JP2008244018A5 - - Google Patents

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Publication number
JP2008244018A5
JP2008244018A5 JP2007080301A JP2007080301A JP2008244018A5 JP 2008244018 A5 JP2008244018 A5 JP 2008244018A5 JP 2007080301 A JP2007080301 A JP 2007080301A JP 2007080301 A JP2007080301 A JP 2007080301A JP 2008244018 A5 JP2008244018 A5 JP 2008244018A5
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JP
Japan
Prior art keywords
semiconductor device
manufacturing
oxygen
substrate
transition metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007080301A
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English (en)
Japanese (ja)
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JP2008244018A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007080301A priority Critical patent/JP2008244018A/ja
Priority claimed from JP2007080301A external-priority patent/JP2008244018A/ja
Publication of JP2008244018A publication Critical patent/JP2008244018A/ja
Publication of JP2008244018A5 publication Critical patent/JP2008244018A5/ja
Pending legal-status Critical Current

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JP2007080301A 2007-03-26 2007-03-26 半導体装置の製造方法 Pending JP2008244018A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007080301A JP2008244018A (ja) 2007-03-26 2007-03-26 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007080301A JP2008244018A (ja) 2007-03-26 2007-03-26 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2008244018A JP2008244018A (ja) 2008-10-09
JP2008244018A5 true JP2008244018A5 (enExample) 2010-01-21

Family

ID=39915019

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007080301A Pending JP2008244018A (ja) 2007-03-26 2007-03-26 半導体装置の製造方法

Country Status (1)

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JP (1) JP2008244018A (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5096294B2 (ja) * 2008-11-08 2012-12-12 独立行政法人科学技術振興機構 抵抗変化型不揮発性メモリー素子
JP2010199104A (ja) * 2009-02-23 2010-09-09 National Institute For Materials Science ノンポーラ型不揮発性メモリー素子
JP2010251352A (ja) * 2009-04-10 2010-11-04 Panasonic Corp 不揮発性記憶素子及びその製造方法
WO2011056281A1 (en) * 2009-11-06 2011-05-12 Rambus Inc. Three-dimensional memory array stacking structure
KR101492139B1 (ko) * 2010-12-01 2015-02-10 캐논 아네르바 가부시키가이샤 비휘발성 메모리 소자 및 그 제조방법
US9269903B2 (en) 2011-06-08 2016-02-23 Ulvac, Inc. Method of manufacturing variable resistance element and apparatus for manufacturing the same
US9103017B2 (en) 2011-11-10 2015-08-11 Joled Inc. Organic display panel, organic display device, organic light emitting device, method of manufacture of these, and thin film formation method
JP5785660B2 (ja) 2012-08-09 2015-09-30 株式会社アルバック 成膜方法および成膜装置
JP6230184B2 (ja) * 2013-10-10 2017-11-15 株式会社アルバック 成膜装置、成膜方法及び金属酸化物薄膜の製造方法
JP2015157996A (ja) * 2014-02-25 2015-09-03 東京エレクトロン株式会社 遷移金属膜の酸化処理方法および酸化処理装置
US9722179B2 (en) * 2014-12-09 2017-08-01 Symetrix Memory, Llc Transition metal oxide resistive switching device with doped buffer region

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2587426B2 (ja) * 1987-08-21 1997-03-05 石塚電子株式会社 薄膜サ−ミスタの製造方法
JPH0193088A (ja) * 1987-10-02 1989-04-12 Fujitsu Ltd 強誘電薄膜の形成方法
KR100363081B1 (ko) * 1999-09-16 2002-11-30 삼성전자 주식회사 박막 형성장치
JP2005203463A (ja) * 2004-01-14 2005-07-28 Sharp Corp 不揮発性半導体記憶装置
WO2005101420A1 (en) * 2004-04-16 2005-10-27 Matsushita Electric Industrial Co. Ltd. Thin film memory device having a variable resistance
JP4358760B2 (ja) * 2005-02-10 2009-11-04 日本電信電話株式会社 LiNbO3結晶薄膜成膜方法
JP2007042784A (ja) * 2005-08-02 2007-02-15 Nippon Telegr & Teleph Corp <Ntt> 金属酸化物素子及びその製造方法

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