CN108376747B - Organic light emitting display device and method of fabricating the same - Google Patents
Organic light emitting display device and method of fabricating the same Download PDFInfo
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- CN108376747B CN108376747B CN201810099076.2A CN201810099076A CN108376747B CN 108376747 B CN108376747 B CN 108376747B CN 201810099076 A CN201810099076 A CN 201810099076A CN 108376747 B CN108376747 B CN 108376747B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
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Abstract
The present invention relates to an organic light emitting display device and a method of manufacturing the same. Wherein the organic light emitting display device includes: the substrate comprises a display area and a packaging area positioned at the periphery of the display area; an organic light emitting device positioned in the display region; a first encapsulation layer wrapping the organic light emitting device; the second packaging layer wraps the first packaging layer; when one of the first packaging layer or the second packaging layer is a metal packaging layer, the other packaging layer is a thin film packaging layer or a glass packaging layer. The organic light-emitting display device has good packaging effect, can effectively block water and oxygen, and further ensures long service life of the organic light-emitting display device.
Description
Technical Field
The invention relates to the field of display devices, in particular to an organic light-emitting display device and a preparation method thereof.
Background
The organic light emitting display device has the characteristics of small volume, low power consumption, self-luminescence and the like, and occupies a leading position in the current flat panel display market. However, since most of the organic light emitting devices inside the organic light emitting device are made of organic materials, any trace amount of oxygen and water outside the organic light emitting device will cause material oxidation and damage the organic light emitting device, thereby reducing the quality and the service life of the organic light emitting display device.
In the traditional scheme, a metal foil packaging and surface attaching mode is adopted to package the organic light-emitting display device, specifically, the metal foil is attached to a packaging area by using OCA glue, but the packaging effect is poor, so that the service life of the organic light-emitting display device is short; and the frame of the prepared organic light-emitting display device is too wide, the frame width is usually 1500-3000 μm, and the requirements of consumers on small volume and attractive appearance of electronic products cannot be met.
Disclosure of Invention
In view of the above, it is desirable to provide an organic light emitting display device with a narrow frame and a good packaging effect.
An organic light emitting display device comprising:
the substrate comprises a display area and a packaging area positioned at the periphery of the display area;
an organic light emitting device positioned in the display region;
a first encapsulation layer wrapping the organic light emitting device;
the second packaging layer wraps the first packaging layer;
when one of the first packaging layer or the second packaging layer is a metal packaging layer, the other packaging layer is a thin film packaging layer or a glass packaging layer.
The organic light-emitting display device has good packaging effect, can effectively block water and oxygen, and further ensures long service life of the organic light-emitting display device.
In one embodiment, the first encapsulation layer and the second encapsulation layer are alternately stacked.
In one embodiment, the width of the side edge of the metal packaging layer is 10-650 μm.
In one embodiment, the material of the metal encapsulation layer comprises copper, iron, nickel or aluminum.
In one embodiment, the substrate is a flexible substrate.
The invention also provides a preparation method of the organic light-emitting display device.
A method of fabricating an organic light emitting display device, comprising the steps of:
providing a substrate; the substrate comprises a display area and a packaging area positioned at the periphery of the display area;
forming an organic light emitting device on a display region of the substrate;
forming a first packaging layer on the packaging area of the substrate, and enabling the first packaging layer to wrap the organic light-emitting device;
forming a second packaging layer on the packaging area of the substrate, and enabling the second packaging layer to wrap the first packaging layer;
when the first packaging layer is a metal packaging layer, the area where the metal packaging layer is located is a metal packaging area, and the second packaging layer is a thin film packaging layer or a glass packaging layer;
when the first packaging layer is a thin film packaging layer or a glass packaging layer, the second packaging layer is a metal packaging layer;
the metal packaging layer is formed by spraying metal particles on the packaging area of the substrate by adopting a cold air dynamic spraying method.
The preparation method of the organic light-emitting display device is simple in process, and the prepared organic light-emitting display device has the advantages of good packaging effect and capability of effectively blocking water and oxygen, so that the organic light-emitting display device is long in service life; moreover, the method can prepare the metal packaging layer with narrow side width, ensure that the finally formed frame of the organic light-emitting display device is narrow, and meet the requirements of consumers on small size and attractive appearance of electronic products.
In one embodiment, the temperature of the spray is within 150 ℃.
In one embodiment, the method further comprises etching the metal encapsulation area of the substrate before spraying the metal particles by the cold gas dynamic spraying method.
