CN113625500A - Electronic paper packaging structure - Google Patents
Electronic paper packaging structure Download PDFInfo
- Publication number
- CN113625500A CN113625500A CN202010314411.3A CN202010314411A CN113625500A CN 113625500 A CN113625500 A CN 113625500A CN 202010314411 A CN202010314411 A CN 202010314411A CN 113625500 A CN113625500 A CN 113625500A
- Authority
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- China
- Prior art keywords
- cover plate
- ink layer
- electronic ink
- substrate
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 51
- 230000004888 barrier function Effects 0.000 claims abstract description 42
- 239000010410 layer Substances 0.000 claims description 76
- 239000012790 adhesive layer Substances 0.000 claims description 25
- 239000000565 sealant Substances 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 8
- 239000010408 film Substances 0.000 description 19
- 239000003094 microcapsule Substances 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- QBYJBZPUGVGKQQ-SJJAEHHWSA-N aldrin Chemical compound C1[C@H]2C=C[C@@H]1[C@H]1[C@@](C3(Cl)Cl)(Cl)C(Cl)=C(Cl)[C@@]3(Cl)[C@H]12 QBYJBZPUGVGKQQ-SJJAEHHWSA-N 0.000 description 2
- 229910003481 amorphous carbon Inorganic materials 0.000 description 2
- 239000008393 encapsulating agent Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- 229910001928 zirconium oxide Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/165—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field
- G02F1/166—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field characterised by the electro-optical or magneto-optical effect
- G02F1/167—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field characterised by the electro-optical or magneto-optical effect by electrophoresis
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/165—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field
- G02F1/1675—Constructional details
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/165—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field
- G02F1/1675—Constructional details
- G02F1/16753—Structures for supporting or mounting cells, e.g. frames or bezels
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/165—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field
- G02F1/1675—Constructional details
- G02F1/1679—Gaskets; Spacers; Sealing of cells; Filling or closing of cells
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Molecular Biology (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Laminated Bodies (AREA)
- Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention discloses an electronic paper packaging structure which comprises a substrate, an electronic ink layer, a cover plate, a moisture barrier film and an adhesion layer. The electronic ink layer is arranged on the substrate. The cover plate covers the electronic ink layer. The substrate and the electronic ink layer are covered by the water-vapor barrier film. The adhesion layer is directly jointed between the cover plate and the water-air barrier film to seal the substrate and the electronic ink layer, and the adhesion layer is not jointed between the cover plate and the electronic ink layer.
Description
Technical Field
The present invention relates to an electronic device package structure, and more particularly, to an electronic paper package structure.
Background
With the progress of flat panel display technology, more and more electronic products are equipped with display devices, especially portable electronic products such as mobile phones, electronic books, digital cameras, etc. Since the portable electronic products are developed towards the trend of light weight, small volume and thin thickness, the display devices applied to the portable electronic products also have the advantages of light weight, small volume and thin thickness.
In order to promote paperless, an electronic billboard, such as an electrophoretic display (EPD) or an Electronic Paper Display (EPD), may replace a conventional printed billboard, which is not only light and thin, but also designed to be flexible.
However, the package structure of the electrophoretic display device or the electronic paper display device has to perform two barrier film lamination steps, which results in high cost and poor moisture barrier capability.
Disclosure of Invention
The invention aims to provide an electronic paper packaging structure which can save cost and improve the water vapor barrier capability.
According to an aspect of the present invention, an electronic paper package structure is provided, which includes a substrate, an electronic ink layer, a cover plate, a moisture barrier film, and an adhesive layer. The electronic ink layer is arranged on the substrate. The cover plate covers the electronic ink layer. The substrate and the electronic ink layer are covered by the water-vapor barrier film. The adhesion layer is directly jointed between the cover plate and the water-air barrier film to seal the substrate and the electronic ink layer, and the adhesion layer is not jointed between the cover plate and the electronic ink layer.
Wherein, the cover plate comprises a transparent substrate and a light-transmitting water vapor barrier layer.
The cover plate comprises a display area and a non-display area, the display area correspondingly displays the electronic ink layer, and the non-display area is correspondingly connected with the adhesion layer.
The side surface of the electronic ink layer is separated from the side surface of the cover plate by a second distance, wherein the second distance is greater than the first distance.
