CN101893742B - 表面贴装多通道光耦合器 - Google Patents

表面贴装多通道光耦合器 Download PDF

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Publication number
CN101893742B
CN101893742B CN2010100029444A CN201010002944A CN101893742B CN 101893742 B CN101893742 B CN 101893742B CN 2010100029444 A CN2010100029444 A CN 2010100029444A CN 201010002944 A CN201010002944 A CN 201010002944A CN 101893742 B CN101893742 B CN 101893742B
Authority
CN
China
Prior art keywords
substrate
light
lead frame
etched
molding compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2010100029444A
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English (en)
Chinese (zh)
Other versions
CN101893742A (zh
Inventor
M·C·Y·基尼奥内斯
R·乔什
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fairchild Semiconductor Corp
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Fairchild Semiconductor Corp
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Filing date
Publication date
Application filed by Fairchild Semiconductor Corp filed Critical Fairchild Semiconductor Corp
Publication of CN101893742A publication Critical patent/CN101893742A/zh
Application granted granted Critical
Publication of CN101893742B publication Critical patent/CN101893742B/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
CN2010100029444A 2004-04-02 2005-02-17 表面贴装多通道光耦合器 Expired - Fee Related CN101893742B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/817,195 2004-04-02
US10/817,195 US7196313B2 (en) 2004-04-02 2004-04-02 Surface mount multi-channel optocoupler

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN200580012042A Division CN100590779C (zh) 2004-04-02 2005-02-17 表面贴装多通道光耦合器

Publications (2)

Publication Number Publication Date
CN101893742A CN101893742A (zh) 2010-11-24
CN101893742B true CN101893742B (zh) 2013-12-18

Family

ID=35053264

Family Applications (2)

Application Number Title Priority Date Filing Date
CN2010100029444A Expired - Fee Related CN101893742B (zh) 2004-04-02 2005-02-17 表面贴装多通道光耦合器
CN200580012042A Expired - Fee Related CN100590779C (zh) 2004-04-02 2005-02-17 表面贴装多通道光耦合器

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN200580012042A Expired - Fee Related CN100590779C (zh) 2004-04-02 2005-02-17 表面贴装多通道光耦合器

Country Status (7)

Country Link
US (1) US7196313B2 (enExample)
JP (1) JP2007531310A (enExample)
CN (2) CN101893742B (enExample)
DE (1) DE112005000717T5 (enExample)
MY (1) MY139480A (enExample)
TW (1) TWI452715B (enExample)
WO (1) WO2005102156A2 (enExample)

