JP2008254925A - チャンバ、特に真空チャンバ内でキャリアを移動させる為の装置 - Google Patents
チャンバ、特に真空チャンバ内でキャリアを移動させる為の装置 Download PDFInfo
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- JP2008254925A JP2008254925A JP2008043354A JP2008043354A JP2008254925A JP 2008254925 A JP2008254925 A JP 2008254925A JP 2008043354 A JP2008043354 A JP 2008043354A JP 2008043354 A JP2008043354 A JP 2008043354A JP 2008254925 A JP2008254925 A JP 2008254925A
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- Prior art keywords
- carrier
- chamber
- electromagnetic coupling
- roller
- hook
- Prior art date
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- 230000008878 coupling Effects 0.000 claims abstract description 34
- 238000010168 coupling process Methods 0.000 claims abstract description 34
- 238000005859 coupling reaction Methods 0.000 claims abstract description 34
- 230000033001 locomotion Effects 0.000 claims description 5
- 230000003028 elevating effect Effects 0.000 claims 2
- 239000000758 substrate Substances 0.000 abstract description 8
- 238000001771 vacuum deposition Methods 0.000 abstract description 8
- 238000000034 method Methods 0.000 description 23
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 3
- 239000000969 carrier Substances 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/54—Apparatus specially adapted for continuous coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F7/00—Magnets
- H01F7/02—Permanent magnets [PM]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Chemical & Material Sciences (AREA)
- Electromagnetism (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Physical Vapour Deposition (AREA)
- Chemical Vapour Deposition (AREA)
- Rollers For Roller Conveyors For Transfer (AREA)
Abstract
【解決手段】キャリア11は、板状に形成され、駆動システムによりローラ12上の狭側下縁部で支持されている。間接駆動装置は電磁継手を利用するが、電磁継手は一部が真空チャンバ内、一部が真空チャンバ外に配置されている。垂直方向に作用する力を用いて、電磁継手の2つの構成部品は、互いにずらすことが可能である。さらに、キャリアを水平方向にずらすことも可能である。
【選択図】図3
Description
Claims (11)
- チャンバ、特に真空チャンバ(1)内でキャリアを移動させる為の装置において、前記キャリア(11)は板状に形成され、駆動ローラ(12)により直線状に移動可能である、前記装置であって、
前記駆動ローラ(12,24)は、昇降機構(30,31)により、板状キャリア(11)の狭い側に向かって、更に、そこから離れて移動可能であることを特徴とする、前記装置。 - 前記駆動ローラ(12,24)は、搬送ビーム(17)上にあり、前記昇降機構(30,31)は、前記搬送ビーム(17)に連結されていることを特徴とする、請求項1に記載の装置。
- 前記駆動ローラ(12,24)は、電磁継手(74)に結合されていることを特徴とする、請求項1に記載の装置。
- 前記電磁継手は、前記チャンバ(1)内部に置かれた第1構成部品(19)と、前記チャンバ(1)の外側に置かれた第2構成部品(20)とを含むことを特徴とする、請求項3に記載の装置。
- 前記キャリア(11)は、少なくとも一つの開口を有することを特徴とする、請求項1に記載の装置。
- 前記キャリア(11)は、アパーチャ(40)を含むことを特徴とする、請求項1に記載の装置。
- 前記アパーチャ(40)を通って伸び、キャリア(11)を支持することができるフックが備えられていることを特徴とする、請求項1または6に記載の装置。
- 前記キャリア(11)は、前記フック(14)が係合するピンを含むことを特徴とする、請求項1に記載の装置。
- 前記フック(14)は、前記キャリア(11)の表面に対し直角に移動可能であることを特徴とする、請求項7に記載の装置。
- 前記フック(14)の運動の為に駆動装置が備えれ、前記駆動装置は、前記チャンバ(1)の外側に置かれていることを特徴とする、請求項9に記載の装置。
- 前記電磁継手の第1構成部品(19)および第2構成部品(20)は、前記キャリア(11)の第1の位置において互いに対称的に対向して置かれ、前記キャリア(11)の第2の位置において、互いに垂直方向にずれていることを特徴とする、請求項4に記載の装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP07104010A EP1973154B1 (de) | 2007-03-13 | 2007-03-13 | Vorrichtung zum Bewegen eines Carriers in einer Vakuumkammer |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2008254925A true JP2008254925A (ja) | 2008-10-23 |
Family
ID=38476363
