CN203415629U - Packaging element, array substrate and display device - Google Patents
Packaging element, array substrate and display device Download PDFInfo
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- CN203415629U CN203415629U CN201320364975.3U CN201320364975U CN203415629U CN 203415629 U CN203415629 U CN 203415629U CN 201320364975 U CN201320364975 U CN 201320364975U CN 203415629 U CN203415629 U CN 203415629U
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- potted element
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Abstract
The utility model provides a packaging element, an array substrate and a display device. The packaging element is used for packaging an OLED device arranged on a substrate. The packaging element comprises a cover plate with a shape the same to that of the top surface of the OLED device and a sealing unit arranged on the cover plate face. The sealing unit is used for integrating with the OLED device and sealing the OLED device. The packaging element makes the OLED device packaged through the sealing unit arranged on the cover plate face. Water and oxygen can be effectively prevented from entering the OLED device. The OLED device is well protected. The packaged OLED device has a longer service lifetime. The array substrate and the display device provided by the utility model achieve longer service lifetimes by adopting the packaging element for a packaging purpose.
Description
Technical field
The utility model relates to Display Technique field, particularly, relates to a kind of potted element, array base palte and display unit.
Background technology
Fast development along with Display Technique, OLED device (Organic Light Emitting Diode: organic electroluminescence device) more and more highlight its advantage, because it has that technique is simple, cost is low, driving voltage is low, luminous efficiency is high, serviceability temperature wide ranges, can flexiblely show, can the panchromatic demonstration of large area etc. plurality of advantages, and be considered to the display device of tool potentiality.But the industrialization of OLED device also faces very large challenge, the useful life of OLED device is shorter is a problem of wherein comparatively giving prominence to.
Due to OLED device sealing is not sternly caused to its internal material and contacting of water and oxygen, be the main cause that makes the decline in useful life of OLED device, therefore how OLED device being carried out to effectively encapsulation is the key of dealing with problems.
At present, OLED device mainly contains two kinds of method for packing: one. the encapsulation of glass back cover formula, two. and thin-film package.
Glass back cover formula method for packing is fairly simple, and its encapsulating structure as shown in Figure 1.First on glass back cover plate 11, apply UV packaging plastic 9, then the substrate 8 that is provided with OLED device 7 is carried out box with glass back cover plate 11, after UV exposure, by UV packaging plastic, airborne water and oxygen are completely cut off and opened with OLED device 7.In encapsulation process, generally also need the drier 10 of making specially (large multiplex film drying agent now) to be arranged in the space that 11 pairs of box-likes of substrate 8 and glass back cover plate become, be used for absorbing residual moisture content.The advantage of this method for packing is: heat conductivity is good, hydrone obstructing capacity is strong, stable chemical performance, anti-oxidant, electric insulation; Shortcoming is: lax porous after UV packaging plastic solidifies, and water and oxygen are easier to pass through from hole; And built-in drier, once expand after water suction, easily cause the distortion of OLED device, thereby further aggravate the damage of OLED device.
In film encapsulation method, the general inorganic thin film layer (being also inorganic barrier layer) with higher water proof ability that adopts is made water blocking layer.But, in generating the process of inorganic thin film layer, can inevitably occur as pin hole, defects i.e.cracks, the existence of these defects greatly reduces the water-resisting ability of inorganic thin film layer.In addition, too much or blocked up inorganic thin film layer can produce larger internal stress, has a strong impact on package quality.
Research shows, adopts the multi-layer intercrossed method for packing of organic thin film layer (being also organic barrier layer or organic flatness layer) and inorganic thin film layer can reduce the defect of inorganic thin film layer and reduce stress.The multi-layer intercrossed thin-film packing structure of typical organic thin film layer (being organic barrier layer 4) and inorganic thin film layer (being inorganic barrier layer 5) as shown in Figure 2, this method for packing can reduce the transmitance of water and oxygen greatly, thereby can improve to a certain extent the useful life of OLED device.And thin-film package do not need back shroud and packaging plastic, can obviously reduce the thickness of device.But the quality of thin-film package quality and organic thin film layer have very large relation, and because thin-film package need to be made plural layers, technique is comparatively complicated, and cost of manufacture is high; Meanwhile, all need the useful life of the compatibility of thin-film package, stability and encapsulated device further to be improved.