Families Citing this family (62)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7061077B2 (en) 2002-08-30 2006-06-13 Fairchild Semiconductor Corporation Substrate based unmolded package including lead frame structure and semiconductor die
JP2006351859A (ja) * 2005-06-16 2006-12-28 Sharp Corp 光結合装置の製造方法
WO2007010315A2 (en) * 2005-07-20 2007-01-25 Infineon Technologies Ag Leadframe strip and mold apparatus for an electronic component and method of encapsulating an electronic component
US8057408B2 (en) 2005-09-22 2011-11-15 The Regents Of The University Of Michigan Pulsed cavitational ultrasound therapy
US10219815B2 (en) * 2005-09-22 2019-03-05 The Regents Of The University Of Michigan Histotripsy for thrombolysis
US20070083120A1 (en) * 2005-09-22 2007-04-12 Cain Charles A Pulsed cavitational ultrasound therapy
US20090057852A1 (en) * 2007-08-27 2009-03-05 Madrid Ruben P Thermally enhanced thin semiconductor package
US7371616B2 (en) * 2006-01-05 2008-05-13 Fairchild Semiconductor Corporation Clipless and wireless semiconductor die package and method for making the same
US20070216033A1 (en) * 2006-03-20 2007-09-20 Corisis David J Carrierless chip package for integrated circuit devices, and methods of making same
US7768105B2 (en) * 2007-01-24 2010-08-03 Fairchild Semiconductor Corporation Pre-molded clip structure
US8106501B2 (en) 2008-12-12 2012-01-31 Fairchild Semiconductor Corporation Semiconductor die package including low stress configuration
KR101391925B1 (ko) * 2007-02-28 2014-05-07 페어차일드코리아반도체 주식회사 반도체 패키지 및 이를 제조하기 위한 반도체 패키지 금형
KR101489325B1 (ko) * 2007-03-12 2015-02-06 페어차일드코리아반도체 주식회사 플립-칩 방식의 적층형 파워 모듈 및 그 파워 모듈의제조방법
US7659531B2 (en) * 2007-04-13 2010-02-09 Fairchild Semiconductor Corporation Optical coupler package
US7683463B2 (en) * 2007-04-19 2010-03-23 Fairchild Semiconductor Corporation Etched leadframe structure including recesses
US7902657B2 (en) * 2007-08-28 2011-03-08 Fairchild Semiconductor Corporation Self locking and aligning clip structure for semiconductor die package
US7737548B2 (en) 2007-08-29 2010-06-15 Fairchild Semiconductor Corporation Semiconductor die package including heat sinks
US7589338B2 (en) * 2007-11-30 2009-09-15 Fairchild Semiconductor Corporation Semiconductor die packages suitable for optoelectronic applications having clip attach structures for angled mounting of dice
US20090140266A1 (en) * 2007-11-30 2009-06-04 Yong Liu Package including oriented devices
KR20090062612A (ko) * 2007-12-13 2009-06-17 페어차일드코리아반도체 주식회사 멀티 칩 패키지
US7781872B2 (en) * 2007-12-19 2010-08-24 Fairchild Semiconductor Corporation Package with multiple dies
US8106406B2 (en) 2008-01-09 2012-01-31 Fairchild Semiconductor Corporation Die package including substrate with molded device
US7626249B2 (en) * 2008-01-10 2009-12-01 Fairchild Semiconductor Corporation Flex clip connector for semiconductor device
US20090194856A1 (en) * 2008-02-06 2009-08-06 Gomez Jocel P Molded package assembly
KR101524545B1 (ko) * 2008-02-28 2015-06-01 페어차일드코리아반도체 주식회사 전력 소자 패키지 및 그 제조 방법
US8018054B2 (en) * 2008-03-12 2011-09-13 Fairchild Semiconductor Corporation Semiconductor die package including multiple semiconductor dice
US7768108B2 (en) * 2008-03-12 2010-08-03 Fairchild Semiconductor Corporation Semiconductor die package including embedded flip chip
KR101519062B1 (ko) * 2008-03-31 2015-05-11 페어차일드코리아반도체 주식회사 반도체 소자 패키지
US20090278241A1 (en) * 2008-05-08 2009-11-12 Yong Liu Semiconductor die package including die stacked on premolded substrate including die
US8193618B2 (en) 2008-12-12 2012-06-05 Fairchild Semiconductor Corporation Semiconductor die package with clip interconnection
US7973393B2 (en) * 2009-02-04 2011-07-05 Fairchild Semiconductor Corporation Stacked micro optocouplers and methods of making the same
US8222718B2 (en) * 2009-02-05 2012-07-17 Fairchild Semiconductor Corporation Semiconductor die package and method for making the same