In one embodiment, when the first packaging layer is a thin film packaging layer or a glass packaging layer, etching the outer surface of the thin film packaging layer or the glass packaging layer.
In one embodiment, the etching is dry etching.
Drawings
Fig. 1 is a front view of an organic light emitting display device according to an embodiment of the present invention.
Fig. 2 is a top view of an organic light emitting display device according to an embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to specific embodiments. It should be understood that the detailed description and specific examples, while indicating the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1 and 2, an organic light emitting display device according to an embodiment of the present invention includes: a substrate 101 having a display region and a package region located at the periphery of the display region, and an organic light emitting device 103 formed in the display region; a first encapsulation layer 105, and wrapping the organic light emitting device 103; a second encapsulation layer 107, and wrapping the first encapsulation layer 105; when one of the first package layer 105 or the second package layer 107 is a metal package layer, the other package layer is a film package layer or a glass package layer, that is, when the first package layer 105 is a metal package layer, the second package layer 107 is a film package layer or a glass package layer; when the first package layer 105 is a film package layer or a glass package layer, the second package layer 107 is a metal package layer.
In a preferred embodiment, the first packaging layer 105 and the second packaging layer 107 can be alternately stacked. That is, the periphery of the second encapsulation layer 107 may further be wrapped with a layer of encapsulation layer, when the second encapsulation layer 107 is a metal encapsulation layer, the encapsulation layer wrapped around the periphery is a film encapsulation layer or a glass encapsulation layer, and when the second encapsulation layer 107 is a film encapsulation layer or a glass encapsulation layer, the encapsulation layer wrapped around the periphery is a metal encapsulation layer.
The substrate has a main function of providing a carrier for processing an organic light emitting device and an encapsulation layer carried thereon.
The substrate may be a rigid substrate or a flexible substrate.
When the substrate is a rigid substrate, the device that is ultimately formed is a rigid organic light emitting device. Wherein the rigid substrate is selected from glass substrates. It is of course understood that the rigid substrate may also be a quartz substrate.
When the substrate is a flexible substrate, the device finally formed is a flexible organic light emitting device. In a preferred embodiment, the material of the flexible substrate is one or a combination of any of polyethylene, polypropylene, polystyrene, polyphenylene ether sulfone, polyimide, and polyethylene terephthalate.
The organic light emitting device includes elements necessary for forming an organic light emitting display device, which are not described herein in detail.
The first packaging layer wraps the organic light-emitting device and mainly has the function of preventing water and oxygen from entering the organic light-emitting device and damaging the structure of the organic light-emitting device. The side width of the first encapsulation layer described herein refers to a distance in a horizontal direction between one side of the first encapsulation layer contacting the organic light emitting device and the other side of the first encapsulation layer contacting the second encapsulation layer, as shown by D2 in fig. 1.
The second packaging layer wraps the first packaging layer and is mainly used for further preventing water and oxygen from entering the organic light-emitting device and damaging the structure of the organic light-emitting device. The side width of the second encapsulation layer referred to herein means a distance in a horizontal direction between one side of the second encapsulation layer contacting the first encapsulation layer and the other side contacting the second encapsulation layer with the outside, as shown by D1 in fig. 1.
When one of the packaging layers is a thin film packaging layer, the thin film packaging layer is a packaging layer without containing a metal simple substance. In a preferred embodiment, the film encapsulation layer is at least one layer of encapsulation film, and specifically, the film encapsulation layer can be a composite encapsulation film formed by one layer of film or a plurality of layers of films in a stacked manner, wherein the composite encapsulation film formed by stacking the plurality of layers of films has a better encapsulation effect and a lower water and oxygen transmission rate. When the film packaging layer is formed by stacking a plurality of films, the plurality of films can be formed by stacking a plurality of organic films, can also be formed by stacking a plurality of inorganic films, and can also be formed by alternately stacking a plurality of organic films and inorganic films.
In a preferred embodiment, the material of the encapsulation film may be flexibly selected according to the specification and application of the organic light emitting device to be manufactured, and is generally an organic or inorganic substance known in the art as the material of the encapsulation film. Preferably, the organic thin film material is polyimide; the inorganic film material is selected from alumina or silicon nitride.
When one of the encapsulating layers is a glass encapsulating layer, the material of the glass encapsulating layer may be selected from ultra-thin glass or a glass cover plate.
In a preferred embodiment, when the encapsulation layer is a thin film encapsulation layer or a glass encapsulation layer, the width of the side edge of the thin film encapsulation layer or the glass encapsulation layer is 800 μm to 1000 μm, which is more advantageous for preparing a narrow-bezel organic light emitting display device.
