CN109616588A - A kind of encapsulating structure of luminescent device, packaging method and display device - Google Patents
A kind of encapsulating structure of luminescent device, packaging method and display device Download PDFInfo
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- CN109616588A CN109616588A CN201811486626.2A CN201811486626A CN109616588A CN 109616588 A CN109616588 A CN 109616588A CN 201811486626 A CN201811486626 A CN 201811486626A CN 109616588 A CN109616588 A CN 109616588A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
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- H10K50/84—Passivation; Containers; Encapsulations
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Abstract
The invention discloses a kind of packaging method of luminescent device, encapsulating structure and display devices.The packaging method includes preparing device substrate and package substrate, and the device substrate includes the luminescent device of substrate and setting on the substrate；The package substrate includes encapsulation cover plate and is arranged on the encapsulation cover plate and the encapsulating structure layer comprising dottle pin layer, and the dottle pin layer is used for so that the side surface away from the encapsulation cover plate of the encapsulating structure layer is in flat surfaces；The package substrate and the device substrate opposite direction are pressed, the side surface away from the encapsulation cover plate of the encapsulating structure layer is bonded with the surface of the substrate.Using the packaging method, it only needs one step press technique just and may make being bonded with the side surface that device substrate mutually presses with the surface of substrate for encapsulating structure layer, it ensure that package edge region has good packaging effect, reduce packaging technology time and the cost of encapsulating structure.
Description
Technical field
The present invention relates to the encapsulation technology fields of display device, and in particular to a kind of encapsulating structure of luminescent device, encapsulation
Method and display device.
Background technique
Luminescent device in display of organic electroluminescence (Organic Light-Emitting Diode, abbreviation OLED)
It easily reacts with ingredients such as steam, oxygen in air, therefore, it is necessary to be strictly disjointed out with the water oxygen in environment, to prolong
The service life of long luminescent device.
Encapsulating structure in the prior art, device substrate and package substrate including pairing.Package substrate includes cap
Plate and the encapsulating structure layer towards device substrate side that encapsulation cover plate is set.Encapsulating structure layer includes barrier layer and setting
In the bonding buffer layer towards device substrate side of barrier layer.Due to barrier layer overlay area and bonding buffer layer overlay area
It is identical, so that barrier layer can not cover package boundary region (region of bonding buffer layer periphery), water oxygen is caused to be easy from encapsulation
Borderline region invades in device substrate, and the luminescent device of device substrate is caused to fail.In order to enable barrier layer covering encapsulation boundary
Region can make the overlay area of barrier layer be greater than the overlay area of bonding buffer layer, but result in encapsulating structure layer in this way
The thickness of edge film layer is less than the thickness of middle film layer, it is necessary to process for pressing be employed many times, this allows for the work of encapsulating structure
Skill time and increased costs, moreover, the pressing in edge is higher to press equipment required precision, technology difficulty is larger.
Summary of the invention
The purpose of the embodiment of the present invention is that a kind of encapsulating structure of luminescent device, packaging method and display device are provided, with
Reduce the process for pressing number formed during encapsulating structure.
In order to solve the above-mentioned technical problem, the embodiment of the invention provides a kind of packaging method of luminescent device, the sides
Method includes:
Prepare device substrate and package substrate, the device substrate includes substrate and setting shining on the substrate
Device；The package substrate includes encapsulation cover plate and is arranged on the encapsulation cover plate and the encapsulating structure layer comprising dottle pin layer,
The dottle pin layer is used for so that the side surface away from the encapsulation cover plate of the encapsulating structure layer is in flat surfaces；
The package substrate and the device substrate opposite direction are pressed, the encapsulating structure layer deviates from the encapsulation cover plate
A side surface be bonded with the surface of the substrate.
Optionally, the package substrate for preparing includes,
Prepare encapsulating structure layer, the encapsulating structure layer includes that the barrier layer being arranged on the encapsulation cover plate, setting exist
Bonding buffer layer on the barrier layer, orthographic projection of the bonding buffer layer on the encapsulation cover plate are located at the barrier layer
In the orthographic projection on the encapsulation cover plate, the dottle pin layer is arranged on the barrier layer around the periphery of the barrier layer,
The height of the dottle pin layer is equal with the height of the barrier layer；
The encapsulating structure layer is attached on the encapsulation cover plate, so that the barrier layer is buffered away from the bonding
The side of layer is towards the encapsulation cover plate.
Optionally, the encapsulating structure layer for preparing includes:
Packaging adhesive film and preparation bonding buffering layer coiled material are prepared, preparing packaging adhesive film includes: to be formed on the first protective film
The barrier layer；The dottle pin layer is formed on the barrier layer, the dottle pin layer has inner circumferential boundary and outer perimeter；It is described
Bonding buffering layer coiled material includes that be arranged on the second protective film and enclose with the inner circumferential boundary of the dottle pin layer region that sets opposite
The thickness of the bonding buffer layer answered, the bonding buffer layer is equal with the thickness of the barrier layer；
By the packaging adhesive film and bonding buffering layer coiled material opposite direction pressing, is formed and be located at the first protective film and the second guarantor
Encapsulating structure layer between cuticula, the inner circumferential boundary that the bonding buffer layer is located at the dottle pin layer are enclosed in the region set.
Optionally, it is characterised in that the package substrate for preparing includes preparing covering plate structure layer and preparation sheet glue film,
Preparing covering plate structure layer includes, and dottle pin layer is formed on the encapsulation cover plate, and the dottle pin layer has inner circumferential boundary
And outer perimeter；The sheet glue film includes barrier layer and the bonding buffer layer that is arranged on the barrier layer, and the bonding is slow
The thickness for rushing layer is equal with the thickness of the dottle pin layer, and the inner circumferential boundary of the bonding buffer layer and the dottle pin layer, which is enclosed, to be set
Region is corresponding；
The sheet glue film is attached on the covering plate structure layer, so that the barrier layer is buffered away from the bonding
The side of layer is towards the covering plate structure layer, and the barrier layer covers the dottle pin floor and the area set is enclosed on the inner circumferential boundary
Domain, the bonding buffer layer are located at the inner circumferential boundary and enclose in the region set.
Optionally, the preparation sheet glue film includes:
Barrier layer is formed on the first protective film；
Bonding buffer layer is formed on the second protective film, the thickness of the bonding buffer layer is with described every cushion thickness phase
Deng；
First protective film and the second protective film opposite direction are pressed, formed between the first protective film and the second protective film
Sheet glue film.
Optionally, the outer perimeter of the dottle pin layer is concordant with the outer boundaries of barrier layer.
Optionally, the dottle pin layer is identical as the material of the barrier layer, the material of the dottle pin layer and the barrier layer
In doped with hygroscopicity particle.
Optionally, the dottle pin layer with a thickness of 10 μm~30 μm, the barrier layer with a thickness of 10 μm~30 μm.
