WO2020199551A1 - Display packaging structure and manufacturing method therefor - Google Patents

Display packaging structure and manufacturing method therefor Download PDF

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Publication number
WO2020199551A1
WO2020199551A1 PCT/CN2019/111540 CN2019111540W WO2020199551A1 WO 2020199551 A1 WO2020199551 A1 WO 2020199551A1 CN 2019111540 W CN2019111540 W CN 2019111540W WO 2020199551 A1 WO2020199551 A1 WO 2020199551A1
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WO
WIPO (PCT)
Prior art keywords
display
element substrate
packaging
display element
filling
Prior art date
Application number
PCT/CN2019/111540
Other languages
French (fr)
Chinese (zh)
Inventor
谭伟
张亮
Original Assignee
深圳市华星光电半导体显示技术有限公司
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Application filed by 深圳市华星光电半导体显示技术有限公司 filed Critical 深圳市华星光电半导体显示技术有限公司
Publication of WO2020199551A1 publication Critical patent/WO2020199551A1/en

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Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/842Containers
    • H10K50/8426Peripheral sealing arrangements, e.g. adhesives, sealants
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/846Passivation; Containers; Encapsulations comprising getter material or desiccants
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass

Definitions

  • the present invention relates to a display packaging structure and a manufacturing method thereof, and in particular to a display packaging structure with a narrow frame and a manufacturing method thereof.
  • OLED Organic Light Emitting Diode
  • OLED display does not require a backlight module.
  • OLED devices inject into organic thin film materials through electron and hole carriers and emit light on the organic material.
  • organic materials are very sensitive to water vapor and oxygen, and water/oxygen penetration will greatly reduce the device life.
  • OLED devices have very high requirements for packaging effects. For example, the water vapor transmission rate is less than 10-6 g/m2/day, oxygen transmission rate is less than 10-5 ml/m2/day (under 1 atmospheric pressure). Therefore, packaging plays an important role in the production of OLED devices and is one of the key factors affecting product yield. At present, with the widespread application of large-size OLED display panels, more and more consumers like OLED products with narrow bezels.
  • the encapsulation method of the existing OLED devices is mainly glass encapsulation.
  • the OLED device is formed on the substrate and the thin film encapsulation layer is made.
  • the cover glass is coated with UV-curable sealant and laser encapsulated glass glue (Laser Sealing), or Dam & Fill sealant is cured to provide a relatively closed environment for the light emitting device, which can achieve good water/oxygen barrier capacity within a certain period of time.
  • the distance from the OLED device to the edge of the substrate is the frame of the display device.
  • the width of the package sealant needs to be sacrificed, thereby affecting the packaging effect, so it is difficult to achieve a narrower frame design.
  • the distance from the OLED device to the edge of the substrate is the frame of the display device.
  • the width of the package sealant needs to be sacrificed, thereby affecting the packaging effect, so it is difficult to achieve a narrower frame design.
  • the present invention provides a display packaging structure and a manufacturing method thereof to solve the problem of sacrificing the width of the packaging sealant in the prior art to achieve a narrow frame design.
  • the main purpose of the present invention is to provide a display packaging structure and a manufacturing method thereof, which can avoid sacrificing the width of the packaging sealant and avoid affecting the packaging effect, thereby achieving a narrower frame design.
  • the secondary objective of the present invention is to provide a display packaging structure and a manufacturing method thereof, which can reduce the distance from the OLED device to the edge of the display panel without affecting the packaging effect, thereby achieving an ultra-narrow frame design.
  • an embodiment of the present invention provides a display packaging structure, including:
  • a cover the cover has a main body and an extension perpendicular to the main body;
  • a display element substrate is provided with a plurality of display elements; wherein the cover body is combined with the display element substrate so that the extension part surrounds a side wall of the display element substrate, and the main body part is arranged on the On the display element substrate, a gap is formed between the extension portion and the side wall;
  • a filling gel is arranged in a display element substrate accommodating space formed by the main body part and the extension part in the cover;
  • a sealant is filled in the gap.
  • the plurality of display elements are a plurality of organic light emitting diode elements.
  • the display packaging structure further includes: an packaging film layer is disposed on the display element substrate and encapsulates the plurality of display elements.
  • the display packaging structure further includes: the filling compound is disposed on a surface of the main body in the accommodating space of the display element substrate.
  • the filling colloid is in contact with the packaging film layer, so that the filling colloid abuts against an upper surface of the packaging film layer.
  • the display packaging structure further includes: a packaging plastic frame is disposed on the main body part, and is disposed around a side wall of the extension part to form a filling plastic containing space, wherein The filling colloid is filled in the filling colloid containing space.
  • the packaging plastic frame includes a getter dispersed in the packaging plastic frame.
  • the packaging film layer has a stepped portion, which is arranged around the packaging film layer;
  • the packaging plastic frame has a protruding part protruding from a surface of the filling plastic body,
  • the protruding part of the encapsulating plastic frame matches the shape of the stepped part of the encapsulating film layer.
  • a display packaging structure including:
  • a cover the cover has a main body and an extension