When one of the package layers is a metal package layer, taking the first package layer as a thin film package layer and the second package layer as a metal package layer as an example: the metal encapsulation layer may be directly formed on the thin film encapsulation layer or indirectly formed on the thin film encapsulation layer, that is, other substances may or may not be included between the metal encapsulation layer and the thin film encapsulation layer. The metal encapsulation layer mainly plays a role in wrapping the film encapsulation layer, and it can be understood that, because the organic device is formed on the substrate, wrapping means that all the other parts of the organic device which can be in contact with the outside are wrapped except the part in contact with the substrate. And water and oxygen are prevented from permeating into the organic light emitting display device through the thin film encapsulation layer to damage the structure of the organic light emitting device.
In a preferred embodiment, the width of the side of the metal encapsulation layer is 10 μm to 650 μm. The width of the side edge of the metal packaging layer is narrow, so that the frame of the finally formed organic light-emitting display device is narrow, the width of the frame of the prepared organic light-emitting display device can reach 900 micrometers at the lowest, and the requirements of consumers on small size and attractiveness of electronic products can be further met. Preferably, the width of the side of the metal encapsulation layer is 10 μm to 500 μm, thereby making the frame of the finally formed organic light emitting display device narrower. More preferably, the width of the side of the metal encapsulation layer may be 10 μm to 100 μm on the premise of ensuring effective blocking of water and oxygen, so that the finally formed frame of the organic light emitting display device is narrower. More preferably, the width of the side of the metal encapsulation layer is 20 μm to 80 μm, so that the frame of the finally formed organic light emitting display device is narrower.
This application adopts cold air power spraying method spraying metal particle to form the metal encapsulation layer, can directly spray the metal particle in the base member surface to combine closely, and then form the encapsulated layer that the structure is fine and close, can effectively separate water and oxygen. Compared with a metal packaging layer formed by an aluminum foil or a copper foil, the metal packaging layer and the film packaging layer do not need to be adhered by an adhesive layer or other redundant layer sets, so that the width of the side edge of the formed metal packaging layer is narrow, and the narrow frame of the finally formed organic light-emitting display device is ensured. Of course, it is understood that other organic or inorganic layers may be formed between the metal encapsulation layer and the thin film encapsulation layer of the present application.
In a preferred embodiment, the material of the metal encapsulation layer comprises copper, iron, nickel, aluminum or alloys thereof. The advantage is that the surface of above-mentioned material and the contact in-process of outside air can take place slow oxidation to can form the oxide film on the surface of metal encapsulation layer, and then more do benefit to the inside that prevents the infiltration of water and oxygen to organic light emitting display device, thereby destroy device inner structure, can understand certainly that the material of metal encapsulation layer also can be for can the other materials of separation water and oxygen.
The organic light-emitting display device has good packaging effect, can effectively block water and oxygen, and further ensures long service life of the organic light-emitting display device.
The invention also provides a preparation method of the organic light-emitting display device.
A preparation method for preparing an organic light-emitting display device comprises the following steps:
and S1, providing a substrate, wherein the substrate comprises a display area and a packaging area positioned at the periphery of the display area, and forming an organic light-emitting device on the display area of the substrate.
S2, forming a first encapsulation layer on the first encapsulation region of the substrate, and making the first encapsulation layer wrap the organic light emitting device, and forming a second encapsulation layer on the second encapsulation region of the substrate, and making the second encapsulation layer wrap the first encapsulation layer.
S3, when the first packaging layer is a metal packaging layer, the area where the metal packaging layer is located is a metal packaging area, and the second packaging layer is a film packaging layer or a glass packaging layer; when the first packaging layer is a film packaging layer or a glass packaging layer, the second packaging layer is a metal packaging layer, and the second packaging area is a metal packaging area. The metal packaging layer is formed by spraying metal particles on the packaging area of the substrate by a cold air dynamic spraying method.
Wherein, a film packaging method is adopted in the process of forming the film packaging layer, and the film packaging method can be spin coating, pasting, spraying and the like. Since the film encapsulation method is a film encapsulation technique known in the art, it is not described herein in detail.
In the process of forming the glass encapsulation layer, a well-known encapsulation technique in the art may be adopted, and will not be described in detail herein.
The following is set forth in connection with the working principle.
The principle of the metal sealing layer formation in the present invention is based on a cold gas dynamic spraying method, specifically, the cold gas dynamic spraying method is to use high-pressure compressed gas as power to drive the tiny metal particles to impact the surface of the base material (i.e. the substrate and the film sealing layer) at high speed, when the speed of the sprayed particles exceeds a specific speed, the sprayed particles generate strong plastic deformation on the surface of the base material and adhere to the base material, and a coating layer is formed on the surface of the base material, and the specific speed is called as a critical speed.
