JP2007523463A - 基板処理装置及び方法 - Google Patents

基板処理装置及び方法 Download PDF

Info

Publication number
JP2007523463A
JP2007523463A JP2006523459A JP2006523459A JP2007523463A JP 2007523463 A JP2007523463 A JP 2007523463A JP 2006523459 A JP2006523459 A JP 2006523459A JP 2006523459 A JP2006523459 A JP 2006523459A JP 2007523463 A JP2007523463 A JP 2007523463A
Authority
JP
Japan
Prior art keywords
substrate
holding mechanism
liquid
rotation speed
substrate holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006523459A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007523463A5 (https=
Inventor
真二 梶田
一郎 片伯部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of JP2007523463A publication Critical patent/JP2007523463A/ja
Publication of JP2007523463A5 publication Critical patent/JP2007523463A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • B08B11/02—Devices for holding articles during cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0424—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
  • Weting (AREA)
JP2006523459A 2004-02-24 2005-02-23 基板処理装置及び方法 Pending JP2007523463A (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2004047358 2004-02-24
JP2004143379 2004-05-13
JP2004190474 2004-06-28
PCT/JP2005/003423 WO2005080007A1 (en) 2004-02-24 2005-02-23 Substrate processing apparatus and method

Publications (2)

Publication Number Publication Date
JP2007523463A true JP2007523463A (ja) 2007-08-16
JP2007523463A5 JP2007523463A5 (https=) 2007-12-06

Family

ID=34890891

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006523459A Pending JP2007523463A (ja) 2004-02-24 2005-02-23 基板処理装置及び方法

Country Status (4)

Country Link
US (1) US20080110861A1 (https=)
EP (1) EP1718420A1 (https=)
JP (1) JP2007523463A (https=)
WO (1) WO2005080007A1 (https=)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009295669A (ja) * 2008-06-03 2009-12-17 Tokyo Electron Ltd 基板処理装置、基板処理方法、プログラムおよび記録媒体
JP2011243627A (ja) * 2010-05-14 2011-12-01 Tokyo Electron Ltd 液処理方法、その液処理方法を実行させるためのプログラムを記録した記録媒体及び液処理装置
KR101140376B1 (ko) 2011-05-23 2012-05-03 주식회사 쓰리디플러스 기판 제조용 공정 챔버
JP2014204061A (ja) * 2013-04-09 2014-10-27 芝浦メカトロニクス株式会社 基板把持装置
KR20160027802A (ko) * 2014-09-02 2016-03-10 주식회사 제우스 기판 액처리 장치 및 기판 액처리 방법
JP2016119436A (ja) * 2014-12-24 2016-06-30 東京エレクトロン株式会社 基板処理装置及び基板処理方法並びに基板処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体
JP2016186988A (ja) * 2015-03-27 2016-10-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
KR20180001683A (ko) * 2016-06-27 2018-01-05 세메스 주식회사 기판 처리 장치 및 용기 세정 방법
KR101880232B1 (ko) * 2015-07-13 2018-07-19 주식회사 제우스 기판 액처리 장치 및 방법
US10395915B2 (en) 2013-02-28 2019-08-27 Semes Co., Ltd. Nozzle assembly, substrate treatment apparatus including the nozzle assembly, and method of treating substrate using the assembly
KR20200009397A (ko) * 2018-07-18 2020-01-30 세메스 주식회사 기판 처리 장치 및 방법
KR20200052505A (ko) * 2018-11-06 2020-05-15 세메스 주식회사 기판 처리 방법 및 기판 처리 장치
US10998203B2 (en) 2015-03-27 2021-05-04 SCREEN Holdings Co., Ltd. Substrate processing device and substrate processing method

