CN110246981A - Organic illuminating electronic device encapsulation structure and its production technology - Google Patents
Organic illuminating electronic device encapsulation structure and its production technology Download PDFInfo
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- CN110246981A CN110246981A CN201910491714.XA CN201910491714A CN110246981A CN 110246981 A CN110246981 A CN 110246981A CN 201910491714 A CN201910491714 A CN 201910491714A CN 110246981 A CN110246981 A CN 110246981A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8423—Metallic sealing arrangements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Optics & Photonics (AREA)
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- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention discloses a kind of metal inserting layer being added in organic illuminating electronic device encapsulated layer designs; mainly pass through the encapsulation technology of the insertion of the metal nano insert layer of nano-scale grade; it is reflected using the light of compact metal nano thin-film; absorb the small size with metallic atom; it can reflect away most UV light, to protect fragile organic function layer.Secondly, when constituting a fine and close water oxygen molecule barrier layer in the metal small molecule and following insulating layer for being less than nanoscale, to further increase packaging effect.
Description
Technical field:
The invention belongs to electrical part processing technique field, in particular to a kind of organic illuminating electronic device encapsulation structure and its encapsulation
Technique.
Background technique:
Novel organic electronic device, organic light emission, organic electro-optic device, organic detectors and organic field-effect tube due to its from
The advantages that body is frivolous, energy saving and self-luminous, power generation, in display and solid-state lighting, the energy, detector, mobile phone, wearable field
It has broad application prospects.Its outstanding characteristic will affect the exploitation of next-generation display electronic product, be that flexible electronic is shown
The main force.
However according to long-term, a large amount of organic electronics studies have shown that the steam and oxygen gas component in air to Organic Electricity
Sub- device has fatal influence, and it is various that reason mainly has steam and oxygen molecule to have organic and other each nanometer thin film layers
Different reactions and influence, to there is very big harm to the integral device service life.If can be carried out to organic electro-optic device
The encapsulation of effect stops steam/oxygen to touch each organic function layer, so that it may greatly improve device lifetime.With many novelties
Encapsulation coating material and direct combination encapsulating structure invented and used, the encapsulation of organic electronic device has obtained huge rush
Into, and existing high encapsulation, the organic electronic display screen of long-life have emerged.
But in existing encapsulating material and technology, UV and white light solidified resin or organic material are indispensable in encapsulation
Selection.However since organic electronic device organic function layer is very frivolous, and since material property is very sensitive to light irradiation,
This has resulted in a conflict, decays to device caused by the UV light for encapsulating highly effective and necessary UV irradiation and organic material
Mutually contradict.How to reduce during manufacturing influence and as far as possible retainer member of the UV light to device encapsulation performance become one it is new
Challenge, production technology and operation will be required it is very harsh, especially high intensity UV illumination package requirements when, such as OLED is aobvious
Show that each organic layer is all stronger UV light absorbing material in device, and encapsulating with UV is that high-intensitive high-power UV irradiates.This
Outside since device and each encapsulated layer are all transparent materials, UV will be caused to be very easy to enter organic assembly layer and lead to light decay
Subtract.The effect of UV encapsulation irradiation how is improved, while reducing the intensity that UV light enters organic layer, is to the solution of external production technology
One very with the work of difficulty and challenge.If we complete that UV light is stopped to enter the logical of organic layer inside period
Road, while not influencing the technique and effect of encapsulation again, so that it may effectively solve the problems, such as this.
UV light can be greatly lowered and enter the strong of organic assembly layer by how being inserted into metal nano layer in existing encapsulating structure
Degree, should have claimed below: nano metal layer cannot be too thick.Metal nano layer cannot influence device top encapsulation organic layer.Nanometer
Metal layer cannot be too thin, effectively to stop UV light.Nano metal layer is not readily accessible to organic assembly layer in encapsulation process, and lower part is exhausted
Edge protective layer effectively completely cuts off metal layer and each layer of organic assembly.UV irradiation and organic assembly one are scheduled on nano metal layer two sides.Together
When, steam and oxygen cannot be exposed in the encapsulation of each layer, in order to avoid insulating protective layer is caused, the damage of metal nano layer and oxidation.
The information disclosed in the background technology section is intended only to increase the understanding to general background of the invention, without answering
When being considered as recognizing or imply that the information constitutes the prior art already known to those of ordinary skill in the art in any form.
