201108889 六、發明說明： 【發明所屬之技術領域】 本發明係有關一種於薄導電箔的一主面設置有以電 解錢覆所形成的多個電極的安裝基板，及使用該安裝基板 在導電落上的安裝部安裝發光元件之薄型發光裝置的製造 方法。 【先前技術】 於第7圖顯示防止由發光元件所發出的光被吸收至基 底基板内’而抑制發光損耗以謀求整體亮度之提升的發光 裝置。 又 該發光裝置係由發光元件、基底基板200、基板 電極部300、連接電極部400、光反射部5〇〇、孔部6〇〇及 鍍覆層700所構成。發光元件100係三族氮化物系化合物 半導體發光元件。基底基板200係以聚醯亞胺、玻璃環氧 樹脂或BT樹脂等樹脂所形成的絕緣性基板，且由以下構件 所製作：從該基板表面形成至背面的由㈣膜所構成的一 對基板電極部3GG、形成於發光元件⑽载置面的相反側 的面之由鋪膜所構成的光反射部5Q〇、朝基底基板測 的厚度方向穿設於由-對基板電極部_所相對向的絕緣 部的孔部600、形成於由該孔部6〇〇露出的光反射部5⑼ 的露出面與孔部_的内周面之以金或銀所形成的錢覆層 700。又’設於基底基& 200的背面’且由與基板電極部 300導通的導電膜所構成的電極，係安襄於母板 (motherboard)等裝置基板的連接電極部。 322025 4 201108889 (先前技術文獻） (專利文獻） 專利文獻1 :日本特開2005_175387號公報 【發明内容】 (發明欲解決之課題） 上述的發光裝置係有如下的問題點。 例如在攜帶終端機器等小型化及薄型化的進展下，發 光裝置的薄型化為一種市場要求。 x 然而’如第7圖的發光裝置中，由於為發光元件1〇〇 配置於基底基板200上的構造，故安裝後的厚度至少需要 為發光元件1GG的厚度及基底基板的厚度的總和以 上。改良基底基板200的材料等雖然亦可推進薄型化，但 有確保作為支持件的某齡度的強度的必要，且若考慮制 造步驟的操作方便等，㈣加大幅度的薄型化係存在= 頸。 又，若使用基底基板200，則於其兩面 300及連接電極部400’且為了連接兩電極則不可土缺少通孔 (through-hole)電極，而無法縮小每一單元（cen)的美板 面積，亦增加了通孔鍍覆等製造步驟數。 另-方面’以-併製造多個上述構成的發光裝置的製 造方法而言，係有以下方法：於-片基板酉己置構成複數個 裝置的導電圖形，於該導電圖形連接電路元件並以樹脂密 封後，藉由切塊程序（dicing)切斷導電圖形及密封樹脂以 分離成每個發光裝置。㈣，這財法會有則用高^ s] 322025 5 201108889 轉的裁切錯切斷導電圖形而產生毛邊（bur r )的疑慮。如此 當產生了毛邊時，則不僅是外觀性遭受損害，並有阻礙安 裝時的穩定性，或於安裝後產生短路的疑慮。 本發明為有鑑於前述之問題所開發者，本發明的目的 係提供一種既抑制毛邊產生，且可一併製造多個發光裝置 的安裝基板及使用該安裝基板的薄型發光裝置的製造方 法。 (解決課題的手段） 本發明的安裝基板係具備：單元，係於導電箔的頂面 以行狀鄰接多個而排列，並具有以電解鍍覆形成的第一電 極部及接近安裝部的策二電極部者；液狀樹脂，係附著於 前述第一電極部及前述第二電極部之間的前述導電箔並補 強前述導電箔；分離用槽孔，係貫通鄰接的行的前述第一 電極部及前述第二電極部之間的前述導電箔而設置，而分 離鄰接的前述行；絕緣用槽孔，係位於前述第一電極部及 前述第二電極部之間，而與前述分離用槽孔平行設置，並 貫通前述導電箔而設置，以使前述第一電極部及前述第二 電極部電性分離；及充填樹脂，設於前述導電箔的底面並 覆蓋前述絕緣用槽孔，並覆蓋對應前述液狀樹脂的位置並 補強前述導電箔；並且藉由去除包含於同一行的前述單元 彼此的邊界的前述導電箔，以分離包含於鄰接的一方的前 述單元的前述導電箔及包含於鄰接的另一方的前述單元的 前述導電箔。 本發明的薄型發光裝置的製造方法係具備：於導電箔 201108889 的頂面，以使由第一電極部及接近安裝部的第二電極部所 ' 構成的單元的區域露出之方式形成的鍍覆阻劑層的步驟； " 以前述鍛覆阻劑層作為遮罩，選擇性地於前述導電羯實施 金屬鍍覆，以行狀地形成多個前述單元的步驟；去除前述 鍍覆阻劑層，並使液狀樹脂附著於前述導電箔上除了前述 第一及第二電極部與前述安裝部外之處的步驟；從底面選 擇性地钱刻前述導電羯，以設置貫通前述導電结以使前述 各單元的前述第一電極部及第二電極部電性分離的絕緣用 槽孔、及貫通前述導電箔以使鄰接的前述行的單元分離的 分離用槽孔，而形成安裝基板的步驟；形成充填樹脂之步 驟，該充填樹脂係從前述導電箔的底面覆蓋前述絕緣用槽 孔，並覆蓋對應前述液狀樹脂的位置，並且補強前述導電 箔；藉由濕蝕刻去除將包含於同一行而鄰接的前述單元彼 此予以連接的連接部分的前述導電箔的步驟；於前述安裝 部固著發光元件，並以搭接線連接前述發光元件的電極及 前述第一電極部的步驟；形成樹脂以使逐行地覆蓋包含於 前述各單元的前述發光元件的步驟；以及於前述連結部分 的前述導電箔被去除的部位，藉由切斷前述安裝基板及前 述樹脂，而個別地分離前述單元的步驟。 (發明的效果） 根據本發明的安裝基板，能得到以下的效果。 根據本發明，以行狀設置由第一電極部及第二電極部 所構成的單元於安裝基板，並去除於單元間的邊界部構成 各電極部的導電箔。藉此，即使在各單元的邊界切斷安裝[S] 7 322025 201108889 基板，於被切斷的區域僅會存在版 料，不會有由金屬構成的導電落Q esist)指月曰材 為切斷安裝基板而產生毛邊， =此’由於不會因 問題。又，習知中為了提升作業邊的各種 的裁切鑽的移動逮度處於高速〃離時使用 於太钵an右主a 而凸顯了毛邊的問題，然 :曰=邊的疑慮而可高速地進行分離步驟。 r…：各早兀的邊界導電箱受到去除的去除區域， 係設有液狀樹脂及由焊接阻劑所構成的樹月t材料义 藉_脂材料’以行狀配置的各翠=帶 狀，故各單元直到最後亦不會散亂，而會呈一片板子的狀 態而方便使用。 再且，根據本發明，藉由以行狀配置上述單元於安裝 基板，可得到以下的效果。 第-點，由於導電基板係由導電箱及於該導電箱的表 面選擇性形成的由電解鐘覆所形成的第一電極部及第二電 極部所形成，故只要導電备為18“瓜'而第一及第二電極 部的鍍覆厚度為15至2()//01，就可實現形成御m以下的 厚度之極度薄型的無支持基板的安農基板。 第二點，由於在安裝基板以行狀配設多個鄰接的第一 電極部及第二電極部，故可在一行集聚多個單元，且與鄰 接的行係以分離用槽孔使之分離’故亦可實現與鄰接的行 之間的間隔極度窄化為習知的1/5的〇 2mm。藉此每一片 安裝基板的單元數可增加至習知的可大幅度提升 生產效率及成本。 322025 8 201108889 第二點’作為安裝基板的初始材料的導電箱係留存直 到最終製品、第一及第二電極部亦僅於必要的位置以電解 鐘覆形成，故在製造步驟中幾乎沒有浪費而捨棄的原始材 料’而可實現對環境友善的生產。 第四點，安裝基板係以導電箔作為基底，而於製造步 驟中容易因為來自外部的力而變形，故藉由將行區分為複 數個區塊，而保留不設置行之共通的導電箱以進行安裝基 板的補強。 土 第五點，由於在安裝部層積有鎳鍍覆層、金鍍覆声或 ，覆層，並且從相反的主面覆蓋有充填樹脂，故可^伴 使不存在支縣㈣絲部具有可魅發光元件的強度。 第六點，安裝基板係由導電箱、第―及第二電極 者’㈣為極薄的材料卻可將來自於固定在安事 :::光元件的發熱直接地擴散至全體導電箱，而： t屏，點'^於安裝部、第—及第二電極部的全或银分 覆層係可制作為發光it件的反射層。 戈银錢 根據本發明的製造方法一點 始製作安萝其缸丄匕 w y、由潯導電箔開 安偽最小限度的材料來實現，並可將 女裳基板的厚度形成.為導至了將 光裝置的製造方法。 藉此只現溥型發 =第由=性地在帽上以電解錢覆形成第 S] 槽孔及絲㈣孔^，如最小贿的細彳做出絕緣用 用才曰孔，故可在不浪費導電羯等原材料下實現[ 9 322025 201108889 最小的安裝基板及薄型發光裝置。 第三點，由於使用第二電極部、液狀樹脂及充填樹脂 來補強難以抵禦變形的導電箔，故可實現使用無支持基板 的安裝基板之薄型發光裝置的製造方法。 第四點，利用液狀樹脂及透明樹脂其樹脂彼此的和諧 性進行發光元件的模鑄成形（mold)，而可在大部分為導電 箔及電解鍍覆層之下，實現良好的樹脂封裝。 第五點，藉由行狀的多個排列配置的各單元，可大量 地製造發光裝置，而由於以分離用槽分離鄰接的行，故可 在一個方向將切塊程序維持為最小限度，而可防止因為切 塊程序帶給封裝的不良影響。 第六點，在本發明中，可以電解鍍覆第一電極部及第 二電極部的步驟、液狀樹脂的附著步驟、分離用槽孔及絕 緣用槽孔的蝕刻步驟、充填樹脂的印刷步驟、以及導電金 屬層的電解鍍覆步驟的極少的步驟數，來實現薄型發光裝 置的製造方法。 【實施方式】 參照第1圖至第6圖，說明本發明之實施形態。 首先，於第1圖顯示本發明的安裝基板。第1圖（A) 係該安裝基板的俯視圖、第1圖（B)係表面的擴大圖、而第 1圖（C)係背面的擴大圖。 本實施形態的安裝基板1係由導電箔10、第一電極部 11、第二電極部12、液狀樹脂13、分離用槽孔14、絕緣 用槽孔15及焊接阻劑層16所構成。 10 322025 201108889 以導電箔ίο而言係選擇可蝕刻並可電解鍍覆的金屬。 本貫施形悲係採用由銅所構成的金屬箔。銅箔係選擇9、 12、18或35//m之極薄的厚度者，由於該銅箔係成為薄型 發光裝置的安裝基板，故較佳為盡可能的薄者。當銅箔太 薄時，由於有在步驟中的製造裝置内的處理中及搬運時， 因施力變形而產生皺折的情形，故在12至2〇〇//111間的範 圍進行選擇。 第一電極部11及第二電極部12係藉由銅的電解鍍覆 選擇性地形成於導電箔10的表面，而形成15至2〇//111的 範圍的厚度。第一電極部11及第二電極部12係相對向配 置，第二電極部12係接近並配置於由導電箔1〇所成的安 裝部17。由於安裝部π僅由導電箔1〇構成而難以抵禦變 形，故較佳為復以第二電極部12包圍安裝部17將之設成 晝框狀作為補強。 上述的安裝部17係固著發光元件等的區域，而為了 製作薄型發光裝置，雖希望能盡可能的薄，但因為必需是 月匕女裝發光元件的強度，故係以第二電極部及後述之設 於導電箔10背面的焊接阻劑層16做補強。 於本實施形態，係以第一電極部11及第二電極部12 構成用以構成一個發光裝置的單元22。又，該單元22係 行狀地配置多個於由分離用槽孔所包夾的細長的區域。 液狀樹脂13係附著於導電箔1 〇表面的除了第一電極 部11，及圍繞安裝部17的第二電極部12以外的區域。液 狀樹脂13係選擇膠狀的聚矽氧（silic〇ne)樹脂、丙烯酸赛y 11 322025 201108889 (aerylie)樹脂與環氧樹脂的混合物等之底塗層 (undercoat)用的樹脂’藉由網版（screen)印刷附著於預定 的塗佈區域，在150°C進行約4個小時左右的熱硬化。液 狀樹脂13係形成為20至40# m，埋設於第一電極部u及 第二電極部12之間以進行導電箔1〇的補強。並且，液狀 樹脂13亦埋設於各單元22彼此之間，藉此配置為一行之 多數個的各單元22係成為藉由液狀樹脂13被連結成為帶 狀的狀態。 分離用槽孔14係設於以行狀排列多個的各單元22的 第一電極部11及第二電極部丨2所鄰接的行間，以逐行分 離各單元22。分離用槽孔14係沿著行連續地延伸，並貫 通導電箔10與形成鄰接的行的第一電極部n及第二電極 部12的銅的電解鑛覆層及導電箔而形成。 絕緣用槽孔15係位於導電箔1〇的相反主面的對應於 第一電極部11及第二電極部12間之位置，且平行於用以 分離導電箔1〇之分離用槽孔14而設置，並貫通導電箔1〇 而設置。藉由該絕緣用槽孔15，將包含於各單元22的第 一電極部11及第二電極部12予以電性分離。 知接阻劑層16係覆盍絕緣用槽孔15，並設於導電落 10的相反主面，且設置於對應液狀樹脂13及安裝部17的 位置，而有補強導電箔10的功效。再且，與上述液狀樹脂 13相同，包含於各行的單元22彼此之間亦埋設有焊接阻 劑層16。從而，本形態係藉由液狀樹脂13及焊接阻劑層 16將包含於各行的單元22彼此保持為帶狀。 12 322025 201108889 接著，說明安裝基板的樣式。 ' 於第1圖（A)所示的安裝基板具體而言係切斷為100mm 'x68mm的大小。周邊係設有晝框狀的框部2，而區分為複數 個區塊3，於各區塊3各單元22係以行狀鄰接而配置。區 塊3間的橋接部4之兩端係連結於框部2，以防止由於不 需要的力造成各單元22的變形。 於各行係連續地排列有多個單元22，行間係以分離用 槽孔14分離隔離。各行係在27mm的長度中排列有30個單 元22，行係設有47行。橋接部4係形成為2. 9mm的寬度， 以補強上下的區塊3。於框部2的左右邊係設置有各兩個 對位孔5,於右下角設有缺角6用以確認正反及上下方向。 又，以鄰接於兩端的行的方式在框部2設有對應各單元22 的周端的標記7，使用於切塊程序時的對位。這些係用於 製造步驟中之與各單元22的對位，以實現極高精度的薄型 發光裝置的製造。 接著，於第1圖（B)顯示安裝基板1的表面擴大圖。 各單元22的大小為極微小的0. 8mmxl. 60mm。於鄰接的分 離用槽孔14間係在右側排列有第一電極部11，並在左側 相對向地排列有第二電極部12，兩者係間隔0. 36mm。 第一電極部11從分離用槽孔14算起係形成0.40nm 左右的寬度。 第二電極部12係包圍安裝部17,以補強安裝部17的 導電箔10。安裝部17係按照所載置的發光元件適當的設 計，而形成0. 40mmx0. 40匪。且，第二電極部12從分離用[s ] 13 322025 201108889 槽孔14算起係形成〇 84刪左右的寬度。 本貫施形態中，包含於-行的單元22彼此之間係被 刀離具體而5，參照第1圖⑻，包含於單元22A的第一 電極部11#與相鄰接的包含於單元22β㈣一電極部Η 分離而沒有連接。並且，包含於單元22Α的第二電極部ΐ2 亦與相鄰接的包含於單元22Β的第二電極部12分離。換句 話說在單元22Α及單元22Β之間，係不存在構成各單元 的導電泊等金屬材料。藉此，即使於發光裝置的製造過程 中在單點鏈線所示的部分進行基板的切斷，金屬材料也不 會被切斷，而防止了伴隨切斷產生毛邊的狀況。 再且，於各單元22彼此之間導電箔被去除的去除區 域的寬度L1係例如為1〇〇以m至2〇〇 # m左右。透過使此寬 度L1較於切斷安裝基板丨的步驟中所使用的裁切鋸的寬度 要長，可更確實地防止毛邊的產生。 並且’於第1圖（C)顯示安裝基板1的背面擴大圖。 於第一外部取出電極部24及第二外部取出電極部25之間 係設有絕緣用槽孔15。絕緣用槽孔15係進行第一外部取 出電極部24及第二外部取出電極部25的電性絕緣，由於 在強度考量上希望盡量保留導電箔1〇,故將寬幅設成最小 之0. 15mm。於鄭接的分離用槽孔η之間以從兩侧算起 〇.40mm的寬幅設有第一外部取出電極部24及第二外部取 出電極部25 ’而包含絕緣用槽孔15的中央部分係由焊接 阻劑層16所覆蓋。該焊接阻劑層16亦網版印刷於框部2 及區塊3間的橋接部4，以增加安裝基板1的全體的機械 14 322025 201108889 性強度。又，焊接阻劑層16亦印刷於安裝部17的導電箔 10的背側，以機械性地補強安裝部17並確保固著發光元 件時的機械性強度。 相同於第一電極部11及第二電極部12的情形，在安 裝基板1的底面，於鄰接的單元22彼此的邊界，金屬材料 係被去除。具體而言，包含於單元22A的第一外部取出電 極部24係與包含於單元22B的第一外部取出電極部24分 離。同樣的，包含於單元22A的第二外部取出電極部25 係與包含於單元22B的第二外部取出電極部25分離。包含 於單元22A的第一外部取出電極部24及第二外部取出電極 部25，與包含於單元22B的第一外部取出電極部24及第 二外部取出電極部25間所分離的距離，與上述L1相同即 可。藉此，由於即使關於安裝基板1的底面側，在單元22 彼此之間亦不存在構成各電極的金屬材料，故即使藉由切 斷以分離單元22彼此，仍防止了伴隨此切斷的毛邊的產 生。 也就是，即使於紙面上以單點鏈線表示的位置切斷安 裝基板1，被切斷者也僅為液狀樹脂13及焊接阻劑層16， 而不會切斷金屬材料。以此，即使以高速旋轉且沿著單點 鏈線移動的裁切鋸進行高速的基板切斷，亦精度良好地控 制切斷面而不會產生毛邊。 本發明的安裝基板1的特徵係以蝕刻形成絕緣用槽孔 15，而由於習知的印刷基板係於基板使用絕緣物，故係採 用機械性的利用起槽機（router)製作槽孔的方法。這種flfs 15 322025 201108889 形，即使提高起槽機的鑽頭（drill)的精度，寬度亦以 1. Omm為界限。由於本發明的安裝基板1係由極薄的導電 箔10所形成，故可透過蝕刻處理，而可達成習知的一半 (0. 5mm)以下的0· 2mm(200 μπι)的寬度。藉此，舉在100mm xlOOmm的安裝基板安裝1608LED(16mmx8mm的大小）的例子 作為計算，則得到以下的結果。 習知的情形中，行之間的間距（pi tch)係1. 6mm(單元 之大小）+ 1. 0mm(槽孔的寬度）而為2. 6mm，在100mm只能容 納38行。每行的單元數為125個，於是成為： 38 行xl25 個=4750 個 ，故每一片安裝基板的生產量為4750個。 相對於此，於本發明，行之間的間距為1. 6mm(單元的 大小）+0. 2mm(槽孔的寬度）而為1. 8mm，於100mm可容納55 行。每行的單元數為125個，於是形成： 55 行xl25 個=6875 個 ，故每一片安裝基板的生產量為6875個。這與習知的情形 單純以面積比做比較為144. 7%，可實現增加44. 7%的生產 量。 接著，參照第2圖至第6圖，說明關於本發明的安裝 基板及使用該安裝基板之薄型發光裝置的製造方法。 本發明的製造方法係由以下步驟所構成：以露出預定 的第一電極部及接近安裝部的第二電極部之方式，以阻劑 層覆蓋導電箔的步驟；以前述阻劑層作為遮罩選擇性地對 前述導電箔實施金屬鍍覆，而以行狀形成鄰接多個單元而 16 322025 201108889 .