JP2007537595A5 - - Google Patents
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- JP2007537595A5 JP2007537595A5 JP2007513157A JP2007513157A JP2007537595A5 JP 2007537595 A5 JP2007537595 A5 JP 2007537595A5 JP 2007513157 A JP2007513157 A JP 2007513157A JP 2007513157 A JP2007513157 A JP 2007513157A JP 2007537595 A5 JP2007537595 A5 JP 2007537595A5
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- Prior art keywords
- gate
- gate dielectric
- dielectric
- contact
- well region
- Prior art date
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- 238000004519 manufacturing process Methods 0.000 claims 6
- 239000003989 dielectric material Substances 0.000 claims 5
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims 4
- 229910052715 tantalum Inorganic materials 0.000 claims 4
- 229910013379 TaC Inorganic materials 0.000 claims 2
- 229910004200 TaSiN Inorganic materials 0.000 claims 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N al2o3 Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 2
- 230000000875 corresponding Effects 0.000 claims 2
- MRELNEQAGSRDBK-UHFFFAOYSA-N lanthanum(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[La+3].[La+3] MRELNEQAGSRDBK-UHFFFAOYSA-N 0.000 claims 2
- 229910003468 tantalcarbide Inorganic materials 0.000 claims 2
- CJNBYAVZURUTKZ-UHFFFAOYSA-N Hafnium(IV) oxide Chemical compound O=[Hf]=O CJNBYAVZURUTKZ-UHFFFAOYSA-N 0.000 claims 1
- 229910000449 hafnium oxide Inorganic materials 0.000 claims 1
- 229910001941 lanthanum oxide Inorganic materials 0.000 claims 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims 1
- 229920005591 polysilicon Polymers 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 1
- 229910052721 tungsten Inorganic materials 0.000 claims 1
- 239000010937 tungsten Substances 0.000 claims 1
Claims (10)
- 第1ゲート誘電体を第1ウェル領域の上に、かつ第1ウェル領域とコンタクトするように、及び、第2ゲート誘電体を第2ウェル領域の上に、かつ第2ウェル領域とコンタクトするように形成する工程と、第1及び第2ゲート誘電体の組成は異なることと、
第1ゲート電極を第1ゲート誘電体の上に、かつ第1ゲート誘電体とコンタクトするように、そして第2ゲート電極を第2ゲート誘電体の上に、かつ第2ゲート誘電体とコンタクトするように形成する工程と、第1及び第2ゲート電極は組成及び膜厚が同じであることと、第1ゲート誘電体は第2誘電体膜を、第1ウェル領域の上側表面の上の第1誘電体膜の上に含み、そして第2ゲート誘電体は第3誘電体膜を、第2ウェル領域の上側表面の上の第1誘電体膜の上に含むこととからなる、半導体の製造方法。 - 第1及び第2ゲート誘電体は共に、高K誘電体である、請求項1記載の製造方法。
- 第1ゲート誘電体は酸化ランタンであり、及び、第2ゲート誘電体は酸化アルミニウムである、請求項2記載の製造方法。
- 第1及び第2ゲート電極はタンタル含有層を、第1及び第2ゲート誘電体のそれぞれの上に、かつ第1及び第2ゲート誘電体のそれぞれとコンタクトする形で含む、請求項3記載の製造方法。
- タンタル含有層はほとんどがTaCから成る、請求項4記載の製造方法。
- タンタル含有層はほとんどがTaSiNから成る、請求項4記載の製造方法。
- 第1及び第2ゲート電極は導電層を、タンタル含有層の上に、かつタンタル含有層とコンタクトする形で含み、導電層はポリシリコン及びタングステンから成るグループから選択される、請求項4記載の製造方法。
- 第1トランジスタを第1ウェル領域の上に、そして第2トランジスタを第2ウェル領域の上に形成する工程を備え、
前記第1トランジスタは第1ゲート誘電体を有し、及び、第2トランジスタは、第1ゲート誘電体とは組成が異なる第2ゲート誘電体を有し、
第1トランジスタは第1ゲート電極を有し、及び第2トランジスタは第2ゲート電極を有し、第1及び第2ゲート電極は組成が同じであり、第1ゲート誘電体及び第2ゲート誘電体は共に高K誘電体である、半導体の製造方法。 - 第1ゲート誘電体は酸化ハフニウムであり、そして第2ゲート誘電体は酸化アルミニウムである、請求項8記載の製造方法。
- 第1及び第2ゲート電極は共にゲート電極層を、該当するゲート誘電体の上に、かつ該当するゲート誘電体とコンタクトする形で含み、ゲート電極層はTaSiN及びTaCから成るグループから選択される、請求項9記載の製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/843,850 US6897095B1 (en) | 2004-05-12 | 2004-05-12 | Semiconductor process and integrated circuit having dual metal oxide gate dielectric with single metal gate electrode |
US10/843,850 | 2004-05-12 | ||
PCT/US2005/013076 WO2005114718A1 (en) | 2004-05-12 | 2005-04-18 | Semiconductor process and integrated circuit having dual metal oxide gate dielectric with single metal gate electrode |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2007537595A JP2007537595A (ja) | 2007-12-20 |
JP2007537595A5 true JP2007537595A5 (ja) | 2008-05-29 |
JP4848366B2 JP4848366B2 (ja) | 2011-12-28 |
Family
ID=34592746
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007513157A Active JP4848366B2 (ja) | 2004-05-12 | 2005-04-18 | 2種類の金属酸化物ゲート誘電体に1種類の金属ゲート電極が設けられる半導体プロセス及び集積回路 |
Country Status (4)
Country | Link |
---|---|
US (1) | US6897095B1 (ja) |
JP (1) | JP4848366B2 (ja) |
TW (1) | TWI382449B (ja) |
WO (1) | WO2005114718A1 (ja) |
Families Citing this family (62)
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KR100598033B1 (ko) * | 2004-02-03 | 2006-07-07 | 삼성전자주식회사 | 반도체 소자의 듀얼 게이트 산화막 형성 방법 |
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US8399934B2 (en) * | 2004-12-20 | 2013-03-19 | Infineon Technologies Ag | Transistor device |
US7592678B2 (en) * | 2004-06-17 | 2009-09-22 | Infineon Technologies Ag | CMOS transistors with dual high-k gate dielectric and methods of manufacture thereof |
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-
2004
- 2004-05-12 US US10/843,850 patent/US6897095B1/en not_active Expired - Lifetime
-
2005
- 2005-04-18 WO PCT/US2005/013076 patent/WO2005114718A1/en active Application Filing
- 2005-04-18 JP JP2007513157A patent/JP4848366B2/ja active Active
- 2005-05-10 TW TW094115107A patent/TWI382449B/zh active
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