JP2007516611A5 - - Google Patents

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JP2007516611A5
JP2007516611A5 JP2006539838A JP2006539838A JP2007516611A5 JP 2007516611 A5 JP2007516611 A5 JP 2007516611A5 JP 2006539838 A JP2006539838 A JP 2006539838A JP 2006539838 A JP2006539838 A JP 2006539838A JP 2007516611 A5 JP2007516611 A5 JP 2007516611A5
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Prior art keywords
electronic device
barrier
substrate
encapsulation assembly
barrier structure
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JP2006539838A
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Japanese (ja)
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JP4980718B2 (en
JP2007516611A (en
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Priority claimed from PCT/US2004/037597 external-priority patent/WO2005050751A2/en
Publication of JP2007516611A publication Critical patent/JP2007516611A/en
Publication of JP2007516611A5 publication Critical patent/JP2007516611A5/ja
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Publication of JP4980718B2 publication Critical patent/JP4980718B2/en
Expired - Fee Related legal-status Critical Current
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Claims (10)

基板および活性領域を有する電子デバイス用の封入アセンブリ（ｅｎｃａｐｓｕｌａｔｉｏｎ ａｓｓｅｍｂｌｙ）であって、
バリヤーシート、および、
前記シートから伸張（ｅｘｔｅｎｄ）するバリヤー構造体を含んでなり、
前記封入アセンブリを前記デバイス基板に接合するために接着剤と併せて使用される際に前記バリヤー構造体が電子デバイス上で用いられるとき、前記バリヤー構造体が電子デバイスを実質的に密封する（ｈｅｒｍｅｔｉｃａｌｌｙ ｓｅａｌ）ように構成され、かつ、前記バリヤー構造体が、前記デバイス基板に融合しないことを特徴とする封入アセンブリ。 An encapsulation assembly for an electronic device having a substrate and an active region, comprising:
Barrier sheet, and
A barrier structure extending from the sheet;
When the barrier structure is used on an electronic device when used in conjunction with an adhesive to bond the encapsulation assembly to the device substrate, the barrier structure substantially hermetically seals the electronic device. sealing), and the barrier structure does not fuse to the device substrate. 封止構造体（ｓｅａｌｉｎｇ ｓｔｒｕｃｔｕｒｅ）および活性領域をさらに有する基板を有してなる電子デバイス用の封入アセンブリであって、
該封入アセンブリが、
実質的に平坦な表面を有するバリヤーシート、および、
平坦な表面から伸張するバリヤー構造体を含んでなり、
前記バリヤー構造体が、電子デバイス上で用いられるとき、電子デバイスを実質的に密封するように構成され、かつ、前記バリヤー構造体が、前記デバイス基板上の前記封止構造体と係合するように構成されることを特徴とする封入アセンブリ。 An encapsulation assembly for an electronic device comprising a substrate further having a sealing structure and an active region, comprising:
The encapsulation assembly comprises:
A barrier sheet having a substantially flat surface, and
Comprising a barrier structure extending from a flat surface;
When the barrier structure is used on an electronic device, the barrier structure is configured to substantially seal the electronic device, and the barrier structure engages the sealing structure on the device substrate. An encapsulating assembly characterized by comprising: 実質的に平坦な表面を有するバリヤーシートおよび封止構造体を含んでなる電子デバイス用の封入アセンブリであって、
前記封止構造体が、前記電子デバイスの前記基板上のバリヤー構造体と係合するように構成されることを特徴とする封入アセンブリ。 An encapsulation assembly for an electronic device comprising a barrier sheet having a substantially flat surface and a sealing structure,
An encapsulation assembly, wherein the sealing structure is configured to engage a barrier structure on the substrate of the electronic device. 電子デバイス用の封止体（ｓｅａｌ）であって、
前記電子デバイスが基板を有し、
前記封止体が、
バリヤー構造体、および、
前記バリヤー構造体と接触する発熱体を含んでなることを特徴とする封止体。 A sealing body for an electronic device,
The electronic device has a substrate;
The sealing body is
A barrier structure, and
A sealing body comprising a heating element in contact with the barrier structure. 有機電子デバイス用の封入アセンブリであって、
該封入アセンブリが，バリヤーシート及び第１の定着構造体（ｋｅｙｉｎｇ ｓｔｒｕｃｔｕｒｅ）を含んでなり、
該バリヤーシートが、有機電子デバイスの電気的活性領域を覆うように大きさが設定され、及び
該第１の定着構造体（ｋｅｙｉｎｇ ｓｔｒｕｃｔｕｒｅ）が、基板の第２の定着構造体に取り付けられるように構成され、
該第２の定着構造体が、前記第１の定着構造体の補体（ｃｏｍｐｌｅｍｅｎｔ）であり、かつ、
該第１および第２の定着構造体の組合せが、密封シールの少なくとも一部を形成することができることを特徴とする有機電子デバイス用の封入アセンブリ。 An encapsulation assembly for an organic electronic device,
The encapsulation assembly comprises a barrier sheet and a first keying structure;