Utility model content
The utility model, for the above-mentioned technical problem existing in prior art, provides a kind of potted element, array base palte and display unit.This potted element encapsulates OLED device by the sealing unit arranging on the cover board, and packaging technology is simple, and cost of manufacture is low, and makes the OLED device longer service life after encapsulation.Adopt the array base palte of this potted element and the longer service life of display unit.
The utility model provides a kind of potted element, for the OLED device being arranged on substrate is encapsulated, described potted element comprises the cover plate that shape is identical with described OLED device end face shape, and being arranged at the sealing unit on described cover plate plate face, described sealing unit is for being integral box with described OLED device and described OLED device being sealed.
Preferably, described cover plate is for covering the end face at described OLED device, and described sealing unit comprises and be arranged at the sealing frame of cover plate on the plate face of described OLED device, and described sealing frame is the side at described OLED device for corral.
Preferably, described sealing unit also comprises the adhesive layer in the region that is arranged at the inside of described sealing frame and the described cover plate of corresponding described OLED device, end face and the side of described adhesive layer for wrapping up described OLED device.
Preferably, described sealing frame closed loop is arranged at the fringe region of described cover plate plate face, and the height of described sealing frame is less than or equal to the distance between described cover plate and described substrate.
Preferably, described sealing frame comprises at least one sub-sealing frame, the nested setting in interval successively of plural described sub-sealing frame.
Preferably, described potted element also comprises the accommodation chamber for accommodating described OLED device, and described accommodation chamber is arranged at the inside of described adhesive layer, and described accommodation chamber adopts transparent material to make.
Preferably, the one side that described OLED device is arranged on described substrate is attaching face, described accommodation chamber comprises for being arranged on organic barrier layer of described OLED device end face and side, the shape of the shape of described organic barrier layer and size and described OLED device and big or small suitable.
Preferably, described accommodation chamber also comprises the inorganic barrier layer that is arranged at described organic barrier layer outside, and the inwall of described inorganic barrier layer and the outer wall of described organic barrier layer fit, and the outer wall of described inorganic barrier layer and the inwall of described adhesive layer fit.
Preferably, described sealing frame adopts metal material to make, and described adhesive layer adopts waterproof jointing material to make, and described organic barrier layer adopts silanes to make, and described inorganic barrier layer adopts Inorganic Silicon Compound to make.
Preferably, between described cover plate, described substrate and described sealing unit, be also provided with epoxy resin filling layer.
The utility model also provides a kind of array base palte, comprising: substrate and be arranged at the OLED device on described substrate, described OLED device adopts above-mentioned potted element to encapsulate.
The utility model also provides a kind of display unit, comprises above-mentioned array base palte.
The beneficial effects of the utility model: described potted element encapsulates OLED device by the sealing unit arranging on the cover board, block water and oxygen enter into OLED device more effectively, thereby can form better protection to OLED device, and then make the OLED device longer service life after encapsulation; The array base palte that the utility model provides and display unit, because OLED device wherein adopts this potted element to encapsulate, make array base palte and display unit also corresponding longer useful life.
Accompanying drawing explanation
Fig. 1 is the structural representation of the array base palte of glass back cover formula encapsulation in prior art;
Fig. 2 is for the structural representation of the film that encapsulates in prior art;
Fig. 3 is the structural representation of array base palte in the utility model embodiment 1;
Fig. 4 A is the cutaway view of cover plate and sealing frame;
Fig. 4 B is the plane graph of cover plate and sealing frame;
Fig. 5 is the structural representation of array base palte in the utility model embodiment 2;
Fig. 6 is the structural representation of array base palte in the utility model embodiment 3.