The substrate comprises an outgoing part extending out of the cover plate, the electronic ink layer is positioned between the substrate and the cover plate, and a groove is defined on a lower surface of the cover plate, a side surface of the electronic ink layer and an upper surface of the outgoing part.
Wherein, it further comprises a sealing compound filled in the groove.
Wherein, the adhesion layer is not jointed between the cover plate and the wire outlet part.
According to an aspect of the present invention, an electronic paper package structure is provided, which includes a substrate, an electronic ink layer, a cover plate, a moisture barrier film, an adhesive layer, and a sealant. The substrate comprises an outgoing part. The electronic ink layer is arranged on the substrate. The cover plate covers the electronic ink layer. The substrate and the electronic ink layer are covered by the water-vapor barrier film. The adhesive layer is directly jointed between the cover plate and the water-air barrier film, the wire outlet part extends out of the cover plate, the electronic ink layer is positioned between the substrate and the cover plate, and a groove is defined on the lower surface of the cover plate, one side surface of the electronic ink layer and one upper surface of the wire outlet part. The sealing compound is filled in the groove.
Wherein, the adhesion layer is not jointed between the cover plate and the electronic ink layer.
Wherein, the adhesion layer is not jointed between the cover plate and the wire outlet part.
Wherein, the cover plate comprises a transparent substrate and a light-transmitting water vapor barrier layer.
The cover plate comprises a display area and a non-display area, the display area correspondingly displays the electronic ink layer, and the non-display area is correspondingly connected with the adhesion layer.
In order to better understand the above and other aspects of the present invention, the following detailed description is given with reference to the accompanying drawings, but not by way of limitation:
drawings
FIG. 1 is a schematic top view illustrating an electronic paper package according to an embodiment of the invention;
FIG. 2 is a schematic view of an electronic paper package structure according to an embodiment of the invention in a cross-section A-A; and
FIG. 3 is a schematic diagram illustrating an electronic paper package structure according to an embodiment of the invention in a cross-section B-B.
Wherein, the reference numbers:
100 electronic paper packaging structure
110 base plate
1101 side surface
1102 upper surface
1103, a wire outlet part
111: groove
112 electronic ink layer
1121 side surface
113 transparent electrode layer
114 cover plate
114a transparent substrate
114b light-transmitting moisture barrier layer
1141 side surface
1142 lower surface
116 moisture barrier film
117 adhesive layer
118 sealing compound
D1 display area
D2 non-display area
Detailed Description
The following embodiments are provided for illustrative purposes only and are not intended to limit the scope of the present invention. The following description will be given with the same/similar reference numerals as used for the same/similar elements. Directional terms as referred to in the following examples, for example: up, down, left, right, front or rear, etc., are referred to only in the direction of the attached drawings. Accordingly, the directional terminology is used for purposes of illustration and is in no way limiting.
According to an embodiment of the present invention, an electronic paper package structure is provided, which includes a moisture barrier film bonded to a cover plate by a single adhesive layer, so as to increase the moisture barrier capability of the electronic paper package structure and reduce the cost. In one embodiment, the Water Vapor barrier capability is differentiated by the value of the Water Vapor Transmission Rate (WVTR). Preferably, the WVTR is less than 2-5 g/m at a temperature of 60 ℃ and a humidity of 90%2A day, or less than 1g/m2A day, or less than 0.5g/m2A day, or less than 0.1g/m2A day, or even less than 0.01g/m2The day is.
Referring to fig. 1 to 3, wherein fig. 1 is a schematic top view of an electronic paper package structure 100 according to an embodiment of the invention, fig. 2 is a schematic diagram of the electronic paper package structure 100 according to an embodiment of the invention in a cross section a-a, and fig. 3 is a schematic diagram of the electronic paper package structure 100 according to an embodiment of the invention in a cross section B-B.
In one embodiment, the electronic paper packaging structure 100 may include a substrate 110, an electronic ink layer 112, a cover plate 114, a moisture barrier film 116, an adhesive layer 117, and a molding compound 118.