排=的剛述第一及第二電極部的步驟；去除前述阻劑層並 於則述V電、冶上除了前述苐一及第二電極部與前述安裝部 -之外^附著液狀樹脂的步驟；由附著前述液狀樹脂的相反 面^•刖述‘電泊進行選擇性地钱刻，以設置電性分離前述 各單元的别述第-電極部及前述第二電極部的絕緣用槽 孔及刀離淨接的則述行的單元的分離用槽孔而形成安裝 基板的步驟，钱刻並去除存在於各單元彼此之間的區域的 導電泊的步驟，·將發光元件固著於前述安裝部，並以搭接 線（bomhng wire)連接前述發光元件的電極及前述第一電 極部的步驟，·以樹脂覆蓋前述發光元件的步驟；以及藉由 切斷基板及樹脂而將各單元分離為發光裝置的步驟。 於第個步驟（第2圖（A)及（B))，以露出預定的第一 電極。ini及接近女裝部的第二電極部之方式以阻劑 層覆蓋21導電箔1 〇。 首先，如第2圖（Α)所示，備置作為導電箔的厚度 為18//m的銅箔，由於導電箔1〇極薄容易變形，故於其背 面貼附有補強用的載體薄片（carrier sheet)2〇。載體薄片 2 〇係使用以聚醋系的薄膜或丙稀酸系薄膜作為基材的高 耐熱性表面保護用薄膜。載體薄片2〇係透明且厚度在 2〇〇#m左右’具有弱黏著性，並藉由塵接以點貼於導電箔 10從而’由捲置有導電箔1 〇的滚筒供給導電箔1 〇，同 4八也亦=捲置有載體薄片2〇的滾筒供給載體薄片2〇，而 可藉由壓接滾筒貼合兩者。載體薄片2〇係保護導電箔 的變形直到於導電落10塗佈了液狀樹月旨13 $止。導電— 322025 17 201108889 ίο係可在貼附了載體薄片20後，裁切成預定的大小（例如 lOOmmxlOOmm的大小）並進行批次（batch)處理，亦可保持 為薄片狀連續地以下述步驟進行處理。 接著，如第2圖（B)所示，於導電箔10的表面以阻劑 層21覆蓋，進行曝光顯影而露出預定的第一電極部及 第一電極。卩12的導電箔1〇並留下其他的部分。阻劑層μ 係使用將光阻劑（photoresist)作成為薄膜狀的乾膜（dq film) ’並貼附於導電箔的表面。 於第二個步驟（第2圖（C))中，係以阻劑層21作為遮 罩而選擇性地對導電箔實施金屬鍍覆，並以行狀地形成 鄰接多個單元22而排列的第一及第二電極部u、12。 於本步驟，由於於導電肖1〇的背面係覆蓋有載體薄 片20，故於鋼的電解鍍覆槽中將導電箔1〇連接於陰極而 配置’在所露出的導電们G上選擇性地析出厚度為15至 的銅錢覆層’而形成第一電極部u及第二電極部 足而導電殆與第一電極部11及第二電極部a 重疊的部分係成為約40_的厚度，而可得到作為安裝基 =的足夠的機械性強度。結束電解鍍覆時，則去除阻劑層 邋：ί安裝部17、第一電極部11及第二電極部12之間的 白1〇路出。由於安裝部17係被第二電極部12以畫框 形。匕圍或接近，故可保護安裝部丨了的導電箔不致變 如」:成各單元22的第-電極部11及第二電極部12係 以行狀鄰接多個而排列，行亦為多個分離而排列。 322025 18 201108889 步驟係尚未於鄰接的行的第―電極部11及第二 二？形成分離用槽孔14’故為連結的狀態。 尸干2 7顯示本步驟的俯視圖。於第3財以陰影轉 阻劑層21，沒有任何印記的部分是導電 I路㈣部分。於該露出的導電㈣上選擇性地析出 厚的銅鑛覆層’形成第一電極部u 二 極部12。 y % 立於第三個步驟（第2圖⑼），係除了第一及第二電極 邛1卜12與安裝部17之外在導電箱1〇上附著液狀樹脂 13。 ,於本步驟，於表面覆蓋新的阻劑層19,並進行曝光顯 影而在安裝部17、第一電極部n及第二電極部12上留下 阻劑層19’僅露出第一電極部u及第二電極部12之間的 導電箔10。 接著’藉由網版印刷將液狀樹脂13選擇性地附著於 第一電極部11與第二電極部12之間的導電箔1〇。液狀樹 脂13係選擇膠狀的聚矽氧樹脂、丙烯酸系樹脂與環氧樹脂 的混合物等底塗層用的樹脂，藉由網版印刷選擇性地附著 於預定的塗佈區域，以150。(：進行約4個小時左右的熱硬 化。液狀樹脂13係形成20至40/z m，埋設於第一電極部 11及第二電極部12之間以進行導電箔1〇的補強。 結束了液狀樹脂13的補強後，則從導電箔10機械性 的剝離載體薄片20，而成為安裝基板的原形的狀態。 於第四個步驟（第2圖（E))，由附著有液狀樹脂13的s 19 322025 201108889 相反面選擇性地蝕刻導電箱10,以設置電性分離各單元22 的第一及第二電極部u、12的絕緣用槽孔15、及分離鄰 接的各行的單元的分離用槽孔14而形成安襞基板。 於本步驟，導電箔10的設有第一電極部11及第二電 極部12的表面側以保護膜34覆蓋，於背面侧以新的：劑 層36覆蓋並進行曝光顯像，以露出預定的分離用 及絕緣用槽孔15之導電箔1〇的背面侧。 接著，從導電箔1〇的背面側噴塗三氣化鐵等蝕刻·液 進行化學蝕刻，分離用槽孔14係以貫通導電箔及其上 的電解鍍覆層部分之方式進行侧而形成，絕緣用槽^ 15 係以蝕刻導電箔10並蝕刻至液狀樹脂13為止之方式形 成。任一者都是約40# m厚以下的銅箔的化學蝕刻故可極 精密地進行蝕刻，可在絕緣用槽孔15形成〇 2咖的寬度， 並可在絕緣用槽孔15形成〇15mm的寬度。且，分離用槽 孔14及絕緣用槽孔丨5係於本步驟同時地形成。 於本步驟形成的分離用槽孔14係如第4圖（A)所示， 形成於鄰接的行的第—電極部11及第二電極部12的中間 位置，並蝕刻貫通導電箔1〇及該導電箔1〇上的電解鍍覆 層部分而形成。 又，絕緣用絕緣用槽孔15係如第4圖（B)所示，製作 於第一電極部11側的液狀樹脂13之下。且，於本圖係包 含下個步驟的構成元件。 一於第五個步驟（第2圖（F))，係進行用以將薄型發光 元件安裝於前個步驟所製作的安裝基板的加工。 20 322025 201108889 首先於導電箔10的背面側以填埋絕緣用槽孔15的 方式進打環氧樹脂系的嬋接卩且劑層16的網版印刷。谭接阻 劑層16係以令導電箱1〇背面的第一電極部u及第二電極 部12露出於各單元的兩側之方式，附著於絕緣用槽孔15 及包含V電箔ίο的安裝部17的中央部分。焊接阻劑層 的任務第-是，在安裝基板的周圍及區塊間亦都被網版印 刷，以增強安裝基板的機械性強度。第二，亦附著於對應 安裝部17的導電箱1G的背面而進行發光元件的固著時的 安裝部17補強。第三，以包含絕緣用槽孔15之方式廣泛 覆盍各單το的導電箔1〇的作為外部電極而運作的第一電 極部11及第二電極部12以外區域，以與液狀樹脂13共同 補強各單元22的導電箔10。第四，分離作為露出的外部 電極而運作的第一電極部丨丨及第二電極部12間，以防止 知接橋接的形成。 . «201108889 VI. Description of the Invention: [Technical Field] The present invention relates to a mounting substrate provided with a plurality of electrodes formed by electrolytic deposition on one main surface of a thin conductive foil, and using the mounting substrate in a conductive drop A method of manufacturing a thin light-emitting device in which a light-emitting element is mounted on the upper mounting portion. [Prior Art] Fig. 7 shows a light-emitting device which prevents light emitted from a light-emitting element from being absorbed into a base substrate, and suppresses light-emission loss to improve overall luminance. Further, the light-emitting device comprises a light-emitting element, a base substrate 200, a substrate electrode portion 300, a connection electrode portion 400, a light reflection portion 5A, a hole portion 6A, and a plating layer 700. The light-emitting element 100 is a group III nitride compound semiconductor light-emitting element. The base substrate 200 is an insulating substrate made of a resin such as polyimide, glass epoxy, or BT resin, and is formed of a pair of substrates composed of a (four) film formed from the surface of the substrate to the back surface. The electrode portion 3GG and the light reflecting portion 5Q〇 formed of the film formed on the surface on the opposite side of the mounting surface of the light emitting element (10) are bored in the thickness direction measured toward the base substrate in the opposite direction of the pair of substrate electrode portions The hole portion 600 of the insulating portion, the money coating layer 700 formed of gold or silver formed on the exposed surface of the light reflecting portion 5 (9) exposed by the hole portion 6 and the inner peripheral surface of the hole portion _. Further, an electrode formed of a conductive film which is provided on the back surface of the base substrate & 200 and which is electrically connected to the substrate electrode portion 300 is attached to the connection electrode portion of the device substrate such as a mother board. 322025 4 201108889 (Prior Art Document) (Patent Document) Patent Document 1: JP-A-2005-175387 SUMMARY OF THE INVENTION PROBLEM TO BE SOLVED BY THE INVENTION The above-described light-emitting device has the following problems. For example, in the progress of miniaturization and thinning of portable terminal devices, the thinning of the light-emitting device is a market requirement. x However, in the light-emitting device of Fig. 7, since the light-emitting element 1 is disposed on the base substrate 200, the thickness after mounting needs to be at least the sum of the thickness of the light-emitting element 1GG and the thickness of the base substrate. Though the material of the base substrate 200 can be reduced in thickness, it is necessary to ensure the strength of a certain degree of support as a support member, and it is convenient to operate in consideration of the manufacturing steps, and (4) a large thickness reduction system is present. . Further, when the base substrate 200 is used, the through-hole electrodes are not available on both sides 300 and the connection electrode portions 400', and in order to connect the two electrodes, the sheet area of each unit (cen) cannot be reduced. Also, the number of manufacturing steps such as through-hole plating has been increased. Further, in the method of manufacturing a plurality of light-emitting devices having the above-described configuration, there is a method in which a conductive pattern of a plurality of devices is formed on a substrate, and a circuit element is connected to the conductive pattern After the resin is sealed, the conductive pattern and the sealing resin are cut by a dicing process to separate into each of the light-emitting devices. (4) This financial law will use the high ^ s] 322025 5 201108889 turn to cut the conductive pattern and produce the burr. When the burrs are generated, not only the appearance is damaged, but also the stability at the time of mounting or the short circuit after installation is caused. The present invention has been made in view of the above problems, and an object of the present invention is to provide a mounting substrate which can suppress generation of burrs and which can simultaneously manufacture a plurality of light-emitting devices, and a method of manufacturing a thin-type light-emitting device using the same. (Means for Solving the Problem) The mounting substrate of the present invention includes a unit in which a top surface of the conductive foil is arranged in a row in a row, and has a first electrode portion formed by electrolytic plating and a method close to the mounting portion. a liquid resin; the liquid resin is adhered to the conductive foil between the first electrode portion and the second electrode portion to reinforce the conductive foil; and the separation hole is formed through the first electrode portion of the adjacent row And the conductive foil between the second electrode portions is provided to separate the adjacent