JP2008103163A - 回路基板の製造方法 - Google Patents
回路基板の製造方法 Download PDFInfo
- Publication number
- JP2008103163A JP2008103163A JP2006284097A JP2006284097A JP2008103163A JP 2008103163 A JP2008103163 A JP 2008103163A JP 2006284097 A JP2006284097 A JP 2006284097A JP 2006284097 A JP2006284097 A JP 2006284097A JP 2008103163 A JP2008103163 A JP 2008103163A
- Authority
- JP
- Japan
- Prior art keywords
- contact
- circuit board
- fixed contact
- plating
- movable contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
- H01H1/021—Composite material
- H01H1/023—Composite material having a noble metal as the basic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/12—Contacts characterised by the manner in which co-operating contacts engage
- H01H1/36—Contacts characterised by the manner in which co-operating contacts engage by sliding
- H01H1/40—Contact mounted so that its contact-making surface is flush with adjoining insulation
- H01H1/403—Contacts forming part of a printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
- Y10T29/4916—Simultaneous circuit manufacturing
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Electrochemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Switches With Compound Operations (AREA)
- Manufacture Of Switches (AREA)
- Contacts (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
【解決手段】同一平面内に互いに略直交方向へ延出する第1の固定接点41と第2の固定接点42とが設けられており、第1の固定接点41に要求される寿命が第2の固定接点42に対して長い回路基板40の製造方法において、絶縁基板の全面に設けられた銅箔をエッチングして第1および第2の固定接点41,42をパターン形成する工程と、絶縁基板の表面をバフで研磨して銅箔に付着した酸化被膜を除去する工程と、第1および第2の固定接点41,42上にそれぞれ1〜5μm厚のニッケルメッキと0.01〜0.5μm厚の金メッキを順次形成する工程とを備え、前記バフの研磨方向を第1の固定接点41上に摺接する第1の可動接点44の摺動方向と略一致させた。
【選択図】図5
Description
15 第1の摺動子受体
16 第2の摺動子受体
31 固定接点
34,43 ソルダーレジスト
35 可動接点
36 摺動子受体
21,41 第1の固定接点
22,42 第2の固定接点
23,44 第1の可動接点
24,45 第2の可動接点
Claims (4)
- 可動接点が摺動する固定接点を有する回路基板の製造方法であって、絶縁基板の全面に設けられた銅箔をエッチングして前記固定接点をパターン形成する工程と、前記銅箔の表面をバフで研磨する工程と、前記固定接点上に1〜5μm厚のニッケルメッキと0.01〜0.5μm厚の金メッキを順次形成する工程とを備え、前記バフの研磨方向を前記可動接点の摺動方向と略一致させたことを特徴とする回路基板の製造方法。
- 請求項1の記載において、前記可動接点が弾性金属板の片面にメッキまたはクラッドにより設けられた金合金からなることを特徴とする回路基板の製造方法。
- 同一平面内に配設された第1および第2の固定接点を有し、これら両固定接点上をそれぞれ第1および第2の可動接点が互いに略直交方向へ摺動する回路基板の製造方法であって、絶縁基板の全面に設けられた銅箔をエッチングして前記第1および第2の固定接点をパターン形成する工程と、前記銅箔の表面をバフで研磨する工程と、前記第1および第2の固定接点上にそれぞれ1〜5μm厚のニッケルメッキと0.01〜0.5μm厚の金メッキを順次形成する工程とを備え、前記バフの研磨方向を前記第1の固定接点上に摺接する前記第1の可動接点の摺動方向と略一致させたことを特徴とする回路基板の製造方法。
- 請求項3の記載において、前記第1の固定接点がターンシグナルスイッチ装置のウインカ動作用接点であり、前記第2の固定接点がパッシング動作用接点であることを特徴とする回路基板の製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006284097A JP4374366B2 (ja) | 2006-10-18 | 2006-10-18 | スイッチ装置に用いられる回路基板の製造方法 |
EP07020024A EP1915039B1 (en) | 2006-10-18 | 2007-10-12 | Method of manufacturing circuit board |
US11/872,215 US7922918B2 (en) | 2006-10-18 | 2007-10-15 | Method of manufacturing circuit board used for switch device |
CN200710166829A CN100596259C (zh) | 2006-10-18 | 2007-10-18 | 电路板的制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006284097A JP4374366B2 (ja) | 2006-10-18 | 2006-10-18 | スイッチ装置に用いられる回路基板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008103163A true JP2008103163A (ja) | 2008-05-01 |
JP4374366B2 JP4374366B2 (ja) | 2009-12-02 |
Family
ID=39047477