Wherein Reference numeral is:
1. cover plate; 2. sealing frame; 3. adhesive layer; 4. organic barrier layer; 5. inorganic barrier layer; 6. epoxy resin filling layer; 7.OLED device; 8. substrate; 9.UV packaging plastic; 10. drier; 11. glass back cover plates.
Embodiment
For making those skilled in the art understand better the technical solution of the utility model, below in conjunction with the drawings and specific embodiments, the utility model potted element, array base palte and display unit are described in further detail.
Embodiment 1:
The present embodiment provides a kind of potted element, for the OLED device being arranged on substrate is encapsulated, potted element comprises the cover plate that shape is identical with OLED device end face shape, and being arranged at the sealing unit on cover plate plate face, sealing unit is for being integral box with OLED device and OLED device being sealed.
As shown in Figure 3, sealing unit comprises and is arranged at the sealing frame 2 of cover plate 1 on the plate face of OLED device 7, or, the adhesive layer 3 that further comprises the region that is arranged at the inside of sealing frame 2 and the cover plate 1 of corresponding OLED device 7, cover plate 1 is for covering the end face at OLED device 7, sealing frame 2 is the side at OLED device 7 for corral, and adhesive layer 3 is for wrapping up end face and the side of OLED device 7.The height of sealing frame 2 is less than or equal to the distance between cover plate 1 and substrate 8, thus make sealing frame can block water and oxygen invade OLED device inside, can not make again the distance between cover plate and substrate surpass the gauged distance of setting.
Wherein, the one side that OLED device 7 is arranged on substrate 8 is attaching face, be that the face that OLED device 7 contacts and fits with substrate 8 is attaching face, adhesive layer 3 is arranged on the outside of OLED device 7 non-attaching faces, be that adhesive layer 3 is bonded in OLED device 7 except each face attaching face is on end face and side, the end face of OLED device 7 and side are carried out to environmental sealing.Because adhesive layer 3 not only has adhesive effect, and there is the effect that block water and oxygen pass through, so 3 pairs of OLED devices 7 of adhesive layer have formed better sealing.
As shown in Figure 4 A and 4 B shown in FIG., sealing frame 2 closed loops are arranged at the fringe region of cover plate 1 plate face, and sealing frame 2 comprises at least one sub-sealing frame, the nested setting in interval successively of plural sub-sealing frame.In the present embodiment, sub-sealing frame is two.If be provided with on the substrate of OLED device and cover plate, have enough large fringe region, the quantity of sub-sealing frame is more, can be better to the blocking effect of water and oxygen.
In addition, between cover plate 1, substrate 8 and sealing unit, (being sealing frame 2 and adhesive layer 3) is also provided with epoxy resin filling layer 6.Epoxy resin filling layer 6 is filled in the region of cover plate 1 and corresponding sealing frame 2 on substrate 8; Epoxy resin filling layer 6 bonds cover plate 1 and substrate 8 be fixed together, and after bonding is fixing, epoxy resin filling layer 6 wraps sealing frame 2 completely, is bonded as one with adhesive layer 3 simultaneously.Because epoxy resin filling layer 6 also has the effect that anti-sealing and oxygen are invaded, so, multi-sealed by sealing frame 2, epoxy resin filling layer 6 and 3 pairs of OLED devices 7 of adhesive layer, water and oxygen are difficult to invade OLED device 7 inside.
It should be noted that, epoxy resin filling layer 6 also can be non-caked with adhesive layer 3, and just sealing frame is completely filled epoxy resin filling layer 6, between epoxy resin filling layer 6 and adhesive layer 3, forms space, is also fine.
Wherein, OLED device is arranged on substrate, and the method for packing that the OLED potted element in application the present embodiment encapsulates OLED device comprises the following steps:
Step S1: form potted element, potted element comprises sealing unit.
In this step, form potted element and comprise:
Step S11: form layer of metal film on the plate face of cover plate; As by sputtering at sputter layer of metal film on cover plate plate face.
