JP2008081676A5 - - Google Patents

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Publication number
JP2008081676A5
JP2008081676A5 JP2006265955A JP2006265955A JP2008081676A5 JP 2008081676 A5 JP2008081676 A5 JP 2008081676A5 JP 2006265955 A JP2006265955 A JP 2006265955A JP 2006265955 A JP2006265955 A JP 2006265955A JP 2008081676 A5 JP2008081676 A5 JP 2008081676A5
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JP
Japan
Prior art keywords
sio
nmr
component
group
single bond
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006265955A
Other languages
English (en)
Japanese (ja)
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JP5388409B2 (ja
JP2008081676A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2006265955A external-priority patent/JP5388409B2/ja
Priority to JP2006265955A priority Critical patent/JP5388409B2/ja
Priority to TW096130215A priority patent/TWI432520B/zh
Priority to EP07807177.6A priority patent/EP2079802B1/en
Priority to US12/443,286 priority patent/US20100022704A1/en
Priority to KR1020097006458A priority patent/KR101383128B1/ko
Priority to CN2007800345804A priority patent/CN101517004B/zh
Priority to PCT/JP2007/067770 priority patent/WO2008041459A1/en
Publication of JP2008081676A publication Critical patent/JP2008081676A/ja
Publication of JP2008081676A5 publication Critical patent/JP2008081676A5/ja
Publication of JP5388409B2 publication Critical patent/JP5388409B2/ja
Application granted granted Critical
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2006265955A 2006-09-28 2006-09-28 硬化性シリコーン組成物およびその硬化物 Expired - Fee Related JP5388409B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2006265955A JP5388409B2 (ja) 2006-09-28 2006-09-28 硬化性シリコーン組成物およびその硬化物
TW096130215A TWI432520B (zh) 2006-09-28 2007-08-15 可固化之聚矽氧組合物及其固化體
KR1020097006458A KR101383128B1 (ko) 2006-09-28 2007-09-05 경화성 실리콘 조성물 및 이의 경화물
US12/443,286 US20100022704A1 (en) 2006-09-28 2007-09-05 Curable Silicone Composition And Cured Body Thereof
EP07807177.6A EP2079802B1 (en) 2006-09-28 2007-09-05 Curable silicone composition and cured body thereof
CN2007800345804A CN101517004B (zh) 2006-09-28 2007-09-05 可固化的硅氧烷组合物及其固化体
PCT/JP2007/067770 WO2008041459A1 (en) 2006-09-28 2007-09-05 Curable silicone composition and cured body thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006265955A JP5388409B2 (ja) 2006-09-28 2006-09-28 硬化性シリコーン組成物およびその硬化物

Publications (3)

Publication Number Publication Date
JP2008081676A JP2008081676A (ja) 2008-04-10
JP2008081676A5 true JP2008081676A5 (https=) 2009-10-15
JP5388409B2 JP5388409B2 (ja) 2014-01-15

Family

ID=38874981

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006265955A Expired - Fee Related JP5388409B2 (ja) 2006-09-28 2006-09-28 硬化性シリコーン組成物およびその硬化物

Country Status (7)

Country Link
US (1) US20100022704A1 (https=)
EP (1) EP2079802B1 (https=)
JP (1) JP5388409B2 (https=)
KR (1) KR101383128B1 (https=)
CN (1) CN101517004B (https=)
TW (1) TWI432520B (https=)
WO (1) WO2008041459A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012057000A (ja) * 2010-09-07 2012-03-22 Shin-Etsu Chemical Co Ltd シリコーン樹脂組成物、半導体装置の封止材、及び半導体装置
KR101376999B1 (ko) * 2012-06-28 2014-03-26 장암칼스 주식회사 전자 소자 절연 봉지용 실리콘 조성물
EP2963459A4 (en) * 2013-02-28 2016-10-26 Hoya Corp METHOD FOR THE PRODUCTION OF EYESE GLASS AND COATING DEVICE FOR COATING LIQUID FOR BASE MATERIAL OF A GLASS GLASS
EP3023467B1 (de) 2014-11-20 2017-05-10 BYK-Chemie GmbH Formmasse, thermoplast oder beschichtungsmittel enthaltend polysiloxane als anti-adhäsive und schmutzabweisende zusätze
TWI875875B (zh) 2019-11-29 2025-03-11 日商力森諾科股份有限公司 含有具有聚氧化烯鏈之化合物之組成物套組

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61195129A (ja) * 1985-02-22 1986-08-29 Toray Silicone Co Ltd 有機けい素重合体の製造方法
US5011870A (en) * 1989-02-08 1991-04-30 Dow Corning Corporation Thermally conductive organosiloxane compositions
US5102960A (en) * 1989-09-11 1992-04-07 Bayer Aktiengesellschaft Silicon-epoxy resin composition
US5206312A (en) * 1989-11-20 1993-04-27 The Dow Chemical Company Aromatic hydroxyl-containing compounds containing organosiloxane moieties, epoxy compounds and cured products thereof
US5362775A (en) * 1991-03-27 1994-11-08 Nippondenso Co., Ltd. Epoxy resin composition and cured product thereof
JP3161786B2 (ja) * 1991-11-20 2001-04-25 東レ・ダウコーニング・シリコーン株式会社 オルガノポリシロキサンおよびその製造方法
JP3367964B2 (ja) * 1992-04-21 2003-01-20 東レ・ダウコーニング・シリコーン株式会社 硬化性樹脂組成物
JP3251655B2 (ja) * 1992-08-05 2002-01-28 東レ・ダウコーニング・シリコーン株式会社 ジオルガノポリシロキサンおよびその製造方法
JP3406646B2 (ja) * 1993-06-29 2003-05-12 東レ・ダウコーニング・シリコーン株式会社 オルガノポリシロキサンおよびその製造方法
JP3466239B2 (ja) * 1993-08-18 2003-11-10 東レ・ダウコーニング・シリコーン株式会社 硬化性樹脂組成物
US6069201A (en) * 1997-09-12 2000-05-30 Shin-Etsu Chemical Co., Ltd. Zinc oxide-filled addition-curable silicone rubber compositions
JP4727017B2 (ja) * 1999-11-15 2011-07-20 東レ・ダウコーニング株式会社 熱伝導性シリコーンゴム組成物
JP2002020586A (ja) * 2000-07-05 2002-01-23 Shin Etsu Chem Co Ltd エポキシ樹脂組成物
JP5166677B2 (ja) * 2005-03-15 2013-03-21 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品

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