rows; the insulating slots are located between the first electrode portion and the second electrode portion, and the separation slot Provided in parallel and penetrating through the conductive foil to electrically separate the first electrode portion and the second electrode portion; and filling the resin on the bottom surface of the conductive foil to cover the insulating slot and covering the corresponding Positioning the liquid resin to reinforce the conductive foil; and removing the conductive foil included in the boundary of the same row in the same row to separate the adjacent ones The conductive foil, the conductive foil before said unit and contained in the other of the adjacent unit. The manufacturing method of the thin light-emitting device of the present invention includes plating on a top surface of the conductive foil 201108889 so as to expose a region of the unit including the first electrode portion and the second electrode portion close to the mounting portion. a step of removing the resist layer; " a step of selectively forming a plurality of the above-mentioned cells in a row by selectively plating the conductive germanium with the forged resist layer as a mask; removing the plating resist layer, And a step of attaching the liquid resin to the conductive foil except for the first and second electrode portions and the mounting portion; selectively etching the conductive crucible from the bottom surface to provide a through-the-conductive layer to provide the foregoing a step of insulating the slot in which the first electrode portion and the second electrode portion are electrically separated from each other, and a separation slot that penetrates the conductive foil to separate the adjacent rows of the cells, thereby forming a mounting substrate; forming a step of filling a resin, the filling resin covering the insulating groove from a bottom surface of the conductive foil, covering a position corresponding to the liquid resin, and reinforcing the conductive a foil; a step of removing the foregoing conductive foil of a connecting portion including the adjacent cells connected to each other in the same row by wet etching; fixing the light emitting device to the mounting portion, and connecting the electrodes of the light emitting device with a bonding wire And the step of forming the first electrode portion; forming a resin to cover the light-emitting elements included in each of the units in a row; and cutting the mounting substrate at a portion of the connecting portion where the conductive foil is removed And the aforementioned resin, and the steps of separately separating the above units. (Effects of the Invention) According to the mounting substrate of the present invention, the following effects can be obtained. According to the invention, the unit composed of the first electrode portion and the second electrode portion is provided in a row on the mounting substrate, and the conductive foil constituting each electrode portion is removed from the boundary portion between the cells. Therefore, even if the [S] 7 322025 201108889 substrate is cut off at the boundary of each unit, only the plate material will be present in the cut area, and there will be no conductive metal esist made of metal. Broken mounting of the substrate to produce burrs, = this 'because it will not be a problem. In addition, in the prior art, in order to improve the movement of various cutting drills at the working edge, the problem of burrs is highlighted when the high-speed detachment is used for the right-hand main a, but: 曰=side doubts can be high-speed Perform the separation step. r...: the removal area of each of the early boundary conductive boxes is removed, and is provided with a liquid resin and a tree-like material composed of solder resists. Therefore, the units will not be scattered until the end, but will be in a state of board and convenient to use. Further, according to the present invention, the following effects can be obtained by arranging the above-described cells in a row on the mounting substrate. In the first point, since the conductive substrate is formed by the conductive box and the first electrode portion and the second electrode portion formed by the electrolysis clock selectively formed on the surface of the conductive box, the conductive portion is 18" melon". On the other hand, the first and second electrode portions have a plating thickness of 15 to 2 () / /01, so that an Annon substrate having an extremely thin and unsupported substrate having a thickness of not more than m can be realized. Since the plurality of adjacent first electrode portions and second electrode portions are arranged in a row in the row, the plurality of cells can be collected in one row, and separated from the adjacent rows by the separation holes, so that it is also possible to achieve adjacent The spacing between rows is extremely narrowed to the conventional 1/5 〇 2 mm, whereby the number of units per substrate can be increased to a conventionally high production efficiency and cost. 322025 8 201108889 The conductive case, which is the initial material of the mounting substrate, remains until the final product, the first and second electrode portions are formed by the electrolytic clock only at the necessary positions, so that there is almost no waste and discarded raw material in the manufacturing step. Achieve environmental friendliness Fourthly, the mounting substrate is made of a conductive foil as a substrate, and is easily deformed by a force from the outside in the manufacturing step, so that the row is divided into a plurality of blocks, and the common conduction without the rows is left. The box is used to reinforce the mounting substrate. At the fifth point of the soil, since the nickel plating layer, the gold plating sound or the coating layer is laminated on the mounting portion, and the opposite main surface is covered with the filling resin, it can be accompanied by There is no strength of the fascinating illuminating element in the branch of the county (fourth). The sixth point is that the mounting substrate is made of a conductive box, and the first and second electrodes (4) are extremely thin materials but can be fixed from the security: :: The heat of the optical element is directly diffused to the entire conductive box, and: t screen, the point of the mounting portion, the first and second electrode portions of the full or silver coating can be made as a reflective layer of the light-emitting element According to the manufacturing method of the present invention, Ge Yinqian firstly manufactures the Anluqi cylinder wy, which is realized by the material of the conductive foil opening and the minimum thickness, and can form the thickness of the female skirt substrate. A method of manufacturing an optical device. ======================================================================================================== [9 322025 201108889 The smallest mounting substrate and thin illuminating device are realized. Thirdly, since the second electrode portion, the liquid resin and the filling resin are used to reinforce the conductive foil which is difficult to resist deformation, the mounting using the unsupported substrate can be realized. A method of manufacturing a thin-type light-emitting device of a substrate. Fourthly, a mold of a light-emitting element is formed by the harmony of a resin of a liquid resin and a transparent resin, and most of them are conductive foils and electrolytic plating layers. In the fifth place, the light-emitting device can be manufactured in a large number by a plurality of rows arranged in a row, and the adjacent rows can be separated by the separation grooves, so that the cutting can be performed in one direction. The block program is kept to a minimum, and the adverse effects of the dicing process on the package are prevented. Sixth, in the present invention, the step of electrolytically plating the first electrode portion and the second electrode portion, the step of attaching the liquid resin, the etching step of the separation groove and the insulating groove, and the printing step of filling the resin And a method of manufacturing a thin light-emitting device by a very small number of steps in the electrolytic plating step of the conductive metal layer. [Embodiment] Embodiments of the present invention will be described with reference to Figs. 1 to 6 . First, the mounting substrate of the present invention is shown in Fig. 1. Fig. 1(A) is a plan view of the mounting substrate, an enlarged view of the surface of Fig. 1(B), and an enlarged view of the back surface of Fig. 1(C). The mounting substrate 1 of the present embodiment is composed of a conductive foil 10, a first electrode portion 11, a second electrode portion 12, a liquid resin 13, a separation slot 14, an insulating slot 15, and a solder resist layer 16. 