WO2014205975A1

WO2014205975A1 - Packaging element, array substrate, display device and packaging method for oled device

Info

Publication number: WO2014205975A1
Application number: PCT/CN2013/086742
Authority: WO
Inventors: 杨维; 宁策; 王珂
Original assignee: 京东方科技集团股份有限公司
Priority date: 2013-06-24
Filing date: 2013-11-08
Publication date: 2014-12-31
Also published as: CN103346268A; CN103346268B

Abstract

A packaging element, an array substrate, a display device and a packaging method for an OLED device. The packaging element is used for packaging an OLED device (7) which is arranged on a substrate (8). The packaging element comprises a cover plate (1), the shape of which matches that of a top surface of the OLED device (7), and a sealing unit which is arranged on an inner surface of the cover plate (1), wherein the sealing unit is used for alignedly joining with the OLED device (7) to form a whole and sealing the OLED device (7). The packaging element packages the OLED device (7) by means of the sealing unit arranged on the cover plate (1), so that water and oxygen can be effectively prevented from entering the OLED device (7), thereby protecting the OLED device (7) well and making the service life of the packaged OLED device (7) longer; since the array substrate and the display device are packaged using the packaging element, the service life thereof is longer; and the packaging element is adopted to package the OLED device (7), so that the process and the method are simpler and more convenient, and the packaging efficiency of the OLED device (7) is improved.

Description

Packaging component, array substrate, display device, and packaging method of 0LED device

The present invention relates to the field of display technologies, and in particular, to a package component, an array substrate, a display device, and a package method of an OLED device. Background technique

With the rapid development of display technology, the 0LED device (Organic Light Emitting Diode) has become more and more prominent because of its simple process, low cost, low driving voltage, high luminous efficiency, and temperature range. Wide, flexible display, large-area full-color display and many other advantages, and is considered to be the most promising display device. However, the industrialization of 0LED devices is still facing great challenges. The short service life of 0LED devices is one of the more prominent problems.

Due to the tight sealing of the 0LED device, the contact between the internal material and water and oxygen is the main reason for the decline of the service life of the 0LED device. Therefore, how to effectively package the 0LED device is the key to solve the problem.

At present, there are two main packaging methods for 0LED devices: 1. Glass back cover package, 2. Thin film package.

The glass back cover packaging method is relatively simple. First, the UV encapsulant is coated on the glass back cover, and the substrate provided with the OLED device is then paired with the glass back cover. After UV exposure, the water and oxygen in the air are isolated from the OLED device by the UV encapsulant. open. The advantages of this packaging method are: good thermal conductivity, strong water molecule barrier property, stable chemical properties, oxidation resistance, electrical insulation; disadvantages: due to the large distance between the glass rear cover 11 and the substrate 8, the UV encapsulant is cured After being easy to loose and porous, water and oxygen can easily pass through the hole; and the built-in desiccant, once expanded after absorption, easily causes deformation of the OLED device, thereby further aggravating the damage of the OLED device.

In the thin film encapsulation method, an inorganic thin film layer (also called an inorganic barrier layer) having a high water barrier capability is generally used as a water blocking layer. However, in the process of forming an inorganic thin film layer In the case, defects such as pinholes and cracks will inevitably occur, and the presence of these defects greatly reduces the water blocking ability of the inorganic thin film layer. In addition, too much or too thick inorganic film layer will generate large internal stress, which seriously affects the package quality.

Studies have shown that a multi-layer interleaving method using an organic thin film layer (also called an organic barrier layer or an organic flat layer) and an inorganic thin film layer can reduce defects and reduce stress of the inorganic thin film layer. A typical thin film encapsulation structure of a typical organic thin film layer (ie, organic barrier layer 4) and an inorganic thin film layer (ie, inorganic barrier layer 5) is shown in FIG. 1. This packaging method can greatly reduce water and oxygen transmittance. Therefore, the service life of the OLED device can be improved to some extent. Moreover, the thin film package does not require a back cover and a package, which can significantly reduce the thickness of the device. However, the quality of the film package has a great relationship with the organic film layer, and since the film package requires a multilayer film, the process is complicated and the manufacturing cost is high; at the same time, the compatibility, stability and packaged device of the film package The service life has to be further improved. Summary of the invention

The present invention is directed to the above technical problems existing in the prior art, and provides a packaged component, an array substrate, a display device, and a package method of an OLED device. The package component encapsulates the 0LED device through a sealing unit disposed on the cover plate, the packaging process is simple, the fabrication cost is low, and the packaged 0 LED device has a longer service life. The packaging method for packaging the 0LED device using the package component is also more convenient.