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI373804B (en) * 2007-07-13 2012-10-01 Lam Res Ag Apparatus and method for wet treatment of disc-like articles
JP5156661B2 (ja) * 2009-02-12 2013-03-06 東京エレクトロン株式会社 液処理装置および液処理方法
US8752872B2 (en) * 2009-09-14 2014-06-17 Fabworx Solutions, Inc. Edge grip end effector
KR101665036B1 (ko) * 2010-04-27 2016-10-24 티이엘 에프에스아이, 인코포레이티드 기판 표면 근방의 유체 혼합을 제어하는 마이크로전자 기판의 습식 처리
JP6018404B2 (ja) * 2012-04-25 2016-11-02 株式会社荏原製作所 基板処理装置
JP2013249495A (ja) * 2012-05-30 2013-12-12 Tokyo Electron Ltd めっき処理装置、めっき処理方法および記憶媒体
US9147593B2 (en) * 2012-10-10 2015-09-29 Lam Research Ag Apparatus for liquid treatment of wafer shaped articles
US9748120B2 (en) 2013-07-01 2017-08-29 Lam Research Ag Apparatus for liquid treatment of disc-shaped articles and heating system for use in such apparatus
US9805946B2 (en) * 2013-08-30 2017-10-31 Taiwan Semiconductor Manufacturing Company Limited Photoresist removal
JP6229933B2 (ja) * 2013-09-27 2017-11-15 株式会社Ｓｃｒｅｅｎホールディングス 処理カップ洗浄方法、基板処理方法および基板処理装置
US9500405B2 (en) * 2014-10-28 2016-11-22 Lam Research Ag Convective wafer heating by impingement with hot gas
JP2016089253A (ja) * 2014-11-10 2016-05-23 株式会社荏原製作所 無電解めっき装置の運転方法
CN105762094B (zh) * 2014-12-19 2018-10-26 沈阳芯源微电子设备有限公司 一种自动清洗晶圆时夹持晶圆边缘的装置及其夹持方法
JP6467292B2 (ja) * 2015-05-29 2019-02-13 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
US9887122B2 (en) * 2016-05-06 2018-02-06 Lam Research Ag Method and apparatus for processing wafer-shaped articles
US10276426B2 (en) * 2016-05-31 2019-04-30 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for performing spin dry etching
JP6789048B2 (ja) * 2016-09-23 2020-11-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6725384B2 (ja) * 2016-09-26 2020-07-15 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法
TWI645913B (zh) * 2016-11-10 2019-01-01 辛耘企業股份有限公司 液體製程裝置
JP7242341B2 (ja) * 2018-03-30 2023-03-20 芝浦メカトロニクス株式会社 基板処理装置
KR102567124B1 (ko) * 2020-04-15 2023-08-14 시바우라 메카트로닉스 가부시끼가이샤 기판 처리 장치
CN113617599B (zh) * 2020-05-09 2025-05-16 浙江一达研磨有限公司 自动涂胶机
CN113838788B (zh) * 2020-06-24 2025-09-19 拓荆科技股份有限公司 晶圆自动承载系统及采用该系统传送晶圆的方法
JP7557332B2 (ja) * 2020-10-09 2024-09-27 東京エレクトロン株式会社 基板洗浄装置、基板洗浄方法及びコンピュータ読み取り可能な記録媒体
JP7752985B2 (ja) * 2021-07-21 2025-10-14 ダイキンファインテック株式会社 基板処理装置
KR102666204B1 (ko) * 2022-08-29 2024-05-16 세메스 주식회사 기판 처리 장치 및 기판 처리 방법

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3142479B2 (ja) * 1995-08-09 2001-03-07 株式会社東芝 光素子
US20030179354A1 (en) * 1996-03-22 2003-09-25 Nikon Corporation Mask-holding apparatus for a light exposure apparatus and related scanning-exposure method
JP3495208B2 (ja) * 1996-11-05 2004-02-09 大日本スクリーン製造株式会社 基板処理装置
JP3739220B2 (ja) * 1998-11-19 2006-01-25 大日本スクリーン製造株式会社 基板処理方法及びその装置
JP3395696B2 (ja) * 1999-03-15 2003-04-14 日本電気株式会社 ウェハ処理装置およびウェハ処理方法
US6579382B2 (en) * 2000-02-17 2003-06-17 Kabushiki Kaisha Toshiba Chemical liquid processing apparatus for processing a substrate and the method thereof
US20020066475A1 (en) * 2000-06-26 2002-06-06 Steven Verhaverbeke Chuck for holding wafer
US20020096196A1 (en) * 2001-01-23 2002-07-25 Takayuki Toshima Substrate processing apparatus and substrate processing method
JP2003117501A (ja) * 2001-10-15 2003-04-22 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
US6807972B2 (en) * 2002-03-29 2004-10-26 Applied Materials, Inc. Gutter and splash-guard for protecting a wafer during transfer from a single wafer cleaning chamber
JP2004006672A (ja) * 2002-04-19 2004-01-08 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP4377169B2 (ja) * 2002-07-08 2009-12-02 東京エレクトロン株式会社 処理装置及び処理方法
JP3838946B2 (ja) * 2002-07-22 2006-10-25 株式会社荏原製作所 基板処理装置及び基板処理方法
US7241342B2 (en) * 2003-12-22 2007-07-10 Asml Holding N.V. Non-dripping nozzle apparatus