10 322025 201108889 In the case of conductive foils, select metals that can be etched and electrolytically plated. The sorrow is based on a metal foil made of copper. The copper foil is selected to have an extremely thin thickness of 9, 12, 18 or 35/m, and since the copper foil is a mounting substrate for a thin light-emitting device, it is preferably as thin as possible. When the copper foil is too thin, wrinkles may occur due to the urging deformation during the processing in the manufacturing apparatus in the step and during transportation, so that it is selected in the range of 12 to 2 〇〇//111. The first electrode portion 11 and the second electrode portion 12 are selectively formed on the surface of the conductive foil 10 by electrolytic plating of copper to form a thickness in the range of 15 to 2 Å//111. The first electrode portion 11 and the second electrode portion 12 are disposed to face each other, and the second electrode portion 12 is disposed close to the mounting portion 17 formed of the conductive foil 1A. Since the mounting portion π is formed only of the conductive foil 1 而 and is difficult to resist deformation, it is preferable that the second electrode portion 12 surrounds the mounting portion 17 and is formed in a frame shape as reinforcement. The mounting portion 17 is fixed to a region such as a light-emitting element, and it is desirable to make the thin-type light-emitting device as thin as possible. However, since it is necessary to have the strength of the moonlight-emitting light-emitting device, the second electrode portion and The solder resist layer 16 provided on the back surface of the conductive foil 10 to be described later is reinforced. In the present embodiment, the first electrode portion 11 and the second electrode portion 12 constitute a unit 22 for constituting one light-emitting device. Further, the unit 22 is arranged in a plurality of rows in an elongated region sandwiched by the separation slots. The liquid resin 13 adheres to a region other than the first electrode portion 11 and the second electrode portion 12 surrounding the mounting portion 17, on the surface of the conductive foil 1. The liquid resin 13 is a resin for undercoat which is selected from the group consisting of a gelatinous silica resin, a acryl y 11 322025 201108889 (aerylie) resin and an epoxy resin mixture. The screen printing was attached to a predetermined coating area, and heat hardening was performed at 150 ° C for about 4 hours. The liquid resin 13 is formed to be 20 to 40 #m, and is embedded between the first electrode portion u and the second electrode portion 12 to reinforce the conductive foil 1〇. Further, the liquid resin 13 is also embedded in each of the cells 22, and a plurality of the cells 22 arranged in a row are connected to each other in a strip shape by the liquid resin 13. The separation slot 14 is provided between the rows adjacent to the first electrode portion 11 and the second electrode portion 丨2 of each of the plurality of cells 22 arranged in a row, and separates the cells 22 row by row. The separation slits 14 are continuously formed along the row, and are formed by passing through the conductive foil 10 and the electrolytic coating layer and the conductive foil of the copper forming the first electrode portion n and the second electrode portion 12 of the adjacent rows. The insulating slot 15 is located at a position opposite to the first electrode portion 11 and the second electrode portion 12 on the opposite main surface of the conductive foil 1〇, and is parallel to the separation slot 14 for separating the conductive foil 1〇. Set and set through the conductive foil 1〇. The first electrode portion 11 and the second electrode portion 12 included in each unit 22 are electrically separated by the insulating hole 15 . The resistive layer 16 is formed to cover the insulating via hole 15 and is provided on the opposite main surface of the conductive pad 10, and is provided at a position corresponding to the liquid resin 13 and the mounting portion 17, and has the effect of reinforcing the conductive foil 10. Further, similarly to the liquid resin 13, the solder resist layer 16 is embedded in the cells 22 included in each row. Therefore, in the present embodiment, the cells 22 included in the respective rows are held in a strip shape by the liquid resin 13 and the solder resist layer 16. 12 322025 201108889 Next, the style of the mounting substrate will be explained. Specifically, the mounting substrate shown in Fig. 1(A) is cut to a size of 100 mm 'x68 mm. The frame portion 2 having a frame shape is provided in the periphery, and is divided into a plurality of blocks 3, and each of the cells 22 in each block 3 is arranged adjacent to each other in a row. Both ends of the bridge portion 4 between the blocks 3 are coupled to the frame portion 2 to prevent deformation of each unit 22 due to an unnecessary force. A plurality of cells 22 are successively arranged in each row, and the rows are separated and separated by the separation slots 14. Each row has 30 cells 22 arranged in a length of 27 mm and 47 rows in a row. The bridge portion 4 is formed to have a width of 2. 9 mm to reinforce the upper and lower blocks 3. Two alignment holes 5 are provided on the left and right sides of the frame portion 2, and a notch angle 6 is provided on the lower right corner to confirm the front and back directions. Further, the mark 7 corresponding to the peripheral end of each unit 22 is provided in the frame portion 2 so as to be adjacent to the rows at both ends, and is used for alignment in the dicing program. These are used in the manufacturing step to align with the respective units 22 to realize the manufacture of a thin-type light-emitting device of extremely high precision. Next, an enlarged view of the surface of the mounting substrate 1 is shown in FIG. 1(B). The size of each unit 22 is very small 0. 8mmxl. 60mm. The first electrode portion 11 is arranged on the right side of the adjacent separation slot 14 and the second electrode portion 12 is arranged on the left side with a spacing of 0.36 mm. The first electrode portion 11 is formed to have a width of about 0.40 nm from the separation slot 14 . The second electrode portion 12 surrounds the mounting portion 17 to reinforce the conductive foil 10 of the mounting portion 17. 40毫米。 The mounting portion 17 is formed according to the appropriate design of the light-emitting elements, forming 0. 40mmx0. 