The present invention provides a package component for packaging an OLED device disposed on a substrate, the package component including a cover plate, and a sealing unit disposed on an inner surface of the cover plate, the sealing unit being used for The cartridge is integrated with the OLED device and the OLED device is sealed.

Preferably, the cover plate is used for covering a top surface of the OLED device, and the sealing unit comprises a sealing frame disposed on the inner surface of the OLED device, the sealing frame is used for enclosing On the side of the OLED device.

Preferably, the sealing unit further includes an adhesive layer disposed inside the sealing frame and disposed at an area of the cover corresponding to the OLED device, The adhesive layer is used to wrap the top and sides of the OLED device.

Preferably, the sealing frame is closedly disposed at an edge region of the inner surface of the cover plate, and the height of the sealing frame is less than or equal to a distance between the cover plate and the substrate.

Preferably, the sealing frame comprises two or more sub-sealing frames which are sequentially arranged in a nested manner.

Preferably, the package component further includes a receiving chamber for accommodating the OLED device, the accommodating chamber is disposed inside the adhesive layer, and the accommodating chamber is made of a transparent material.

Preferably, one side of the OLED device disposed on the substrate is an attachment surface, and the accommodating chamber includes an organic barrier layer disposed on a top surface and a side surface of the OLED device, and the shape of the organic barrier layer And the size is adapted to the shape and size of the OLED device.

Preferably, the accommodating chamber further includes an inorganic barrier layer disposed outside the organic barrier layer, an inner wall of the inorganic barrier layer is adhered to an outer wall of the organic barrier layer, and an outer wall of the inorganic barrier layer is The inner walls of the adhesive layer are attached.

Preferably, the sealing frame is made of a metal material, the adhesive layer is made of a water-impermeable bonding material, the organic barrier layer is made of an organosilicon compound, and the inorganic barrier layer is made of inorganic silicide. .

Preferably, an epoxy resin filling layer is further disposed between the cover plate, the substrate and the sealing unit.

The present invention also provides an array substrate comprising: a substrate and an OLED device disposed on the substrate, the OLED device being packaged using the package component described above.

The present invention also provides a display device comprising the above array substrate.

The present invention also provides a method of packaging an OLED device, the OLED device being disposed on a substrate, the packaging method comprising:

Step S1: forming a package component, the package component including a sealing unit; Step S2: the package component is integrated with the OLED device.

Preferably, forming the package component comprises the following steps: Step S1 l: forming a metal film on the inner surface of the cover;

Step S12: forming a sealing frame by patterning the metal film. Preferably, forming the package component further comprises the following steps:

Step S14: forming an organic barrier layer on the top surface and the side surface of the 0 LED device; or, further comprising:

Step S15: forming an inorganic barrier layer on the outer side of the organic barrier layer; Step S13: providing an adhesive layer inside the sealing frame and in a region of the cover plate corresponding to the OLED device. Preferably, the organic barrier layer is formed by coating.