Step S12: metal film is formed to the figure that comprises sealing frame by a composition technique; By apply photoresist on metal film, then by exposure, develop and etching, finally form the figure of sealing frame.In the present embodiment, on the plate face of cover plate, form two sub-sealing frames.
Or, also further comprise:
Step S13: in the inside of sealing frame and the region division adhesive layer of the cover plate of corresponding OLED device.Conventionally, two aspects of adhesive layer all have stickiness, and are respectively arranged with diaphragm.Before adhesive layer and cover plate are set together, first the size of adhesive layer is set to corresponding the end face of OLED device and the big or small sum of side, and carries out in advance cutting by the shape of OLED device.When adhesive layer and cover plate are set together; can first remove in one of them aspect of adhesive layer the diaphragm of the end face size of corresponding OLED device; then this part adhesive layer of removing diaphragm is pasted to the region corresponding with OLED device of cover plate, and in this adhesive layer, the diaphragm in other regions of same aspect and the diaphragm of another aspect retain.Wherein, in this adhesive layer, the diaphragm in other regions of same aspect is removed during to box at this potted element and OLED, and the diaphragm of another aspect is removed when bonding at the end face with OLED device and side.
Step S2: potted element and OLED device are integral box.
In this step, potted element and OLED device are integral and comprise box: between cover plate, substrate and sealing unit (being sealing frame and adhesive layer), apply epoxy resin, form epoxy resin filling layer, by potted element and OLED device to box.After box, the end face of adhesive layer and OLED device and side (be OLED device except each face attaching face) fits and is bonded as one; After treating epoxy resin cure, OLED device is just packaged.
Embodiment 2:
The present embodiment provides a kind of potted element, and as different from Example 1, this potted element, on the basis of embodiment 1, also comprises the accommodation chamber for accommodating OLED device, and accommodation chamber is arranged at the inside of adhesive layer, and accommodation chamber adopts transparent material to make.
As shown in Figure 5, accommodation chamber comprises for being arranged on organic barrier layer 4 of OLED device 7 end faces and side, the shape of organic barrier layer 4 and size are suitable with shape and the size of OLED device 7, be that the one side that OLED device 7 is arranged on substrate 8 is attaching face, organic barrier layer 4 be bonded in OLED device 7 except each face attaching face be on end face and side, the inwall of the outer wall of organic barrier layer 4 and adhesive layer 3 fits; OLED device 7 is carried out to environmental sealing.Wherein, organic barrier layer 4 adopts silanes, as: hexamethyldisiloxane, TEG dipropyl dilute acid ester are made.Due to the feature such as organic barrier layer 4 has high water resistance, good flexibility, non crystalline structure, free of pinholes, corrosion-resistant, adherence is strong, can well stop water and oxygen.
Other structure and the material of potted element are identical with embodiment 1, repeat no more herein.
Correspondingly, different from the method for packing in embodiment 1, on the basis of embodiment 1, potted element also comprises the encapsulation of OLED device: while forming potted element in step S1, also increased the step that forms organic barrier layer.Concrete, step S14: end face and side (being the non-attaching face not contacting with substrate of OLED device) at OLED device form organic barrier layer.
Wherein, form organic barrier layer and adopt cladding process, silanes is coated on the end face and side of OLED device.Be provided with the cover plate of sealing unit (being sealing frame and adhesive layer) and OLED device to box after, the inwall of adhesive layer and the outer wall of organic barrier layer are fitted and are bonded as one, and OLED device is formed to sealing.
Certainly, form method that organic barrier layer also can adopt attaching by the film that comprises silanes composition by attaching, the mode of pressing attaches on the end face and side of OLED device.
Other step that potted element encapsulates OLED device is identical with embodiment 1, repeats no more herein.
