JP2008010423A5 - - Google Patents
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- Publication number
- JP2008010423A5 JP2008010423A5 JP2007168387A JP2007168387A JP2008010423A5 JP 2008010423 A5 JP2008010423 A5 JP 2008010423A5 JP 2007168387 A JP2007168387 A JP 2007168387A JP 2007168387 A JP2007168387 A JP 2007168387A JP 2008010423 A5 JP2008010423 A5 JP 2008010423A5
- Authority
- JP
- Japan
- Prior art keywords
- coating
- electrically conductive
- conductive element
- metal
- adhesion promoting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000011248 coating agent Substances 0.000 claims 27
- 238000000576 coating method Methods 0.000 claims 27
- 229910052751 metal Inorganic materials 0.000 claims 16
- 239000002184 metal Substances 0.000 claims 16
- 230000001737 promoting effect Effects 0.000 claims 11
- 239000000203 mixture Substances 0.000 claims 10
- 229920005573 silicon-containing polymer Polymers 0.000 claims 9
- 238000000034 method Methods 0.000 claims 8
- 239000000758 substrate Substances 0.000 claims 8
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims 7
- 229920000642 polymer Polymers 0.000 claims 7
- 229910000077 silane Inorganic materials 0.000 claims 7
- 239000003795 chemical substances by application Substances 0.000 claims 4
- 238000005260 corrosion Methods 0.000 claims 4
- 230000007797 corrosion Effects 0.000 claims 4
- 230000001681 protective effect Effects 0.000 claims 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 3
- 229910052760 oxygen Inorganic materials 0.000 claims 3
- 239000001301 oxygen Substances 0.000 claims 3
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 claims 3
- 150000004756 silanes Chemical class 0.000 claims 3
- WHIVNJATOVLWBW-PLNGDYQASA-N (nz)-n-butan-2-ylidenehydroxylamine Chemical compound CC\C(C)=N/O WHIVNJATOVLWBW-PLNGDYQASA-N 0.000 claims 2
- HXLAEGYMDGUSBD-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propan-1-amine Chemical compound CCO[Si](C)(OCC)CCCN HXLAEGYMDGUSBD-UHFFFAOYSA-N 0.000 claims 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 claims 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 claims 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 2
- -1 Triethoxysilyl Chemical group 0.000 claims 2
- TVJPBVNWVPUZBM-UHFFFAOYSA-N [diacetyloxy(methyl)silyl] acetate Chemical compound CC(=O)O[Si](C)(OC(C)=O)OC(C)=O TVJPBVNWVPUZBM-UHFFFAOYSA-N 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 2
- 229920001577 copolymer Polymers 0.000 claims 2
- 230000007062 hydrolysis Effects 0.000 claims 2
- 238000006460 hydrolysis reaction Methods 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 238000001465 metallisation Methods 0.000 claims 2
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 claims 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims 2
- 239000002904 solvent Substances 0.000 claims 2
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 claims 2
- 239000010936 titanium Substances 0.000 claims 2
- 229910052719 titanium Inorganic materials 0.000 claims 2
- 239000000080 wetting agent Substances 0.000 claims 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 claims 1
- OGZPYBBKQGPQNU-DABLZPOSSA-N (e)-n-[bis[[(e)-butan-2-ylideneamino]oxy]-methylsilyl]oxybutan-2-imine Chemical compound CC\C(C)=N\O[Si](C)(O\N=C(/C)CC)O\N=C(/C)CC OGZPYBBKQGPQNU-DABLZPOSSA-N 0.000 claims 1
- KSCAZPYHLGGNPZ-UHFFFAOYSA-N 3-chloropropyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)CCCCl KSCAZPYHLGGNPZ-UHFFFAOYSA-N 0.000 claims 1
- OXYZDRAJMHGSMW-UHFFFAOYSA-N 3-chloropropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCCl OXYZDRAJMHGSMW-UHFFFAOYSA-N 0.000 claims 1
- FMGBDYLOANULLW-UHFFFAOYSA-N 3-isocyanatopropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCN=C=O FMGBDYLOANULLW-UHFFFAOYSA-N 0.000 claims 1
- RWLDCNACDPTRMY-UHFFFAOYSA-N 3-triethoxysilyl-n-(3-triethoxysilylpropyl)propan-1-amine Chemical compound CCO[Si](OCC)(OCC)CCCNCCC[Si](OCC)(OCC)OCC RWLDCNACDPTRMY-UHFFFAOYSA-N 0.000 claims 1
- DCQBZYNUSLHVJC-UHFFFAOYSA-N 3-triethoxysilylpropane-1-thiol Chemical compound CCO[Si](OCC)(OCC)CCCS DCQBZYNUSLHVJC-UHFFFAOYSA-N 0.000 claims 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 claims 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 claims 1