Preferably, the inorganic barrier layer is formed by plasma enhanced chemical vapor deposition. The invention has the beneficial effects that the package component encapsulates the OLED device through a sealing unit disposed on the cover plate, thereby avoiding more effective blocking of water and oxygen from entering due to a large distance between the glass rear cover and the substrate. In the 0 LED device, the OLED device can be better protected, and the packaged OLED device has a longer service life; and, because the package component is simple to manufacture and low in cost, the package component is used to package the OLED device. The process and method are also simpler, thereby improving the packaging efficiency of the OLED device. DRAWINGS

1 is a schematic structural view of a film for packaging in the prior art;

2 is a schematic structural view of an array substrate according to Embodiment 1 of the present invention;

Figure 3A is a cross-sectional view of the cover and the sealing frame;

Figure 3B is a plan view of the cover and the sealing frame;

4 is a schematic structural view of an array substrate according to Embodiment 2 of the present invention;

FIG. 5 is a schematic structural view of an array substrate in Embodiment 3 of the present invention.

The reference numerals are:

1. cover plate; 2. sealing frame; 3. adhesive layer; 4. organic barrier layer; 5. inorganic barrier Layer; 6. epoxy resin filling layer; 7. 0 LED device; 8. substrate; 9. UV encapsulation glue;

In order to enable those skilled in the art to better understand the technical solutions of the present invention, the packaging components, the array substrate, the display device, and the packaging method of the OLED device of the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. Example 1

The embodiment provides a package component for packaging an OLED device disposed on a substrate, the package component includes a cover plate matched with a top surface shape of the OLED device, and a sealing unit disposed on the inner surface of the cover plate, sealing The unit is used to integrate the OLED device and seal the OLED device.

As shown in FIG. 2, the sealing unit includes a sealing frame 2 disposed on the inner surface of the cover plate 1 facing the OLED device 7, or further comprising an adhesive layer 3 disposed inside the sealing frame 2 and disposed at The cover 1 corresponds to the area of the OLED device 7, the cover 1 is intended to cover the top surface of the OLED device 7, the sealing frame 2 is used to encircle the side of the OLED device 7, and the adhesive layer 3 is used to wrap the OLED device 7 Top and side. The height of the sealing frame 2 is less than or equal to the distance between the cover plate 1 and the substrate 8, so that the sealing frame can block the intrusion of water and oxygen into the OLED device due to the large distance between the glass back cover and the substrate. The distance between the cover and the substrate does not exceed the set standard distance.

The sealing frame 2 is made of a metal material such as copper, and the metal material has a good barrier effect of water and oxygen; the adhesive layer 3 is made of a water-impermeable bonding material.

Wherein, the one surface of the 0 LED device 7 disposed on the substrate 8 is a bonding surface, that is, the surface where the OLED device 7 is in contact with the substrate 8 and the bonding surface is the bonding surface, and the adhesive layer 3 is disposed on the non-attached surface of the OLED device 7 The outer side, that is, the adhesive layer 3 is adhered to the top surface and the side surface of the OLED device 7 except for the attachment surface, and the top surface and the side surface of the OLED device 7 are wrapped and sealed. Since the adhesive layer 3 not only has an adhesive action but also has a function of blocking the passage of water and oxygen, the adhesive layer 3 forms a better seal for the OLED device 7. As shown in FIG. 3 (including FIG. 3A and FIG. 3B ), the sealing frame 2 is closedly disposed on an edge region of the inner surface of the cover plate 1 , and the sealing frame 2 includes at least one sub-sealing frame, and two or more sub-sealing frames are sequentially Interval nesting settings. In this embodiment, the sub-sealing frames are two. If the substrate with the OLED device is provided with a sufficiently large edge area on the cover, the greater the number of sub-sealing frames, the better the barrier to water and oxygen.

Further, an epoxy resin filled layer 6 is further provided between the cover 1, the substrate 8, and the sealing unit (i.e., the sealing frame 2 and the adhesive layer 3). The epoxy resin filling layer 6 is filled in the area of the corresponding sealing frame 2 on the cover plate 1 and the substrate 8; the epoxy resin filling layer 6 bonds and fixes the cover plate 1 and the substrate 8 together, and after bonding and fixing, the epoxy resin The filling layer 6 completely encloses the sealing frame 2 while being bonded integrally with the adhesive layer 3. Since the epoxy resin filling layer 6 also has an effect of preventing intrusion of water and oxygen, water and oxygen are hardly invaded by the multiple sealing of the OLED device 7 by the sealing frame 2, the epoxy resin filling layer 6, and the adhesive layer 3. 0 LED device 7 internal.