40匪. Further, the second electrode portion 12 is formed from the slot [s] 13 322025 201108889 for the separation to form a width of the yoke 84. In the present embodiment, the cells 22 included in the row are separated from each other by a knife 5, and referring to FIG. 1 (8), the first electrode portion 11# included in the cell 22A and the adjacent electrode are included in the cell 22β (four). One electrode portion 分离 is separated without connection. Further, the second electrode portion ΐ2 included in the unit 22A is also separated from the adjacent second electrode portion 12 included in the unit 22A. In other words, between the unit 22 and the unit 22, there is no metal material such as a conductive poise constituting each unit. Thereby, even if the substrate is cut at the portion indicated by the single-dot chain line in the manufacturing process of the light-emitting device, the metal material is not cut, and the occurrence of burrs accompanying the cutting is prevented. Further, the width L1 of the removal region where the conductive foil is removed between the respective units 22 is, for example, about 1 to about 2 〇〇 #m. By making this width L1 longer than the width of the cutting saw used in the step of cutting the mounting substrate ,, the generation of burrs can be more reliably prevented. Further, an enlarged view of the back surface of the mounting substrate 1 is shown in Fig. 1(C). An insulating groove 15 is formed between the first outer extraction electrode portion 24 and the second outer extraction electrode portion 25. The insulating slot 15 is electrically insulated from the first external extraction electrode portion 24 and the second external extraction electrode portion 25. Since it is desirable to retain the conductive foil 1〇 as much as possible in terms of strength, the width is set to a minimum of 0. 15mm. Between the separation slots η of Zheng Zheng, the first outer extraction electrode portion 24 and the second outer extraction electrode portion 25' are provided with a width of 40 mm from both sides, and the center of the insulating slot 15 is included. Part of it is covered by a solder resist layer 16. The solder resist layer 16 is also screen printed on the bridge portion 4 between the frame portion 2 and the block 3 to increase the mechanical strength of the entire mounting substrate 1. Further, the solder resist layer 16 is also printed on the back side of the conductive foil 10 of the mounting portion 17, to mechanically reinforce the mounting portion 17 and to secure the mechanical strength when the light-emitting element is fixed. In the same manner as the first electrode portion 11 and the second electrode portion 12, the metal material is removed at the boundary between the adjacent cells 22 on the bottom surface of the mounting substrate 1. Specifically, the first external extraction electrode portion 24 included in the unit 22A is separated from the first external extraction electrode portion 24 included in the unit 22B. Similarly, the second external extraction electrode portion 25 included in the unit 22A is separated from the second external extraction electrode portion 25 included in the unit 22B. The distance separating the first outer extraction electrode portion 24 and the second outer extraction electrode portion 25 included in the unit 22A from the first outer extraction electrode portion 24 and the second outer extraction electrode portion 25 included in the unit 22B, and the above L1 is the same. Therefore, even if the metal material constituting each electrode is not present between the cells 22 with respect to the bottom surface side of the mounting substrate 1, even if the separation unit 22 is separated by cutting, the burrs accompanying the cutting are prevented. The production. That is, even if the mounting substrate 1 is cut at a position indicated by a single-dot chain line on the paper surface, only the liquid resin 13 and the solder resist layer 16 are cut, and the metal material is not cut. As a result, even if the cutting saw that moves at a high speed and moves along the single-dot chain line performs high-speed substrate cutting, the cut surface is accurately controlled without burrs. The mounting substrate 1 of the present invention is characterized in that the insulating slot 15 is formed by etching, and since the conventional printed circuit board uses an insulator for the substrate, a mechanical groove forming method is used. . This flfs 15 322025 201108889 shape, even if the accuracy of the drill of the grooved machine is improved, the width is limited to 1. Omm. Since the mounting substrate 1 of the present invention is formed of an extremely thin conductive foil 10, it can be etched to achieve a width of 0. 2 mm (200 μm) which is less than half (0.5 mm). Thus, an example of mounting 1608 LED (16 mm x 8 mm size) on a mounting board of 100 mm x 100 mm was calculated, and the following results were obtained. In the conventional case, the pitch between the lines (pi tch) is 1. 6 mm (the size of the unit) + 1. 0 mm (the width of the slot) and is 2. 6 mm, and can accommodate only 38 lines at 100 mm. The number of cells per row is 125, so it becomes: 38 rows xl25 = 4750, so the production capacity of each mounting substrate is 4750. 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The number of cells per row is 125, so that 55 rows x 15 words = 6875 are formed, so the production capacity of each mounting substrate is 6875. This is in contrast to the conventional situation. The ratio of area ratio is 144.7%, which can increase the production by 44.7%. Next, a mounting substrate of the present invention and a method of manufacturing a thin light-emitting device using the same will be described with reference to Figs. 2 to 6 . The manufacturing method of the present invention comprises the steps of: covering a conductive foil with a resist layer in such a manner as to expose a predetermined first electrode portion and a second electrode portion close to the mounting portion; and using the resist layer as a mask Optionally, the conductive foil is metal plated, and the steps of forming the adjacent first and second electrode portions adjacent to the plurality of cells are formed in a row; the resist layer is removed and the V is removed. a step of attaching a liquid resin in addition to the first and second electrode portions and the mounting portion described above, and attaching the liquid resin to the opposite side of the liquid resin to selectively electively engrave a step of forming a mounting substrate by electrically separating the insulating slot of the first electrode portion and the second electrode portion of the respective units and the separating slot of the unit that is disconnected from the blade. The step of engraving and removing the conductive mooring existing in the area between the units, fixing the light emitting element to the mounting portion, and connecting the electrode of the light emitting element and the first electrode by a bomhng wire Ministry Step, the step of covering the resin-emitting element; and by cutting the resin substrate and the step of separating each unit light emitting device. In the first step (Fig. 2 (A) and (B)), the predetermined first electrode is exposed. The ini and the second electrode portion close to the women's section cover the 21 conductive foil 1 以 with a resist layer. First, as shown in Fig. 2 (Α), a copper foil having a thickness of 18/m as a conductive foil is provided, and since the conductive foil 1 is extremely thin and easily deformed, a carrier sheet for reinforcement is attached to the back surface thereof ( Carrier sheet) 2〇. Carrier Sheet 2 A film of high heat resistance surface protection using a polyester film or an acrylic film as a substrate is used. The carrier sheet 2 is transparent and has a thickness of about 2 Å #m', and has a weak adhesive property, and