In order to solve the above-mentioned technical problem, the embodiment of the invention also provides a kind of encapsulating structures of luminescent device, including
The device substrate and package substrate of opposite direction pressing,
Device substrate, the luminescent device including substrate and setting on the substrate；
Package substrate including encapsulation cover plate and is arranged on the encapsulation cover plate and the encapsulating structure layer comprising dottle pin layer,
The dottle pin layer is used for so that the side surface away from the encapsulation cover plate of the encapsulating structure layer is in flat surfaces, the envelope
The side surface away from the encapsulation cover plate of assembling structure layer is bonded with the surface of the substrate.
Optionally, the encapsulating structure layer further includes the barrier layer being arranged on the encapsulation cover plate and is arranged in the resistance
Bonding buffer layer on interlayer, orthographic projection of the bonding buffer layer on the encapsulation cover plate are located at the barrier layer described
In orthographic projection on encapsulation cover plate, the dottle pin layer is arranged on the barrier layer around the periphery of the bonding buffer layer, institute
The height for stating dottle pin layer is equal with the bonding height of buffer layer.
Optionally, the dottle pin layer is arranged on the encapsulation cover plate, and the dottle pin layer has inner circumferential boundary and outer periphery
Boundary, the encapsulating structure layer further include barrier layer and bonding buffer layer, and the barrier layer setting is on the dottle pin layer and described
The region that barrier layer covers the dottle pin layer and the inner circumferential bounded is set, the bonding buffer layer are arranged on the barrier layer
And the bonding buffer layer is located in the region that the inner circumferential bounded is set, the thickness and the dottle pin layer of the bonding buffer layer
Thickness it is equal.
Optionally, the outer perimeter of the dottle pin layer is concordant with the outer boundaries of barrier layer.
Optionally, the dottle pin layer is identical as the material of the barrier layer, the material of the dottle pin layer and the barrier layer
In doped with hygroscopicity particle.
Optionally, the dottle pin layer with a thickness of 10 μm~30 μm, the barrier layer with a thickness of 10 μm~30 μm.
In order to solve the above-mentioned technical problem, the embodiment of the invention also provides a kind of display devices, including use the above institute
The encapsulating structure stated.
The packaging method for the luminescent device that the embodiment of the present invention proposes, encapsulating structure layer includes dottle pin layer, and dottle pin layer makes
The side surface away from the encapsulation cover plate of encapsulating structure layer is in flat surfaces, thus, by the package substrate and the device
Part substrate opposite direction press when, it is only necessary to one step press technique can so that encapsulating structure layer one mutually pressed with device substrate
Side surface is bonded with the surface of substrate, ensure that package edge region has good packaging effect.The envelope of the embodiment of the present invention
Dress method, it is no longer necessary to carry out second for fringe region and press, reduce packaging technology time and the cost of encapsulating structure.
It is pressed due to no longer needing to carry out second for fringe region, so that shape can occurs to avoid encapsulation cover plate edge region
Become and cause bigger stress, so that encapsulating structure is stronger, while reducing the required precision to press equipment.
Other features and advantages of the present invention will be illustrated in the following description, also, partly becomes from specification
It obtains it is clear that understand through the implementation of the invention.The objectives and other advantages of the invention can be by specification, right
Specifically noted structure is achieved and obtained in claim and attached drawing.
Detailed description of the invention
Attached drawing is used to provide to further understand technical solution of the present invention, and constitutes part of specification, with this
The embodiment of application technical solution for explaining the present invention together, does not constitute the limitation to technical solution of the present invention.
Fig. 1 is a kind of structural schematic diagram of the encapsulating structure of luminescent device in the related technology；
Fig. 2 a is a kind of structural schematic diagram of device substrate；
Fig. 2 b is a kind of structural schematic diagram of package substrate；
Fig. 2 c is obtained after package substrate shown in device substrate shown in Fig. 2 a and Fig. 2 b is carried out first time pressing
The schematic diagram of encapsulating structure；
Fig. 2 d is the schematic diagram that the encapsulating structure obtained after pressing again is carried out to encapsulating structure shown in Fig. 2 c；
Fig. 3 is the schematic diagram of the packaging method of luminescent device of the embodiment of the present invention；
Fig. 4 a is the cross section structure schematic diagram of the package substrate formed in first embodiment of the invention；
Fig. 4 b is the overlooking structure diagram of the package substrate formed in first embodiment of the invention；
Fig. 5 is the schematic diagram for the encapsulating structure that first embodiment of the invention is formed；
Fig. 6 is the preparation flow schematic diagram of encapsulating structure layer in first embodiment of the invention；
Fig. 7 a is that the structural schematic diagram after barrier layer is formed in first embodiment of the invention；
Fig. 7 b is that the structural schematic diagram after dottle pin layer is formed in first embodiment of the invention；
Fig. 7 c is the structural schematic diagram of bonding buffering layer coiled material in first embodiment of the invention；
Fig. 8 a is the structural schematic diagram of encapsulating structure layer in first embodiment of the invention；
Fig. 8 b is the Section A-A structural schematic diagram in Fig. 8 a；
Fig. 9 a is the cross section structure schematic diagram of the package substrate formed in third embodiment of the invention；
Fig. 9 b is the overlooking structure diagram of the package substrate formed in third embodiment of the invention；
Figure 10 is the schematic diagram for the encapsulating structure that third embodiment of the invention is formed；
Figure 11 is the preparation flow schematic diagram of sheet glue film in third embodiment of the invention；
Figure 12 a is that the structural schematic diagram after barrier layer is formed in third embodiment of the invention；
Figure 12 b is the structural schematic diagram of sheet glue film in third embodiment of the invention；
Figure 12 c is the section B-B structural schematic diagram in Figure 12 b；
Figure 13 is the preparation flow schematic diagram of third embodiment of the invention cover plate structure sheaf；
Figure 14 is the structural schematic diagram of third embodiment of the invention cover plate structure sheaf.
Description of symbols:
10-device substrates；11-substrates；12-luminescent devices；
13-passivation layers；20-encapsulating structure layers；21-bonding buffer layers；
22-barrier layers；23-dottle pin layers；30-encapsulation cover plates；
40-package substrates；51-the first idler wheel；52-the second idler wheel；
53-third idler wheels；54-the four idler wheel；61-the first protective film；
62-the second protective film；71-apparatus for coating；100-package edge regions；
231-inner circumferential boundaries；232-outer perimeters.
Specific embodiment
To make the objectives, technical solutions, and advantages of the present invention clearer, below in conjunction with attached drawing to the present invention
Embodiment be described in detail.It should be noted that in the absence of conflict, in the embodiment and embodiment in the application
Feature can mutual any combination.