The substrate 110 is, for example, a transparent glass or plastic substrate or an opaque substrate, and the upper surface 1102 of the substrate 110 is configured with a thin film transistor array (TFT array) or conductive graphite as a lower electrode plate. The cover plate 114 may include a transparent substrate 114a and a light-transmissive moisture barrier layer 114b, wherein the transparent substrate 114a is, for example, plastic or glass, and the material thereof may include a polymer plastic material such as polyethylene terephthalate (PET), Polystyrene (PS), Polycarbonate (PC), and the like. The material of the transparent moisture barrier layer 114b may be at least one of aluminum oxide (AlOx), silicon oxide, silicon nitride, titanium oxide, zirconium oxide, aluminum oxynitride, silicon oxynitride, and amorphous carbon. The moisture barrier ability of the light transmissive moisture barrier layer 114b is greater than that of the transparent substrate 114 a. In addition, the bottom surface 1142 of the cover plate 114 is provided with a transparent electrode layer 113, such as Indium Tin Oxide (ITO), as an upper electrode plate.
The electronic ink layer 112 is disposed on the substrate 110, and the electronic ink layer 112 is located between the substrate 110 and the cover plate 114. The electronic ink layer 112 may, for example, include millions of microcapsules (microcapsules) each containing electrophoretic particles, wherein the electrophoretic particles are negatively charged white and positively charged black particles suspended in a transparent liquid. When the electric field between the substrate 110 and the cover plate 114 is turned on, the electrophoretic particles move to the top of the microcapsule by the principle that the positive and negative charges attract each other, and a user can see the white or black particles on the corresponding block, thereby displaying a pixel pattern. In addition, the electronic ink layer 112 may also be a three-color or multi-color electronic ink layer to realize a full-color domain display effect, but the invention is not limited thereto. In addition, the electronic ink layer 112 may be a microcapsule (microcapsules) type electronic ink layer or a microcup type electronic ink layer.
In one embodiment, the moisture barrier film 116 is used to cover the substrate 110 and the electronic ink layer 112, so that the substrate 110 and the electronic ink layer 112 are sealed between the cover plate 114 and the moisture barrier film 116. In addition, the adhesive layer 117 is directly bonded between the cover plate 114 and the moisture barrier film 116, so as to reduce the moisture of the external environment entering through the adhesive layer 117, thereby increasing the moisture barrier capability of the electronic paper packaging structure 100. In one embodiment, the thickness of the adhesive layer 117 is about 25 μm, which is increased by 2 times (about 50 μm) compared to the conventional method of bonding two barrier films by using a double adhesive layer, so that more moisture in the external environment can enter through the double adhesive layer. Therefore, in the embodiment, the single adhesive layer 117 is directly bonded between the cover plate 114 and the moisture barrier film 116, which can save the cost and increase the moisture barrier capability of the electronic paper packaging structure 100.
In addition, in the embodiment, the single adhesive layer 117 is directly bonded between the cover plate 114 and the moisture barrier film 116, so the adhesive layer 117 is not bonded between the cover plate 114 and the electronic ink layer 112.
The moisture barrier film 116 includes a polymer such as epoxy resin, Polyurethane (PU), silica gel, or aluminum foil, or at least one material selected from aluminum oxide (AlOx), silicon oxide, silicon nitride, titanium oxide, zirconium oxide, aluminum oxynitride, silicon oxynitride, and amorphous carbon. In one embodiment, the moisture barrier film 116 covers the periphery of the substrate 110 and the electronic ink layer 112, wherein the electronic ink layer 112 is correspondingly displayed in a display area D1 of the cover plate 114, and the adhesive layer 117 is correspondingly bonded to a non-display area D2 of the cover plate 114.
In addition, referring to fig. 2, the side surface 1121 of the electronic ink layer 112 is substantially aligned with the side surface 1101 of the substrate 110 or the side surface 1101 of the substrate 110 protrudes a first distance relative to the side surface 1121 of the electronic ink layer 112, and the side surface 1121 of the electronic ink layer 112 is spaced a second distance (i.e., the width of the non-display area D2, for example, 2mm) relative to the side surface 1141 of the cover plate 114, wherein the second distance is greater than the first distance, so that the electronic ink layer 112 is hidden between the substrate 110 and the cover plate 114 to increase the moisture blocking distance and prevent the electronic ink layer 112 from being affected by moisture penetration of the external environment.
