JP2007531310A5 - - Google Patents
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- Publication number
- JP2007531310A5 JP2007531310A5 JP2007506175A JP2007506175A JP2007531310A5 JP 2007531310 A5 JP2007531310 A5 JP 2007531310A5 JP 2007506175 A JP2007506175 A JP 2007506175A JP 2007506175 A JP2007506175 A JP 2007506175A JP 2007531310 A5 JP2007531310 A5 JP 2007531310A5
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- optical coupling
- light
- substrate
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000008878 coupling Effects 0.000 claims 14
- 238000010168 coupling process Methods 0.000 claims 14
- 238000005859 coupling reaction Methods 0.000 claims 14
- 230000003287 optical effect Effects 0.000 claims 14
- 239000000758 substrate Substances 0.000 claims 12
- 238000000034 method Methods 0.000 claims 9
- 150000001875 compounds Chemical class 0.000 claims 8
- 238000000465 moulding Methods 0.000 claims 8
- 239000000463 material Substances 0.000 claims 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 3
- 229910052802 copper Inorganic materials 0.000 claims 3
- 239000010949 copper Substances 0.000 claims 3
- 238000005530 etching Methods 0.000 claims 2
- 238000000151 deposition Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/817,195 US7196313B2 (en) | 2004-04-02 | 2004-04-02 | Surface mount multi-channel optocoupler |
| PCT/US2005/005133 WO2005102156A2 (en) | 2004-04-02 | 2005-02-17 | Surface mount multi-channel optocoupler |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007531310A JP2007531310A (ja) | 2007-11-01 |
| JP2007531310A5 true JP2007531310A5 (enExample) | 2008-03-27 |
Family
ID=35053264
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007506175A Pending JP2007531310A (ja) | 2004-04-02 | 2005-02-17 | 表面実装多重チャネル光結合素子 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7196313B2 (enExample) |
| JP (1) | JP2007531310A (enExample) |
| CN (2) | CN100590779C (enExample) |
| DE (1) | DE112005000717T5 (enExample) |
| MY (1) | MY139480A (enExample) |
| TW (1) | TWI452715B (enExample) |
| WO (1) | WO2005102156A2 (enExample) |
Families Citing this family (62)
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|---|---|---|---|---|
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| US8057408B2 (en) | 2005-09-22 | 2011-11-15 | The Regents Of The University Of Michigan | Pulsed cavitational ultrasound therapy |
| US10219815B2 (en) | 2005-09-22 | 2019-03-05 | The Regents Of The University Of Michigan | Histotripsy for thrombolysis |
| US20070083120A1 (en) * | 2005-09-22 | 2007-04-12 | Cain Charles A | Pulsed cavitational ultrasound therapy |
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| US7371616B2 (en) * | 2006-01-05 | 2008-05-13 | Fairchild Semiconductor Corporation | Clipless and wireless semiconductor die package and method for making the same |
| US20070216033A1 (en) * | 2006-03-20 | 2007-09-20 | Corisis David J | Carrierless chip package for integrated circuit devices, and methods of making same |
| US7768105B2 (en) * | 2007-01-24 | 2010-08-03 | Fairchild Semiconductor Corporation | Pre-molded clip structure |
| US8106501B2 (en) * | 2008-12-12 | 2012-01-31 | Fairchild Semiconductor Corporation | Semiconductor die package including low stress configuration |
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| KR101489325B1 (ko) * | 2007-03-12 | 2015-02-06 | 페어차일드코리아반도체 주식회사 | 플립-칩 방식의 적층형 파워 모듈 및 그 파워 모듈의제조방법 |
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| KR101519062B1 (ko) * | 2008-03-31 | 2015-05-11 | 페어차일드코리아반도체 주식회사 | 반도체 소자 패키지 |