Alternatively, the epoxy resin filling layer 6 and the adhesive layer 3 may not be bonded, that is, only the sealing frame is completely filled with the epoxy resin filling layer 6, and the gap between the epoxy resin filling layer 6 and the adhesive layer 3 is formed. , it is also fine.

The embodiment further provides a method for packaging an OLED device, wherein the OLED device is disposed on the substrate, and the packaging of the package component to the OLED device includes the following steps: Step S1: forming a package component, the package component comprising a sealing unit.

The steps of forming the package component include:

Step S11: forming a metal film on the inner surface of the cover; for example, sputtering a metal film on the inner surface of the cover by sputtering.

Step S12: forming a sealing frame by patterning the metal film; that is, by coating a photoresist on the metal film, and then exposing, developing, and etching, finally forming a pattern of the sealing frame. In this embodiment, two sub-sealing frames are formed on the inner surface of the cover.

Or, further including:

Step S13: An adhesive layer is provided inside the sealing frame and on the cover plate corresponding to the area of the OLED device. Generally, both layers of the adhesive layer are viscous and are respectively provided with a protective film. Before the adhesive layer and the cover are placed together, the size of the adhesive layer is set to correspond to the sum of the size of the top surface and the side surface of the OLED device, and The shape of the OLED device is pre-cut. When the adhesive layer and the cover are disposed together, the protective film corresponding to the top surface of the OLED device in one of the layers of the adhesive layer may be removed, and then the adhesive layer of the protective film is pasted to the cover. The area corresponding to the 0LED device, while retaining the protective film of the other layer on the same layer in the adhesive layer and the protective film of the other layer. Thereafter, the protective film of the other layer of the same layer in the adhesive layer is removed when the package component and the OLED are paired, and the protective film of the other layer is removed when bonding to the top and side of the OLED device.

Step S2: Integrating the package component with the 0LED device.

The step of integrating the package component with the OLED device is: applying epoxy resin between the cover, the substrate, and the sealing unit (ie, the sealing frame and the adhesive layer) to form an epoxy filled layer, and the package component is 0 LED device pair box. After the cartridge is bonded, the adhesive layer and the top surface and side of the 0 LED device (i.e., the faces of the 0 LED device except the attachment surface) are bonded and bonded together; after the epoxy resin is cured, the 0 LED device is packaged. Example 2:

The present embodiment provides a package component. The package component is different from the embodiment 1. The package component further includes a receiving chamber for accommodating the OLED device, and the accommodating chamber is disposed on the adhesive layer 3. Inside, the housing chamber is made of a transparent material.

As shown in FIG. 4, the accommodating chamber includes an organic barrier layer 4 for being disposed on the top surface and the side surface of the OLED device 7. The shape and size of the organic barrier layer 4 are matched with the shape and size of the OLED device 7, that is, the OLED device. 7 is disposed on the substrate 8 as an attachment surface, and the organic barrier layer 4 is adhered to the top surface and the side surface of the OLED device 7 except for the attachment surface, the outer wall of the organic barrier layer 4 and the adhesive layer 3 The inner wall is fitted; the OLED device 7 is wrapped and sealed. The organic barrier layer 4 is made of an organic silicide such as hexamethyldisiloxane or tetraethylene glycol diacrylate. Since the organic barrier layer 4 has high water repellency, good flexibility, amorphous structure, no pinholes, corrosion resistance, and strong adhesion, it can well block water and oxygen.

Other structures and materials of the package components are the same as those in Embodiment 1, and are not described herein again. Correspondingly, differently from the packaging method provided in Embodiment 1, on the basis of Embodiment 1, the packaging of the OLED device by the package component further includes: forming an organic barrier when forming the package component in step S1 The steps of the layer. Specifically, step S14: forming an organic barrier layer on the top surface and the side surface of the OLED device (ie, the non-attach surface of the OLED device that is not in contact with the substrate).