Referring to fig. 1 and 3, the substrate 110 may include a wire outlet portion 1103 for inputting/outputting a signal. The wire outlet portion 1103 extends out of the cover plate 114, and a lower surface 1142 of the cover plate 114, a side surface 1121 of the electronic ink layer 112, and an upper surface 1102 of the wire outlet portion 1103 define a groove 111. In the present embodiment, the encapsulant 118 can be filled in the recess 111 to prevent the electronic ink layer 112 from being affected by moisture penetration of the external environment. The molding compound 118 can be a thermoplastic, thermosetting, ultraviolet-curable, or room temperature-curable polymer curing compound, but the invention is not limited thereto.
In addition, since the encapsulant 118 is already sealed between the outgoing line portion 1103 of the substrate 110 and the cover plate 114, the adhesive layer 117 is not required to be bonded between the substrate 110 and the cover plate 114, so as to reduce the amount of the adhesive layer 117.
According to the electronic paper packaging structure disclosed by the embodiment of the invention, only one step of attaching the water-air-resistance diaphragm is needed, the manufacturing process is simplified, and the cost is lower. In addition, since the thickness of the adhesive layer is thin (e.g., less than 25 μm) and the gap between the cover plate and the moisture barrier film is small (e.g., less than 25 μm), moisture in the external environment is less likely to enter through the adhesive layer, thereby increasing the moisture barrier capability of the electronic paper package structure.
In summary, although the present invention has been described with reference to the above embodiments, the present invention is not limited thereto. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the protection scope of the present invention should be determined by the appended claims.
The present invention is capable of other embodiments, and various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (12)
1. An electronic paper packaging structure, comprising:
a substrate;
an electronic ink layer disposed on the substrate;
a cover plate covering the electronic ink layer;
a moisture barrier film covering the substrate and the electronic ink layer; and
and the adhesion layer is directly jointed between the cover plate and the water-gas barrier film to seal the substrate and the electronic ink layer, and the adhesion layer is not jointed between the cover plate and the electronic ink layer.
2. The electronic paper packaging structure of claim 1, wherein the cover plate comprises a transparent substrate and a light-transmissive moisture barrier layer.
3. The electronic paper packaging structure of claim 1, wherein the cover plate comprises a display area and a non-display area, the display area correspondingly displays the electronic ink layer, and the non-display area correspondingly engages the adhesive layer.
4. The electronic paper packaging structure of claim 1, wherein a side surface of the substrate protrudes a first distance relative to a side surface of the electronic ink layer, and the side surface of the electronic ink layer is spaced a second distance relative to a side surface of the cover plate, wherein the second distance is greater than the first distance.
5. The electronic paper packaging structure of claim 1, wherein the substrate includes an outlet portion extending outside the cover plate, the electronic ink layer is located between the substrate and the cover plate, and a lower surface of the cover plate, a side surface of the electronic ink layer, and an upper surface of the outlet portion define a groove.
6. The electronic paper package structure of claim 5, further comprising a sealant filled in the recess.
7. The electronic paper packaging structure of claim 5, wherein the adhesive layer is not bonded between the cover plate and the wire outlet portion.
8. An electronic paper packaging structure, comprising:
a substrate including an outlet portion;
an electronic ink layer disposed on the substrate;
a cover plate covering the electronic ink layer;
a moisture barrier film covering the substrate and the electronic ink layer;
an adhesive layer directly bonded between the cover plate and the water-gas barrier film, wherein the wire outlet part extends out of the cover plate, the electronic ink layer is positioned between the substrate and the cover plate, and a groove is defined on a lower surface of the cover plate, a side surface of the electronic ink layer and an upper surface of the wire outlet part; and
a sealant filled in the groove.
9. The electronic paper packaging structure of claim 8, wherein the adhesive layer is not bonded between the cover plate and the electronic ink layer.
10. The electronic paper packaging structure of claim 8, wherein the adhesive layer is not bonded between the cover plate and the wire outlet portion.
11. The electronic paper packaging structure of claim 8, wherein the cover plate comprises a transparent substrate and a light-transmissive moisture barrier layer.
12. The electronic paper packaging structure of claim 8, wherein the cover plate comprises a display area and a non-display area, the display area correspondingly displays the electronic ink layer, and the non-display area correspondingly engages the adhesive layer.