is attached to the conductive foil 10 by dusting to supply the conductive foil 1 by a roller on which the conductive foil 1 is wound. In the same manner, the roller is supplied with the carrier sheet 2〇, and the carrier sheet 2 is attached, and both of them can be attached by a pressure roller. The carrier sheet 2 is used to protect the conductive foil from deformation until the conductive layer 10 is coated with a liquid-like tree. Conductive - 322025 17 201108889 ίο After the carrier sheet 20 is attached, it can be cut into a predetermined size (for example, a size of 100 mm x 100 mm) and subjected to batch processing, or can be kept in a sheet form continuously in the following steps. deal with. Next, as shown in Fig. 2(B), the surface of the conductive foil 10 is covered with a resist layer 21, and exposure and development are performed to expose a predetermined first electrode portion and a first electrode. The conductive foil of 卩12 is 1 〇 and leaves other parts. The resist layer μ is a dry film (dq film) in which a photoresist is formed as a film and attached to the surface of the conductive foil. In the second step (Fig. 2(C)), the conductive foil is selectively plated with the resist layer 21 as a mask, and the plurality of cells 22 are arranged in a row to form a row. First and second electrode portions u, 12. In this step, since the back surface of the conductive film 1 is covered with the carrier sheet 20, the conductive foil 1〇 is connected to the cathode in the electrolytic plating bath of the steel, and the arrangement is 'selectively on the exposed conductive members G. a portion in which the first electrode portion u and the second electrode portion are formed to form a first electrode portion u and a second electrode portion, and a portion where the conductive ridge overlaps the first electrode portion 11 and the second electrode portion a is formed to have a thickness of about 40 mm. A sufficient mechanical strength as a mounting base = can be obtained. When the electrolytic plating is completed, the resist layer 去除: ί is removed from the mounting portion 17, the first electrode portion 11, and the second electrode portion 12. Since the mounting portion 17 is framed by the second electrode portion 12. When the circumference is close to or close to each other, the conductive foil which is protected from the mounting portion is not changed as follows: the first electrode portion 11 and the second electrode portion 12 of each unit 22 are arranged in a row and adjacent to each other, and the rows are also plural. Arrange and separate. 322025 18 201108889 The steps are not yet in the first electrode part 11 and the second part of the adjacent row? The separation groove 14' is formed so as to be connected. The corpse 2 7 shows a top view of this step. In the third fiscal year, the shadow-transfer layer 21, the portion without any imprint, is the conductive I-way (four) portion. A thick copper ore coating is selectively deposited on the exposed conductive (four) to form a first electrode portion u-dipole portion 12. y % is set in the third step (Fig. 2 (9)), and the liquid resin 13 is attached to the conductive case 1 except for the first and second electrodes 121 and 12 and the mounting portion 17. In this step, a new resist layer 19 is covered on the surface, and exposure development is performed to leave a resist layer 19 ′ on the mounting portion 17 , the first electrode portion n and the second electrode portion 12 to expose only the first electrode portion. The conductive foil 10 between the u and the second electrode portion 12. Next, the liquid resin 13 is selectively attached to the conductive foil 1 之间 between the first electrode portion 11 and the second electrode portion 12 by screen printing. The liquid resin 13 is a resin for an undercoat layer such as a gel-like polyoxyn resin, a mixture of an acrylic resin and an epoxy resin, and is selectively adhered to a predetermined coating region by screen printing to 150. (: Thermal hardening is performed for about 4 hours. The liquid resin 13 is formed to be 20 to 40/zm, and is buried between the first electrode portion 11 and the second electrode portion 12 to reinforce the conductive foil 1〇. After the liquid resin 13 is reinforced, the carrier sheet 20 is mechanically peeled off from the conductive foil 10 to be in the original state of the mounting substrate. In the fourth step (Fig. 2 (E)), the liquid resin is adhered thereto. s 19 322025 201108889 on the opposite side selectively etches the conductive box 10 to provide an insulating slot 15 for electrically separating the first and second electrode portions u, 12 of each unit 22, and separating the cells of the adjacent rows The separation hole 14 is formed to form an ampoule substrate. In this step, the surface side of the conductive foil 10 on which the first electrode portion 11 and the second electrode portion 12 are provided is covered with a protective film 34, and a new layer is formed on the back side. 36 is covered and subjected to exposure development to expose the back side of the conductive foil 1 of the predetermined separation and insulation slot 15. Next, an etching solution such as three-iron-iron is sprayed from the back side of the conductive foil 1 进行 to carry out chemistry. The etching and separation slot 14 is formed to penetrate the conductive foil and the electrolysis thereon The coating portion is formed side by side, and the insulating groove 15 is formed so as to etch the conductive foil 10 and etch it to the liquid resin 13. Any of them is a chemical etching of a copper foil of about 40 #m thick or less. Therefore, the etching can be performed extremely precisely, and the width of the insulating hole 15 can be formed, and the width of the insulating hole 15 can be formed to be 15 mm. The separation hole 14 and the insulating hole 丨 5 The separation hole 14 formed in this step is formed at an intermediate position between the first electrode portion 11 and the second electrode portion 12 of the adjacent rows as shown in FIG. 4(A). And the etching is performed through the conductive foil 1 and the portion of the electroplated layer on the conductive foil 1A. The insulating insulating trench 15 is formed in the first electrode portion 11 as shown in FIG. 4(B). The liquid resin 13 on the side is underneath. In this figure, the constituent elements of the next step are included. In the fifth step (Fig. 2(F)), the thin light-emitting device is mounted on the previous one. The processing of the mounting substrate produced in the step. 20 322025 201108889 First on the back side of the conductive foil 10 The epoxy resin is bonded to the screen by the epoxy resin, and the resist layer 16 is formed by the first electrode portion u and the first surface of the conductive case 1 The two electrode portions 12 are exposed to both sides of each unit, and are attached to the central portion of the insulating slot 15 and the mounting portion 17 including the V foil. The task of soldering the resist layer is to surround the mounting substrate. The blocks are also screen-printed to enhance the mechanical strength of the mounting substrate. Secondly, the mounting portion 17 is fixed to the back surface of the conductive case 1G corresponding to the mounting portion 17 to fix the light-emitting element. Thirdly, the first electrode portion 11 and the second electrode portion 12 which operate as external electrodes of the conductive foil 1A of each of the single τ opa are covered so as to cover the liquid resin 13 with the liquid resin 13 The conductive foil 10 of each unit 22 is collectively reinforced. Fourth, the first electrode portion 运作 and the second electrode portion 12 which operate as the exposed external electrodes are separated to prevent the formation of the bridge. «
