JP2008251668A - ワイヤーボンディング方法およびledプリントヘッド用ベースの製造方法 - Google Patents
ワイヤーボンディング方法およびledプリントヘッド用ベースの製造方法 Download PDFInfo
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- JP2008251668A JP2008251668A JP2007088457A JP2007088457A JP2008251668A JP 2008251668 A JP2008251668 A JP 2008251668A JP 2007088457 A JP2007088457 A JP 2007088457A JP 2007088457 A JP2007088457 A JP 2007088457A JP 2008251668 A JP2008251668 A JP 2008251668A
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Abstract
【解決手段】
基板のパッドの他に、素子パッドよりも硬度の高いダミーパッドを基板に設け、素子のパッド、基板のパッドの順に複数回のワイヤーボンディングをした後、ダミーパッドにおいて、ワイヤーボンディングを行うことにより、キャピラリの先端に堆積したアルミニウムを除去する。
【選択図】 図13
Description
また、このダミーパッドは、基板に形成された基板パッドとは電気的な導通の無い独立したパッドでも良いし、基板パッドの一部であっても良い。また、ダミーパッドは、基板に形成された基板パッド同士を接続する配線パターンを太くしたものであっても良い。
図1は、キャピラリの側部断面図である。図2乃至図4は、キャピラリの側面図である。図5乃至図14は、本発明にかかるワイヤーボンディング方法を説明するための模式図である。
また、ワイヤー6は、直径10〜150μm程度の細い導線であるが、説明を分かりやすくするため、各図においてワイヤー6を太く図示している。
図1に示すように、本発明において用いられるキャピラリ1は、中心部に後述するワイヤーを供給するための貫通穴2が形成されている。キャピラリの材質は、セラミック、ルビー、酸化ジルコニウム等を用いることができる。
次に、本発明に係るワイヤーボンディング方法を説明する。尚、ワイヤーボンディング装置は市販されている公知の装置を用いれば良いので、キャピラリ以外の装置は、説明を簡単にするため省略する。
しかし、キャピラリ1の先端3には、素子パッドの金属層を構成するアルミニウムの金属カスが付着し、堆積する。
すなわち、図3に示すように、キャピラリ1の先端3から突出した所定量のワイヤー6の近傍に、図4に示すようにトーチ7を位置させ、ワイヤー6とトーチ7の間に電圧を印加する。そうすると、スパークが発生し、図5に示すように、キャピラリ1の先端3にボール8が形成される。
そして、図13、図14に示すように、図示しないワイヤーボンディング装置を用いてキャピラリ1をダミーパッド15に押し付けて、ワイヤー6をダミーパッド15に超音波併用熱圧着方式で接続させると同時に、ワイヤー6を切断する。
図15は、LEDプリントヘッドの側面図である。図16は、図15で示したLEDプリントヘッドにおけるLEDプリントヘッド用ベースの平面図である。図17は、図16で示したLEDプリントヘッド用ベースのB−B断面の拡大図である。
尚、実施例1で説明した部分と同一の部分については、同一の符号を付して説明を省略する。
図18は、キャピラリの側面図であり、図19は、図18に示したキャピラリを下方(A方向)から見たときの拡大図である。
尚、実施例1および実施例2で説明した部分と同一の部分については、同一の符号を付して説明を省略する。
すなわち、図20に示すように、複数のLEDアレイ20が実装された電源ラインとしての基板パッド12の未使用部分である端部を、ダミーパッド15として用いても良い。
すなわち図21に示すように、基板パッド12に接続された配線パターン25の途中において、配線パターン25の幅を広くした部分を形成し、その部分をダミーパッドとして用いても良い。
この場合であっても、キャピラリの先端に付着した金属カスは、基板パッドの厚い金属層中にめりこむので、前記したように、キャピラリの先端から金属カスを除去することができる。
2 貫通穴
3 先端
4 先端部
5 ダイヤモンド状炭素硬質皮膜
6 ワイヤー
9 基板
10 電子部品
11 素子パッド
12 基板パッド
13 発光部
15 ダミーパッド
24 LEDプリントヘッド用ベース
25 配線パターン
Claims (11)
- 基板に形成された複数の基板パッドと、
前記基板に実装された電子部品の表面に形成された複数の素子パッドとをキャピラリから出るワイヤーにより結線するワイヤーボンディングする方法において、
前記キャピラリの先端から突出したワイヤーを前記キャピラリによって前記基板パッドに押し付けて前記基板パッドに該ワイヤーを接続させ、該ワイヤーを引き出しながら前記キャピラリを移動させ、該ワイヤーを前記キャピラリによって前記素子パッドに押し付けて前記素子パッドに前記ワイヤーを接続させると同時に前記ワイヤーを切断する一連の動作を複数回行った後、
前記キャピラリの先端から突出したワイヤーを前記キャピラリによってダミーパッドに押し付けて該ダミーパッドに該ワイヤーを接続させ、該ワイヤーを引き出しながら前記キャピラリを移動させ、該ワイヤーを前記キャピラリによって前記ダミーパッドに押し付けて該ダミーパッドに前記ワイヤーを接続させると同時に前記ワイヤーを切断することを特徴とするワイヤーボンディング方法 - 前記ダミーパッドは、基板パッドの一部または基板パッドに接続された配線パターンである請求項1に記載のワイヤーボンディング方法
- 前記キャピラリの表面には、ダイヤモンド状炭素硬質皮膜が施されている請求項1に記載のワイヤーボンディング方法
- 前記電子部品は発光素子であり、
前記電子部品の表面に形成された素子パッドの近傍に発光部が形成されている請求項1〜請求項3のいずれか一つに記載のワイヤーボンディング方法 - 前記発光素子は、LEDアレイである請求項4に記載のワイヤーボンディング方法
- 前記電子部品は受光素子であり、
前記電子部品の表面に形成された素子パッドの近傍に受光部が形成されている請求項1〜請求項3のいずれか一つに記載のワイヤーボンディング方法 - 前記ダミーパッドは、金を主成分とする金属により形成されており、