Embodiment 3:
The present embodiment provides a kind of potted element, different from embodiment 1-2 is, as shown in Figure 6, this potted element is on the basis of embodiment 2, described accommodation chamber also comprises the inorganic barrier layer 5 that is arranged at organic barrier layer 4 outsides, the outer wall of the inwall of inorganic barrier layer 5 and organic barrier layer 4 fits, and the inwall of the outer wall of inorganic barrier layer 5 and adhesive layer 3 fits.Inorganic barrier layer 5 adopts Inorganic Silicon Compounds to make as SiNxOy.5 pairs of water of inorganic barrier layer and oxygen have very strong blocking capability, but because inorganic barrier layer 5 has not been fully dense, are set directly on the end face of OLED device and side and there will be pin hole or other defect; In addition, the internal stress that 5 pairs of OLED devices of inorganic barrier layer produce is larger; Be arranged on organic barrier layer 4 outsides, can be made up the above-mentioned defect of inorganic barrier layer 5, improved its blocking capability to water and oxygen.
Other structure and the material of potted element are identical with embodiment 2, repeat no more herein.
Correspondingly, different from the method for packing in embodiment 2, on the basis of embodiment 2, potted element also comprises the encapsulation of OLED device: step S15: the outside at organic barrier layer forms inorganic barrier layer.The inwall of inorganic barrier layer and the outer wall of organic barrier layer fit; The cover plate that is provided with sealing unit (being sealing frame and adhesive layer) and the OLED device that is provided with organic barrier layer and inorganic barrier layer to box after, the outer wall of inorganic barrier layer and the inwall of adhesive layer fit, like this, adhesive layer, inorganic barrier layer and organic barrier layer successively nested and tight bond are integrated, and OLED device is formed to sealing.
Wherein, form inorganic barrier layer and adopt plasma enhanced chemical vapor deposition method, component ratio between the reaction source gas passing into by adjustment in PCVD, change content and the ratio of each element (as N element and O element) in Inorganic Silicon Compound SiNxOy, thereby improve the water of inorganic barrier layer and the blocking capability of oxygen; Reduce the internal stress that inorganic barrier layer produces OLED device simultaneously.
The beneficial effect of embodiment 1-3: potted element encapsulates OLED device by the sealing unit arranging on the cover board; block water and oxygen enter into OLED device more effectively; thereby can form better protection to OLED device, and then make the OLED device longer service life after encapsulation.This potted element is simple for production and cost is low, and the technique and the method that make to adopt this potted element to encapsulate OLED device are also easier, thereby has improved the packaging efficiency of OLED device.
Embodiment 4:
The present embodiment provides a kind of array base palte, comprising: substrate and be arranged at the OLED device on substrate, OLED device adopts the potted element providing in embodiment 1-3 to encapsulate.
The beneficial effect of embodiment 4: this array base palte, owing to adopting the potted element providing in embodiment 1-3 to encapsulate the OLED device being arranged on substrate, makes the longer service life of the array base palte after encapsulation.
Embodiment 5:
The present embodiment provides a kind of display unit, and the array base palte providing in embodiment 4 is provided.
The beneficial effect of embodiment 5: this display unit, owing to adopting the potted element providing in embodiment 1-3 to encapsulate, makes the longer service life of the display unit after encapsulation.
Be understandable that, above execution mode is only used to principle of the present utility model is described and the illustrative embodiments that adopts, yet the utility model is not limited to this.For those skilled in the art, in the situation that not departing from principle of the present utility model and essence, can make various modification and improvement, these modification and improvement are also considered as protection range of the present utility model.
Claims (12)
1. a potted element, for the OLED device being arranged on substrate is encapsulated, it is characterized in that, described potted element comprises the cover plate that shape is identical with described OLED device end face shape, and being arranged at the sealing unit on described cover plate plate face, described sealing unit is for being integral box with described OLED device and described OLED device being sealed.
2. potted element according to claim 1, it is characterized in that, described cover plate is for covering the end face at described OLED device, and described sealing unit comprises and be arranged at the sealing frame of cover plate on the plate face of described OLED device, and described sealing frame is the side at described OLED device for corral.