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CN202010314411.3A CN113625500B (en) | 2020-04-21 | 2020-04-21 | Electronic paper packaging structure |
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CN202010314411.3A CN113625500B (en) | 2020-04-21 | 2020-04-21 | Electronic paper packaging structure |
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CN113625500B CN113625500B (en) | 2024-04-16 |
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Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005114820A (en) * | 2003-10-03 | 2005-04-28 | Toppan Printing Co Ltd | Microcapsule type electrophoresis display panel and its manufacturing method |
CN1617636A (en) * | 2003-11-12 | 2005-05-18 | 铼宝科技股份有限公司 | Organic luminous panel with hydrophobic layer |
US20070152956A1 (en) * | 2002-06-10 | 2007-07-05 | E Ink Corporation | Electro-optic display with edge seal |
CN101154010A (en) * | 2006-09-29 | 2008-04-02 | 启萌科技有限公司 | Electronic paper device |
US20100311490A1 (en) * | 2009-06-08 | 2010-12-09 | Miller Mark A | Portable electronic charge device for card devices |
US20110195258A1 (en) * | 2010-02-11 | 2011-08-11 | National Chiao Tung University | Microencapsulated liquid device and method for making the same |
CN103246121A (en) * | 2012-02-07 | 2013-08-14 | 元太科技工业股份有限公司 | Electronic ink display device |
CN103365022A (en) * | 2012-03-27 | 2013-10-23 | 元太科技工业股份有限公司 | Electronic ink display device and manufacturing method thereof |
CN103887449A (en) * | 2013-12-16 | 2014-06-25 | 友达光电股份有限公司 | Organic light emitting device and method of fabricating the same |
CN105609655A (en) * | 2015-12-28 | 2016-05-25 | 天马微电子股份有限公司 | Organic light emitting display panel and manufacturing method thereof |
CN205982946U (en) * | 2016-08-29 | 2017-02-22 | 深圳晶华显示器材有限公司 | Electron paper segment encode display device with double glazing structure |
CN206311871U (en) * | 2017-01-04 | 2017-07-07 | 京东方科技集团股份有限公司 | A kind of display device of electronic paper |
CN109616588A (en) * | 2018-12-06 | 2019-04-12 | 合肥鑫晟光电科技有限公司 | A kind of encapsulating structure of luminescent device, packaging method and display device |
-
2020
- 2020-04-21 CN CN202010314411.3A patent/CN113625500B/en active Active
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070152956A1 (en) * | 2002-06-10 | 2007-07-05 | E Ink Corporation | Electro-optic display with edge seal |
JP2005114820A (en) * | 2003-10-03 | 2005-04-28 | Toppan Printing Co Ltd | Microcapsule type electrophoresis display panel and its manufacturing method |
CN1617636A (en) * | 2003-11-12 | 2005-05-18 | 铼宝科技股份有限公司 | Organic luminous panel with hydrophobic layer |
CN101154010A (en) * | 2006-09-29 | 2008-04-02 | 启萌科技有限公司 | Electronic paper device |
US20100311490A1 (en) * | 2009-06-08 | 2010-12-09 | Miller Mark A | Portable electronic charge device for card devices |
US20110195258A1 (en) * | 2010-02-11 | 2011-08-11 | National Chiao Tung University | Microencapsulated liquid device and method for making the same |
CN103246121A (en) * | 2012-02-07 | 2013-08-14 | 元太科技工业股份有限公司 | Electronic ink display device |
CN103365022A (en) * | 2012-03-27 | 2013-10-23 | 元太科技工业股份有限公司 | Electronic ink display device and manufacturing method thereof |
CN103887449A (en) * | 2013-12-16 | 2014-06-25 | 友达光电股份有限公司 | Organic light emitting device and method of fabricating the same |
CN105609655A (en) * | 2015-12-28 | 2016-05-25 | 天马微电子股份有限公司 | Organic light emitting display panel and manufacturing method thereof |
CN205982946U (en) * | 2016-08-29 | 2017-02-22 | 深圳晶华显示器材有限公司 | Electron paper segment encode display device with double glazing structure |
CN206311871U (en) * | 2017-01-04 | 2017-07-07 | 京东方科技集团股份有限公司 | A kind of display device of electronic paper |
CN109616588A (en) * | 2018-12-06 | 2019-04-12 | 合肥鑫晟光电科技有限公司 | A kind of encapsulating structure of luminescent device, packaging method and display device |
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