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009295669A (ja) * 2008-06-03 2009-12-17 Tokyo Electron Ltd 基板処理装置、基板処理方法、プログラムおよび記録媒体
JP2011243627A (ja) * 2010-05-14 2011-12-01 Tokyo Electron Ltd 液処理方法、その液処理方法を実行させるためのプログラムを記録した記録媒体及び液処理装置
KR101140376B1 (ko) 2011-05-23 2012-05-03 주식회사 쓰리디플러스 기판 제조용 공정 챔버
US10395915B2 (en) 2013-02-28 2019-08-27 Semes Co., Ltd. Nozzle assembly, substrate treatment apparatus including the nozzle assembly, and method of treating substrate using the assembly
US9922861B2 (en) 2013-04-09 2018-03-20 Shibaura Mechatronics Corporation Substrate gripping device and substrate processing apparatus
JP2014204061A (ja) * 2013-04-09 2014-10-27 芝浦メカトロニクス株式会社 基板把持装置
JP2016054294A (ja) * 2014-09-02 2016-04-14 ゼウス カンパニー リミテッド 基板液処理装置及び基板液処理方法
KR20160027802A (ko) * 2014-09-02 2016-03-10 주식회사 제우스 기판 액처리 장치 및 기판 액처리 방법
KR102030681B1 (ko) * 2014-09-02 2019-10-10 주식회사 제우스 기판 액처리 장치 및 기판 액처리 방법
JP2016119436A (ja) * 2014-12-24 2016-06-30 東京エレクトロン株式会社 基板処理装置及び基板処理方法並びに基板処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体
JP2016186988A (ja) * 2015-03-27 2016-10-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
US11804387B2 (en) 2015-03-27 2023-10-31 SCREEN Holdings Co., Ltd. Substrate processing device and substrate processing method
US10998203B2 (en) 2015-03-27 2021-05-04 SCREEN Holdings Co., Ltd. Substrate processing device and substrate processing method
KR101880232B1 (ko) * 2015-07-13 2018-07-19 주식회사 제우스 기판 액처리 장치 및 방법
KR102497794B1 (ko) * 2016-06-27 2023-02-10 세메스 주식회사 기판 처리 장치 및 용기 세정 방법
KR20180001683A (ko) * 2016-06-27 2018-01-05 세메스 주식회사 기판 처리 장치 및 용기 세정 방법
KR102162188B1 (ko) * 2018-07-18 2020-10-07 세메스 주식회사 기판 처리 장치 및 방법
KR20200009397A (ko) * 2018-07-18 2020-01-30 세메스 주식회사 기판 처리 장치 및 방법
KR20200052505A (ko) * 2018-11-06 2020-05-15 세메스 주식회사 기판 처리 방법 및 기판 처리 장치
KR102139605B1 (ko) * 2018-11-06 2020-08-12 세메스 주식회사 기판 처리 방법 및 기판 처리 장치
US11361962B2 (en) 2018-11-06 2022-06-14 Semes Co., Ltd. Method and apparatus for processing substrate

Also Published As

Publication number Publication date
WO2005080007A1 (en) 2005-09-01
US20080110861A1 (en) 2008-05-15
EP1718420A1 (en) 2006-11-08

Similar Documents

Publication Publication Date Title
JP2007523463A (ja) 基板処理装置及び方法
JP4976949B2 (ja) 基板処理装置
US20090070946A1 (en) Apparatus for and method of processing substrate
JP6363876B2 (ja) 基板処理方法および基板処理装置
JP2006004955A (ja) 基板処理装置及び基板処理方法
JP7203685B2 (ja) 基板処理装置、基板処理方法およびプログラム
JP5390873B2 (ja) 基板処理方法および基板処理装置
JP2002151455A (ja) 半導体ウエハ用洗浄装置
KR20160012919A (ko) 기판 처리 방법 및 기판 처리 장치, 및 기판 처리 프로그램을 기억한 컴퓨터 판독가능 기억 매체
JPH11297652A (ja) 基板処理装置
JP6983571B2 (ja) 基板処理方法および基板処理装置
JP4255702B2 (ja) 基板処理装置及び方法
WO2006068127A1 (ja) エピタキシャルシリコンウェハの製造方法
JP3425895B2 (ja) 回転式基板乾燥装置および乾燥方法
JP2000114219A (ja) 基板処理装置
JP3035450B2 (ja) 基板の洗浄処理方法
JP4342324B2 (ja) 基板処理方法および基板処理装置
JP2003109935A (ja) 基板周縁処理装置および基板周縁処理方法
KR20070035476A (ko) 기판 처리 장치 및 기판 처리 방법
CN1921955A (zh) 衬底处理设备和方法
JP2002124508A (ja) 基板用スピン処理装置
JP3903879B2 (ja) 半導体基板のエッチング処理方法
JP2004022783A (ja) 処理装置
JP3810056B2 (ja) 基板処理方法、現像処理方法および基板処理装置
JPH1074686A (ja) 薬液処理方法、および、装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20071022

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20071022

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20091208

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20100413