Furthermore, the inventors of the present application have found that, if a conventional metal foil is used as a metal encapsulation layer, many problems occur, such as: the metal foil needs to be extended in the rolling process, and under the influence of rolling oil, rolling rollers and a production environment, pinholes can appear on the surface of the metal foil, so that water and oxygen can permeate into the organic light-emitting display device through the pinholes to damage the device structure. In a preferred embodiment of the present application, the organic light emitting device is first encapsulated with a thin film, and then the thin film encapsulation layer is encapsulated with a metal. The metal packaging adopts a cold air dynamic spraying method to accelerate metal particles to exceed the critical speed of the metal particles, and then the metal particles are sprayed on the surface of a metal packaging area to form a metal packaging layer. The pinhole phenomenon can not occur, thus effectively preventing the water and the oxygen from permeating.
In a preferred embodiment, the process of driving the fine metal particles means compressing air and then accelerating the metal particles using the compressed air as an acceleration source. Preferably, the compressed air is compressed at 1 to 50kPa, which is more advantageous to cause the metal particles to rapidly exceed their critical velocity.
In a preferred embodiment, the temperature of the spraying process is within 150 ℃, so as to prevent the organic light-emitting device structure from being damaged due to the overhigh temperature in the spraying process.
In a preferred embodiment, the method for manufacturing an organic light emitting display device further includes etching the metal encapsulation area of the substrate before spraying the metal particles by the cold air dynamic spraying method, so that the metal particles sprayed into the metal encapsulation area of the substrate are more tightly combined with the substrate, and the encapsulation effect is better.
In a preferred embodiment, the method for manufacturing an organic light emitting display device further includes etching an outer surface of the film encapsulation layer or the glass encapsulation layer when the first encapsulation layer is the film encapsulation layer or the glass encapsulation layer. Therefore, the metal particles sprayed to the surface of the film packaging layer are combined with the film packaging layer more tightly, and the packaging effect is better.
In a preferred embodiment, the etching is dry etching, the etching is rapid, and metal particles are favorably attached to the film packaging layer and the metal packaging region.
The preparation method of the organic light-emitting display device is simple in process, and the prepared organic light-emitting display device has the advantages of good packaging effect and capability of effectively blocking water and oxygen, so that the organic light-emitting display device is long in service life; moreover, the method can prepare the metal packaging layer with narrow side width, ensure that the finally formed frame of the organic light-emitting display device is narrow, and meet the requirements of consumers on small size and attractive appearance of electronic products.
The invention is further illustrated by the following examples.
Example 1
1) The method comprises the steps of taking a glass substrate comprising a display area and a packaging area located on the periphery of the display area, wherein the packaging area comprises a first packaging area and a second packaging area located on the periphery of the first packaging area, the first packaging area is a thin film packaging area, the second packaging area is a metal packaging area, and an organic light-emitting device is evaporated on the display area of the substrate.
2) And spin-coating the thin film packaging area of the glass substrate by adopting a thin film packaging method to prepare an aluminum oxide packaging layer with the side width of 900 micrometers. And then, carrying out dry etching on the outer surface of the aluminum oxide packaging layer, wherein the etching depth is one third of the width of the side edge of the outer surface of the aluminum oxide packaging layer. And then etching the glass substrate in the metal packaging area by using a conventional etching method, wherein the etching depth is one third of the width of the side edge of the glass substrate.
3) Compressing air at 40kPa, taking aluminum particles with the particle size of 100nm, accelerating the aluminum particles by the compressed air to exceed the critical speed of the aluminum particles by 700m/s, and spraying the aluminum particles to a metal packaging area of a glass substrate at the temperature of 140 ℃ to form a metal packaging layer with the side width of 20 microns, wherein the finally prepared organic light-emitting device is A1.
Example 2
The process for preparing an organic light emitting device is substantially the same as in example 1, except that: compressing air at 40kPa, taking copper particles with the particle size of 100nm, accelerating the copper particles to exceed the critical speed of the copper particles by 580m/s by using the compressed air, and spraying the copper particles to a metal packaging area of a glass substrate at the temperature of 140 ℃ to form a metal packaging layer with the side width of 20 microns, wherein the finally prepared organic light-emitting device is A2.