Fig. 1 is a kind of structural schematic diagram of the encapsulating structure of luminescent device in the related technology.The encapsulating structure includes opposite
The device substrate 10 and package substrate 40 of fitting.Device substrate 10 includes substrate 11, the luminescent device 12 being arranged in substrate 11
And the passivation layer (Passivation) 13 of covering 12 outer surface of luminescent device.Luminescent device can be OLED device.Encapsulate base
Plate 40 includes encapsulation cover plate 30 and the packaging adhesive film 20 towards device substrate side that encapsulation cover plate 30 is arranged in.Packaging adhesive film 20
Generally comprise bonding buffer layer 21 and barrier layer 22.Using laminating machine by device substrate 10 and the opposite fitting of package substrate 40, and
It is hot pressed into box under vacuum atmosphere, forms encapsulating structure as shown in Figure 1.Bonding buffer layer 21 is the uniform glue-line of film thickness, is risen
To buffer protection function.Barrier layer 22 further functions as the effect of barrier water oxygen.In encapsulating structure shown in Fig. 1, barrier layer
22 is identical with the bonding overlay area of buffer layer 21, and therefore, barrier layer 22 does not cover package boundary region 100, causes to obstruct
Layer 22 can not play the role of obstructing water oxygen in package boundary region 100, thus, water oxygen can be along the boundary of bonding buffer layer 21
It intrudes into luminescent device, luminescent device is caused to fail.
In order to enable barrier layer 22 cover package boundary region 100, the overlay area of barrier layer 22 can be increased, so as to
When forming encapsulating structure, barrier layer can cover package boundary region 100.
Fig. 2 a is a kind of structural schematic diagram of device substrate, and Fig. 2 b is a kind of structural schematic diagram of package substrate, and Fig. 2 c is
The signal for the encapsulating structure that package substrate shown in device substrate shown in Fig. 2 a and Fig. 2 b obtain after first time pressing
Figure, Fig. 2 d are the schematic diagram that the encapsulating structure obtained after pressing again is carried out to encapsulating structure shown in Fig. 2 c.Form Fig. 2 d institute
The packaging method of the encapsulating structure shown is summarized as follows:
Form device substrate as shown in Figure 2 a.Device substrate 10 includes substrate 11, the photophore being arranged in substrate 11
Part 12 and the passivation layer 13 for covering 12 outer surface of luminescent device.
Form package substrate as shown in Figure 2 b.Package substrate includes substrate 30 and the encapsulation knot being arranged in substrate 30
Structure layer 20.When forming package substrate, in general, bonding buffer layer 21 and barrier layer 22 are formed laminar film by process for pressing
Layer, the sheet film layer of formation glue material in the form of sheets.The sheet film layer is bonded with encapsulation cover plate 30 using coating technique, is formed as schemed
Structure shown in 2b.Encapsulating structure layer includes barrier layer 22 and bonding buffer layer 21.In order to allow barrier layer 22 to cover encapsulation
Borderline region, the overlay area of barrier layer 22 are greater than the overlay area of bonding buffer layer 21.
Device substrate and package substrate opposite direction are pressed using process for pressing, as shown in Figure 2 c.In figure 2 c, barrier layer 22
Overlay area be greater than bonding buffer layer 21 overlay area, therefore, in the bonding processes of device substrate 10 and package substrate 40
In, the thickness of encapsulating structure layer edge film layer is less than the thickness of middle film layer, causes after carrying out one step press, edge film layer can not
It is bonded with the surface of substrate 11, causes packaging effect at package edge region 100 bad.In order to enable package edge region 100
Relatively good packaging effect is obtained, needs to carry out second for fringe region to press, so that edge film layer and substrate 11
Surface fitting.
Fig. 2 b is the package structure diagram after second of pressing.It is pressed carrying out second for package edge region 100
After conjunction, barrier layer 22 covers package edge region 100, doped with alkali metal oxide in barrier layer 22, such as calcium oxide etc.,
Therefore, barrier layer 22 can stop water oxygen to intrude into luminescent device along the boundary of bonding buffer layer 21, extend photophore
The service life of part.
But formed during encapsulating structure, process for pressing twice is carried out, when not only increasing process equipment and technique
Between, and deformation occurs will cause bigger stress for 30 edge region of encapsulation cover plate.Long-time stress is easy to cause encapsulation
It is insecure, cause encapsulation cover plate 30 to separate opening with device substrate.In addition, needing in second of process for pressing using edge
Pressing, and edge pressing is higher to the required precision of press equipment, if pressing region deviates in addition to display area, due to resistance
Barrier layer 22 may be caused to make with bonding buffer layer 21 without well contacting there are gap between interlayer 22 and bonding buffer layer 21
It is poor at packaging effect；If pressing region to deviate to display area direction, it may cause display area and weighed wounded, influence product
Quality.
In order to reduce packaging technology time and the cost of luminescent device, the embodiment of the present invention proposes a kind of luminescent device
Packaging method.As shown in figure 3, Fig. 3 is the schematic diagram of the packaging method of luminescent device of the embodiment of the present invention, this method comprises:
Prepare device substrate and package substrate, the device substrate includes substrate and setting shining on the substrate
Device；The package substrate includes encapsulation cover plate and is arranged on the encapsulation cover plate and the encapsulating structure layer comprising dottle pin layer,
The dottle pin layer is used for so that the side surface away from the encapsulation cover plate of the encapsulating structure layer is in flat surfaces；
The package substrate and the device substrate opposite direction are pressed, the encapsulating structure layer deviates from the encapsulation cover plate
A side surface be bonded with the surface of the substrate.
The packaging method for the luminescent device that the embodiment of the present invention proposes, encapsulating structure layer includes dottle pin layer, and dottle pin layer makes
The side surface away from the encapsulation cover plate of encapsulating structure layer is in flat surfaces, thus, by the package substrate and the device
Part substrate opposite direction press when, it is only necessary to one step press technique can so that encapsulating structure layer one mutually pressed with device substrate
Side surface is bonded with the surface of substrate, ensure that package edge region has good packaging effect.The envelope of the embodiment of the present invention
Dress method, it is no longer necessary to carry out second for fringe region and press, reduce packaging technology time and the cost of encapsulating structure.
It is pressed due to no longer needing to carry out second for fringe region, so that shape can occurs to avoid encapsulation cover plate edge region
Become and cause bigger stress, so that encapsulating structure is stronger, while reducing the required precision to press equipment.
Technology contents of the invention will be discussed in detail by specific embodiment below.Photophore in the embodiment of the present invention
Part can be OLED device.
First embodiment:
In the first embodiment of the invention, the packaging method of luminescent device, specifically includes:
S1: device substrate 10 is prepared.Device substrate 10 include substrate 11, the luminescent device 12 that is arranged in substrate 11 and
The passivation layer 13 of 12 outer surface of luminescent device is covered, as shown in Figure 2 a.In the present embodiment, device substrate 10 can use ability
Domain conventional method is prepared, and details are not described herein.