' I 接著，藉由電解鍍覆將導電性金屬層23附著於安裝 基板1之露出的第一電極部u.、.安裝部17及第二電極部 12。導電性金屬層23係為可進柠搭接的高硬度多層金屬 層。於此係例如鎳（Ni) —金（AU)層，或係Ni—竑層。又， 亦可為使用鈀（Pd)等的Ni —Pd層，或Ag—Pd層。Ni為硬 度高的金屬層，Au層或Ag層係可與金屬細線28搭接。 在此，安裝基板1除了被液狀樹脂13及焊接阻劑層 16所覆蓋的部分以外，在未形成新的遮罩之狀態進行電解 鍍覆。於導電箔10的表面側的第一電極部11及第二電極 部12及安裝部17鍍覆導電性金屬層23，並於導電落1〇 [ r 322025 21 201108889 的背面舰覆於成為外縣出電極設在㈣的第—外部取 出電極部24及第二外部取出電極部25。鎳層係形成約 5_’而金、銀或麵層約形成〇 2_，利用錄層的硬度兼 而補強安裝部17。金、銀或鈀層除了可進行搭接，亦；作 為發光元件的反射層的功效。 並且’於本步驟’係進行經甴導電落的連結部通電的 電解锻覆處理。具體而言，如第4圖⑷所示，以行狀排列 的各單元22係經由由導㈣構成的連結部（纏細的部幻 連接。從而’於步驟中，係經由該連接部通電，而藉由電 解鍵覆處獅成鍍覆膜。又，該連接部分係於後續的步驟 去除。 於第六個步驟中，參照第5圖，係藉由去除設於各單 元22彼此間的金屬材料，防止於最終進行的分離步驟中產 生毛邊。第5圖（A)係顯币安褒基板的頂面的平面圖，第5 圖（B)係顯示安裝基板的底面的平面圖，而第5圖〇至第 5圖（E)係於第5圖（A)的c_c，線的剖面圖。 參照第5圖（A)，藉由上述的步驟於安裝基板i的頂 面以行狀设置由第一電極部U及第二電極部12構成的單 元22。由於於各單元22彼此間設有液狀樹脂13，故乍看 之下各單元22雖似乎是互相分離，但在本步驟以前，行狀 排列的單元22彼此係因為由液狀樹脂13所覆蓋的導電箔 而仍為連接的狀態。示意此狀態的是第5圖（c)。 >…、第5圖（B)，在考裝基板的底面，包含於鄰接的 單元2 2的第一外部取出電極部2 4及第二外部.取出電極部 322025 22 201108889 25係藉由導電箔相互連接。從而，當對保持此狀態於單元 22彼此的邊界進行切斷處理時，則會因為切斷導電箔而產 生毛邊。於本步驟，係透過蝕刻去除位於單元22彼此間的 導電箱’猎以設置去除區域30。也就是’精由預先去除配 置於於之後的步驟進行切斷加工的領域的導電膜，以抑制 毛邊的產生。 參照第5圖（D)的剖面圖，於本步驟中，首先，以覆 蓋包含於各單元22的第一外部取出電極部24的底面，並 且使上述去除區域30的導電箔露出的方式形成阻劑32。 實際上，構成設於導電箔10的底面的第一外部取出電極部 24的鍍覆膜係被阻劑32選擇性地覆蓋。並且，透過由下 方進行濕蝕刻，將去除區域30的導電箔10及鍍覆膜予以 去除。該钮刻係在到達液狀樹脂13為止連續的進行，以完 全地去除存在於去除區域30的金屬材料。又，為了保護配 置於導電箔10頂面的第一電極部11及第二電極部12不受 本步驟的蝕刻，而以未圖示的保護膜保護第一電極部11 及第二電極部12。本步驟結束後，阻劑32係被剝離。 參照第5圖（E)，接著，於導電箔10被去除的去除區 域30埋設新的充填樹脂38。具體而言，藉由充填液狀或 半固態的環氡樹脂或聚矽氧樹脂等於去除區域30後，進行 加熱硬化，以形成充填樹脂38。 透過以上步驟以製造多個以行狀配置了單元22的安 裝基板。該安裝基板1係如參照第1圖（B)及第1圖（C)所 說明，在各單元彼此間去除導電箔等金屬材料。因此即使s] 23 322025 201108889 為了使各單元22分離而切斷安裝基板1，亦不會切斷金屬 材料，故可實現了防止毛邊產生的分離步驟。 接著如第6圖（A)及（B)所示，進行薄型發光裝置的組 裝。 於第七個步驟（第6圖（A))中，係於安裝部17固著發 光元件26，並以搭接線連接發光元件26的電極與第一電 極部11。 於本步驟，發光元件26的陰極電極係以接著劑27固 著於安裝部17上。發光元件26的固著係使用貼片機（chip mounter)。發光元件26實際所被固著者，係安裝部的導電 性金屬層23。安裝部17係以被第二電極部12圍繞而形 成，故將發光元件26安裝至該安裝部17内部時容易辨認 位置。 接著劑27係為銀（Ag)等導電性膠。發光元件26亦可 藉由安裝部17的金（Au)鑛覆層與Au共晶而固著。 並且，透過使用金製的金屬細線28,以搭接器（bonder) 一邊對第1電極部11的位置進行圖案辨識一邊進行超音波 熱壓接，以連接發光元件26的陽極電極及第一電極部11 的導電性金屬層23。此外、發光元件26的陰極電極係透 過接著劑27直接地與第二電極部12連接。 於第八個步驟（第6圖（B))，係以透明樹脂29覆蓋發 光元件2 6。 於本步驟，係以透明樹脂29覆蓋發光元件26及金屬 細線28。透明樹脂29係保護發光元件26及金屬細線28 24 322025 201108889 不接觸外部氣體，且亦有透出光的透鏡的作用。 ' 透明樹脂29係使用模鑄成形模具透過轉移成形 • (transfer mold)或射出成形（injection mold)形成。關於 所成形的透明樹脂29，由於在安裝部17的第二電極部12 的周邊係以液狀樹脂13包圍三邊，故因為同為樹脂的液狀 樹脂13及透明樹脂29的特性而可保持良好的接著強度。 是故被各別地分離後，由於透明樹脂29所具有的強度，儘 管在薄型之下仍可維持發光裝置的形狀。 模鑄成形模具係配置成與分離用槽孔14、第一電極部 11及第二電極部12的一部份重疊，並僅於安裝基板1的 表面側注入透明樹脂29而進行模鑄成形。此時因透明樹脂 29與包圍安裝部17的第二電極部12的三邊的液狀樹脂13 有優良的配適性，故可良好地進行接著並封裝發光元件 26 ° 於第九個步驟（第6圖（C))，係依各單元22予以分割 為個別的發光裝置。 於本步驟中，由於多個單元22係以行狀排列，故各 行的透明樹脂29係以分離用槽孔分隔，而顯現為連續的一 條樹脂模鑄件。於是，鄰接於安裝基板的各行而排列的多 個單元係藉由切塊程序分離為各別的已完成的發光裝置。 透過對行進行正交的切塊程序，鄰接的單元22即可藉由分 離用槽孔14各別地分離。 於本步驟中，係同時分割透明樹脂29及附著有透明 樹脂29的安裝基板1。參照第1圖（B)及第1圖（C)，安裝[s] 25 322025 201108889 基板i係於單點鏈線所示的位置被切斷。如上所述，於安 裝基板1被切斷的部分（單元22彼此之間的區域），導電箔 及鍍覆膜等金屬材料係被去除。從而，僅切斷安裝基板1 由樹脂所構成的部分，故沒有因為本步驟的切斷而產生的 毛邊。並且，可加快切斷透明樹脂29及安裝基板1的速度 以提高生產力。 再且，參照第1圖（B)，分離單元22彼此間的寬度L1， 係設定為較使用於本步驟的分離的裁切鋸的寬度要寬。從 而，避開單元22中所含的電極而進行由裁切鋸所為之分 離，故能以不產生毛邊之方式進行分離。 【圖式簡單說明】 第1圖係本發明安裝基板的（A)俯視圖、（B)表面擴大 圖、（C)背面擴大圖。 第2圖係使用於本發明的安裝基板的製造方法說明 圖，而（A)至（F)係剖面圖。 第3圖係說明本發明的製造方法的俯視圖。 第4圖係本發明的製造方法的說明圖，（A)為俯視圖、 而（B)為仰視圖。 第5圖係本發明的製造方法的說明圖，（A)為俯視圖、 (B)為仰視圖、而（C)至（E)為剖面圖。 第6圖係說明本發明的製造方法的剖面圖，（A)及（B 為剖面圖）、而（C)為平面圖。 第7圖係說明習知的發光裝置的剖面圖。 【主要元件符號說明】 26 322025 201108889 1 安裝基板 2 框部 3 區塊 4 橋接部 5 對位孔 6 切角部 7 標記 10 導電箔 11 第一電極部 12 第二電極部 13 液狀樹脂 14 分離用槽孔 15 絕緣用槽孔 16 焊接阻劑層 17 安裝部 19,21,36 阻劑層 20 載體薄片 22,22A，22B 單元 23 導電性金屬層 24 第一外部取出 電極部 25 第二外部取出電極部 26 發光元件 27 接著劑 28 金屬細線 29 透明樹脂 30 去除區域 32 阻劑 34 保護膜 38 充填樹脂 100 發光元件 200 基底基板 300 基板電極 400 連接電極部 500 光反射部 600 孔部 700 鍵覆層 L1 寬度 322025' I Next, the conductive metal layer 23 is adhered to the exposed first electrode portion u., the mounting portion 17 and the second electrode portion 12 of the mounting substrate 1 by electrolytic plating. The conductive metal layer 23 is a high-hardness multilayer metal layer which can be grafted with lime. This is for example a nickel (Ni)-gold (AU) layer or a Ni-germanium layer. Further, a Ni-Pd layer such as palladium (Pd) or an Ag-Pd layer may be used. Ni is a metal layer having a high hardness, and the Au layer or the Ag layer may be overlapped with the fine metal wires 28. Here, the mounting substrate 1 is subjected to electrolytic plating in a state where a new mask is not formed, except for the portion covered by the liquid resin 13 and the solder resist layer 16. The first electrode portion 11 and the second electrode portion 12 and the mounting portion 17 on the surface side of the conductive foil 10 are plated with a conductive metal layer 23, and are deposited on the back side of the conductive layer 1 r [32222 21 201108889] The output electrode is provided in the first outer extraction electrode portion 24 and the second outer extraction electrode portion 25 of (4). The nickel layer is formed to be about 5 mm', and the gold, silver or surface layer is formed into approximately 〇 2_, and the mounting portion 17 is reinforced by the hardness of the recording layer. In addition to the bonding of the gold, silver or palladium layers, it also serves as a reflective layer for the light-emitting elements. Further, in the present step, an electrolytic forging treatment in which the connection portion of the crucible is electrically connected is energized. Specifically, as shown in FIG. 4 (4), each unit 22 arranged in a row is connected via a connecting portion (four) which is formed by a guide (four). Thus, in the step, the unit is energized via the connecting portion. The lion is coated with a plating film by an electrolytic bond. Further, the connecting portion is removed in a subsequent step. In the sixth step, referring to FIG. 5, the metal material disposed between each unit 22 is removed. To prevent burrs from being formed in the final separation step. Fig. 5(A) is a plan view of the top surface of the ampule substrate, and Fig. 5(B) is a plan view showing the bottom surface of the mounting substrate, and Fig. 5 5(E) is a cross-sectional view taken along line c_c of Fig. 5(A). Referring to Fig. 5(A), the first electrode is arranged in a row on the top surface of the mounting substrate i by the above-described steps. The unit U composed of the portion U and the second electrode portion 12. Since the liquid resin 13 is provided between the units 22, the units 22 seem to be separated from each other at first glance, but are arranged in a row before this step. The units 22 are still connected to each other because of the conductive foil covered by the liquid resin 13. Fig. 5(c) shows this state. >..., Fig. 5(B), the first external extraction electrode portion 24 and the second portion of the adjacent unit 2 are included on the bottom surface of the test substrate. Externally, the electrode portion 322025 22 201108889 25 is connected to each other by a conductive foil. Therefore, when the boundary between the cells 22 is cut in this state, burrs are formed by cutting the conductive foil. The conductive box located between the units 22 is removed by etching to set the removal area 30. That is, the conductive film in the field in which the cutting process is performed by removing the step disposed in advance is performed to suppress the generation of burrs. Referring to the cross-sectional view of Fig. 5(D), in this step, first, the bottom surface of the first external extraction electrode portion 24 included in each unit 22 is covered, and the conductive foil of the removal region 30 is exposed to form a resistance. In other words, the plating film constituting the first external extraction electrode portion 24 provided on the bottom surface of the conductive foil 10 is selectively covered by the resist 32. Further, by performing wet etching from below, the region 30 