Comparative example 1
1) The method comprises the steps of taking a glass substrate comprising a display area and a packaging area located on the periphery of the display area, wherein the packaging area comprises a first packaging area and a second packaging area located on the periphery of the first packaging area, the first packaging area is a thin film packaging area, the second packaging area is a metal packaging area, and an organic light-emitting device is evaporated on the display area of the substrate.
2) And spin-coating the thin film packaging area of the glass substrate by adopting a thin film packaging method to prepare an aluminum oxide packaging layer with the side width of 900 micrometers.
3) Preparing an aluminum foil with the side width of 700 mu m by a metal extension method, then attaching the aluminum foil to a metal packaging area of a glass substrate by using OCA glue to form a metal packaging layer with the side width of 700 mu m, and finally preparing the organic light-emitting device B1.
Comparative example 2
The organic light emitting device was fabricated by the same method as in comparative example 1, except that: preparing a copper foil with the side width of 700 mu m, and then attaching the copper foil to a metal packaging area of the glass substrate by using OCA glue to form a metal packaging layer with the side width of 700 mu m, wherein the finally prepared organic light-emitting device is B2.
Table 1 shows the encapsulation effect and the frame width of the organic light emitting display device by comparing the conventional metal encapsulation method with the metal encapsulation method of the present invention. Among them, water permeability and oxygen permeability are used as indexes for evaluating the sealing effect.
TABLE 1
As can be seen from table 1, the organic light emitting device prepared by the metal encapsulation method of the present invention has better effect than the conventional aluminum foil encapsulation or copper foil encapsulation, for example, the side width of a1 is thinner than that of B1 compared to a1 and B1, but the water transmittance and oxygen transmittance are lower. Therefore, the prepared organic light-emitting display device has a good packaging effect, and the service life of the organic light-emitting display device can be prolonged. Moreover, the width of the side edge of the metal packaging layer is narrow, so that the finally formed frame of the organic light-emitting display device is narrow, and the requirements of consumers on small size and attractive appearance of electronic products are met.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. An organic light emitting display device, comprising:
the substrate comprises a display area and a packaging area positioned at the periphery of the display area;
an organic light emitting device positioned in the display region;
a first encapsulation layer wrapping the organic light emitting device;
the second packaging layer wraps the first packaging layer;
when one of the first packaging layer or the second packaging layer is a metal packaging layer, the other packaging layer is a thin film packaging layer or a glass packaging layer;
the side width of the film packaging layer or the glass packaging layer is 800-1000 μm, the metal packaging layer is formed by spraying metal particles on the packaging area of the substrate by adopting a cold air dynamic spraying method, and the side width of the metal packaging layer is 20-80 μm.
2. The organic light-emitting display device according to claim 1, wherein the first encapsulation layers and the second encapsulation layers are alternately stacked.
3. The organic light-emitting display device according to claim 1, wherein the metal encapsulation layer has a side width of 20 μm.
4. The organic light-emitting display device of claim 1, wherein the material of the metal encapsulation layer comprises copper, iron, nickel, or aluminum.
5. The organic light-emitting display device according to claim 1, wherein the substrate is a flexible substrate.
6. A method for manufacturing an organic light emitting display device, comprising the steps of:
providing a substrate; the substrate comprises a display area and a packaging area positioned at the periphery of the display area;
forming an organic light emitting device on a display region of the substrate;
forming a first packaging layer on the packaging area of the substrate, and enabling the first packaging layer to wrap the organic light-emitting device;
forming a second packaging layer on the packaging area of the substrate, and enabling the second packaging layer to wrap the first packaging layer;
when the first packaging layer is a metal packaging layer, the area where the metal packaging layer is located is a metal packaging area, and the second packaging layer is a thin film packaging layer or a glass packaging layer;
when the first packaging layer is a thin film packaging layer or a glass packaging layer, the second packaging layer is a metal packaging layer;
the side width of the film packaging layer or the glass packaging layer is 800-1000 μm, and the metal packaging layer is formed by spraying metal particles on the packaging area of the substrate by a cold air dynamic spraying method and has a side width of 20-80 μm.
7. The method of claim 6, wherein the temperature of the spray coating is within 150 ℃.
8. The method of claim 6, further comprising etching the metal encapsulation region of the substrate before spraying the metal particles by cold gas dynamic spraying.
9. The method of claim 6, further comprising etching an outer surface of the thin film encapsulation layer or the glass encapsulation layer when the first encapsulation layer is the thin film encapsulation layer or the glass encapsulation layer.
10. The method of manufacturing an organic light-emitting display device according to claim 8 or 9, wherein the etching is dry etching.
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