S2: preparing package substrate 40, and package substrate includes encapsulation cover plate 30 and the encapsulation knot that is arranged on encapsulation cover plate 30
Structure layer, encapsulating structure layer include the barrier layer 22 being arranged on encapsulation cover plate 30 and the bonding being arranged on barrier layer 22 buffering
Layer 21 bonds buffer layer 21 in the orthographic projection on encapsulation cover plate 30 and is located at orthographic projection range of the barrier layer 22 on encapsulation cover plate 30
Interior, encapsulating structure layer further includes that the dottle pin layer 23 on barrier layer 22 is arranged in around the periphery of bonding buffer layer 21, dottle pin layer
23 thickness H1 is equal with the bonding thickness H2 of buffer layer 21, so that the side table of encapsulating structure layer mutually pressed with device substrate
Face (being in fig.4 the uper side surface of encapsulating structure layer) be in flat surface, in the present embodiment, encapsulating structure layer and device
The side surface that part substrate mutually presses includes a side surface towards device substrate 10 and the dottle pin layer 23 for bonding buffer layer 21
Towards a side surface of device substrate 10, as shown in fig. 4 a and shown in Fig. 4 b.Fig. 4 a is to be formed in first embodiment of the invention
The cross section structure schematic diagram of package substrate, Fig. 4 b are the plan structure signal of the package substrate formed in first embodiment of the invention
Figure.In the present embodiment, the side surface of package substrate mutually pressed with device substrate includes the upper surface for bonding buffer layer 21
With the upper surface of dottle pin layer 23.In the present embodiment, the material of encapsulation cover plate 30 is metal.
S3: using press equipment by package substrate 40 and the opposite pressing of device substrate 10, encapsulating structure layer deviates from encapsulation
One side surface of cover board 30 is bonded with the surface of substrate 11, that is to say, that bonding buffer layer 21 towards the one of device substrate 10
Side surface is bonded with the surface of substrate 11, and the surface of the side surface and substrate 11 towards device substrate 10 of dottle pin layer 23 is pasted
It closes, as shown in Figure 5.Fig. 5 is the schematic diagram for the encapsulating structure that first embodiment of the invention is formed.
It is easily understood that step S1 and S2 and there is no the sequencing of essence, device substrate and package substrate can be with
It prepares, can also successively prepare simultaneously.
The packaging method for the luminescent device that the embodiment of the present invention proposes, when preparing package substrate 40, the shape on barrier layer 22
At the dottle pin layer 23 around bonding buffer layer 21, the thickness of dottle pin layer 23 is equal with the bonding thickness of buffer layer 21, this is allowed for
The thickness of the edge film layer of encapsulating structure layer 20 is equal with the thickness of middle film layer, avoids the height of fringe region and intermediate region
It is poor to spend, so that encapsulating structure layer is in flat surface with the surface that 10 phase of device substrate presses, thus, by device substrate 10 and envelope
Dress substrate 40 is when being pressed, it is only necessary to one step press technique can so that dottle pin layer 23 the side towards device substrate 10
Surface and bonding buffer layer 21 are bonded with the surface of substrate 11 simultaneously, ensure that package edge region is imitated with good encapsulation
Fruit.The packaging method of the embodiment of the present invention, it is no longer necessary to carry out second for fringe region and press, reduce encapsulating structure
Packaging technology time and cost.It is pressed due to no longer needing to carry out second for fringe region, thus can be to avoid encapsulation
Deformation occurs and causes bigger stress for 30 edge region of cover board, so that encapsulating structure is stronger, while reducing pair
The required precision of press equipment.
In the present embodiment, the thickness H1 of the dottle pin layer 23 of formation is 10 μm~30 μm, and the thickness H3 of barrier layer 22 is 10 μ
M~30 μm.
In order to enable dottle pin layer 23 plays the role of similarly obstructing water oxygen, the material of dottle pin layer 23 as barrier layer 22
Can be identical as the material of barrier layer 22, thus, dottle pin layer 23 can be integrated into a whole with barrier layer 22, be reached such as Fig. 2 d
Shown in barrier layer barrier water oxygen effect.In the present embodiment, the material of barrier layer 22 includes organic matter, wherein organic matter
It can be used as the basic material of barrier layer 22, it is inorganics doped in basic material, in this way, can not only guarantee that barrier layer 22 has
There is good elasticity, but also there is good barrier water oxygen.Organic matter can be PET (polyethylene terephthalate),
PEN (polyethylene naphthalate), PI (polyimides), PVC (polyvinyl chloride), PTFE (polytetrafluoroethylene (PTFE)) etc..In this reality
It applies in example, doped with hygroscopicity particle in dottle pin layer 23 and barrier layer 22, for example, alkali metal oxide particle.Hygroscopicity
Grain is preferably CaO particle.Doped with hygroscopicity particulate matter in dottle pin layer 23 and barrier layer 22, it can thus increase dottle pin layer
23 and the moisture absorption sectional area of barrier layer 22 further block steam by dottle pin layer and barrier layer, mention to enhance water imbibition
The high packaging effect of encapsulating structure.
In the present embodiment, as shown in figures 4 a and 4b, the outside of the inboard boundary of dottle pin layer 23 and bonding buffer layer 21
Boundary is concordant, in this way, the preparation of package substrate is not only facilitated, moreover, after forming encapsulating structure, dottle pin layer 23 and barrier layer
22 will can bond the exposed side surface of buffer layer 21 and upper surface cladding together, improve the oxygen performance that blocks water of encapsulating structure,
And improve the being firmly combined property of encapsulating structure.In the present embodiment, in the circumferential direction of dottle pin layer 23, dottle pin layer 23
Wall thickness is equal, as shown in Figure 4 b, W1=W2.It is easily understood that the wall thickness of dottle pin layer 23 can be set according to actual needs, such as
Fruit actual needs, W1 can also be not equal to W2.It can also be seen that the outer surface of dottle pin layer 23 and barrier layer 22 from Fig. 4 b
Outer surface is concordant.
In the present embodiment, preparing package substrate 40 includes preparing encapsulating structure layer, encapsulating structure layer include barrier layer 22,
Bond buffer layer 21 and dottle pin layer 23.Fig. 6 is the preparation flow schematic diagram of encapsulating structure layer in first embodiment of the invention.Reference
Fig. 6, preparing encapsulating structure layer includes preparing packaging adhesive film and preparation bonding buffering layer coiled material, and the process for preparing packaging adhesive film is specific
It is described as follows:
Barrier layer 22 is formed on the first protective film 61, specific as follows: winding is provided with the first protection on the first idler wheel 51
Film 61, the material of the first protective film 61 can be PET (polyethylene terephthalate), PEN (polyethylene naphthalate),
PI (polyimides) or PC (polycarbonate).The side of second idler wheel 52 is provided with apparatus for coating 71, the spray of apparatus for coating 71
Gap is maintained between mouth and the second idler wheel 52 (gap is 0.01mm~1mm).Under the rolling action of idler wheel, the first protection
Film 61 is transmitted on the second idler wheel 52 from the first idler wheel 51, and the even spread on the first protective film 61 of apparatus for coating 71 forms barrier
Layer 22, as shown in Figure 7a, Fig. 7 a are that the structural schematic diagram after barrier layer is formed in first embodiment of the invention.The base of barrier layer 22
Body material is inorganic matter, doped with hygroscopicity particle in barrier layer 22, for example, alkali metal oxide particle.Hygroscopicity particulate matter
Preferably CaO.