Wherein, the organic barrier layer is formed by coating, and the organosilicon compound is coated on the top and side surfaces of the 0 LED device. After the cover plate with the sealing unit (ie, the sealing frame and the adhesive layer) is placed on the box with the 0 LED device, the inner wall of the adhesive layer is bonded to the outer wall of the organic barrier layer to form a seal for the 0 LED device.

Of course, the formation of the organic barrier layer may also be carried out by attaching a film containing the organosilicide component to the top and side surfaces of the OLED device by attaching and pressing.

The other steps of encapsulating the 0LED device by the package component are the same as those of the embodiment 1, and are not described herein again. Example 3:

The present embodiment provides a package component, which is different from Embodiment 1-2. As shown in FIG. 5, the package component is based on Embodiment 2, and the accommodating chamber further includes an outer layer disposed on the outer side of the organic barrier layer 4. The inorganic barrier layer 5, the inner wall of the inorganic barrier layer 5 is bonded to the outer wall of the organic barrier layer 4, and the outer wall of the inorganic barrier layer 5 is bonded to the inner wall of the adhesive layer 3. The inorganic barrier layer 5 is made of an inorganic silicide such as S iNxOy. The inorganic barrier layer 5 has a strong barrier to water and oxygen, but since the inorganic barrier layer 5 is not completely dense, pinholes or other defects may occur directly on the top and side surfaces of the OLED device; in addition, the inorganic barrier layer The internal stress generated by the 5 pairs of OLED devices is large. In the present embodiment, by disposing the inorganic barrier layer 5 outside the organic barrier layer 4, the above-described defects of the inorganic barrier layer 5 can be compensated for, and the barrier property against water and oxygen can be improved.

Other structures and materials of the package components are the same as those in Embodiment 2, and will not be described herein.

Correspondingly, unlike the packaging method provided in Embodiment 2, in implementation On the basis of Example 2, the packaging of the package component to the OLED device further includes: Step S15: forming an inorganic barrier layer on the outer side of the organic barrier layer. The inner wall of the inorganic barrier layer is adhered to the outer wall of the organic barrier layer; the cover plate provided with the sealing unit (ie, the sealing frame and the adhesive layer) is placed on the box with the OLED device provided with the organic barrier layer and the inorganic barrier layer, and the inorganic barrier is The outer wall of the layer is bonded to the inner wall of the adhesive layer such that the adhesive layer, the inorganic barrier layer and the organic barrier layer are sequentially nested and tightly bonded together to form a seal for the OLED device.

According to the preferred embodiment, a packaging method of providing an organic barrier layer and an inorganic barrier layer in the adhesive layer is utilized to avoid the disadvantage of separately applying the inorganic barrier layer or the organic barrier layer, and the package is improved while reducing the internal stress. Stability and compatibility. Further, according to the method of the present embodiment, a relatively simple process is provided as compared with the case where the multilayer alternate thin film package structure is separately provided in the prior art, and the manufacturing and mounting costs are reduced.

Wherein, the inorganic barrier layer is formed by plasma enhanced chemical vapor deposition, and in the plasma chemical vapor deposition, each element in the inorganic silicide SiNxOy (such as N element and 0 element) is changed by adjusting the ratio of the components between the reaction source gases. The content and proportion of the inorganic barrier layer to improve the barrier property against water and oxygen; and at the same time reduce the internal stress generated by the inorganic barrier layer on the OLED device.

Advantageous Effects of Embodiments 1-3: The package component encapsulates the OLED device through a sealing unit disposed on the cover plate, which can more effectively block water and oxygen from entering the OLED device, thereby forming better protection for the OLED device. In turn, the packaged OLED device has a longer service life. The package component is simple to manufacture and low in cost, and the process and method for packaging the 0LED device by the package component are also more convenient, thereby improving the packaging efficiency of the 0LED device. Example 4:

This embodiment provides an array substrate comprising: a substrate and an OLED device disposed on the substrate, wherein the OLED device is packaged by using the package components provided in Embodiments 1-3.