The barrier sheet is sized to cover the electrically active area of the organic electronic device, and the first fixing structure is attached to the second fixing structure of the substrate. Configured,
The second fixing structure is a complement of the first fixing structure; and
An encapsulation assembly for an organic electronic device, wherein the combination of the first and second fuser structures can form at least a portion of a hermetic seal. 基板、電気的活性領域を覆う封入アセンブリ、及びバリヤー材料を含んでなるバリヤー構造体を備える電子デバイスであって、
前記基板が、有機電子デバイスの電気的活性領域を含み、
前記封入アセンブリが、前記デバイス基板に面するバリヤー表面を含んでなり、及び、
前記バリヤー構造体が、前記封入アセンブリの前記バリヤー表面および前記基板に取り付けられ、かつ、前記バリヤー構造体がデバイス基板から１ミクロン以下離れていることを特徴とする電子デバイス。 An electronic device comprising a substrate, an encapsulation assembly overlying an electrically active region, and a barrier structure comprising a barrier material comprising:
The substrate includes an electrically active region of an organic electronic device;
The encapsulation assembly comprises a barrier surface facing the device substrate; and
An electronic device wherein the barrier structure is attached to the barrier surface of the encapsulation assembly and the substrate, and the barrier structure is no more than 1 micron away from a device substrate. 基板を有し、該基板および活性領域の外側から伸張するバリヤー構造体を有する、電子デバイス用の封入アセンブリであって、
該封入アセンブリが、
実質的に平坦な表面を有するバリヤーシートおよび封止構造体を含んでなり、
前記バリヤーシートが、前記デバイス基板上の前記バリヤー構造体と係合するように構成されることを特徴とする封入アセンブリ。 An encapsulation assembly for an electronic device having a substrate and having a barrier structure extending from outside the substrate and the active region,
The encapsulation assembly comprises:
Comprising a barrier sheet having a substantially flat surface and a sealing structure;
An encapsulation assembly, wherein the barrier sheet is configured to engage the barrier structure on the device substrate. 請求項７に記載の封入アセンブリを含んでなることを特徴とする電子デバイス。 An electronic device comprising the encapsulation assembly of claim 7 . 基板上の電子デバイスを封止する方法であって、
バリヤーシート、および前記シートから伸張するバリヤー構造体を含んでなる封入アセンブリを形成するステップと、
前記バリヤー構造体および前記基板のうちの少なくとも１つに接着剤を塗布するステップと、
前記バリヤー構造体を、前記電子デバイスが前記封入アセンブリによって密閉されるように前記基板に接合するステップと、
を含んでなる方法。 A method for sealing an electronic device on a substrate, comprising:
Forming an encapsulation assembly comprising a barrier sheet and a barrier structure extending from the sheet;
Applying an adhesive to at least one of the barrier structure and the substrate;
Bonding the barrier structure to the substrate such that the electronic device is sealed by the encapsulation assembly;
Comprising a method. 基板および活性領域を有する電子デバイス用の封入アセンブリであって、
バリヤーシート、および、
前記シートの表面から伸長するバリヤー構造体を含んでなり、
前記バリヤー構造体が、発熱体をさらに含み、前記バリヤー構造体が、電子デバイス上で用いられるとき、電子デバイスを実質的に密封するように構成されることを特徴とする封入アセンブリ。 An encapsulation assembly for an electronic device having a substrate and an active region,
Barrier sheet, and
A barrier structure extending from the surface of the sheet;
An encapsulation assembly, wherein the barrier structure further comprises a heating element, the barrier structure being configured to substantially seal the electronic device when used on the electronic device.
JP2006539838A 2003-11-12 2004-11-10 Encapsulation assembly for electronic devices Expired - Fee Related JP4980718B2 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US51913903P 2003-11-12 2003-11-12
US60/519,139 2003-11-12
US61922204P 2004-10-15 2004-10-15
US60/619,222 2004-10-15
PCT/US2004/037597 WO2005050751A2 (en) 2003-11-12 2004-11-10 Encapsulation assembly for electronic devices

Publications (3)

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JP2007516611A JP2007516611A (en) 2007-06-21
JP2007516611A5 true JP2007516611A5 (en) 2008-01-10
JP4980718B2 JP4980718B2 (en) 2012-07-18

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Country Status (5)

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EP (1) EP1683209A2 (en)
JP (1) JP4980718B2 (en)
KR (1) KR20060113710A (en)
TW (1) TWI365677B (en)
WO (1) WO2005050751A2 (en)

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