JP2008041837A - 半導体装置および半導体装置の製造方法 - Google Patents
半導体装置および半導体装置の製造方法 Download PDFInfo
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Abstract
【解決手段】複数の半導体基板が貼り合わせて形成される合わせ基板と、前記合わせ基板に形成された凹部と、前記凹部に実装される半導体素子と、を有することを特徴とする半導体装置。複数の半導体基板を貼り合わせて合わせ基板を形成する第1の工程と、前記合わせ基板をエッチングして凹部を形成する第2の工程と、前記凹部に半導体素子を実装する第3の工程と、を有することを特徴とする半導体装置の製造方法。
【選択図】図1G
Description
101,103,201,203 半導体基板
101A,103A,201A,203A,201B 穴部
103B,208 凹部
102,202 接合層
104,204 合わせ基板
105,106,205,206,207 レジストパターン
105A,106A,205A,206A,207A 開口部
107,209 絶縁膜
108,210 ビアプラグ
109,211,213 半導体素子
110,212,214 バンプ
111,215 蓋部
Claims (10)
- 複数の半導体基板が貼り合わせて形成される合わせ基板と、
前記合わせ基板に形成された凹部と、
前記凹部に実装される半導体素子と、を有することを特徴とする半導体装置。 - 前記複数の半導体基板はシリコン基板よりなり、該複数の該半導体基板は、シリコン酸化膜を含む接合層により貼り合わせられていることを特徴とする請求項1記載の半導体装置。
- 前記凹部の底面側には、前記貼り合わせ基板を貫通するビアプラグが形成され、前記半導体素子は当該ビアプラグに接続されるように実装されていることを特徴とする請求項1または2記載の半導体装置。
- 前記凹部は、前記複数の半導体基板のうちの少なくとも一つを貫通するように形成されていることを特徴とする請求項1乃至3のいずれか1項記載の半導体装置。
- 前記凹部は、前記複数の半導体基板にそれぞれ形成される穴部が連通した構造であることを特徴とする請求項1乃至4のいずれか1項記載の半導体装置。
- 前記複数の半導体基板の結晶方位が異なるように、当該複数の半導体基板が貼り合わせられて前記合わせ基板が構成されていることを特徴とする請求項1乃至5のいずれか1項記載の半導体装置の製造方法。
- 複数の半導体基板を貼り合わせて合わせ基板を形成する第1の工程と、
前記合わせ基板をエッチングして凹部を形成する第2の工程と、
前記凹部に半導体素子を実装する第3の工程と、を有することを特徴とする半導体装置の製造方法。 - 前記第1の工程では、前記複数の半導体基板の貼り合わせに接合層が用いられ、前記第2の工程では、当該接合層がエッチングストッパ層として用いられることを特徴とする請求項7記載の半導体装置の製造方法。
- 前記複数の半導体基板は、シリコン基板よりなり、前記接合層はシリコン酸化膜を含むことを特徴とする請求項8記載の半導体装置の製造方法。
- 前記第1の工程では、前記複数の半導体基板の結晶方位が異なるように、当該複数の半導体基板が貼り合わせられることを特徴とする請求項7乃至9のいずれか1項記載の半導体装置の製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006212491A JP5107539B2 (ja) | 2006-08-03 | 2006-08-03 | 半導体装置および半導体装置の製造方法 |
US11/882,568 US7705451B2 (en) | 2006-08-03 | 2007-08-02 | Semiconductor device and method of manufacturing the same |
EP07015307.7A EP1884994B1 (en) | 2006-08-03 | 2007-08-03 | Semiconductor device and method of manufacturing the same |
TW096128588A TWI424546B (zh) | 2006-08-03 | 2007-08-03 | 半導體裝置及其製造方法 |
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JP2006212491A JP5107539B2 (ja) | 2006-08-03 | 2006-08-03 | 半導体装置および半導体装置の製造方法 |
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JP2008041837A true JP2008041837A (ja) | 2008-02-21 |
JP5107539B2 JP5107539B2 (ja) | 2012-12-26 |
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US (1) | US7705451B2 (ja) |
EP (1) | EP1884994B1 (ja) |
JP (1) | JP5107539B2 (ja) |
TW (1) | TWI424546B (ja) |
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JP4955349B2 (ja) * | 2006-09-07 | 2012-06-20 | 新光電気工業株式会社 | 半導体装置 |
WO2009110547A1 (ja) * | 2008-03-05 | 2009-09-11 | シャープ株式会社 | 通信システム、通信装置及び通信方法 |
JP5291979B2 (ja) * | 2008-04-24 | 2013-09-18 | 株式会社フジクラ | 圧力センサ及びその製造方法と、該圧力センサを備えた電子部品 |
JP5331546B2 (ja) | 2008-04-24 | 2013-10-30 | 株式会社フジクラ | 圧力センサモジュール及び電子部品 |
EP2339627A1 (en) * | 2009-12-24 | 2011-06-29 | Imec | Window interposed die packaging |
JP5062496B2 (ja) * | 2010-03-29 | 2012-10-31 | 横河電機株式会社 | 運転状態解析システムおよび運転状態解析方法 |
US20120188721A1 (en) * | 2011-01-21 | 2012-07-26 | Nxp B.V. | Non-metal stiffener ring for fcbga |
DE102012220323A1 (de) * | 2012-11-08 | 2014-05-08 | Robert Bosch Gmbh | Bauteil und Verfahren zu dessen Herstellung |
US10322481B2 (en) * | 2014-03-06 | 2019-06-18 | Infineon Technologies Ag | Support structure and method of forming a support structure |
US20150262902A1 (en) | 2014-03-12 | 2015-09-17 | Invensas Corporation | Integrated circuits protected by substrates with cavities, and methods of manufacture |
US9355997B2 (en) | 2014-03-12 | 2016-05-31 | Invensas Corporation | Integrated circuit assemblies with reinforcement frames, and methods of manufacture |
US9165793B1 (en) | 2014-05-02 | 2015-10-20 | Invensas Corporation | Making electrical components in handle wafers of integrated circuit packages |
WO2016089831A1 (en) * | 2014-12-02 | 2016-06-09 | Invensas Corporation | Interposers with circuit modules encapsulated by moldable material in a cavity, and methods of fabrication |
US11355427B2 (en) * | 2016-07-01 | 2022-06-07 | Intel Corporation | Device, method and system for providing recessed interconnect structures of a substrate |
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---|---|---|---|---|
JP2009021583A (ja) * | 2007-06-19 | 2009-01-29 | Honeywell Internatl Inc | ダイ装着応力遮断構造 |
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US7705451B2 (en) | 2010-04-27 |
EP1884994A2 (en) | 2008-02-06 |
JP5107539B2 (ja) | 2012-12-26 |
EP1884994A3 (en) | 2010-08-04 |
US20080029852A1 (en) | 2008-02-07 |
EP1884994B1 (en) | 2018-10-10 |
TW200810067A (en) | 2008-02-16 |
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