前記素子パッドは、アルミニウムを主成分とする金属により形成されている請求項1〜請求項6のいずれか一つに記載のワイヤーボンディング方法 - ベースに固定された基板に形成された複数の基板パッドと、
前記基板に実装されたLEDアレイの表面に形成された複数の素子パッドとをキャピラリによりワイヤーボンディングするLEDプリントヘッド用ベースの製造方法において、
前記キャピラリの先端から突出したワイヤーを前記キャピラリによって前記基板パッドに押し付けて前記基板パッドに該ワイヤーを接続させ、該ワイヤーを引き出しながら前記キャピラリを移動させ、該ワイヤーを前記キャピラリによって前記素子パッドに押し付けて前記素子パッドに前記ワイヤーを接続させると同時に前記ワイヤーを切断する一連の動作を複数回行った後、
前記キャピラリの先端から突出したワイヤーを前記キャピラリによって前記ダミーパッドに押し付けて前記ダミーパッドに該ワイヤーを接続させ、該ワイヤーを引き出しながら前記キャピラリを移動させ、該ワイヤーを前記キャピラリによって前記ダミーパッドに押し付けて前記ダミーパッドに前記ワイヤーを接続させると同時に前記ワイヤーを切断することを特徴とするLEDプリントヘッド用ベースの製造方法 - 前記ダミーパッドは、基板パッドの一部または基板パッドに接続された配線パターンである請求項8に記載のLEDプリントヘッド用ベースの製造方法
- 前記キャピラリの表面には、ダイヤモンド状炭素硬質皮膜が施されている請求項8または請求項9に記載のLEDプリントヘッド用ベースの製造方法
- 前記ダミーパッドは、金を主成分とする金属により形成されており、
前記素子パッドは、アルミニウムを主成分とする金属により形成されている請求項8〜請求項10のいずれか一つに記載のLEDプリントヘッド用ベースの製造方法
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010177306A (ja) * | 2009-01-28 | 2010-08-12 | Suzuka Fuji Xerox Co Ltd | Led基板装置およびledプリントヘッド |
JP2013179255A (ja) * | 2011-10-25 | 2013-09-09 | Asm Technology Singapore Pte Ltd | ワイヤーボンダのためのワイヤーテール自動調節システム |
JP2016167556A (ja) * | 2015-03-10 | 2016-09-15 | 富士ゼロックス株式会社 | 基板、基板装置、光学装置、画像形成装置、ワイヤーボンディング方法及び基板装置の製造方法 |
US11827036B2 (en) | 2020-11-06 | 2023-11-28 | Canon Kabushiki Kaisha | Optical print head and method for manufacturing optical print head |
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JPH01241138A (ja) * | 1988-03-23 | 1989-09-26 | Toshiba Corp | 半導体装置のワイヤボンディング方法 |
JPH05183191A (ja) * | 1991-12-30 | 1993-07-23 | Kyocera Corp | Ledプリントヘッド |
JPH07321143A (ja) * | 1994-05-25 | 1995-12-08 | Sumitomo Electric Ind Ltd | ワイヤボンディング方法およびその装置 |
JPH1187395A (ja) * | 1997-09-05 | 1999-03-30 | Hitachi Ltd | ワイヤボンディング方法および装置 |
JP2008147551A (ja) * | 2006-12-13 | 2008-06-26 | Denso Corp | ワイヤボンディング方法およびワイヤボンディング装置 |
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JPH01241138A (ja) * | 1988-03-23 | 1989-09-26 | Toshiba Corp | 半導体装置のワイヤボンディング方法 |
JPH05183191A (ja) * | 1991-12-30 | 1993-07-23 | Kyocera Corp | Ledプリントヘッド |
JPH07321143A (ja) * | 1994-05-25 | 1995-12-08 | Sumitomo Electric Ind Ltd | ワイヤボンディング方法およびその装置 |
JPH1187395A (ja) * | 1997-09-05 | 1999-03-30 | Hitachi Ltd | ワイヤボンディング方法および装置 |
JP2008147551A (ja) * | 2006-12-13 | 2008-06-26 | Denso Corp | ワイヤボンディング方法およびワイヤボンディング装置 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010177306A (ja) * | 2009-01-28 | 2010-08-12 | Suzuka Fuji Xerox Co Ltd | Led基板装置およびledプリントヘッド |
JP2013179255A (ja) * | 2011-10-25 | 2013-09-09 | Asm Technology Singapore Pte Ltd | ワイヤーボンダのためのワイヤーテール自動調節システム |
JP2016167556A (ja) * | 2015-03-10 | 2016-09-15 | 富士ゼロックス株式会社 | 基板、基板装置、光学装置、画像形成装置、ワイヤーボンディング方法及び基板装置の製造方法 |
US11827036B2 (en) | 2020-11-06 | 2023-11-28 | Canon Kabushiki Kaisha | Optical print head and method for manufacturing optical print head |
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