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008043354A Pending JP2008254925A (ja) | 2007-03-13 | 2008-02-25 | チャンバ、特に真空チャンバ内でキャリアを移動させる為の装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20080223693A1 (ja) |
EP (1) | EP1973154B1 (ja) |
JP (1) | JP2008254925A (ja) |
KR (1) | KR100984208B1 (ja) |
CN (1) | CN101270473B (ja) |
AT (1) | ATE555496T1 (ja) |
TW (1) | TW200903691A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018525839A (ja) * | 2015-08-21 | 2018-09-06 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 基板を移送するための装置、基板を真空処理するための装置、及び磁気浮揚システムを保守するための方法 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102031492B (zh) * | 2009-09-24 | 2012-06-27 | 迎辉科技股份有限公司 | 真空机械引入装置 |
KR101243743B1 (ko) * | 2010-02-18 | 2013-03-13 | 주식회사 아바코 | 기판 이송 장치, 기판 처리 장치 및 이를 이용한 기판 처리 방법 |
DE102011113292A1 (de) * | 2011-09-05 | 2013-03-07 | Schmid Vacuum Technology Gmbh | Vakuumdurchführung und Vakuumbeschichtungsvorrichtung mit Vakuumdurchführungen |
CN108349656B (zh) * | 2015-11-09 | 2020-04-21 | 莱特拉姆有限责任公司 | 具有动力弹出辊的输送机 |
CN105668143B (zh) * | 2016-03-23 | 2017-08-25 | 北京轩宇智能科技有限公司 | 一种密封操作系统及其磁耦合式密封输料装置 |
CN106429291A (zh) * | 2016-11-08 | 2017-02-22 | 天奇自动化工程股份有限公司 | 磁性积放辊筒 |
CN109715849B (zh) * | 2017-08-25 | 2020-12-22 | 应用材料公司 | 用于在真空室中传输载体的设备、用于真空处理基板的系统、以及用于在真空室中传输载体的方法 |
CN107858654B (zh) * | 2017-10-31 | 2023-06-02 | 东莞市汇成真空科技有限公司 | 大型罐体内壁镀膜用真空阴极电弧镀膜机电弧源组件的驱动系统 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0272540A (ja) * | 1988-09-05 | 1990-03-12 | Matsushita Electric Ind Co Ltd | マグネトロン |
JPH0669316A (ja) * | 1992-06-15 | 1994-03-11 | Nissin Electric Co Ltd | 基板処理装置 |
JP2002068476A (ja) * | 2000-08-29 | 2002-03-08 | Anelva Corp | 磁気搬送装置 |
JP2005269709A (ja) * | 2004-03-16 | 2005-09-29 | Maguneo Giken:Kk | 磁気回転伝達装置及び密閉撹拌装置 |
JP2008013849A (ja) * | 2006-06-22 | 2008-01-24 | Applied Materials Gmbh & Co Kg | 平面基板搬送用搬送ローラを備えた真空コーティング設備 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2954130A (en) * | 1959-07-08 | 1960-09-27 | United States Steel Corp | Lift conveyor for upsetting machine |
US4042128A (en) * | 1975-11-26 | 1977-08-16 | Airco, Inc. | Substrate transfer apparatus for a vacuum coating system |
JPS57194841A (en) * | 1981-05-23 | 1982-11-30 | Sony Corp | Automatic assembling device |
AU572375B2 (en) | 1985-01-31 | 1988-05-05 | Boc Group, Inc., The | Transporting of workpiece to and from vacuum coating apparatus |
DE3623970A1 (de) * | 1986-07-16 | 1988-01-28 | Leybold Heraeus Gmbh & Co Kg | Transporteinrichtung mit rollensystemen fuer vakuum-beschichtungsanlagen |
DE4428136A1 (de) * | 1994-08-09 | 1996-02-15 | Leybold Ag | Vakuum-Beschichtungsanlage |
JPH08172121A (ja) * | 1994-12-20 | 1996-07-02 | Hitachi Ltd | 基板搬送装置 |
JP3732250B2 (ja) * | 1995-03-30 | 2006-01-05 | キヤノンアネルバ株式会社 | インライン式成膜装置 |
US5749454A (en) * | 1995-05-26 | 1998-05-12 | Span Tech Corporation | Conveyor system with driven roller transfer assembly |
CH691680A5 (de) * | 1996-10-15 | 2001-09-14 | Unaxis Deutschland Gmbh | Transportvorrichtung für Werkstücke in einer Vakuumanlage. |
KR200198426Y1 (ko) * | 1997-05-30 | 2001-04-02 | 김영환 | 반도체웨이퍼이송장치 |