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| US8421204B2 (en) | 2011-05-18 | 2013-04-16 | Fairchild Semiconductor Corporation | Embedded semiconductor power modules and packages |
| US9144694B2 (en) | 2011-08-10 | 2015-09-29 | The Regents Of The University Of Michigan | Lesion generation through bone using histotripsy therapy without aberration correction |
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| JP2015516233A (ja) | 2012-04-30 | 2015-06-11 | ザ リージェンツ オブ ザ ユニバーシティ オブ ミシガン | ラピッドプロトタイピング方法を使用した超音波トランスデューサー製造 |
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| US10780298B2 (en) | 2013-08-22 | 2020-09-22 | The Regents Of The University Of Michigan | Histotripsy using very short monopolar ultrasound pulses |
| US11135454B2 (en) | 2015-06-24 | 2021-10-05 | The Regents Of The University Of Michigan | Histotripsy therapy systems and methods for the treatment of brain tissue |
| TWI587536B (zh) * | 2015-11-11 | 2017-06-11 | 趙寶龍 | 光耦合器 |
| US10170658B2 (en) * | 2015-11-13 | 2019-01-01 | Advanced Semiconductor Engineering, Inc. | Semiconductor package structures and method of manufacturing the same |
| US11211305B2 (en) | 2016-04-01 | 2021-12-28 | Texas Instruments Incorporated | Apparatus and method to support thermal management of semiconductor-based components |
| US10861796B2 (en) | 2016-05-10 | 2020-12-08 | Texas Instruments Incorporated | Floating die package |
| US10179730B2 (en) | 2016-12-08 | 2019-01-15 | Texas Instruments Incorporated | Electronic sensors with sensor die in package structure cavity |
| US10074639B2 (en) | 2016-12-30 | 2018-09-11 | Texas Instruments Incorporated | Isolator integrated circuits with package structure cavity and fabrication methods |
| US10411150B2 (en) | 2016-12-30 | 2019-09-10 | Texas Instruments Incorporated | Optical isolation systems and circuits and photon detectors with extended lateral P-N junctions |
| US9929110B1 (en) | 2016-12-30 | 2018-03-27 | Texas Instruments Incorporated | Integrated circuit wave device and method |
| US10121847B2 (en) | 2017-03-17 | 2018-11-06 | Texas Instruments Incorporated | Galvanic isolation device |
| AU2019389001B2 (en) | 2018-11-28 | 2025-08-14 | Histosonics, Inc. | Histotripsy systems and methods |
| AU2021213168A1 (en) | 2020-01-28 | 2022-09-01 | The Regents Of The University Of Michigan | Systems and methods for histotripsy immunosensitization |
| IL300851A (en) | 2020-08-27 | 2023-04-01 | Univ Michigan Regents | Ultrasonic transducer with transmit-receive capability for focused ultrasound |
| CN113540058A (zh) * | 2021-06-03 | 2021-10-22 | 华润微集成电路(无锡)有限公司 | 一种高耐压光耦封装产品及制作方法 |
| AU2023366591A1 (en) | 2022-10-28 | 2025-04-24 | Histosonics, Inc. | Histotripsy systems and methods |
| WO2024221001A2 (en) | 2023-04-20 | 2024-10-24 | Histosonics, Inc. | Histotripsy systems and associated methods including user interfaces and workflows for treatment planning and therapy |
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-
2004
- 2004-04-02 US US10/817,195 patent/US7196313B2/en not_active Expired - Lifetime
-
2005
- 2005-02-17 DE DE112005000717T patent/DE112005000717T5/de not_active Withdrawn
- 2005-02-17 WO PCT/US2005/005133 patent/WO2005102156A2/en not_active Ceased
- 2005-02-17 JP JP2007506175A patent/JP2007531310A/ja active Pending
- 2005-02-17 CN CN200580012042A patent/CN100590779C/zh not_active Expired - Fee Related
- 2005-02-17 CN CN2010100029444A patent/CN101893742B/zh not_active Expired - Fee Related
- 2005-02-23 TW TW094105381A patent/TWI452715B/zh not_active IP Right Cessation
- 2005-03-28 MY MYPI20051344A patent/MY139480A/en unknown
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