JP2008138097A5 - - Google Patents

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Publication number
JP2008138097A5
JP2008138097A5 JP2006326334A JP2006326334A JP2008138097A5 JP 2008138097 A5 JP2008138097 A5 JP 2008138097A5 JP 2006326334 A JP2006326334 A JP 2006326334A JP 2006326334 A JP2006326334 A JP 2006326334A JP 2008138097 A5 JP2008138097 A5 JP 2008138097A5
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JP
Japan
Prior art keywords
gan substrate
polishing
polishing step
rough
rough polishing
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Application number
JP2006326334A
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English (en)
Japanese (ja)
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JP5599547B2 (ja
JP2008138097A (ja
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Priority claimed from JP2006326334A external-priority patent/JP5599547B2/ja
Priority to JP2006326334A priority Critical patent/JP5599547B2/ja
Application filed filed Critical
Priority to US11/946,531 priority patent/US7828628B2/en
Priority to TW096145141A priority patent/TWI409323B/zh
Priority to KR20070123289A priority patent/KR101488987B1/ko
Publication of JP2008138097A publication Critical patent/JP2008138097A/ja
Priority to US12/886,810 priority patent/US20110005143A1/en
Publication of JP2008138097A5 publication Critical patent/JP2008138097A5/ja
Publication of JP5599547B2 publication Critical patent/JP5599547B2/ja
Application granted granted Critical
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JP2006326334A 2006-12-01 2006-12-01 硬質結晶基板研磨方法及び油性研磨スラリー Active JP5599547B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2006326334A JP5599547B2 (ja) 2006-12-01 2006-12-01 硬質結晶基板研磨方法及び油性研磨スラリー
US11/946,531 US7828628B2 (en) 2006-12-01 2007-11-28 Method of polishing hard crystal substrate
TW096145141A TWI409323B (zh) 2006-12-01 2007-11-28 Hard crystalline substrate grinding methods and oily grinding slurry
KR20070123289A KR101488987B1 (ko) 2006-12-01 2007-11-30 경질 결정 기판 연마 방법 및 유성 연마 슬러리
US12/886,810 US20110005143A1 (en) 2006-12-01 2010-09-21 Polishing oil slurry for polishing hard crystal substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006326334A JP5599547B2 (ja) 2006-12-01 2006-12-01 硬質結晶基板研磨方法及び油性研磨スラリー

Publications (3)

Publication Number Publication Date
JP2008138097A JP2008138097A (ja) 2008-06-19
JP2008138097A5 true JP2008138097A5 (https=) 2011-02-03
JP5599547B2 JP5599547B2 (ja) 2014-10-01

Family

ID=39498652

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006326334A Active JP5599547B2 (ja) 2006-12-01 2006-12-01 硬質結晶基板研磨方法及び油性研磨スラリー

Country Status (4)

Country Link
US (2) US7828628B2 (https=)
JP (1) JP5599547B2 (https=)
KR (1) KR101488987B1 (https=)
TW (1) TWI409323B (https=)

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MY158571A (en) 2009-03-13 2016-10-14 Saint Gobain Ceramics Chemical mechanical planarization using nanodiamond
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JP2011108321A (ja) * 2009-11-18 2011-06-02 Hitachi Ltd 磁気ヘッドスライダの製造方法
JP5620300B2 (ja) * 2011-02-16 2014-11-05 Ｍｉｐｏｘ株式会社 結晶材料からなる被研磨物を研磨するための研磨盤とその製造方法、及び研磨方法
JP5734435B2 (ja) * 2011-08-10 2015-06-17 三菱電機株式会社 半導体装置の製造方法
CN103959437B (zh) 2011-09-30 2017-08-01 圣戈班晶体及检测公司 具有特定结晶特征的iii‑v族衬底材料及其制备方法
WO2013049775A2 (en) 2011-09-30 2013-04-04 Saint-Gobain Ceramics & Plastics, Inc. Scintillation detection device with pressure sensitive adhesive
US9522454B2 (en) * 2012-12-17 2016-12-20 Seagate Technology Llc Method of patterning a lapping plate, and patterned lapping plates
CN103013345B (zh) * 2012-12-21 2015-02-18 清华大学 油性金刚石研磨液及其制备方法
TWI529964B (zh) 2012-12-31 2016-04-11 聖戈班晶體探測器公司 具有薄緩衝層的iii-v族基材及其製備方法
JP6694745B2 (ja) * 2016-03-31 2020-05-20 株式会社フジミインコーポレーテッド 研磨用組成物
CN109715751A (zh) 2016-09-23 2019-05-03 圣戈本陶瓷及塑料股份有限公司 化学机械平坦化浆料及其形成方法
JP7135531B2 (ja) * 2018-07-20 2022-09-13 株式会社デンソー 炭化珪素半導体装置の製造方法
EP3918023B1 (en) 2019-01-31 2025-12-31 Pureon Inc. Multimodal diamond-based abrasive suspension or assembly for polishing hard substrates
CN114341861A (zh) * 2019-08-29 2022-04-12 株式会社半导体能源研究所 特性预测系统
CN112480825A (zh) * 2020-12-10 2021-03-12 河南联合精密材料股份有限公司 碳化硅晶片粗抛用金刚石抛光液及制备方法
CN112980391A (zh) * 2021-03-02 2021-06-18 河北思瑞恩新材料科技有限公司 一种用于碳化硅晶片加工的粗磨液及其制备方法
TWI813999B (zh) * 2021-05-14 2023-09-01 日揚科技股份有限公司 硬質材料加工裝置及其系統
US11365854B1 (en) 2021-09-24 2022-06-21 E. Mishan & Sons, Inc. Solar light with positionable panels
EP4424870A4 (en) * 2021-10-28 2025-10-08 Tokai Carbon Kk POLYCRYSTALLINE SIC MOLDED BODY AND ITS MANUFACTURING METHOD
CN114231251A (zh) * 2021-12-27 2022-03-25 河南联合精密材料股份有限公司 一种碳化硅晶片粗磨用金刚石研磨液及其制备方法
WO2024263357A1 (en) * 2023-06-21 2024-12-26 Corning Incorporated Coated articles, methods of polishing, and methods of making the same
CN117261002A (zh) * 2023-08-28 2023-12-22 深圳先进技术研究院 一种金属卤化物钙钛矿单晶的机械加工处理方法
JP7499934B1 (ja) 2023-11-13 2024-06-14 Ｊｘ金属株式会社 リン化インジウム基板及び半導体エピタキシャルウエハ
JP7499933B1 (ja) 2023-11-13 2024-06-14 Ｊｘ金属株式会社 リン化インジウム基板及び半導体エピタキシャルウエハ
JP7499932B1 (ja) 2023-11-13 2024-06-14 Ｊｘ金属株式会社 リン化インジウム基板及び半導体エピタキシャルウエハ

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