138471A0 (en) | 2000-09-14 | 2001-10-31 | Yissum Res Dev Co | Novel semiconductor materials and their uses |
EP1341991A4 (en) | 2000-11-17 | 2007-05-30 | Emcore Corp | LASER ISOLATED CHIP WITH TAPPED SIDE WALLS TO IMPROVE LIGHTING OUTPUT |
US7358679B2 (en) | 2002-05-09 | 2008-04-15 | Philips Solid-State Lighting Solutions, Inc. | Dimmable LED-based MR16 lighting apparatus and methods |
CA2427559A1 (en) | 2002-05-15 | 2003-11-15 | Sumitomo Electric Industries, Ltd. | White color light emitting device |
DE602004027211D1 (de) | 2003-01-16 | 2010-07-01 | Femmepharma Holding Co Inc | Vaginaler oder rektaler applikator und verfahren |
JP2005005482A (ja) * | 2003-06-12 | 2005-01-06 | Citizen Electronics Co Ltd | Led発光装置及びそれを用いたカラー表示装置 |
NO20041523L (no) | 2003-09-19 | 2005-03-21 | Sumitomo Electric Industries | Lysemitterende halvlederelement |
DE10354936B4 (de) | 2003-09-30 | 2012-02-16 | Osram Opto Semiconductors Gmbh | Strahlungemittierendes Halbleiterbauelement |
US7026653B2 (en) | 2004-01-27 | 2006-04-11 | Lumileds Lighting, U.S., Llc | Semiconductor light emitting devices including current spreading layers |
TWI229465B (en) | 2004-03-02 | 2005-03-11 | Genesis Photonics Inc | Single chip white light component |
TWI243489B (en) | 2004-04-14 | 2005-11-11 | Genesis Photonics Inc | Single chip light emitting diode with red, blue and green three wavelength light emitting spectra |
US7361938B2 (en) | 2004-06-03 | 2008-04-22 | Philips Lumileds Lighting Company Llc | Luminescent ceramic for a light emitting device |
US7553683B2 (en) | 2004-06-09 | 2009-06-30 | Philips Lumiled Lighting Co., Llc | Method of forming pre-fabricated wavelength converting elements for semiconductor light emitting devices |
US7126160B2 (en) | 2004-06-18 | 2006-10-24 | 3M Innovative Properties Company | II-VI/III-V layered construction on InP substrate |
US7119377B2 (en) | 2004-06-18 | 2006-10-10 | 3M Innovative Properties Company | II-VI/III-V layered construction on InP substrate |
US7534633B2 (en) | 2004-07-02 | 2009-05-19 | Cree, Inc. | LED with substrate modifications for enhanced light extraction and method of making same |
US7223998B2 (en) | 2004-09-10 | 2007-05-29 | The Regents Of The University Of California | White, single or multi-color light emitting diodes by recycling guided modes |
JP2008516456A (ja) | 2004-10-08 | 2008-05-15 | ザ リージェンツ オブ ザ ユニヴァーシティー オブ カリフォルニア | 高効率発光ダイオード |
US7804100B2 (en) | 2005-03-14 | 2010-09-28 | Philips Lumileds Lighting Company, Llc | Polarization-reversed III-nitride light emitting device |
US7417260B2 (en) | 2005-06-28 | 2008-08-26 | Dong-Sing Wuu | Multiple-chromatic light emitting device |
JP2009509326A (ja) | 2005-09-19 | 2009-03-05 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 可変色の発光装置及びその制御方法 |
US7285791B2 (en) | 2006-03-24 | 2007-10-23 | Goldeneye, Inc. | Wavelength conversion chip for use in solid-state lighting and method for making same |
US20070284565A1 (en) | 2006-06-12 | 2007-12-13 | 3M Innovative Properties Company | Led device with re-emitting semiconductor construction and optical element |
US7902542B2 (en) | 2006-06-14 | 2011-03-08 | 3M Innovative Properties Company | Adapted LED device with re-emitting semiconductor construction |
JP4989936B2 (ja) * | 2006-07-27 | 2012-08-01 | 株式会社朝日ラバー | 照明装置 |
KR100829925B1 (ko) | 2007-03-02 | 2008-05-16 | 세메스 주식회사 | 기판을 처리하는 장치 및 방법 |
US8941566B2 (en) | 2007-03-08 | 2015-01-27 | 3M Innovative Properties Company | Array of luminescent elements |
US7288902B1 (en) | 2007-03-12 | 2007-10-30 | Cirrus Logic, Inc. | Color variations in a dimmable lighting device with stable color temperature light sources |
US7687816B2 (en) | 2007-03-20 | 2010-03-30 | International Business Machines Corporation | Light emitting diode |
US7759854B2 (en) * | 2007-05-30 | 2010-07-20 | Global Oled Technology Llc | Lamp with adjustable color |
US10505083B2 (en) | 2007-07-11 | 2019-12-10 | Cree, Inc. | Coating method utilizing phosphor containment structure and devices fabricated using same |