Dottle pin layer 23 is formed on barrier layer 22, specific as follows: the first protective film 61 carries barrier layer 22 and is sent to
The lower section of third idler wheel 53, third idler wheel 53 form dottle pin layer 23 by way of transfer on barrier layer 22, as shown in Figure 7b,
Fig. 7 b is that the structural schematic diagram after dottle pin layer is formed in first embodiment of the invention.Wherein, dottle pin layer 23 is located at barrier layer 22
In range, dottle pin layer 23 has inner circumferential boundary 231 and outer perimeter 232, and in the present embodiment, dottle pin layer 23 is in " returning " font.
The outer perimeter of dottle pin layer 23 is concordant with the outer boundary of barrier layer 22, the downside outer boundary of dottle pin layer 23 and the downside of barrier layer 22
Boundary is concordant, as shown in Figure 7b.In the present embodiment, in the circumferential direction of dottle pin layer 23, the wall thickness of dottle pin layer 23 is equal.Resistance
22 dottle pin layer 23 of interlayer can be identical as the material of barrier layer 22.
Precuring is carried out to barrier layer 22 and dottle pin layer 23, specifically, the first protective film 61 carry barrier layer 22 and every
Bed course 23 is dried into oven and precuring, completes the production of packaging adhesive film.
Winding is provided with bonding buffering layer coiled material on 4th idler wheel 54, and as shown in Figure 7 c, Fig. 7 c is that the present invention first is implemented
The structural schematic diagram of bonding buffering layer coiled material in example, bonding buffering layer coiled material include that the second protective film 62 and setting are protected second
Bonding buffer layer 21 on cuticula 62, bonding buffer layer 21 are glue material, and material can be epoxy resin etc..Bond buffer layer 21
Boundary dimensions be less than or equal to the inner boundary size of dottle pin layer 23, i.e. a2≤a1, b2≤b1, in the present embodiment, bonding are slow
The boundary dimensions for rushing layer 21 is equal to the inner boundary size of dottle pin layer 23, i.e. a2=a1, b2=b1.Bond the thickness H2 of buffer layer 21
It is equal with the thickness H1 of dottle pin layer 23, as shown in Figure 5.Formed bond buffering layer coiled material when, can be using transfer printing process the
Bonding buffer layer 21 corresponding with the dottle pin layer 23 on the first protective film 61 is formed on two protective films 62, and to bonding buffer layer
21 carry out precuring, can obtain bonding buffering layer coiled material as shown in Figure 7 c.
Packaging adhesive film and bonding buffer layer glue material are sent into press equipment simultaneously, hot pressing fitting is carried out on press equipment,
So that bonding buffer layer 21 enters in the inboard boundary area defined of dottle pin layer 23, envelope as figures 8 a and 8 b show is formed
Assembling structure layer, Fig. 8 a are the schematic diagram of encapsulating structure layer in first embodiment of the invention, and Fig. 8 b is the Section A-A structure in Fig. 8 a
Schematic diagram.Encapsulating structure layer includes barrier layer 22,23 and of dottle pin layer between the first protective film 61 and the second protective film 62
Buffer layer 21 is bonded, dottle pin layer 23 is disposed around the periphery of bonding buffer layer 21.Fig. 7 a~Fig. 8 b is for that this hair is described in detail
Bright schematic diagram does not represent actual size size.It is easily understood that can be formed more by preparation flow shown in fig. 6
Encapsulating structure layer is opened, when specifically used, to be cut into the use of individual encapsulating structure layer.
In the present embodiment, as shown in Figure 8 b, the first protective film 61 is light release film, and the second protective film 62 is attached most importance to release
Film, that is to say, that the cohesive force between the first protective film 61 and encapsulating structure layer is less than the second protective film 62 and encapsulating structure layer
Between cohesive force, thus, facilitate and remove the first protective film 61 from encapsulating structure layer.
First protective film 61 is removed from encapsulating structure layer, and the encapsulating structure layer with the second protective film 62 is attached
On encapsulation cover plate 30, then, the second protective film 62 is removed, package substrate as shown in fig. 4 a is formed.
Second embodiment:
Second embodiment of the invention proposes a kind of encapsulating structure, as shown in Figure 5.The encapsulating structure uses first embodiment
Packaging method be prepared, which includes the device substrate 10 and package substrate 40 of opposite pressing.Device substrate 10
Including substrate 11, the luminescent device being arranged in substrate 11 12 and the passivation layer 13 for covering 12 outer surface of luminescent device.Encapsulation
Substrate includes encapsulation cover plate and is arranged on the encapsulation cover plate 30 and the encapsulating structure layer comprising dottle pin layer, dottle pin layer 23 are used for
So that the side surface away from encapsulation cover plate 30 of encapsulating structure layer is in flat surfaces.Encapsulating structure layer deviates from the cap
One side surface of plate is bonded with the surface of the substrate.
In the present embodiment, as shown in figure 5, encapsulating structure layer includes bonding buffer layer 21, barrier layer 22 and dottle pin layer 23.
Wherein, barrier layer 22 be arranged in encapsulation cover plate 30 towards on the side of device substrate 10, the bonding setting of buffer layer 21 is obstructing
Layer 22 exists towards on the side of device substrate 10, bonding orthographic projection of the buffer layer 21 on encapsulation cover plate 30 and be located at barrier layer 22
In orthographic projection on encapsulation cover plate 30.Dottle pin layer 23 around the periphery of bonding buffer layer 21 be arranged in barrier layer 22 towards device
On the side of part substrate 10, the thickness H1 of dottle pin layer 23 is equal with the bonding thickness H2 of buffer layer 21, thus, bond buffer layer 21
The side surface towards device substrate 10 be bonded with the surface of substrate 11, the side table towards device substrate 10 of dottle pin layer 23
Face is also bonded with the surface of substrate 11.
