JP2008118123A5 - - Google Patents
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- Publication number
- JP2008118123A5 JP2008118123A5 JP2007265332A JP2007265332A JP2008118123A5 JP 2008118123 A5 JP2008118123 A5 JP 2008118123A5 JP 2007265332 A JP2007265332 A JP 2007265332A JP 2007265332 A JP2007265332 A JP 2007265332A JP 2008118123 A5 JP2008118123 A5 JP 2008118123A5
- Authority
- JP
- Japan
- Prior art keywords
- tube
- insulating layer
- conductive layer
- forming
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 12
- 238000004519 manufacturing process Methods 0.000 claims 11
- 238000000034 method Methods 0.000 claims 8
- 238000007599 discharging Methods 0.000 claims 4
- 239000004020 conductor Substances 0.000 claims 2
- 238000005530 etching Methods 0.000 claims 1
- 238000009413 insulation Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007265332A JP5371143B2 (ja) | 2006-10-12 | 2007-10-11 | 半導体装置の作製方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006279206 | 2006-10-12 | ||
| JP2006279206 | 2006-10-12 | ||
| JP2007265332A JP5371143B2 (ja) | 2006-10-12 | 2007-10-11 | 半導体装置の作製方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008118123A JP2008118123A (ja) | 2008-05-22 |
| JP2008118123A5 true JP2008118123A5 (enExample) | 2010-11-25 |
| JP5371143B2 JP5371143B2 (ja) | 2013-12-18 |
Family
ID=39503785
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007265332A Expired - Fee Related JP5371143B2 (ja) | 2006-10-12 | 2007-10-11 | 半導体装置の作製方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5371143B2 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010040567A (ja) * | 2008-07-31 | 2010-02-18 | Tokyo Electron Ltd | 酸化膜表面の洗浄及び保護方法および酸化膜表面の洗浄及び保護装置 |
| KR101634411B1 (ko) * | 2008-10-31 | 2016-06-28 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 구동 회로, 표시 장치 및 전자 장치 |
| KR101476817B1 (ko) | 2009-07-03 | 2014-12-26 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 트랜지스터를 갖는 표시 장치 및 그 제작 방법 |
| KR102162746B1 (ko) | 2009-10-21 | 2020-10-07 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 아날로그 회로 및 반도체 장치 |
| CN210110300U (zh) * | 2019-08-16 | 2020-02-21 | 北京京东方技术开发有限公司 | 像素驱动电路、阵列基板和显示装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5271798A (en) * | 1993-03-29 | 1993-12-21 | Micron Technology, Inc. | Method for selective removal of a material from a wafer's alignment marks |
| US6290863B1 (en) * | 1999-07-31 | 2001-09-18 | Micron Technology, Inc. | Method and apparatus for etch of a specific subarea of a semiconductor work object |
| DE10053198C2 (de) * | 2000-10-26 | 2003-01-02 | Infineon Technologies Ag | Verfahren zum lokalen Ätzen |
| JP5025095B2 (ja) * | 2004-05-07 | 2012-09-12 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
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2007
- 2007-10-11 JP JP2007265332A patent/JP5371143B2/ja not_active Expired - Fee Related