CA2770452C (en) * 2009-08-17 2017-09-19 Histosonics, Inc. Disposable acoustic coupling medium container
WO2011028609A2 (en) * 2009-08-26 2011-03-10 The Regents Of The University Of Michigan Devices and methods for using controlled bubble cloud cavitation in fractionating urinary stones
CA2770700C (en) * 2009-08-26 2018-04-24 William W. Roberts Micromanipulator control arm for therapeutic and imaging ultrasound transducers
JP4764519B1 (ja) * 2010-01-29 2011-09-07 株式会社東芝 Ｌｅｄパッケージ
US8421204B2 (en) 2011-05-18 2013-04-16 Fairchild Semiconductor Corporation Embedded semiconductor power modules and packages
US9144694B2 (en) 2011-08-10 2015-09-29 The Regents Of The University Of Michigan Lesion generation through bone using histotripsy therapy without aberration correction
US9012826B2 (en) 2012-01-03 2015-04-21 Avago Technologies General Ip (Singapore) Pte. Ltd. Optocoupler with multiple photodetectors and improved feedback control of LED
US9049783B2 (en) * 2012-04-13 2015-06-02 Histosonics, Inc. Systems and methods for obtaining large creepage isolation on printed circuit boards
EP2844343B1 (en) 2012-04-30 2018-11-21 The Regents Of The University Of Michigan Ultrasound transducer manufacturing using rapid-prototyping method
US20140100459A1 (en) 2012-10-05 2014-04-10 The Regents Of The University Of Michigan Bubble-induced color doppler feedback during histotripsy
CN102915942B (zh) * 2012-10-08 2015-12-02 华东光电集成器件研究所 一种光耦合器精确固晶装置
US11432900B2 (en) 2013-07-03 2022-09-06 Histosonics, Inc. Articulating arm limiter for cavitational ultrasound therapy system
US10293187B2 (en) 2013-07-03 2019-05-21 Histosonics, Inc. Histotripsy excitation sequences optimized for bubble cloud formation using shock scattering
US10780298B2 (en) 2013-08-22 2020-09-22 The Regents Of The University Of Michigan Histotripsy using very short monopolar ultrasound pulses
ES2948135T3 (es) 2015-06-24 2023-08-31 Univ Michigan Regents Sistemas de terapia de histotripsia para el tratamiento del tejido cerebral
TWI587536B (zh) * 2015-11-11 2017-06-11 趙寶龍 光耦合器
US10170658B2 (en) * 2015-11-13 2019-01-01 Advanced Semiconductor Engineering, Inc. Semiconductor package structures and method of manufacturing the same
US11211305B2 (en) 2016-04-01 2021-12-28 Texas Instruments Incorporated Apparatus and method to support thermal management of semiconductor-based components
US10861796B2 (en) 2016-05-10 2020-12-08 Texas Instruments Incorporated Floating die package
US10179730B2 (en) 2016-12-08 2019-01-15 Texas Instruments Incorporated Electronic sensors with sensor die in package structure cavity
US9929110B1 (en) 2016-12-30 2018-03-27 Texas Instruments Incorporated Integrated circuit wave device and method
US10411150B2 (en) 2016-12-30 2019-09-10 Texas Instruments Incorporated Optical isolation systems and circuits and photon detectors with extended lateral P-N junctions
US10074639B2 (en) * 2016-12-30 2018-09-11 Texas Instruments Incorporated Isolator integrated circuits with package structure cavity and fabrication methods
US10121847B2 (en) 2017-03-17 2018-11-06 Texas Instruments Incorporated Galvanic isolation device
CN120324803A (zh) 2018-11-28 2025-07-18 希斯托索尼克斯公司 组织摧毁术系统及方法
EP4096782A4 (en) 2020-01-28 2024-02-14 The Regents Of The University Of Michigan SYSTEMS AND METHODS FOR HISTOTRIPSIA IMMUNOSENSITIZATION
AU2021332372A1 (en) 2020-08-27 2023-03-16 The Regents Of The University Of Michigan Ultrasound transducer with transmit-receive capability for histotripsy
CN113540058A (zh) * 2021-06-03 2021-10-22 华润微集成电路(无锡)有限公司 一种高耐压光耦封装产品及制作方法
EP4608504A1 (en) 2022-10-28 2025-09-03 Histosonics, Inc. Histotripsy systems and methods
AU2024257180A1 (en) 2023-04-20 2025-09-18 Histosonics, Inc. Histotripsy systems and associated methods including user interfaces and workflows for treatment planning and therapy