Summary of the invention:
The purpose of the present invention is to provide a kind of organic illuminating electronic device encapsulation structures, to overcome above-mentioned in the prior art
Defect.
To achieve the above object, the present invention provides a kind of organic illuminating electronic device encapsulation structures, comprising: preparation is in base
Organic electronic device or organic function layer on bottom, in the protection insulating layer of organic luminescent device, and on protection insulating layer
The metal layer of deposition, and UV solidification organic layer and top encapsulation cover plate on the metal layer.
Basic principle of the invention is based on using nanometer active metal insert layer in UV optic-solidified adhesive and organic assembly layer
Centre, rather than device top is directly overlayed, allow metal nano layer entirely to cover organic assembly functional layer top.It is organic above
Photocurable layers go out the reflection of most UV light and refraction when carrying out UV cure package, and basic isolation UV enters organic
Device area then effectively reduces the UV photo attenuation of organic assembly.It is calculated according to nanocomposite optical, 50 nanometers of metal Al film
85% or more UV light projection rate can be reduced, 100 nanometers of Al film can reduce by 99% or more UV light transmission.As long as it can be seen that
The insertion of 50-200 nanometers of Al metal membrane can greatly completely cut off UV light transmission and enter organic period layer.Furthermore nanometer scale
Metal be easy to chemically react with water/oxygen, and generate the metal oxide or metal salt of insulation.The reaction of this part can consume
Water/oxygen molecule that the overwhelming majority penetrates, until the complete end of reaction of entire metal layer.It is nanometer that it, which reacts the substance generated,
Magnitude, reaction product can rest on original position, not only no longer migrate, but also subsequent water/oxygen can be stopped to go successively to device
Part region.This process can be greatly reduced water/oxygen and enter the process and quantity of device area from boundary, to improve whole envelope
Fill the effect of layer.Entire insulating protective layer and nano metal layer plated film are to be to carry out in the identical vacuum coating equipment of device growth
(< 10-4Pa), other UV solidify the plated film of organic encapsulation layer and Light Curing is all completed in an inert atmosphere in fact, such as nitrogen
It is completed in the glove box of the inert gases such as gas, argon gas.Water and oxygen content should be less than 1 ppm in glove box.In encapsulation process
The substrate of use is the flexible substrates that glass and high water oxygen stop, and organic electronic device is used to water oxygen and thermo-responsive organic small
Mulecular luminescence device (OLED).The entire encapsulating structure in metal layer top is stopped using UV solidified resin and glass glass or high water oxygen
Flexible substrates compound encapsulation structure.
The technical solution that the present invention further limits are as follows:
Further, substrate is selected from metal, quartzy, silica, glass, and silicon wafer etc inorganic transparent substrate is also possible to various
Flexiplast, polymer, the organic transparent substrates of resin material.
Further, organic electronic device and organic function layer are selected from organic luminescent device OLED, quantum luminescent device
GLED, polymer light-emitting device PLED, small organic molecule, polymer, perovskite photoelectric device, photodetector and solar-electricity
Pond and organic, one of polymer field-effect tube.
Further, protection insulating layer is selected from metal oxide, electrodeless insulating materials, one of metallic salt.
Further, active metal layer choosing is certainly golden, silver, calcium, magnesium, one of aluminium
Further, active metal layer is deposited on protection insulating layer by plasma or electronics sputtering or thermal evaporation methods
On, active metal layer is with a thickness of 50-200 nanometers.
Further, protection insulating layer area is greater than the area of active metal layer.
Further, UV solidifies organic layer selected from UV, white light solidification, package curing resin, package curing glue/polymer
One of layer or the MULTILAYER COMPOSITE encapsulating structure of a variety of materials.
Further, top encapsulation cover plate is selected from the metal that high water oxygen stops, glass, silicon wafer, silica, metal oxidation
The fexible film that object and high water oxygen stop, one of substrate.