- 239000005046 Chlorosilane Substances 0.000 claims 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- 150000001298 alcohols Chemical class 0.000 claims 1
- 150000001335 aliphatic alkanes Chemical class 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 238000005229 chemical vapour deposition Methods 0.000 claims 1
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical class Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 claims 1
- 238000004140 cleaning Methods 0.000 claims 1
- 238000004132 cross linking Methods 0.000 claims 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 claims 1
- 239000000446 fuel Substances 0.000 claims 1
- 230000003301 hydrolyzing effect Effects 0.000 claims 1
- 239000011159 matrix material Substances 0.000 claims 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 claims 1
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 claims 1
- JJYSEGMTGODKMM-UHFFFAOYSA-N n-diazo-6-triethoxysilylhexane-1-sulfonamide Chemical group CCO[Si](OCC)(OCC)CCCCCCS(=O)(=O)N=[N+]=[N-] JJYSEGMTGODKMM-UHFFFAOYSA-N 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 229920000620 organic polymer Polymers 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 238000005240 physical vapour deposition Methods 0.000 claims 1
- 238000005554 pickling Methods 0.000 claims 1
- 238000001020 plasma etching Methods 0.000 claims 1
- 238000005498 polishing Methods 0.000 claims 1
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical group CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 238000004544 sputter deposition Methods 0.000 claims 1
- 239000003381 stabilizer Substances 0.000 claims 1
- 239000010935 stainless steel Substances 0.000 claims 1
- 229910001220 stainless steel Inorganic materials 0.000 claims 1
- 239000007858 starting material Substances 0.000 claims 1
- 229910052715 tantalum Inorganic materials 0.000 claims 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims 1
- FRGPKMWIYVTFIQ-UHFFFAOYSA-N triethoxy(3-isocyanatopropyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCN=C=O FRGPKMWIYVTFIQ-UHFFFAOYSA-N 0.000 claims 1
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 claims 1
- FBBATURSCRIBHN-UHFFFAOYSA-N triethoxy-[3-(3-triethoxysilylpropyldisulfanyl)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCSSCCC[Si](OCC)(OCC)OCC FBBATURSCRIBHN-UHFFFAOYSA-N 0.000 claims 1
- HHPPHUYKUOAWJV-UHFFFAOYSA-N triethoxy-[4-(oxiran-2-yl)butyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCCC1CO1 HHPPHUYKUOAWJV-UHFFFAOYSA-N 0.000 claims 1
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 claims 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 229910052726 zirconium Inorganic materials 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/475,499 US8133591B2 (en) | 2006-06-27 | 2006-06-27 | Adhesion of polymeric coatings to bipolar plate surfaces using silane coupling agents |
| US11/475,499 | 2006-06-27 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008010423A JP2008010423A (ja) | 2008-01-17 |
| JP2008010423A5 true JP2008010423A5 (enExample) | 2011-07-28 |
| JP4981542B2 JP4981542B2 (ja) | 2012-07-25 |
Family
ID=38825447
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007168387A Expired - Fee Related JP4981542B2 (ja) | 2006-06-27 | 2007-06-27 | 電気化学的セル用電気伝導性素子及びその製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US8133591B2 (enExample) |
| JP (1) | JP4981542B2 (enExample) |
| CN (1) | CN101123314B (enExample) |
| DE (1) | DE102007029428B4 (enExample) |
Families Citing this family (34)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US7354862B2 (en) * | 2005-04-18 | 2008-04-08 | Intel Corporation | Thin passivation layer on 3D devices |
| WO2008006060A1 (en) * | 2006-07-07 | 2008-01-10 | Drexel University | Electrical insulation of devices with thin layers |
| KR101000697B1 (ko) * | 2008-07-17 | 2010-12-10 | 현대자동차주식회사 | 연료전지용 금속분리판 및 이의 표면층 형성 방법 |
| JP5430093B2 (ja) * | 2008-07-24 | 2014-02-26 | デクセリアルズ株式会社 | 導電性粒子、異方性導電フィルム、及び接合体、並びに、接続方法 |