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4114177A (en) * 1975-05-01 1978-09-12 Bell Telephone Laboratories, Incorporated Optically coupled device with diffusely reflecting enclosure

Family Cites Families (82)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4124860A (en) * 1975-02-27 1978-11-07 Optron, Inc. Optical coupler
US4450461A (en) * 1981-07-24 1984-05-22 General Electric Company Low cost high isolation voltage optocoupler with improved light transmissivity
US4445043A (en) * 1982-01-28 1984-04-24 General Instrument Corporation Method of making an optocoupler
US4680613A (en) * 1983-12-01 1987-07-14 Fairchild Semiconductor Corporation Low impedance package for integrated circuit die
US4751199A (en) * 1983-12-06 1988-06-14 Fairchild Semiconductor Corporation Process of forming a compliant lead frame for array-type semiconductor packages
US4772935A (en) * 1984-12-19 1988-09-20 Fairchild Semiconductor Corporation Die bonding process
US4890153A (en) * 1986-04-04 1989-12-26 Fairchild Semiconductor Corporation Single bonding shelf, multi-row wire-bond finger layout for integrated circuit package
US4794431A (en) * 1986-04-21 1988-12-27 International Rectifier Corporation Package for photoactivated semiconductor device
US4720396A (en) * 1986-06-25 1988-01-19 Fairchild Semiconductor Corporation Solder finishing integrated circuit package leads
NL8602091A (nl) * 1986-08-18 1988-03-16 Philips Nv Beeldopneeminrichting uitgevoerd met een vaste-stof beeldopnemer en een elektronische sluiter.
DE3633181C2 (de) * 1986-09-30 1998-12-10 Siemens Ag Reflexlichtschranke
US4791473A (en) * 1986-12-17 1988-12-13 Fairchild Semiconductor Corporation Plastic package for high frequency semiconductor devices
US4731701A (en) * 1987-05-12 1988-03-15 Fairchild Semiconductor Corporation Integrated circuit package with thermal path layers incorporating staggered thermal vias
US5172214A (en) * 1991-02-06 1992-12-15 Motorola, Inc. Leadless semiconductor device and method for making the same
US5203075A (en) * 1991-08-12 1993-04-20 Inernational Business Machines Method of bonding flexible circuit to cicuitized substrate to provide electrical connection therebetween using different solders
JPH0595071A (ja) * 1991-10-01 1993-04-16 Ibiden Co Ltd 電子部品搭載用基板及びその製造方法
KR100280762B1 (ko) * 1992-11-03 2001-03-02 비센트 비.인그라시아 노출 후부를 갖는 열적 강화된 반도체 장치 및 그 제조방법
JP3254865B2 (ja) * 1993-12-17 2002-02-12 ソニー株式会社 カメラ装置
JP3541491B2 (ja) * 1994-06-22 2004-07-14 セイコーエプソン株式会社 電子部品
US5489800A (en) * 1994-08-31 1996-02-06 Motorola, Inc. Dual channel small outline optocoupler package and method thereof
US5545893A (en) * 1994-12-23 1996-08-13 Motorola, Inc. Optocoupler package and method for making
US6183077B1 (en) * 1995-04-27 2001-02-06 Hewlett-Packard Company Method and apparatus for keying ink supply containers
JP3191617B2 (ja) * 1995-06-13 2001-07-23 日立電線株式会社 リードフレーム及びこれを用いた半導体装置
US5789809A (en) * 1995-08-22 1998-08-04 National Semiconductor Corporation Thermally enhanced micro-ball grid array package
JP3549294B2 (ja) * 1995-08-23 2004-08-04 新光電気工業株式会社 半導体装置及びその実装構造
US5637916A (en) * 1996-02-02 1997-06-10 National Semiconductor Corporation Carrier based IC packaging arrangement
JP3773268B2 (ja) * 1996-09-30 2006-05-10 シーメンス アクチエンゲゼルシヤフト サンドイッチ構造のマイクロエレクトロニクス構成部材
JP2000049184A (ja) * 1998-05-27 2000-02-18 Hitachi Ltd 半導体装置およびその製造方法
US6229200B1 (en) * 1998-06-10 2001-05-08 Asat Limited Saw-singulated leadless plastic chip carrier
JP2000003988A (ja) * 1998-06-15 2000-01-07 Sony Corp リードフレームおよび半導体装置
US6143981A (en) * 1998-06-24 2000-11-07 Amkor Technology, Inc. Plastic integrated circuit package and method and leadframe for making the package