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006284097A Expired - Fee Related JP4374366B2 (ja) | 2006-10-18 | 2006-10-18 | スイッチ装置に用いられる回路基板の製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7922918B2 (ja) |
EP (1) | EP1915039B1 (ja) |
JP (1) | JP4374366B2 (ja) |
CN (1) | CN100596259C (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017511561A (ja) * | 2014-04-17 | 2017-04-20 | 昆明安沃信科技有限公司Kunming Quasion Tech Co., Ltd. | 高効率充電機能を有する盗難防止警報装置 |
KR101776419B1 (ko) * | 2015-11-26 | 2017-09-07 | 현대 파워텍 주식회사 | 구름 접촉식 인히비터 스위치 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8574722B2 (en) * | 2011-05-09 | 2013-11-05 | Tyco Electronics Corporation | Corrosion resistant electrical conductor |
FR2982994B1 (fr) | 2011-11-21 | 2014-01-10 | Sc2N Sa | Commutateur electrique a contact frottant |
US9224550B2 (en) | 2012-12-26 | 2015-12-29 | Tyco Electronics Corporation | Corrosion resistant barrier formed by vapor phase tin reflow |
CN108076608A (zh) * | 2016-11-14 | 2018-05-25 | 华为机器有限公司 | 金属机壳及其制造方法 |
AT524231B1 (de) * | 2020-09-23 | 2022-04-15 | Molto Luce Gmbh | Beleuchtungsvorrichtung |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1070302B (ja) * | 1959-09-30 | |||
US3914161A (en) * | 1972-06-16 | 1975-10-21 | Matsushita Electric Ind Co Ltd | Electroplating solutions for depositing silver alloys and a method of forming silver alloys by electroplating |
JPS5790233A (en) * | 1980-11-26 | 1982-06-04 | Honda Motor Co Ltd | Automatic winker canceler |
JPS6154119A (ja) * | 1984-08-24 | 1986-03-18 | 松下電工株式会社 | 小形スイツチ |
US4687545A (en) * | 1986-06-18 | 1987-08-18 | Macdermid, Incorporated | Process for stripping tin or tin-lead alloy from copper |
JPH0677277A (ja) | 1992-08-26 | 1994-03-18 | Hitachi Ltd | 絶縁被覆ワイヤのボールボンディング装置とボンディング方法 |
JPH07326844A (ja) * | 1994-05-31 | 1995-12-12 | Ando Electric Co Ltd | プリント配線板の導体パターンの製造方法 |
JPH11214115A (ja) * | 1998-01-29 | 1999-08-06 | Whitaker Corp:The | 電気コンタクト及びその製造方法 |
JP2000188028A (ja) | 1998-12-22 | 2000-07-04 | Shibafu Engineering Kk | 摺動接点装置及び接点材料 |
JP2001236848A (ja) * | 2000-02-21 | 2001-08-31 | Niles Parts Co Ltd | スイッチ装置 |
JP3870704B2 (ja) * | 2001-03-14 | 2007-01-24 | 松下電器産業株式会社 | 半導体装置 |
KR100442519B1 (ko) * | 2002-04-09 | 2004-07-30 | 삼성전기주식회사 | 모듈화 인쇄회로기판의 표면처리용 합금 도금액 |
-
2006
- 2006-10-18 JP JP2006284097A patent/JP4374366B2/ja not_active Expired - Fee Related
-
2007
- 2007-10-12 EP EP07020024A patent/EP1915039B1/en not_active Expired - Fee Related
- 2007-10-15 US US11/872,215 patent/US7922918B2/en not_active Expired - Fee Related
- 2007-10-18 CN CN200710166829A patent/CN100596259C/zh not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017511561A (ja) * | 2014-04-17 | 2017-04-20 | 昆明安沃信科技有限公司Kunming Quasion Tech Co., Ltd. | 高効率充電機能を有する盗難防止警報装置 |
US9940800B2 (en) | 2014-04-17 | 2018-04-10 | Kunming Quasion Tech Co., Ltd. | Anti-theft alarm device with high charging efficiency |
KR101776419B1 (ko) * | 2015-11-26 | 2017-09-07 | 현대 파워텍 주식회사 | 구름 접촉식 인히비터 스위치 |
Also Published As
Publication number | Publication date |
---|---|
EP1915039A3 (en) | 2009-07-29 |
US20080093335A1 (en) | 2008-04-24 |
JP4374366B2 (ja) | 2009-12-02 |
US7922918B2 (en) | 2011-04-12 |
CN100596259C (zh) | 2010-03-24 |
CN101166400A (zh) | 2008-04-23 |
EP1915039B1 (en) | 2012-01-18 |
EP1915039A2 (en) | 2008-04-23 |
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