WO1999004416A1 (de) | 1997-07-17 | 1999-01-28 | Kunze Concewitz Horst | Verfahren und vorrichtung zum behandeln von flächigen substraten, insbesondere silizium-scheiben (wafer) zur herstellung mikroelektronischer bauelemente |
US6206176B1 (en) * | 1998-05-20 | 2001-03-27 | Applied Komatsu Technology, Inc. | Substrate transfer shuttle having a magnetic drive |
TW552306B (en) * | 1999-03-26 | 2003-09-11 | Anelva Corp | Method of removing accumulated films from the surfaces of substrate holders in film deposition apparatus, and film deposition apparatus |
JP2002110763A (ja) | 2000-09-26 | 2002-04-12 | Daikin Ind Ltd | 基板搬送方法およびその装置 |
KR100486692B1 (ko) * | 2002-03-29 | 2005-05-03 | 주식회사 엘지이아이 | 연속처리가 가능한 열교환기 표면처리장치 |
DE10227365B4 (de) | 2002-06-12 | 2006-07-06 | Leibniz-Institut für Festkörper- und Werkstoffforschung e.V. | Vorrichtung zur Bewegung von Einbauteilen in Vakuumanlagen |
KR100529433B1 (ko) | 2003-02-04 | 2005-11-17 | 동부아남반도체 주식회사 | 반도체 세정장비용 카세트 이송장치 |
DE10328273A1 (de) | 2003-06-23 | 2005-01-27 | Von Ardenne Anlagentechnik Gmbh | Transportvorrichtung flächenförmiger Substrate, insbesondere in Vakuumbeschichtungsanlagen |
JP4265312B2 (ja) | 2003-07-03 | 2009-05-20 | アシスト テクノロジーズ ジャパン株式会社 | 懸垂型搬送台車およびその制御方法ならびに搬送システム |
ITBO20040629A1 (it) | 2004-10-14 | 2005-01-14 | Marchesini Group Spa | Sistema per la trasmissione del moto tra organi separati da una parete divisoria |
DE602007006147D1 (de) * | 2007-02-02 | 2010-06-10 | Applied Materials Inc | Prozesskammer, Inline-Beschichtungsanlage und Verfahren zur Behandlung eines Substrats |
-
2007
- 2007-03-13 EP EP07104010A patent/EP1973154B1/de not_active Not-in-force
- 2007-03-13 AT AT07104010T patent/ATE555496T1/de active
-
2008
- 2008-02-18 KR KR1020080014447A patent/KR100984208B1/ko not_active IP Right Cessation
- 2008-02-21 TW TW097106114A patent/TW200903691A/zh unknown
- 2008-02-25 JP JP2008043354A patent/JP2008254925A/ja active Pending
- 2008-02-28 US US12/039,606 patent/US20080223693A1/en not_active Abandoned
- 2008-02-29 CN CN2008100065000A patent/CN101270473B/zh not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0272540A (ja) * | 1988-09-05 | 1990-03-12 | Matsushita Electric Ind Co Ltd | マグネトロン |
JPH0669316A (ja) * | 1992-06-15 | 1994-03-11 | Nissin Electric Co Ltd | 基板処理装置 |
JP2002068476A (ja) * | 2000-08-29 | 2002-03-08 | Anelva Corp | 磁気搬送装置 |
JP2005269709A (ja) * | 2004-03-16 | 2005-09-29 | Maguneo Giken:Kk | 磁気回転伝達装置及び密閉撹拌装置 |
JP2008013849A (ja) * | 2006-06-22 | 2008-01-24 | Applied Materials Gmbh & Co Kg | 平面基板搬送用搬送ローラを備えた真空コーティング設備 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018525839A (ja) * | 2015-08-21 | 2018-09-06 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 基板を移送するための装置、基板を真空処理するための装置、及び磁気浮揚システムを保守するための方法 |
Also Published As
Publication number | Publication date |
---|---|
US20080223693A1 (en) | 2008-09-18 |
KR20080084584A (ko) | 2008-09-19 |
KR100984208B1 (ko) | 2010-09-28 |
CN101270473B (zh) | 2012-03-07 |
TW200903691A (en) | 2009-01-16 |
CN101270473A (zh) | 2008-09-24 |
EP1973154A1 (de) | 2008-09-24 |
EP1973154B1 (de) | 2012-04-25 |
ATE555496T1 (de) | 2012-05-15 |
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