WO2009036579A1 (en) | 2007-09-21 | 2009-03-26 | Hoffmann Neopac Ag | Apparatus for plasma supported coating of the inner surface of tube-like packaging containers made of plastics with the assistance of a non-thermal reactive ambient pressure beam plasma |
KR20100077191A (ko) | 2007-10-08 | 2010-07-07 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 접합된 반도체 파장 변환기를 갖는 발광 다이오드 |
EP2203938A1 (en) | 2007-10-26 | 2010-07-07 | Cree Led Lighting Solutions, Inc. | Illumination device having one or more lumiphors, and methods of fabricating same |
US20110186877A1 (en) | 2008-06-05 | 2011-08-04 | Haase Michael A | Light emitting diode with bonded semiconductor wavelength converter |
WO2009158138A2 (en) | 2008-06-26 | 2009-12-30 | 3M Innovative Properties Company | Semiconductor light converting construction |
WO2009158191A2 (en) | 2008-06-26 | 2009-12-30 | 3M Innovative Properties Company | Semiconductor light converting construction |
JP2012500411A (ja) | 2008-08-14 | 2012-01-05 | スリーエム イノベイティブ プロパティズ カンパニー | 画像形成用光源モジュールを有する投影システム |
KR20110053376A (ko) | 2008-09-04 | 2011-05-20 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | Gan ld에 의해 광학적으로 펌핑되는 히트 싱크 상의 ⅱ-ⅵ족 mqw vcsel |
CN102197596B (zh) | 2008-09-08 | 2014-10-29 | 3M创新有限公司 | 电像素化发光装置 |
US8619620B2 (en) | 2008-09-16 | 2013-12-31 | Qualcomm Incorporated | Methods and systems for transmission mode selection in a multi channel communication system |
JP2012514329A (ja) | 2008-12-24 | 2012-06-21 | スリーエム イノベイティブ プロパティズ カンパニー | 両方の側に波長変換器を有する光生成デバイス |
WO2010129409A1 (en) | 2009-05-05 | 2010-11-11 | 3M Innovative Properties Company | Semiconductor devices grown on indium-containing substrates utilizing indium depletion mechanisms |
CN102460741A (zh) | 2009-05-05 | 2012-05-16 | 3M创新有限公司 | 具有增大的提取效率的再发光半导体构造 |
US8304976B2 (en) | 2009-06-30 | 2012-11-06 | 3M Innovative Properties Company | Electroluminescent devices with color adjustment based on current crowding |
CN102473817A (zh) | 2009-06-30 | 2012-05-23 | 3M创新有限公司 | 无镉再发光半导体构造 |
-
2010
- 2010-06-25 JP JP2012517777A patent/JP2012532453A/ja active Pending
- 2010-06-25 WO PCT/US2010/040017 patent/WO2011002686A1/en active Application Filing
- 2010-06-25 EP EP10730307A patent/EP2449856A1/en not_active Withdrawn
- 2010-06-25 KR KR1020127002033A patent/KR20120092549A/ko not_active Application Discontinuation
- 2010-06-25 CN CN201080029543.6A patent/CN102474932B/zh not_active Expired - Fee Related
- 2010-06-25 US US13/379,895 patent/US8629611B2/en not_active Expired - Fee Related
- 2010-06-29 TW TW099121301A patent/TW201130107A/zh unknown
-
2015
- 2015-02-09 JP JP2015023239A patent/JP6140742B2/ja not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005101296A (ja) * | 2003-09-25 | 2005-04-14 | Osram-Melco Ltd | 可変色発光ダイオード素子及び可変色発光ダイオードモジュール及び可変色発光ダイオード照明器具 |
JP2008523615A (ja) * | 2004-12-09 | 2008-07-03 | スリーエム イノベイティブ プロパティズ カンパニー | 多色、広帯域または「白色」発光用の適合型短波長led |
WO2007114614A1 (en) * | 2006-03-31 | 2007-10-11 | Seoul Semiconductor Co., Ltd. | Light emitting device and lighting system having the same |
JP2009094517A (ja) * | 2007-10-10 | 2009-04-30 | Cree Inc | 複数変換材料発光ダイオードパッケージおよびその製造方法 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2014119313A1 (ja) * | 2013-01-31 | 2017-01-26 | 株式会社東芝 | 発光装置及びled電球 |
JP2017045928A (ja) * | 2015-08-28 | 2017-03-02 | 日亜化学工業株式会社 | 発光装置 |
JP2022523868A (ja) * | 2019-03-28 | 2022-04-26 | ルミレッズ リミテッド ライアビリティ カンパニー | 色調整可能な発光ダイオード(led)システム、led照明システム及び方法 |
JP7305784B2 (ja) | 2019-03-28 | 2023-07-10 | ルミレッズ リミテッド ライアビリティ カンパニー | 色調整可能な発光ダイオード(led)システム、led照明システム及び方法 |
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TW201130107A (en) | 2011-09-01 |
CN102474932A (zh) | 2012-05-23 |
KR20120092549A (ko) | 2012-08-21 |
US20120104935A1 (en) | 2012-05-03 |
CN102474932B (zh) | 2015-12-16 |
WO2011002686A1 (en) | 2011-01-06 |
JP6140742B2 (ja) | 2017-05-31 |
US8629611B2 (en) | 2014-01-14 |
EP2449856A1 (en) | 2012-05-09 |
JP2015149480A (ja) | 2015-08-20 |
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