JP2008502680A5 - - Google Patents

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JP2008502680A5
JP2008502680A5 JP2007516461A JP2007516461A JP2008502680A5 JP 2008502680 A5 JP2008502680 A5 JP 2008502680A5 JP 2007516461 A JP2007516461 A JP 2007516461A JP 2007516461 A JP2007516461 A JP 2007516461A JP 2008502680 A5 JP2008502680 A5 JP 2008502680A5
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JP2008502680A (ja
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Priority claimed from US10/869,532 external-priority patent/US7166732B2/en
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JP2007516461A 2004-06-16 2005-03-14 銅薄膜の堆積前駆体として有用な銅（ｉ）化合物 Pending JP2008502680A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/869,532 US7166732B2 (en) 2004-06-16 2004-06-16 Copper (I) compounds useful as deposition precursors of copper thin films
PCT/US2005/008416 WO2006009590A1 (en) 2004-06-16 2005-03-14 Copper (i) compounds useful as deposition precursors of copper thin films

Publications (2)

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JP2008502680A JP2008502680A (ja) 2008-01-31
JP2008502680A5 true JP2008502680A5 (https=) 2008-05-08

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JP2007516461A Pending JP2008502680A (ja) 2004-06-16 2005-03-14 銅薄膜の堆積前駆体として有用な銅（ｉ）化合物

Country Status (8)

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US (5) US7166732B2 (https=)
EP (1) EP1765834A4 (https=)
JP (1) JP2008502680A (https=)
KR (2) KR20120105057A (https=)
CN (1) CN101084229A (https=)
IL (1) IL180072A0 (https=)
TW (1) TWI397531B (https=)
WO (1) WO2006009590A1 (https=)

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