JP2007516611A5 - - Google Patents

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Publication number
JP2007516611A5
JP2007516611A5 JP2006539838A JP2006539838A JP2007516611A5 JP 2007516611 A5 JP2007516611 A5 JP 2007516611A5 JP 2006539838 A JP2006539838 A JP 2006539838A JP 2006539838 A JP2006539838 A JP 2006539838A JP 2007516611 A5 JP2007516611 A5 JP 2007516611A5
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JP
Japan
Prior art keywords
electronic device
barrier
substrate
encapsulation assembly
barrier structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006539838A
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English (en)
Japanese (ja)
Other versions
JP2007516611A (ja
JP4980718B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2004/037597 external-priority patent/WO2005050751A2/en
Publication of JP2007516611A publication Critical patent/JP2007516611A/ja
Publication of JP2007516611A5 publication Critical patent/JP2007516611A5/ja
Application granted granted Critical
Publication of JP4980718B2 publication Critical patent/JP4980718B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2006539838A 2003-11-12 2004-11-10 電子デバイス用の封入アセンブリ Expired - Fee Related JP4980718B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US51913903P 2003-11-12 2003-11-12
US60/519,139 2003-11-12
US61922204P 2004-10-15 2004-10-15
US60/619,222 2004-10-15
PCT/US2004/037597 WO2005050751A2 (en) 2003-11-12 2004-11-10 Encapsulation assembly for electronic devices

Publications (3)

Publication Number Publication Date
JP2007516611A JP2007516611A (ja) 2007-06-21
JP2007516611A5 true JP2007516611A5 (enExample) 2008-01-10
JP4980718B2 JP4980718B2 (ja) 2012-07-18

Family

ID=34623092

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006539838A Expired - Fee Related JP4980718B2 (ja) 2003-11-12 2004-11-10 電子デバイス用の封入アセンブリ

Country Status (5)

Country Link
EP (1) EP1683209A2 (enExample)
JP (1) JP4980718B2 (enExample)
KR (1) KR20060113710A (enExample)
TW (1) TWI365677B (enExample)
WO (1) WO2005050751A2 (enExample)

Families Citing this family (34)

