JP2008047918A5 - - Google Patents

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Publication number
JP2008047918A5
JP2008047918A5 JP2007212015A JP2007212015A JP2008047918A5 JP 2008047918 A5 JP2008047918 A5 JP 2008047918A5 JP 2007212015 A JP2007212015 A JP 2007212015A JP 2007212015 A JP2007212015 A JP 2007212015A JP 2008047918 A5 JP2008047918 A5 JP 2008047918A5
Authority
JP
Japan
Prior art keywords
polymeric material
overmold
package
heat sink
attached
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007212015A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008047918A (ja
JP5121353B2 (ja
Filing date
Publication date
Priority claimed from US11/505,152 external-priority patent/US7423341B2/en
Application filed filed Critical
Publication of JP2008047918A publication Critical patent/JP2008047918A/ja
Publication of JP2008047918A5 publication Critical patent/JP2008047918A5/ja
Application granted granted Critical
Publication of JP5121353B2 publication Critical patent/JP5121353B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2007212015A 2006-08-16 2007-08-16 オーバーモールドされたｍｃｍｉｃパッケージ及びその製造方法 Active JP5121353B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/505,152 US7423341B2 (en) 2006-08-16 2006-08-16 Plastic overmolded packages with mechanically decoupled lid attach attachment
US11/505152 2006-08-16

Publications (3)

Publication Number Publication Date
JP2008047918A JP2008047918A (ja) 2008-02-28
JP2008047918A5 true JP2008047918A5 (OSRAM) 2010-07-22
JP5121353B2 JP5121353B2 (ja) 2013-01-16

Family

ID=39095325

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007212015A Active JP5121353B2 (ja) 2006-08-16 2007-08-16 オーバーモールドされたｍｃｍｉｃパッケージ及びその製造方法

Country Status (4)

Country Link
US (2) US7423341B2 (OSRAM)
JP (1) JP5121353B2 (OSRAM)
KR (1) KR101398404B1 (OSRAM)
CN (1) CN101127349B (OSRAM)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7423341B2 (en) * 2006-08-16 2008-09-09 Agere Systems Inc. Plastic overmolded packages with mechanically decoupled lid attach attachment
KR101221807B1 (ko) * 2006-12-29 2013-01-14 페어차일드코리아반도체 주식회사 전력 소자 패키지
WO2009022729A1 (ja) 2007-08-10 2009-02-19 Nissan Motor Co., Ltd. 可変動弁装置
US7781682B2 (en) * 2008-03-31 2010-08-24 Intel Corporation Methods of fabricating multichip packages and structures formed thereby
US7829390B2 (en) * 2008-11-20 2010-11-09 Azurewave Technologies, Inc. Packaging structure of SIP and a manufacturing method thereof
US8362607B2 (en) * 2009-06-03 2013-01-29 Honeywell International Inc. Integrated circuit package including a thermally and electrically conductive package lid
FR2968126A1 (fr) * 2010-11-29 2012-06-01 St Microelectronics Grenoble 2 Boitier semi-conducteur a via thermique et procédé de fabrication
US9562534B2 (en) * 2012-05-04 2017-02-07 Ghsp, Inc. In-line dual pump and motor with control device
US9202772B2 (en) * 2013-02-28 2015-12-01 Altera Corporation Heat pipe in overmolded flip chip package
US20170356640A1 (en) 2016-06-10 2017-12-14 Innotec, Corp. Illumination assembly including thermal energy management
KR102617088B1 (ko) 2019-09-18 2023-12-26 삼성전자주식회사 반도체 패키지
US20230137512A1 (en) * 2021-11-03 2023-05-04 Western Digital Technologies, Inc. Stacked ssd semiconductor device

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06132425A (ja) * 1992-10-22 1994-05-13 Kyocera Corp 半導体装置
JPH0758254A (ja) * 1993-08-19 1995-03-03 Fujitsu Ltd マルチチップモジュール及びその製造方法
US5886408A (en) * 1994-09-08 1999-03-23 Fujitsu Limited Multi-chip semiconductor device
JPH0878618A (ja) * 1994-09-08 1996-03-22 Fujitsu Ltd マルチチップモジュール及びその製造方法
US5610442A (en) * 1995-03-27 1997-03-11 Lsi Logic Corporation Semiconductor device package fabrication method and apparatus
JPH0964252A (ja) * 1995-08-25 1997-03-07 Hitachi Ltd 半導体装置
US5587882A (en) * 1995-08-30 1996-12-24 Hewlett-Packard Company Thermal interface for a heat sink and a plurality of integrated circuits mounted on a substrate
US6238954B1 (en) * 1999-09-28 2001-05-29 Intel Corporation COF packaged semiconductor
US6535388B1 (en) * 2001-10-04 2003-03-18 Intel Corporation Wirebonded microelectronic packages including heat dissipation devices for heat removal from active surfaces thereof
US6987032B1 (en) * 2002-07-19 2006-01-17 Asat Ltd. Ball grid array package and process for manufacturing same
JP2004289059A (ja) 2003-03-25 2004-10-14 Denso Corp 半導体装置
US7153725B2 (en) * 2004-01-27 2006-12-26 St Assembly Test Services Ltd. Strip-fabricated flip chip in package and flip chip in system heat spreader assemblies and fabrication methods therefor
EP1741136A2 (fr) * 2004-04-13 2007-01-10 SA Intexys Procede de fabrication de circuits electroniques et optoelectroniques
TWI246757B (en) * 2004-10-27 2006-01-01 Siliconware Precision Industries Co Ltd Semiconductor package with heat sink and fabrication method thereof
US7332823B2 (en) * 2005-12-15 2008-02-19 Intel Corporation Providing a metal layer in a semiconductor package
US7332807B2 (en) * 2005-12-30 2008-02-19 Intel Corporation Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same
US7423341B2 (en) * 2006-08-16 2008-09-09 Agere Systems Inc. Plastic overmolded packages with mechanically decoupled lid attach attachment

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