A kind of organic illuminating electronic device packaging technology, it is characterised in that: carry out in accordance with the following steps:
S1. stand-by substrate is got out, surface can be cleaned, and is put into steam and oxygen that vacuum oven removes extra absorption
Gas；Substrate is put into organic function layer growth and prepares organic electronic device；After the preparation for completing organic electronic device, directly will
One layer of active metal layer is deposited thereafter in vacuum evaporation one layer of protection insulating layer of intracavitary vapor deposition in organic electronic device above again；
S2. sample is passed to 20 DEG C, water, oxygen content are less than in the nitrogen glove box of 1ppm；Pass through one layer of spin coating proceeding film
2-10 microns of thick UV solidify organic layer；
S3. the top encapsulation cover plate cleared up is covered on the device of step S2；
S4. packaged device is passed to and is placed in UV curing station, substrate, device and nano metal layer are under, UV solidification tree
Upper, whole equipment is also located in nitrogen glove box for rouge and encapsulation cover film；
S5. it on the basis of the device of step S4, opens UV lamp and irradiates entire sample cure package coating, complete device after 2-4 minutes
Part solidification；
Temperature is no more than 40C during entire encapsulation process, and RH is no more than 60% environment measurement.
Compared with prior art, the invention has the following beneficial effects:
Metal inserting layer design disclosed by the invention, caused by having during UV photocuring potting resin is effectively reduced simultaneously
The effect of organic luminescent device optical attenuation, while the efficiency for stopping water oxygen infiltration can also be improved.The invention design is applicable to
The rapid large-area encapsulation of various hard and flexible organic illuminating electronic device, can especially integrate and be applied to existing organic electronic device
In the superelevation steam/oxygen barrier rate encapsulating structure and design of part.This is a kind of establishes in nanometer scale UV reflecting metal
Film is greatly lowered UV light and penetrates package curing glue and protective layer to high intensity UV light emitting and attenuation principle in encapsulation process
Afterwards to the optical attenuation of organic luminous layer and functional layer.The encapsulation technology of the insertion of the metal nano insert layer of nano-scale grade, benefit
It is reflected with the light of compact metal nano thin-film, absorbs the small size with metallic atom, most UV light can be reflected away,
To protect fragile organic function layer.Secondly, being constituted when in the metal small molecule and following insulating layer for being less than nanoscale
One fine and close water oxygen molecule barrier layer, to further increase packaging effect.The present invention utilizes the gold of a nanometer scale
Belong to the improvement that encapsulates in organic electronic device of insert layer, to avoid UV light in existing organic electronic device encapsulation process to having
The injury of machine electronic device, this solves the problems, such as that the strong light guide of UV causes device decaying in organic electronic device encapsulation process.By
In the single layer of an only nano metal, metal electrode material and film plating process can be directly used with better simply, do not needed
Individual equipment and material.And be integrated with existing most of organic electronic device encapsulating structure and process, further mention
The packaging efficiency of high organic electronic device.This to organic electronic device packaging effect and its various electronic equipments application
In, provide new means and can test function.And the invention not will cause the complexity of packaging technology and cost is excessively high asks
Topic, and the application for the optical attenuation of organic electronic device and light sensitive material provides new method and thinking.
Detailed description of the invention:
Fig. 1 is layer structure schematic diagram of the invention；
Specific embodiment:
Specific embodiments of the present invention will be described in detail below, it is to be understood that protection scope of the present invention is not had
The limitation of body embodiment.
Unless otherwise explicitly stated, otherwise in entire disclosure and claims, term " includes " or its change
Changing such as "comprising" or " including " etc. will be understood to comprise stated element or component, and not exclude other members
Part or other component parts.
A kind of organic illuminating electronic device encapsulation structure, comprising: organic electronic device or organic function of the preparation in substrate
Ergosphere, in the protection insulating layer of organic luminescent device, and the metal layer deposited on protection insulating layer, and on the metal layer
UV solidification organic layer and top encapsulation cover plate.
Wherein, substrate is selected from metal, quartzy, silica, glass, and silicon wafer etc hardness reaches the material of 4 or more Mohs' hardness
Material, is also possible to various flexiplasts, polymer, resin material.
Wherein, organic electronic device and organic function layer are selected from organic luminescent device OLED, quantum luminescent device GLED, gather
Object luminescent device PLED, small organic molecule, polymer, perovskite photoelectric device, photodetector and solar battery are closed, and
It is organic, one of polymer field-effect tube.
Wherein, protection insulating layer is selected from metal oxide, electrodeless insulating materials, one of metallic salt.
Wherein, active metal layer choosing is certainly golden, silver, calcium, magnesium, one of aluminium.