is removed. guide The electric foil 10 and the plating film are removed. The button is continuously formed until reaching the liquid resin 13 to completely remove the metal material present in the removal region 30. Further, in order to protect the top surface of the conductive foil 10 The first electrode portion 11 and the second electrode portion 12 are not etched in this step, and the first electrode portion 11 and the second electrode portion 12 are protected by a protective film (not shown). After the end of the step, the resist 32 is peeled off. Referring to Fig. 5(E), next, a new filling resin 38 is buried in the removal region 30 where the conductive foil 10 is removed. Specifically, by filling a liquid or semi-solid cyclic resin or polyoxyl resin After the region 30 is removed, heat curing is performed to form the filling resin 38. Through the above steps, a plurality of mounting substrates in which the cells 22 are arranged in a row are manufactured. The mounting substrate 1 is made of a metal material such as a conductive foil removed between the respective units as described with reference to Figs. 1(B) and 1(C). Therefore, even if s] 23 322025 201108889, in order to separate the respective units 22 and cut the mounting substrate 1, the metal material is not cut, so that the separation step for preventing the occurrence of burrs can be achieved. Next, as shown in Fig. 6 (A) and (B), the assembly of the thin type light-emitting device is carried out. In the seventh step (Fig. 6(A)), the light-emitting element 26 is fixed to the mounting portion 17, and the electrode of the light-emitting element 26 and the first electrode portion 11 are connected by a bonding wire. In this step, the cathode electrode of the light-emitting element 26 is fixed to the mounting portion 17 with an adhesive 27. The fixing of the light-emitting element 26 uses a chip mounter. The light-emitting element 26 is actually a fixer, and is a conductive metal layer 23 of the mounting portion. Since the mounting portion 17 is formed to be surrounded by the second electrode portion 12, the position of the light-emitting element 26 when it is attached to the inside of the mounting portion 17 is easily recognized. The adhesive 27 is a conductive paste such as silver (Ag). The light-emitting element 26 can also be fixed by eutectic with Au in the gold (Au) ore layer of the mounting portion 17. Further, by using a metal thin wire 28 made of gold, ultrasonic welding is performed while patterning the position of the first electrode portion 11 by a bonder to connect the anode electrode and the first electrode of the light-emitting element 26. The conductive metal layer 23 of the portion 11. Further, the cathode electrode of the light-emitting element 26 is directly connected to the second electrode portion 12 via the adhesive 27. In the eighth step (Fig. 6(B)), the light-emitting element 26 is covered with a transparent resin 29. In this step, the light-emitting element 26 and the thin metal wires 28 are covered with a transparent resin 29. The transparent resin 29 protects the light-emitting element 26 and the metal thin wires 28 24 322025 201108889 It does not contact the outside air, and also functions as a lens that transmits light. The transparent resin 29 is formed by a transfer molding or a injection mold using a die-casting mold. Since the liquid resin 13 is surrounded by the liquid resin 13 in the periphery of the second electrode portion 12 of the mounting portion 17, the liquid resin 13 and the transparent resin 29 are retained as properties of the resin. Good adhesion strength. Therefore, after being separated separately, the shape of the light-emitting device can be maintained even under the thin shape due to the strength of the transparent resin 29. The mold for molding is disposed so as to overlap a portion of the separation hole 14, the first electrode portion 11, and the second electrode portion 12, and the transparent resin 29 is injected only on the surface side of the mounting substrate 1 to perform molding. At this time, since the transparent resin 29 has excellent compatibility with the liquid resin 13 on the three sides of the second electrode portion 12 surrounding the mounting portion 17, the light-emitting element can be satisfactorily packaged and sealed in the ninth step (the first step). 6 (C)) is divided into individual light-emitting devices according to each unit 22. In this step, since the plurality of cells 22 are arranged in a row, the transparent resins 29 of the respective rows are separated by the slits for separation, and appear as a continuous resin molded article. Thus, a plurality of cells arranged adjacent to each row of the mounting substrate are separated into individual completed light-emitting devices by a dicing process. The adjacent cells 22 can be separated by the separation slots 14 by orthogonally dicing the rows. In this step, the transparent resin 29 and the mounting substrate 1 to which the transparent resin 29 is attached are simultaneously divided. Referring to Fig. 1 (B) and Fig. 1 (C), mounting [s] 25 322025 201108889 The substrate i is cut at the position indicated by the single-dot chain line. As described above, in the portion where the mounting substrate 1 is cut (the region between the cells 22), the metal material such as the conductive foil and the plating film is removed. Therefore, only the portion of the mounting substrate 1 made of resin is cut, so that no burrs are generated due to the cutting of this step. Further, the speed at which the transparent resin 29 and the mounting substrate 1 are cut can be increased to increase productivity. Further, referring to Fig. 1(B), the width L1 between the separation units 22 is set to be wider than the width of the separate cutting saw used in this step. Therefore, the electrode included in the unit 22 is separated from the electrode by the cutting saw, so that separation can be performed without generating burrs. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a (A) plan view, (B) surface enlargement diagram, and (C) rear enlarged view of the mounting substrate of the present invention. Fig. 2 is a view for explaining a method of manufacturing a mounting substrate of the present invention, and (A) to (F) are cross-sectional views. Fig. 3 is a plan view showing the manufacturing method of the present invention. Fig. 4 is an explanatory view showing a manufacturing method of the present invention, wherein (A) is a plan view and (B) is a bottom view. Fig. 5 is an explanatory view showing a manufacturing method of the present invention, wherein (A) is a plan view, (B) is a bottom view, and (C) to (E) are cross-sectional views. Figure 6 is a cross-sectional view showing the manufacturing method of the present invention, (A) and (B are cross-sectional views), and (C) is a plan view. Figure 7 is a cross-sectional view showing a conventional light-emitting device. [Description of main components] 26 322025 201108889 1 Mounting board 2 Frame part 3 Block 4 Bridge part 5 Registration hole 6 Corner cut 7 Marking 10 Conductive foil 11 First electrode part 12 Second electrode part 13 Liquid resin 14 Separation Slot 15 Insulation Slot 16 Solder Resistive Layer 17 Mounting Portion 19, 21, 36 Resistive Layer 20 Carrier Sheet 22, 22A, 22B Unit 23 Conductive Metal Layer 24 First External Extraction Electrode Portion 25 Second External Removal Electrode portion 26 Light-emitting element 27 Next agent 28 Metal thin wire 29 Transparent resin 30 Removal region 32 Resistor 34 Protective film 38 Filling resin 100 Light-emitting element 200 Base substrate 300 Substrate electrode 400 Connection electrode portion 500 Light-reflecting portion 600 Hole portion 700 Key coating L1 width 322025