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US20080211090A1 (en) * 2005-07-05 2008-09-04 Koninklijke Philips Electronics, N.V. Packed Semiconductor Sensor Chip For Use In Liquids
DE102005053722B4 (de) * 2005-11-10 2007-08-16 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Deckelwafer, in der Mikrosystemtechnik einsetzbares Bauelement mit einem solchen Wafer sowie Lötverfahren zum Verbinden entsprechender Bauelement-Teile
KR100673765B1 (ko) 2006-01-20 2007-01-24 삼성에스디아이 주식회사 유기전계발광 표시장치 및 그 제조방법
US20070172971A1 (en) * 2006-01-20 2007-07-26 Eastman Kodak Company Desiccant sealing arrangement for OLED devices
KR100671647B1 (ko) * 2006-01-26 2007-01-19 삼성에스디아이 주식회사 유기전계발광 표시 장치
KR100732817B1 (ko) * 2006-03-29 2007-06-27 삼성에스디아이 주식회사 유기전계발광 표시장치 및 그 제조방법
DE102006016260B4 (de) * 2006-04-06 2024-07-18 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vielfach-Bauelement mit mehreren aktive Strukturen enthaltenden Bauteilen (MEMS) zum späteren Vereinzeln, flächiges Substrat oder flächig ausgebildete Kappenstruktur, in der Mikrosystemtechnik einsetzbares Bauteil mit aktiven Strukturen, Einzelsubstrat oder Kappenstruktur mit aktiven Strukturen und Verfahren zum Herstellen eines Vielfach-Bauelements
US7800303B2 (en) 2006-11-07 2010-09-21 Corning Incorporated Seal for light emitting display device, method, and apparatus
KR20080051756A (ko) * 2006-12-06 2008-06-11 삼성에스디아이 주식회사 유기 발광 표시 장치 및 그 제조 방법
TW200836580A (en) * 2007-02-28 2008-09-01 Corning Inc Seal for light emitting display device and method
TWI378592B (en) * 2007-09-04 2012-12-01 Iner Aec Executive Yuan Sealing material for solid oxide fuel cells
DE102007053849A1 (de) * 2007-09-28 2009-04-02 Osram Opto Semiconductors Gmbh Anordnung umfassend ein optoelektronisches Bauelement
ITMI20071903A1 (it) * 2007-10-04 2009-04-05 Getters Spa Metodo per la produzione di pannelli solari mediante l'impiego di un tristrato polimerico comprendente un sistema getter composito
EP2053026B1 (en) * 2007-10-26 2014-04-02 Institute of Nuclear Energy Research, Atomic Energy Council Sealing material for solid oxide fuel cells
KR100976457B1 (ko) * 2008-10-22 2010-08-17 삼성모바일디스플레이주식회사 유기전계발광표시장치 및 그 제조방법
KR100993415B1 (ko) * 2009-03-24 2010-11-09 삼성모바일디스플레이주식회사 유기전계발광 표시 장치
KR101180234B1 (ko) * 2009-04-03 2012-09-05 (주)엘지하우시스 디자인층을 구비한 건물 일체형 태양전지 모듈
US8440479B2 (en) * 2009-05-28 2013-05-14 Corning Incorporated Method for forming an organic light emitting diode device
EP2448032B1 (en) * 2009-06-24 2014-09-17 Mitsubishi Chemical Corporation Organic electronic device and method for producing the same
US8505337B2 (en) 2009-07-17 2013-08-13 Corning Incorporated Methods for forming fritted cover sheets and glass packages comprising the same
JP5824809B2 (ja) 2010-02-10 2015-12-02 日本電気硝子株式会社 シール材及びそれを用いたシール方法
KR101297375B1 (ko) * 2011-09-05 2013-08-19 주식회사 에스에프에이 평면디스플레이용 화학 기상 증착장치
JP2014007198A (ja) * 2012-06-21 2014-01-16 Kaneka Corp 結晶シリコン系光電変換装置およびその製造方法
US8926337B2 (en) * 2012-08-24 2015-01-06 Apple Inc. Method for improving connector enclosure adhesion
JP6192912B2 (ja) * 2012-09-14 2017-09-06 株式会社カネカ 有機ｅｌ装置
JP6192911B2 (ja) * 2012-09-10 2017-09-06 株式会社カネカ 有機ｅｌ装置及びその製造方法
US9450202B2 (en) 2012-10-31 2016-09-20 Industrial Technology Research Institute Environmental sensitive electronic device package having side wall barrier structure
TWI581422B (zh) * 2013-05-15 2017-05-01 財團法人工業技術研究院 環境敏感電子元件封裝體
US8829507B2 (en) * 2012-12-06 2014-09-09 General Electric Company Sealed organic opto-electronic devices and related methods of manufacturing
JP6185304B2 (ja) * 2013-06-28 2017-08-23 株式会社カネカ 結晶シリコン系光電変換装置およびその製造方法
CN104030578B (zh) * 2014-07-03 2016-08-17 王磊 真空复合隔离围护构件
CN107046104A (zh) * 2017-01-10 2017-08-15 广东欧珀移动通信有限公司 Oled封装结构及其制备方法
TWI750421B (zh) * 2018-10-30 2021-12-21 立景光電股份有限公司 顯示面板
TWI883672B (zh) * 2023-11-30 2025-05-11 元太科技工業股份有限公司 顯示裝置

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GB2127740B (en) * 1982-09-30 1985-10-23 Burr Brown Res Corp Improved hermetic sealing process
JPS61136247A (ja) * 1984-12-07 1986-06-24 Toshiba Corp 半導体装置
US6426484B1 (en) * 1996-09-10 2002-07-30 Micron Technology, Inc. Circuit and method for heating an adhesive to package or rework a semiconductor die
JPH11121167A (ja) * 1997-10-16 1999-04-30 Tdk Corp 有機ｅｌ素子
JP2000040585A (ja) * 1998-07-21 2000-02-08 Tdk Corp 有機ｅｌ素子モジュール
US6255239B1 (en) * 1998-12-04 2001-07-03 Cerdec Corporation Lead-free alkali metal-free glass compositions
JP2001057287A (ja) * 1999-08-20 2001-02-27 Tdk Corp 有機ｅｌ素子
US6333460B1 (en) * 2000-04-14 2001-12-25 International Business Machines Corporation Structural support for direct lid attach
JP2002299043A (ja) * 2001-03-30 2002-10-11 Sanyo Electric Co Ltd 有機電界発光型ディスプレイの封止構造
KR20040002956A (ko) * 2001-05-24 2004-01-07 오리온전기 주식회사 유기전계발광소자의 인캡슐레이션 용기 및 그 제조방법
US6933537B2 (en) * 2001-09-28 2005-08-23 Osram Opto Semiconductors Gmbh Sealing for OLED devices
JP3942017B2 (ja) * 2002-03-25 2007-07-11 富士フイルム株式会社 発光素子
JP2005086032A (ja) * 2003-09-09 2005-03-31 Kyocera Corp 圧電振動子収納用容器

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