Wherein, active metal layer is deposited on protection insulating layer by plasma or electronics sputtering or thermal evaporation methods
On, active metal layer is with a thickness of 50-200 nanometers.
Wherein, protection insulating layer area is greater than the area of active metal layer.
Wherein, UV solidifies organic layer selected from UV, and white light solidifies, package curing resin, package curing glue/polymeric layer, or
Person is one of MULTILAYER COMPOSITE encapsulating structure of a variety of materials.
Wherein, the metal that top encapsulation cover plate stops selected from high water oxygen, glass, silicon wafer, silica, metal oxide, with
And the fexible film that high water oxygen stops, one of substrate.
According to the design and processes of invention, one of implementations are using following steps:
The first step gets out stand-by glass or high-barrier flexible PET substrate, can clean to surface.And it is put into vacuum drying
Case removes the steam and oxygen of extra absorption.It is raw that glass or high-barrier flexible PET substrate are put into organic light-emitting diode equipment
Long and preparation OLED device.After the preparation for completing OLED device, directly by OLED device at one layer 100 of the intracavitary vapor deposition of vacuum evaporation
100 nanometers of aluminum metal layer is deposited thereafter in the LiF insulating layer of nanometer above again.
Sample is passed to 20 DEG C by second step, and water, oxygen content are less than in the nitrogen glove box of 1ppm.Pass through spin coating proceeding
One layer of UV solidified resin of film is about 2-10 microns thick.
Third step covers the glass for the encapsulation covering cleared up on the device of second step or high-barrier flexible PET covers
Cover board.
4th step is placed on packaged device is incoming in UV curing station, substrate and device and nano metal layer under,
UV solidified resin and encapsulation cover film are upper.Whole equipment is also located in nitrogen glove box.
5th step opens UV lamp and irradiates entire sample cure package coating, complete after 2-4 minutes on the basis of four steps
Device solidification.
7th step, device is put into life-span test system, and the test electric current kept constant detects device light emitting efficiency
The conductance failure conditions of curve and active metal layer.
Wherein temperature is no more than 40C in encapsulation process and test process, and RH is no more than 60% environment measurement.
Above four kinds of examples show that the hybrid package structure of various metals nanometer reflection layer and insulating layer can significantly drop
The decaying of OLED device caused by low UV irradiation, and improve the service life of encapsulated device.
The aforementioned description to specific exemplary embodiment of the invention is in order to illustrate and illustration purpose.These descriptions
It is not wishing to limit the invention to disclosed precise forms, and it will be apparent that according to the above instruction, can much be changed
And variation.The purpose of selecting and describing the exemplary embodiment is that explaining specific principle of the invention and its actually answering
With so that those skilled in the art can be realized and utilize a variety of different exemplary implementation schemes of the invention and
Various chooses and changes.The scope of the present invention is intended to be limited by claims and its equivalents.
Claims (10)
1. a kind of organic illuminating electronic device encapsulation structure characterized by comprising organic electronic device of the preparation in substrate
Or organic function layer, in the protection insulating layer of organic luminescent device, and the metal layer deposited on protection insulating layer, Yi Ji
UV solidification organic layer and top encapsulation cover plate on metal layer.
2. organic illuminating electronic device encapsulation structure according to claim 1, which is characterized in that substrate is selected from metal, stone
English, silica, glass, silicon wafer etc inorganic transparent substrate are also possible to various flexiplasts, polymer, and resin material is organic
Transparent substrates.
3. organic illuminating electronic device encapsulation structure according to claim 1, which is characterized in that organic electronic device and have
Machine functional layer is selected from organic luminescent device OLED, quantum luminescent device GLED, polymer light-emitting device PLED, small organic molecule,
Polymer, perovskite photoelectric device, photodetector and solar battery and organic, one of polymer field-effect tube.
4. organic illuminating electronic device encapsulation structure according to claim 1, which is characterized in that protection insulating layer is selected from gold
Belong to oxide, electrodeless insulating materials, one of metallic salt.
5. organic illuminating electronic device encapsulation structure according to claim 1, which is characterized in that active metal layer choosing is certainly
Gold, silver, calcium, magnesium, one of aluminium.
6. organic illuminating electronic device encapsulation structure according to claim 1, which is characterized in that active metal layer passes through
Ion or electronics sputtering or thermal evaporation methods are deposited on protection insulating layer, and active metal layer is with a thickness of 50-200 nanometers.