  • a display element substrate is provided with a plurality of display elements; wherein the cover body is combined with the display element substrate so that the extension part surrounds a side wall of the display element substrate, and the main body part is arranged on the On the display element substrate, a gap is formed between the extension portion and the side wall; and
  • a sealant is filled in the gap.
  • the plurality of display elements are a plurality of organic light emitting diode elements.
  • the display packaging structure further includes: an packaging film layer is disposed on the display element substrate and encapsulates the plurality of display elements.
  • the display packaging structure further includes: a filler is disposed in a display element substrate accommodating space formed by the main body portion and the extension portion, and the filler is disposed on the On a surface of the main body in the accommodating space of the display element substrate.
  • the filling colloid is in contact with the packaging film layer, so that the filling colloid abuts against an upper surface of the packaging film layer.
  • the display packaging structure further includes: a packaging plastic frame is disposed on the main body part, and is disposed around a side wall of the extension part to form a filling plastic containing space, wherein The filling colloid is filled in the filling colloid containing space.
  • the packaging plastic frame includes a getter dispersed in the packaging plastic frame.
  • the packaging film layer has a stepped portion, which is arranged around the packaging film layer;
  • the packaging plastic frame has a protruding part protruding from a surface of the filling plastic body,
  • the protruding part of the encapsulating plastic frame matches the shape of the stepped part of the encapsulating film layer.
  • another embodiment of the present invention provides a manufacturing method of a display package structure, including the steps:
  • the cover body is combined with the display element substrate, wherein the extension part surrounds a side wall of the display element substrate, and the main body part is disposed on the display element substrate, so that a gap is formed in the display element substrate. Between the extension part and the side wall;
  • a sealant is provided and filled in the gap.
  • the manufacturing method of the display package structure includes: turning the cover over so that a display element substrate accommodation space of the display element substrate faces upward;
  • the filling gel and the sealing gel undergo a curing step at the same time, so that the filling gel and the sealing gel are cured to seal the display packaging structure.
  • a pre-curing step is performed, so that the filling colloid is transformed into a B-stage state.
  • the display packaging structure and manufacturing method of the present invention can reduce the distance from the OLED device to the edge of the display panel by wrapping the extension of the cover body around the side wall of the display element substrate without affecting the packaging effect. So as to achieve ultra-narrow frame design.
  • FIG. 1 is a schematic diagram of the display package structure of the first embodiment of the present invention.
  • FIGS 2A to 2D are schematic diagrams of the manufacturing method of the display package structure according to the first embodiment of the present invention.
  • FIG. 3 is a schematic diagram of the display package structure of the second embodiment of the present invention.
  • the first embodiment of the present invention provides a display structure in order to achieve the foregoing objective of the present invention.
  • the display structure includes: a cover 10 having a main body portion 11A and an extension portion 11B; and a display element substrate 20 having a substrate 21 provided with a plurality of display elements 22 .
  • a cover 10 having a main body portion 11A and an extension portion 11B
  • a display element substrate 20 having a substrate 21 provided with a plurality of display elements 22 .
  • an embodiment of the present invention provides a display packaging structure in order to achieve the foregoing objective of the present invention.
  • the cover 10 has the main body portion 11A in the shape of a flat plate and the extension portion 11B perpendicular to the main body portion 11A.
  • the extension portion 11B is arranged around the main body portion 11A to form A accommodating space for a display element substrate.
  • the cover 10 is a transparent glass cover 10.
  • a filler 12 is disposed in the display device substrate accommodating space formed by the main body portion 11A and the extension portion 11B, and the filler 12 is disposed in the display device substrate accommodating space On a surface of the main body portion 11A.
  • the filling colloid 12 is a transparent optical colloid.
  • the filled colloid 12 is a filled colloid 12 containing a phosphor that can excite blue, red, or green light.
  • the filled colloid 12 is a quantum dot film.
  • the cover 10 further includes: an encapsulating plastic frame 13 arranged on the main body portion 11A and arranged around a side wall of the extension portion 11B to form a filling gel containing space.
  • the filling gel 12 is filled in the filling gel containing space.
  • the packaging plastic frame 13 has a protrusion 13A protruding from a surface of the filling plastic body 12.
  • a thickness of the encapsulating plastic frame 13 is greater than a thickness of the filling plastic body 12.
  • the thickness of the packaging plastic frame 13 is twice the thickness of the filling plastic body 12.
  • the packaging plastic frame 13 includes a getter dispersed in the packaging plastic frame 13.
  • the plastic encapsulation frame 13 includes a desiccant dispersed in the plastic encapsulation frame 13.
  • the substrate 21 is a glass substrate.
  • the plurality of display elements 22 are a plurality of organic light emitting diode elements.
  • the display element substrate 20 includes: a first electrode layer, a hole transport layer (HTL), a light emitting layer (EL), an electron transport layer (ETL), and a second electrode layer.
  • the hole transport layer is provided on the first electrode layer; the light emitting layer is provided on the hole transport layer; the electron transport layer is provided on the light emitting layer; the second electrode layer is provided On the electron transport layer.