3. potted element according to claim 2, it is characterized in that, described sealing unit also comprises the adhesive layer in the region that is arranged at the inside of described sealing frame and the described cover plate of corresponding described OLED device, end face and the side of described adhesive layer for wrapping up described OLED device.
4. potted element according to claim 3, is characterized in that, described sealing frame closed loop is arranged at the fringe region of described cover plate plate face, and the height of described sealing frame is less than or equal to the distance between described cover plate and described substrate.
5. potted element according to claim 4, is characterized in that, described sealing frame comprises at least one sub-sealing frame, the nested setting in interval successively of plural described sub-sealing frame.
6. potted element according to claim 5, is characterized in that, described potted element also comprises the accommodation chamber for accommodating described OLED device, and described accommodation chamber is arranged at the inside of described adhesive layer, and described accommodation chamber adopts transparent material to make.
7. potted element according to claim 6, it is characterized in that, described accommodation chamber comprises for being arranged on organic barrier layer of described OLED device end face and side, the shape of the shape of described organic barrier layer and size and described OLED device and big or small suitable.
8. potted element according to claim 7, it is characterized in that, described accommodation chamber also comprises the inorganic barrier layer that is arranged at described organic barrier layer outside, the inwall of described inorganic barrier layer and the outer wall of described organic barrier layer fit, and the outer wall of described inorganic barrier layer and the inwall of described adhesive layer fit.
9. potted element according to claim 8, it is characterized in that, described sealing frame adopts metal material to make, and described adhesive layer adopts waterproof jointing material to make, described organic barrier layer adopts silanes to make, and described inorganic barrier layer adopts Inorganic Silicon Compound to make.
10. according to the potted element described in claim 1-9 any one, it is characterized in that, between described cover plate, described substrate and described sealing unit, be also provided with epoxy resin filling layer.
11. 1 kinds of array base paltes, comprising: substrate and be arranged at the OLED device on described substrate, it is characterized in that, and described OLED device adopts the potted element described in claim 1-10 any one to encapsulate.
12. 1 kinds of display unit, is characterized in that, comprise the array base palte described in claim 11.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201320364975.3U CN203415629U (en) | 2013-06-24 | 2013-06-24 | Packaging element, array substrate and display device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201320364975.3U CN203415629U (en) | 2013-06-24 | 2013-06-24 | Packaging element, array substrate and display device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103346268A (en) * | 2013-06-24 | 2013-10-09 | 京东方科技集团股份有限公司 | Encapsulating method for encapsulating components, array substrates, display devices and OLED components |
| CN104157799A (en) * | 2014-08-29 | 2014-11-19 | 深圳市华星光电技术有限公司 | OLED package method and OLED package structure |
| CN107921738A (en) * | 2015-08-12 | 2018-04-17 | 富士胶片株式会社 | Stacked film |
-
2013
- 2013-06-24 CN CN201320364975.3U patent/CN203415629U/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103346268A (en) * | 2013-06-24 | 2013-10-09 | 京东方科技集团股份有限公司 | Encapsulating method for encapsulating components, array substrates, display devices and OLED components |
| WO2014205975A1 (en) * | 2013-06-24 | 2014-12-31 | 京东方科技集团股份有限公司 | Packaging element, array substrate, display device and packaging method for oled device |
| CN103346268B (en) * | 2013-06-24 | 2016-04-13 | 京东方科技集团股份有限公司 | The method for packing of potted element, array base palte, display unit and OLED |
| CN104157799A (en) * | 2014-08-29 | 2014-11-19 | 深圳市华星光电技术有限公司 | OLED package method and OLED package structure |
| US9614177B2 (en) | 2014-08-29 | 2017-04-04 | Shenzhen China Star Optoelectronics Technology Co., Ltd | OLED package method and OLED package structure |
| CN107921738A (en) * | 2015-08-12 | 2018-04-17 | 富士胶片株式会社 | Stacked film |
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