7. organic illuminating electronic device encapsulation structure according to claim 1, which is characterized in that protection insulating layer area is big
In the area of active metal layer.
8. organic illuminating electronic device encapsulation structure according to claim 1, which is characterized in that UV solidification organic layer is selected from
UV, white light solidification, package curing resin, the MULTILAYER COMPOSITE encapsulating structure of package curing glue/polymeric layer or a variety of materials
One of.
9. organic illuminating electronic device encapsulation structure according to claim 1, which is characterized in that top encapsulation cover plate is selected from
The fexible film that the metal that high water oxygen stops, glass, silicon wafer, silica, metal oxide and high water oxygen stop, in substrate
One kind.
10. a kind of organic illuminating electronic device packaging technology, it is characterised in that: carry out in accordance with the following steps:
S1. stand-by substrate is got out, surface can be cleaned, and is put into steam and oxygen that vacuum oven removes extra absorption
Gas；Substrate is put into organic function layer growth and prepares organic electronic device；After the preparation for completing organic electronic device, directly will
One layer of active metal layer is deposited thereafter in vacuum evaporation one layer of protection insulating layer of intracavitary vapor deposition in organic electronic device above again；
S2. sample is passed to 20 DEG C, water, oxygen content are less than in the nitrogen glove box of 1ppm；Pass through one layer of spin coating proceeding film
2-10 microns of thick UV solidify organic layer；
S3. the top encapsulation cover plate cleared up is covered on the device of step S2；
S4. packaged device is passed to and is placed in UV curing station, substrate, device and nano metal layer are under, UV solidification tree
Upper, whole equipment is also located in nitrogen glove box for rouge and encapsulation cover film；
S5. it on the basis of the device of step S4, opens UV lamp and irradiates entire sample cure package coating, complete device after 2-4 minutes
Part solidification；
Temperature is no more than 40C during entire encapsulation process, and RH is no more than 60% environment measurement.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910491714.XA CN110246981A (en) | 2019-06-06 | 2019-06-06 | Organic illuminating electronic device encapsulation structure and its production technology |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110838547A (en) * | 2019-11-08 | 2020-02-25 | 福仕保(江苏)新材料有限公司 | Vacuum sputtering mixed light-cured resin packaging process for organic electronic device |
| CN114203927A (en) * | 2021-12-02 | 2022-03-18 | 长春若水科技发展有限公司 | Flexible yellow light organic light emitting diode and preparation method thereof |
| CN114388707A (en) * | 2021-12-30 | 2022-04-22 | 华南理工大学 | White light electroluminescent device and preparation method and application thereof |
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|---|---|---|---|---|
| CN1602122A (en) * | 2004-09-30 | 2005-03-30 | 清华大学 | Organic electroluminescent element |
| JP2013218796A (en) * | 2012-04-04 | 2013-10-24 | Sumitomo Chemical Co Ltd | Electronic device |
| CN103594647A (en) * | 2012-08-15 | 2014-02-19 | 海洋王照明科技股份有限公司 | Organic electroluminescent device and preparation method thereof |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1602122A (en) * | 2004-09-30 | 2005-03-30 | 清华大学 | Organic electroluminescent element |
| JP2013218796A (en) * | 2012-04-04 | 2013-10-24 | Sumitomo Chemical Co Ltd | Electronic device |
| CN103594647A (en) * | 2012-08-15 | 2014-02-19 | 海洋王照明科技股份有限公司 | Organic electroluminescent device and preparation method thereof |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110838547A (en) * | 2019-11-08 | 2020-02-25 | 福仕保(江苏)新材料有限公司 | Vacuum sputtering mixed light-cured resin packaging process for organic electronic device |
| CN114203927A (en) * | 2021-12-02 | 2022-03-18 | 长春若水科技发展有限公司 | Flexible yellow light organic light emitting diode and preparation method thereof |
| CN114388707A (en) * | 2021-12-30 | 2022-04-22 | 华南理工大学 | White light electroluminescent device and preparation method and application thereof |
| CN114388707B (en) * | 2021-12-30 | 2024-06-04 | 华南理工大学 | White light electroluminescent device and preparation method and application thereof |
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Application publication date: 20190917 |