US6133634A (en) * 1998-08-05 2000-10-17 Fairchild Semiconductor Corporation High performance flip chip package
US6393183B1 (en) * 1998-08-13 2002-05-21 Eugene Robert Worley Opto-coupler device for packaging optically coupled integrated circuits
US6424035B1 (en) * 1998-11-05 2002-07-23 Fairchild Semiconductor Corporation Semiconductor bilateral switch
JP3871486B2 (ja) * 1999-02-17 2007-01-24 株式会社ルネサステクノロジ 半導体装置
US6656206B2 (en) 1999-05-13 2003-12-02 Cardia, Inc. Occlusion device with non-thrombogenic properties
US6479280B1 (en) 1999-09-24 2002-11-12 Vlaams Interuniversitair Institutuut Voor Biotechnologie Vzw Recombinant phages capable of entering host cells via specific interaction with an artificial receptor
US6720642B1 (en) * 1999-12-16 2004-04-13 Fairchild Semiconductor Corporation Flip chip in leaded molded package and method of manufacture thereof
US6384472B1 (en) 2000-03-24 2002-05-07 Siliconware Precision Industries Co., Ltd Leadless image sensor package structure and method for making the same
US6989588B2 (en) * 2000-04-13 2006-01-24 Fairchild Semiconductor Corporation Semiconductor device including molded wireless exposed drain packaging
US6556750B2 (en) * 2000-05-26 2003-04-29 Fairchild Semiconductor Corporation Bi-directional optical coupler
US6661082B1 (en) * 2000-07-19 2003-12-09 Fairchild Semiconductor Corporation Flip chip substrate design
JP2002093982A (ja) * 2000-09-13 2002-03-29 Shinko Electric Ind Co Ltd 半導体装置及びその製造方法
US6342670B1 (en) * 2000-09-19 2002-01-29 Lite-On Electronics, Inc. Photoelectric module device
CN1347151A (zh) * 2000-10-10 2002-05-01 华泰电子股份有限公司 电荷耦合元件取像芯片封装结构
US6753605B2 (en) * 2000-12-04 2004-06-22 Fairchild Semiconductor Corporation Passivation scheme for bumped wafers
US6798044B2 (en) * 2000-12-04 2004-09-28 Fairchild Semiconductor Corporation Flip chip in leaded molded package with two dies
US6564100B2 (en) 2000-12-06 2003-05-13 Cardiac Pacemakers, Inc. Cardiac rhythm management system with remotely activated capture verification for CHF and other patients
CN1152429C (zh) * 2000-12-11 2004-06-02 胜开科技股份有限公司 封装影像感测芯片及其封装方法
JP2002203957A (ja) * 2000-12-28 2002-07-19 Rohm Co Ltd トランジスタ
JP2002217416A (ja) * 2001-01-16 2002-08-02 Hitachi Ltd 半導体装置
US6469384B2 (en) * 2001-02-01 2002-10-22 Fairchild Semiconductor Corporation Unmolded package for a semiconductor device
US6891257B2 (en) * 2001-03-30 2005-05-10 Fairchild Semiconductor Corporation Packaging system for die-up connection of a die-down oriented integrated circuit
US6528869B1 (en) * 2001-04-06 2003-03-04 Amkor Technology, Inc. Semiconductor package with molded substrate and recessed input/output terminals
US6645791B2 (en) * 2001-04-23 2003-11-11 Fairchild Semiconductor Semiconductor die package including carrier with mask
US6731002B2 (en) * 2001-05-04 2004-05-04 Ixys Corporation High frequency power device with a plastic molded package and direct bonded substrate
US6437429B1 (en) * 2001-05-11 2002-08-20 Walsin Advanced Electronics Ltd Semiconductor package with metal pads
US6893901B2 (en) * 2001-05-14 2005-05-17 Fairchild Semiconductor Corporation Carrier with metal bumps for semiconductor die packages
US6683375B2 (en) * 2001-06-15 2004-01-27 Fairchild Semiconductor Corporation Semiconductor die including conductive columns
US6784376B1 (en) 2001-08-16 2004-08-31 Amkor Technology, Inc. Solderable injection-molded integrated circuit substrate and method therefor
US6449174B1 (en) * 2001-08-06 2002-09-10 Fairchild Semiconductor Corporation Current sharing in a multi-phase power supply by phase temperature control