In the present embodiment, the thickness H1 of dottle pin layer 23 is 10 μm~30 μm, and the thickness H3 of barrier layer 22 is 10 μm~30 μ
m。
In order to enable dottle pin layer 23 plays the role of similarly obstructing water oxygen, the material of dottle pin layer 23 as barrier layer 22
Can be identical as the material of barrier layer 22, thus, dottle pin layer 23 can be integrated into a whole with barrier layer 22, be reached such as Fig. 2 d
Shown in barrier layer barrier water oxygen effect.In the present embodiment, the material of barrier layer 22 includes organic matter, wherein organic matter
It can be used as the basic material of barrier layer 22, it is inorganics doped in basic material, in this way, can not only guarantee that barrier layer 22 has
There is good elasticity, but also there is good barrier water oxygen.Organic matter can be PET (polyethylene terephthalate),
PEN (polyethylene naphthalate), PI (polyimides), PVC (polyvinyl chloride), PTFE (polytetrafluoroethylene (PTFE)) etc..In this reality
It applies in example, doped with hygroscopicity particle in dottle pin layer 23 and barrier layer 22, for example, alkali metal oxide particle.Hygroscopicity
Grain is preferably CaO particle.Doped with hygroscopicity particulate matter in dottle pin layer 23 and barrier layer 22, it can thus increase dottle pin layer
23 and the moisture absorption sectional area of barrier layer 22 further block steam by dottle pin layer and barrier layer, mention to enhance water imbibition
The high packaging effect of encapsulating structure.
Fig. 4 b is the overlooking structure diagram of package substrate.In the present embodiment, as shown in Figure 4 b, the inside of dottle pin layer 23
Boundary is concordant with the bonding outer boundaries of buffer layer 21, in this way, the preparation of package substrate is not only facilitated, moreover, sealing being formed
After assembling structure, dottle pin layer 23 and barrier layer 22 will can bond the exposed side surface of buffer layer 21 and upper surface cladding together, mention
The high oxygen performance that blocks water of encapsulating structure, and improve the being firmly combined property of encapsulating structure.In the present embodiment, in dottle pin layer
In 23 circumferential direction, the wall thickness of dottle pin layer 23 is equal, in figure Fig. 4 b, W1=W2.It is easily understood that the wall of dottle pin layer 23
Thickness can be set according to actual needs, if actual needs, W can also be not equal to W2.It can also be seen that dottle pin layer from Fig. 4 b
23 outer surface is concordant with the outer surface of barrier layer 22.
3rd embodiment:
In second embodiment of the invention, the packaging method of luminescent device is specifically included:
S1: device substrate 10 is prepared.In the present embodiment, the structure and preparation method and first embodiment of device substrate 10
Identical, details are not described herein.
S2: preparing package substrate 40, and package substrate includes encapsulation cover plate 30 and the encapsulation knot that is arranged on encapsulation cover plate 30
Structure layer.Encapsulating structure layer includes the dottle pin layer 23 being arranged on encapsulation cover plate 30, and dottle pin layer 23 has inner circumferential boundary 231 and periphery
Boundary 232.In the present embodiment, the boundary of dottle pin layer 23 is in quadrangle.It is easily understood that the boundary shape of dottle pin layer 23 can
To be arranged according to actual needs.Encapsulating structure layer further includes the barrier layer 22 being arranged on metal cover board 30 and dottle pin layer 23, resistance
Interlayer 22 covers dottle pin layer 23 and the region set is enclosed on inner circumferential boundary 231.Encapsulating structure layer further includes being arranged on barrier layer 22
Bonding buffer layer 21, bonding buffer layer 21 is located at inner circumferential boundary 231 and encloses in the region set, the thickness H1 of dottle pin layer 23 with bond
The thickness H2 of buffer layer 21 is equal, so that the side surface of encapsulating structure layer mutually pressed with device substrate (is in fig. 9 a envelope
The uper side surface of assembling structure layer) it is in flat surface, as shown in figures 9 a and 9b.Fig. 9 a is to be formed in third embodiment of the invention
Package substrate cross section structure schematic diagram.Fig. 9 b is that the plan structure of the package substrate formed in third embodiment of the invention is shown
It is intended to.In the present embodiment, encapsulating structure layer includes the upper of bonding buffer layer 21 with the side surface that device substrate mutually presses
The upper surface for being located at bonding 21 exterior portion of buffer layer on surface and barrier layer 22.In the present embodiment, the material of encapsulation cover plate 30
Matter is metal, such as ITO etc..
S3: being pressed using press equipment by package substrate 40 and device substrate 10 are opposite, bonding buffer layer 21 towards device
One side surface of part substrate 10 is bonded with the surface of substrate 11, barrier layer 22 towards a side surface of device substrate 10 and substrate
11 surface fitting, as shown in Figure 10.Figure 10 is the schematic diagram for the encapsulating structure that third embodiment of the invention is formed.
It is easily understood that step S1 and S2 and there is no the sequencing of essence, device substrate and package substrate can be with
It prepares, can also successively prepare simultaneously.
The packaging method for the luminescent device that the embodiment of the present invention proposes, when preparing package substrate 40, on encapsulation cover plate 30
Dottle pin layer 23 is formed, the thickness of dottle pin layer 23 is equal with the bonding thickness of buffer layer 21, this allows for the side of encapsulating structure layer 20
The thickness of velum layer and the thickness of middle film layer are equal, avoid the difference in height of fringe region and intermediate region, so that encapsulation knot
Structure layer 20 is in flat surface with the surface that 10 phase of device substrate presses, thus, device substrate 10 and package substrate 40 are carried out
When pressing, it is only necessary to which one step press technique can be so that the side surface towards device substrate 10 of barrier layer 22 be delayed with bonding
It rushes layer 21 while being bonded with the surface of substrate 11, ensure that package edge region has good packaging effect.The present invention is implemented
The packaging method of example, it is no longer necessary to carry out second for fringe region and press, reduce the packaging technology time of encapsulating structure
And cost.It is pressed due to no longer needing to carry out second for fringe region, thus can be to avoid encapsulation cover plate 30 at edge
Deformation occurs and causes bigger stress in region, so that encapsulating structure is stronger, while reducing the essence to press equipment
Degree requires.
In the present embodiment, the thickness H1 of the dottle pin layer 23 of formation is 10 μm~30 μm, and the thickness H3 of barrier layer 22 is 10 μ
M~30 μm.
Material, the material of barrier layer 22 of dottle pin layer 23 in the present embodiment are identical with first embodiment, herein not
It repeats again.In the present embodiment, as shown in figure 9b, in the circumferential direction of dottle pin layer 23, the wall thickness of dottle pin layer 23 is equal, is scheming
In 9b, W1=W2.It is easily understood that the wall thickness of dottle pin layer 23 can be set according to actual needs, if actual needs, W1
W2 can be not equal to.It can also be seen that the outer surface of dottle pin layer 23 is concordant with the outer surface of barrier layer 22 from Fig. 9 b.
In the present embodiment, preparing package substrate 40 including preparation sheet glue film and covering plate structure layer, sheet glue film includes
Barrier layer 22 and bonding buffer layer 21, covering plate structure layer includes encapsulation cover plate 30 and dottle pin layer 23.