The beneficial effect of Embodiment 4: the array substrate is adopted in Embodiment 1-3 The package component is provided to package the OLED device disposed on the substrate, so that the packaged substrate substrate has a longer service life. Example 5:

The embodiment provides a display device comprising the array substrate provided in Embodiment 4.

Advantageous Effects of Embodiment 5: The display device is packaged by using the package components provided in Embodiments 1-3, so that the life of the packaged display device is longer. It is to be understood that the above embodiments are merely exemplary embodiments employed to explain the principles of the invention, but the invention is not limited thereto. Various modifications and improvements can be made by those skilled in the art without departing from the spirit and scope of the invention. These modifications and improvements are also considered to be within the scope of the invention.

Claims

Claim

A package component for packaging an OLED device disposed on a substrate, wherein the package component comprises a cover plate, and a sealing unit disposed on an inner surface of the cover plate, the sealing unit For integrating with the OLED device and sealing the OLED device.

2. The package component according to claim 1, wherein the cover plate is for covering a top surface of the OLED device, and the sealing unit comprises a cover plate disposed on an inner surface of the OLED device The upper sealing frame is used to encircle the side of the OLED device.

3. The package component according to claim 2, wherein the sealing unit further comprises an adhesive layer disposed inside the sealing frame and disposed on the cover plate corresponding to the The area of the 0 LED device that is used to wrap the top and sides of the OLED device.

The package component according to claim 3, wherein the sealing frame is closedly disposed on an edge region of the inner surface of the cover plate, and the height of the sealing frame is less than or equal to the cover plate and the substrate The distance between them.

The package component according to claim 4, wherein the sealing frame comprises two or more sub-sealing frames which are sequentially arranged in a nested manner.

The package component according to claim 5, wherein the package component further includes an accommodating chamber for accommodating the OLED device, and the accommodating chamber is disposed inside the adhesive layer. The accommodating chamber is made of a transparent material.

7. The package component according to claim 6, wherein the accommodating chamber comprises an organic barrier layer disposed on a top surface and a side surface of the OLED device, The shape and size of the organic barrier layer are adapted to the shape and size of the OLED device.

The package component according to claim 7, wherein the accommodating chamber further comprises an inorganic barrier layer disposed outside the organic barrier layer, an inner wall of the inorganic barrier layer and the organic barrier layer The outer wall is attached, and the outer wall of the inorganic barrier layer is in contact with the inner wall of the adhesive layer.

9. The package component according to claim 8, wherein the sealing frame is made of a metal material, the adhesive layer is made of a water-impermeable adhesive material, and the organic barrier layer is made of a silicone material. The inorganic barrier layer is made of an inorganic silicide.

The package component according to any one of claims 1 to 9, characterized in that an epoxy resin filled layer is further disposed between the cover plate, the substrate and the sealing unit.

11. An array substrate, comprising: a substrate and an OLED device disposed on the substrate, wherein the OLED device is packaged using the package component of any of claims 1-10.

12. A display device, comprising the array substrate of claim 11.

13. A method of packaging an OLED device, the OLED device being disposed on a substrate, the packaging method comprising:

14. The packaging method according to claim 13, wherein: The steps of forming the package component include:

Step S11: forming a metal film on the inner surface of the cover;

Step S12: forming a sealing frame by patterning the metal film

The packaging method according to claim 14, wherein the forming the package component further comprises the following steps:

Step S14: forming an organic barrier layer on the top surface and the side surface of the OLED device; Step S15: forming an inorganic barrier layer on the outer side of the organic barrier layer; and step S13: inside the sealing frame and the cover plate An adhesive layer is provided corresponding to a region of the OLED device.

16. The packaging method according to claim 15, wherein the organic barrier layer is formed by coating.

The encapsulation method according to claim 15, wherein the inorganic barrier layer is formed by a plasma enhanced chemical vapor deposition method.

18. The encapsulation method according to claim 17, wherein the performance of the inorganic barrier layer is optimized by changing the content and ratio of each element in the inorganic silicide during chemical vapor deposition.