| US8304143B2 (en) * | 2008-11-25 | 2012-11-06 | GM Global Technology Operations LLC | Conductive and hydrophilic coating for PEMFC bipolar plate |
| US8530100B2 (en) * | 2009-12-10 | 2013-09-10 | Daimler Ag | Method of chemical treatment of fuel cell plate surface to modify wettability of flow field channels |
| CN101859905B (zh) * | 2010-06-23 | 2012-06-20 | 湖南大学 | 一种燃料电池用石墨/树脂复合双极板的制备方法 |
| DE102011007759A1 (de) * | 2011-04-20 | 2012-10-25 | Siemens Aktiengesellschaft | Elektrolysezelle mit einem Blechpaket übereinander gestapelter Bleche mit Ausnehmungen und Verfahren zu deren Herstellung und Betrieb |
| JP6111727B2 (ja) * | 2013-02-20 | 2017-04-12 | 本田技研工業株式会社 | 燃料電池セパレータ |
| CN104470297B (zh) * | 2013-09-22 | 2018-08-07 | 富钰精密组件（昆山）有限公司 | 包覆有硅胶的外壳及使用该外壳的电子装置 |
| JP6670448B2 (ja) * | 2016-08-16 | 2020-03-25 | 株式会社オートネットワーク技術研究所 | 蓄電モジュール |
| CN106935880B (zh) * | 2017-03-08 | 2019-08-30 | 上海电力学院 | 一种质子交换膜燃料电池用铝合金双极板的表面改性方法 |
| KR102429014B1 (ko) * | 2017-08-16 | 2022-08-03 | 현대자동차 주식회사 | 연료전지용 분리판 및 연료전지용 분리판의 코팅 방법 |
| JP2019102339A (ja) * | 2017-12-05 | 2019-06-24 | トヨタ自動車株式会社 | 燃料電池用セパレータの製造方法 |
| DE102017129352A1 (de) * | 2017-12-08 | 2019-06-13 | Ensinger Gmbh | Polymer-basierendes Substrat sowie Verfahren zu dessen Herstellung |
| DE102017129353A1 (de) | 2017-12-08 | 2019-06-13 | Ensinger Gmbh | Polymer-basierendes Substrat sowie Verfahren zu dessen Herstellung |
| US10978752B2 (en) * | 2018-03-19 | 2021-04-13 | Kabushiki Kaisha Toshiba | Secondary battery, battery pack, and vehicle |
| CN110522290A (zh) * | 2018-05-25 | 2019-12-03 | 佛山市顺德区美的电热电器制造有限公司 | 一种铝合金内锅及其制备方法和烹饪器具 |
| US11028242B2 (en) * | 2019-06-03 | 2021-06-08 | Enevate Corporation | Modified silicon particles for silicon-carbon composite electrodes |
| GB2584825B (en) * | 2019-05-08 | 2021-12-01 | Wootzano Ltd | Substrates for electronic skins |
| CN111978864A (zh) * | 2019-05-24 | 2020-11-24 | 电子科技大学 | 一种表面改性剂、其配置方法及其应用 |
| DE102019121670A1 (de) * | 2019-08-12 | 2021-02-18 | Bayerische Motoren Werke Aktiengesellschaft | Verfahren zum Aufbringen einer elektrisch isolierenden Lackschicht auf eine Bipolarplatte für eine Brennstoffzelle |
| DE102019127626A1 (de) * | 2019-10-14 | 2021-04-15 | Elringklinger Ag | Bipolarplatte, Verfahren zur Herstellung und deren Verwendung |
| DE102019217123A1 (de) * | 2019-11-06 | 2021-05-06 | Robert Bosch Gmbh | Verfahren zur Herstellung eines Bauteil-Kunststoff-Verbundes |
| DE102019217128A1 (de) * | 2019-11-06 | 2021-05-06 | Robert Bosch Gmbh | Verfahren zur Herstellung eines Bauteil-Elastomer-Verbundes |
| DE102019217131A1 (de) * | 2019-11-06 | 2021-05-06 | Robert Bosch Gmbh | Verfahren zur Herstellung eines Bauteil-Thermoplast-Verbundes |
| CN111509260A (zh) * | 2020-04-14 | 2020-08-07 | 上海神力科技有限公司 | 提高燃料电池质子交换膜边框表面粘合剂稳定性的方法 |
| CN111509259A (zh) * | 2020-04-14 | 2020-08-07 | 上海神力科技有限公司 | 一种提高燃料电池极板表面粘合剂稳定性的方法 |
| DE102020216104A1 (de) * | 2020-12-17 | 2022-06-23 | Robert Bosch Gesellschaft mit beschränkter Haftung | Brennstoffzellenstapel und Verfahren zur Herstellung |
| EP4285427A4 (en) | 2021-01-26 | 2025-03-19 | Electric Hydrogen Co. | Interconnection layers in electrochemical cells |
| CN114334860B (zh) * | 2021-12-28 | 2025-09-02 | 广东思泉新材料股份有限公司 | 一种石墨导热片及其制备、及半导体散热装置 |
| CN114613560B (zh) * | 2022-03-30 | 2024-04-26 | 萍乡华创电气有限公司 | 一种自洁型高强度瓷绝缘子及其制备方法 |
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| DE102024201668A1 (de) | 2024-02-23 | 2025-08-28 | Robert Bosch Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung einer Bipolarplatte |
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| JP2004014272A (ja) * | 2002-06-06 | 2004-01-15 | Mitsubishi Plastics Ind Ltd | 燃料電池用セパレータ |
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-
2006
- 2006-06-27 US US11/475,499 patent/US8133591B2/en not_active Expired - Fee Related
-
2007
- 2007-06-26 DE DE200710029428 patent/DE102007029428B4/de not_active Expired - Fee Related
- 2007-06-27 JP JP2007168387A patent/JP4981542B2/ja not_active Expired - Fee Related
- 2007-06-27 CN CN200710146422XA patent/CN101123314B/zh not_active Expired - Fee Related
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