Figure 11 is the preparation flow schematic diagram of sheet glue film in third embodiment of the invention.Referring to Fig.1 1, prepare sheet glue
The process of film is described as follows:
Barrier layer 22 is formed on the first protective film 61, specific as follows: winding is provided with the first protection on the first idler wheel 51
Film 61, the material of the first protective film 61 can be PET (polyethylene terephthalate), PEN (polyethylene naphthalate),
PI (polyimides) or PC (polycarbonate).The side of second idler wheel 52 is provided with apparatus for coating 71, the spray of apparatus for coating 71
Gap is maintained between mouth and the second idler wheel 52 (gap is 0.01mm~1mm).Under the rolling action of idler wheel, the first protection
Film 61 is transmitted on the second idler wheel 52 from the first idler wheel 51, and the even spread on the first protective film 61 of apparatus for coating 71 forms barrier
Layer 22, as figure 12 a shows, Figure 12 a are that the structural schematic diagram after barrier layer is formed in third embodiment of the invention.Barrier layer 22
Basic material is inorganic matter, doped with hygroscopicity particle in barrier layer 22, for example, alkali metal oxide particle.Hygroscopicity particle
Object is preferably CaO.
Precuring is carried out to barrier layer 22, specifically, the first protective film 61 carries barrier layer 22 and enters oven progress
Dry and precuring.
Winding is provided with bonding buffering layer coiled material on 4th idler wheel 54, and the bonding in the present embodiment buffers layer coiled material and first
Embodiment is identical, and details are not described herein.
First protective film 61 of the barrier layer 22 after carrying precuring is sent into pressing with bonding buffer layer glue material simultaneously to set
It is standby, hot pressing fitting is carried out on press equipment, forms the sheet glue film such as Figure 12 b and Figure 12 c shown in, and Figure 12 b is of the invention the
The structural schematic diagram of sheet glue film in three embodiments, Figure 12 c are the section B-B structural schematic diagram in Figure 12 b.Sheet glue film includes
Barrier layer 22 and bonding buffer layer 21 between the first protective film 61 and the second protective film 62, bonding buffer layer 21 are located at resistance
In region where interlayer 22.
In the present embodiment, as shown in fig. 12 c, the first protective film 61 is light release film, and the second protective film 62 is attached most importance to release
Film, that is to say, that the cohesive force between the first protective film 61 and sheet glue film is less than between the second protective film 62 and sheet glue film
Cohesive force, thus, facilitate and remove the first protective film 61 from sheet glue film.
Figure 13 is the preparation flow schematic diagram of third embodiment of the invention cover plate structure sheaf, referring to Fig.1 3, prepare cover board
The process of structure sheaf is described as follows:
Dottle pin layer 23 is formed on encapsulation cover plate 30, and dottle pin is specifically formed on encapsulation cover plate 30 by transfer printing process
Layer 23, as shown in figure 14.Figure 14 is the structural schematic diagram of third embodiment of the invention cover plate structure sheaf, and dottle pin layer 23 has interior
Perimeter 231 and outer perimeter 232.In the present embodiment, the boundary of dottle pin layer 23 is in quadrangle.The thickness H1 of dottle pin layer 23 with
The thickness H2 for bonding buffer layer 21 is equal.
Package substrate 40 is prepared, specifically, the first protective film 61 is removed from sheet glue film, and will be with the second protection
The sheet glue film of film 62 is attached on covering plate structure layer, so that barrier layer 22 covers dottle pin layer 23 and inner circumferential boundary 231 is enclosed and set
Region, bonding buffer layer 21 is located at inner circumferential boundary 231 and encloses in the region set, then, remove the second protective film 62, formed such as figure
Package substrate shown in 9a.
Figure 12 a~Figure 14 is for the schematic diagram that the present invention will be described in detail, does not represent actual size size.
Fourth embodiment:
Fourth embodiment of the invention proposes a kind of encapsulating structure, as shown in Figure 10.The encapsulating structure is implemented using third
The packaging method of example is prepared, which includes the device substrate 10 and package substrate 40 of opposite pressing.Device substrate
10 include substrate 11, the luminescent device 12 being arranged in substrate 11 and the passivation layer 13 for covering 12 outer surface of luminescent device.Envelope
Dress substrate includes encapsulation cover plate and is arranged on the encapsulation cover plate 30 and the encapsulating structure layer comprising dottle pin layer, and dottle pin layer 23 is used
In make the side surface away from encapsulation cover plate 30 of encapsulating structure layer in flat surfaces.Encapsulating structure layer deviates from the encapsulation
One side surface of cover board is bonded with the surface of the substrate.
In the present embodiment, as shown in Figure 10, encapsulating structure layer includes dottle pin layer 23, barrier layer 22 and bonding buffer layer
21.Wherein, dottle pin layer 23 be arranged in encapsulation cover plate 30 towards on the side of device substrate 10, dottle pin layer 23 has inner circumferential boundary
231 and outer perimeter 232.Barrier layer 22 be arranged in dottle pin layer 23 towards on the side of device substrate 10, barrier layer 22 is sealing
Orthographic projection on capping plate 20 includes that the region set is enclosed on the region at 23 place of dottle pin layer and inner circumferential boundary 231.Bond buffer layer
21 be arranged in barrier layer 22 towards on the side of device substrate 10, bonding buffer layer 21 is located at inner circumferential boundary 231 and encloses the area set
In domain, the thickness H1 of dottle pin layer 23 is equal with the bonding thickness H2 of buffer layer 21.Bond buffer layer 21 towards device substrate 10
A side surface be bonded with the surface of substrate 11, a side surface towards device substrate 10 for barrier layer 22 and the surface of substrate 11
Fitting.
In the present embodiment, the thickness H1 of the dottle pin layer 23 of formation is 10 μm~30 μm, and the thickness H3 of barrier layer 22 is 10 μ
M~30 μm.
Material, the material of barrier layer 22 of dottle pin layer 23 in the present embodiment are identical with first embodiment, herein not
It repeats again.In the present embodiment, as shown in figure 9b, in the circumferential direction of dottle pin layer 23, the wall thickness of dottle pin layer 23 is equal, is scheming
In 9b, W1=W2.It is easily understood that the wall thickness of dottle pin layer 23 can be set according to actual needs, if actual needs, W1
W2 can be not equal to.It can also be seen that the outer surface of dottle pin layer 23 is concordant with the outer surface of barrier layer 22 from Fig. 9 b.
5th embodiment:
Inventive concept based on previous embodiment, the embodiment of the invention also provides a kind of display device, the display devices
Including the encapsulating structure using previous embodiment.Display device can be with are as follows: mobile phone, tablet computer, television set, display, notes
Any products or components having a display function such as this computer, Digital Frame, navigator.
In the description of the embodiment of the present invention, it is to be understood that term " middle part ", "upper", "lower", "top", "bottom",
The orientation or positional relationship of the instructions such as "inner", "outside" is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of retouching
It states the present invention and simplifies description, rather than the device or element of indication or suggestion meaning must have a particular orientation, with specific
Orientation construction and operation, therefore be not considered as limiting the invention.