US6633030B2 (en) * 2001-08-31 2003-10-14 Fiarchild Semiconductor Surface mountable optocoupler package
US6603183B1 (en) * 2001-09-04 2003-08-05 Amkor Technology, Inc. Quick sealing glass-lidded package
US20040173894A1 (en) * 2001-09-27 2004-09-09 Amkor Technology, Inc. Integrated circuit package including interconnection posts for multiple electrical connections
US6891256B2 (en) * 2001-10-22 2005-05-10 Fairchild Semiconductor Corporation Thin, thermally enhanced flip chip in a leaded molded package
US6642738B2 (en) * 2001-10-23 2003-11-04 Fairchild Semiconductor Corporation Method and apparatus for field-effect transistor current sensing using the voltage drop across drain to source resistance that eliminates dependencies on temperature of the field-effect transistor and/or statistical distribution of the initial value of drain to source resistance
US6674157B2 (en) * 2001-11-02 2004-01-06 Fairchild Semiconductor Corporation Semiconductor package comprising vertical power transistor
US6566749B1 (en) * 2002-01-15 2003-05-20 Fairchild Semiconductor Corporation Semiconductor die package with improved thermal and electrical performance
US6830959B2 (en) * 2002-01-22 2004-12-14 Fairchild Semiconductor Corporation Semiconductor die package with semiconductor die having side electrical connection
US6867489B1 (en) * 2002-01-22 2005-03-15 Fairchild Semiconductor Corporation Semiconductor die package processable at the wafer level
US6650015B2 (en) * 2002-02-05 2003-11-18 Siliconware Precision Industries Co., Ltd. Cavity-down ball grid array package with semiconductor chip solder ball
WO2003079407A2 (en) * 2002-03-12 2003-09-25 Fairchild Semiconductor Corporation Wafer-level coated copper stud bumps
JP4189161B2 (ja) * 2002-03-15 2008-12-03 新日本無線株式会社 リードフレーム及び半導体装置並びにそれらの製造方法
US6836023B2 (en) * 2002-04-17 2004-12-28 Fairchild Semiconductor Corporation Structure of integrated trace of chip package
WO2003101569A1 (en) * 2002-05-31 2003-12-11 Mattel, Inc. sPRING-DRIVEN TOY VEHICLE
US7061077B2 (en) * 2002-08-30 2006-06-13 Fairchild Semiconductor Corporation Substrate based unmolded package including lead frame structure and semiconductor die
US6818973B1 (en) * 2002-09-09 2004-11-16 Amkor Technology, Inc. Exposed lead QFP package fabricated through the use of a partial saw process
US6777800B2 (en) * 2002-09-30 2004-08-17 Fairchild Semiconductor Corporation Semiconductor die package including drain clip
US6943434B2 (en) * 2002-10-03 2005-09-13 Fairchild Semiconductor Corporation Method for maintaining solder thickness in flipchip attach packaging processes
US6806580B2 (en) * 2002-12-26 2004-10-19 Fairchild Semiconductor Corporation Multichip module including substrate with an array of interconnect structures
US6798047B1 (en) * 2002-12-26 2004-09-28 Amkor Technology, Inc. Pre-molded leadframe
US6867481B2 (en) * 2003-04-11 2005-03-15 Fairchild Semiconductor Corporation Lead frame structure with aperture or groove for flip chip in a leaded molded package

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4114177A (en) * 1975-05-01 1978-09-12 Bell Telephone Laboratories, Incorporated Optically coupled device with diffusely reflecting enclosure

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JP2007531310A (ja) 2007-11-01
CN100590779C (zh) 2010-02-17
CN101893742A (zh) 2010-11-24
TW200605391A (en) 2006-02-01
MY139480A (en) 2009-10-30
WO2005102156A2 (en) 2005-11-03
CN1943004A (zh) 2007-04-04
US20050218300A1 (en) 2005-10-06
DE112005000717T5 (de) 2008-07-03
US7196313B2 (en) 2007-03-27
WO2005102156A3 (en) 2006-01-26
TWI452715B (zh) 2014-09-11

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