Although disclosed herein embodiment it is as above, the content only for ease of understanding the present invention and use
Embodiment is not intended to limit the invention.Technical staff in any fields of the present invention is taken off not departing from the present invention
Under the premise of the spirit and scope of dew, any modification and variation, but the present invention can be carried out in the form and details of implementation
Scope of patent protection, still should be subject to the scope of the claims as defined in the appended claims.
Claims (15)
1. a kind of packaging method of luminescent device, which is characterized in that the described method includes:
Device substrate and package substrate are prepared, the device substrate includes the photophore of substrate and setting on the substrate
Part；The package substrate includes encapsulation cover plate and is arranged on the encapsulation cover plate and the encapsulating structure layer comprising dottle pin layer, institute
Dottle pin layer is stated for so that the side surface away from the encapsulation cover plate of the encapsulating structure layer is in flat surfaces；
The package substrate and the device substrate opposite direction are pressed, the encapsulating structure layer away from the one of the encapsulation cover plate
Side surface is bonded with the surface of the substrate.
2. packaging method according to claim 1, which is characterized in that the package substrate for preparing includes,
Encapsulating structure layer is prepared, the encapsulating structure layer includes the barrier layer being arranged on the encapsulation cover plate, is arranged described
Bonding buffer layer on barrier layer, orthographic projection of the bonding buffer layer on the encapsulation cover plate are located at the barrier layer in institute
It states in the orthographic projection on encapsulation cover plate, the dottle pin layer is arranged on the barrier layer around the periphery of the barrier layer, described
The height of dottle pin layer is equal with the height of the barrier layer；
The encapsulating structure layer is attached on the encapsulation cover plate so that the barrier layer away from the bonding buffer layer
Side is towards the encapsulation cover plate.
3. packaging method according to claim 2, which is characterized in that the encapsulating structure layer for preparing includes:
Prepare packaging adhesive film and preparation bonding buffering layer coiled material, prepare packaging adhesive film include: on the first protective film formed described in
Barrier layer；The dottle pin layer is formed on the barrier layer, the dottle pin layer has inner circumferential boundary and outer perimeter；The bonding
Buffering layer coiled material includes that be arranged on the second protective film and enclose with the inner circumferential boundary of the dottle pin layer region that sets corresponding
Buffer layer is bonded, the thickness of the bonding buffer layer is equal with the thickness of the barrier layer；
By the packaging adhesive film and bonding buffering layer coiled material opposite direction pressing, is formed and be located at the first protective film and the second protective film
Between encapsulating structure layer, the bonding buffer layer is located at the inner circumferential boundary of the dottle pin layer and encloses in the region set.
4. packaging method according to claim 1, which is characterized in that the package substrate for preparing includes preparing covering plate structure
Layer and preparation sheet glue film,
Preparing covering plate structure layer includes, and dottle pin layer is formed on the encapsulation cover plate, the dottle pin layer is with inner circumferential boundary and outside
Perimeter；The sheet glue film includes barrier layer and the bonding buffer layer that is arranged on the barrier layer, the bonding buffer layer
Thickness it is equal with the thickness of the dottle pin layer, the region set is enclosed on the bonding buffer layer and the inner circumferential boundary of the dottle pin layer
It is corresponding；
The sheet glue film is attached on the covering plate structure layer so that the barrier layer away from the bonding buffer layer
Side is towards the covering plate structure layer, and the barrier layer covers the dottle pin layer and the region set is enclosed on the inner circumferential boundary,
The bonding buffer layer is located at the inner circumferential boundary and encloses in the region set.
5. packaging method according to claim 4, which is characterized in that the preparation sheet glue film includes:
Barrier layer is formed on the first protective film；
On the second protective film formed bonding buffer layer, it is described bonding buffer layer thickness with it is described equal every cushion thickness；
First protective film and the second protective film opposite direction are pressed, the sheet between the first protective film and the second protective film is formed
Glue film.
6. packaging method according to claim 2 or 4, which is characterized in that the outer perimeter and barrier layer of the dottle pin layer
Outer boundaries it is concordant.
7. packaging method according to claim 2 or 4, which is characterized in that the material of the dottle pin layer and the barrier layer
It is identical, doped with hygroscopicity particle in the material of the dottle pin layer and the barrier layer.
8. packaging method according to claim 2 or 4, which is characterized in that the dottle pin layer with a thickness of 10 μm~30 μm,
The barrier layer with a thickness of 10 μm~30 μm.
9. a kind of encapsulating structure of luminescent device, which is characterized in that device substrate and package substrate including opposite direction pressing,
Device substrate, the luminescent device including substrate and setting on the substrate；
Package substrate including encapsulation cover plate and is arranged on the encapsulation cover plate and the encapsulating structure layer comprising dottle pin layer, described
Dottle pin layer is used for so that the side surface away from the encapsulation cover plate of the encapsulating structure layer is in flat surfaces, and the encapsulation is tied
The side surface away from the encapsulation cover plate of structure layer is bonded with the surface of the substrate.
10. encapsulating structure according to claim 9, which is characterized in that the encapsulating structure layer further includes being arranged described
Barrier layer on encapsulation cover plate and the bonding buffer layer being arranged on the barrier layer, the bonding buffer layer is in the cap
Orthographic projection on plate is located at the barrier layer in the orthographic projection on the encapsulation cover plate, and the dottle pin layer is slow around the bonding
The periphery for rushing layer is arranged on the barrier layer, and the height of the dottle pin layer is equal with the bonding height of buffer layer.
11. encapsulating structure according to claim 9, which is characterized in that the dottle pin layer is arranged on the encapsulation cover plate,
The dottle pin layer has inner circumferential boundary and outer perimeter, and the encapsulating structure layer further includes barrier layer and bonds buffer layer, described
The region that on the dottle pin layer and the barrier layer covers the dottle pin layer and the inner circumferential bounded is set, institute is arranged in barrier layer
Bonding buffer layer is stated to be arranged on the barrier layer and the bonding buffer layer is located in the region that the inner circumferential bounded is set, institute
The thickness for stating bonding buffer layer is equal with the thickness of the dottle pin layer.
12. encapsulating structure described in 0 or 11 according to claim 1, which is characterized in that the outer perimeter and barrier of the dottle pin layer
The outer boundaries of layer are concordant.
13. encapsulating structure described in 0 or 11 according to claim 1, which is characterized in that the material of the dottle pin layer and the barrier layer
Matter is identical, doped with hygroscopicity particle in the material of the dottle pin layer and the barrier layer.
14. encapsulating structure described in 0 or 11 according to claim 1, which is characterized in that the dottle pin layer with a thickness of 10 μm~30
μm, the barrier layer with a thickness of 10 μm~30 μm.
15. a kind of display device, which is characterized in that including using encapsulating structure described in any one of claim 9~14.
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| CN112786802A (en) * | 2020-12-23 | 2021-05-11 | 乐金显示光电科技(中国)有限公司 | Display device packaging structure and manufacturing method of packaging plate |
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