  • the first electrode layer is a transparent anode layer and the second electrode layer is a transparent cathode layer.
  • the first electrode layer and the second electrode layer are made of indium tin oxide (ITO).
  • the cover 10 is combined with the display element substrate 20, so that the extension portion 11B surrounds a side wall of the display element substrate 20, and the main body portion 11A is disposed on the On the display element substrate 20, a gap is formed between the extension portion 11B and the side wall; and a sealing compound 30 is filled in the gap.
  • the water vapor transmission rate of the sealant 30 at atmospheric pressure is less than 10-6 g/m2/day, and the oxygen transmission rate is less than 10-5 ml/m2/day.
  • a projection area of the display element substrate 20 is smaller than a projection area of the main body portion 11A, so that the display element substrate 20 can be embedded in the display element substrate accommodating space of the cover 10 as a whole.
  • the present invention can adjust the frame of the display through the thickness of the extension 11B and the gap. When a display design with a very narrow frame is to be realized, the thickness of the extension 11B and the width of the gap can be reduced to shorten The distance from the edge of the plurality of display elements to the extension portion 11B.
  • the display packaging structure further includes: an packaging film layer 23 is disposed on the display element substrate 20 to package the plurality of display elements 22.
  • the filling gel 12 is in contact with the packaging film layer 23 so that the filling gel 12 abuts against an upper surface of the packaging film layer 23.
  • the encapsulation plastic frame 13 and the encapsulation film layer 23 have a structural shape matching.
  • the packaging film layer 23 has a stepped portion 23A disposed around the packaging film layer 23; and the packaging rubber frame 13 has a protruding portion 13A protruding from a surface of the filling gel 12, wherein The protruding portion 13A of the encapsulating plastic frame 13 and the step portion 23A of the encapsulating film layer 23 have a shape matching.
  • FIGS. 2A to 2D show a schematic flow chart of a manufacturing method of a display package structure according to a first embodiment of the present invention.
  • the manufacturing method includes the steps:
  • (S11) Provide a cover body 10 having a main body portion 11A and an extension portion 11B;
  • a display element substrate 20 is provided, and a plurality of display elements 22 are provided on the display element substrate 20;
  • the plurality of display elements 22 are a plurality of organic light emitting diode elements.
  • the manufacturing method of the display packaging structure further includes: providing a packaging film layer 23 on the display element substrate 20 and packaging the plurality of display elements 22.
  • step of providing the cover 10 further includes: providing a filler 12 in a display element substrate accommodating space formed by the main body portion 11A and the extension portion 11B, and the filler 12 is disposed On a surface of the main body 11A in the accommodating space of the display element substrate.
  • the step of combining the cover body 10 with the display element substrate 20 further includes: contacting the filling gel 12 with the packaging film layer 23, so that the filling gel 12 Abut against an upper surface of the packaging film layer 23.
  • the filling gel 12 is filled in the filling gel containing space.
  • the packaging plastic frame 13 includes a getter dispersed in the packaging plastic frame 13.
  • the packaging film layer 23 has a stepped portion 23A disposed around the packaging film layer 23; and the packaging rubber frame 13 has a protruding portion 13A protruding from a surface of the filling gel 12, wherein The protruding portion 13A of the encapsulating plastic frame 13 and the step portion 23A of the encapsulating film layer 23 have a shape matching.
  • the manufacturing method of the display packaging structure includes:
  • the filling gel 12 and the sealing gel 30 are cured.
  • a pre-curing step is performed, so that the filled colloid 12 is transformed into a B-stage state.
  • the sealing compound 30 is filled in the gap, the filling compound 12 and the sealing compound 30 undergo a curing step at the same time, so that the filling compound 12 and the sealing compound 30 are cured to seal the display package structure.
  • FIG. 3 shows a schematic diagram of a display package structure according to a second embodiment of the present invention.
  • the display structure of the second embodiment of the present invention is similar to that of the first embodiment, and generally uses the same component names and drawing numbers. The difference is that an array cover with a plurality of cover units 10 is provided, and the array cover Each of the plurality of cover units 10 has a display element substrate accommodating space, and each of the display element substrate accommodating spaces is provided with a display element substrate 20 respectively. Furthermore, a gap between each cover unit 10 and each display element substrate 20 is filled with a sealant 30. After each cover unit 10 and each display element substrate 20 are packaged, all single steps are performed on the array cover to form multiple display packaging structures of the first embodiment.
  • the OLED device is formed on the substrate and the thin film encapsulation layer is made, and the cover glass is coated with UV-curable sealant and laser Encapsulated glass glue (Laser Sealing), or Dam & Fill sealant is cured to provide a relatively closed environment for the light emitting device, which can achieve good water/oxygen barrier capacity within a certain period of time.
  • Laser Sealing laser Encapsulated glass glue
  • Dam & Fill sealant is cured to provide a relatively closed environment for the light emitting device, which can achieve good water/oxygen barrier capacity within a certain period of time.
  • the existing packaging methods if the OLED device wants to achieve a narrow frame design, it is necessary to sacrifice the width of the packaging sealant, thereby affecting the packaging effect.
  • the display packaging structure and the manufacturing method thereof of the present invention can reduce the distance from the OLED device to the edge of the display panel without affecting the packaging effect by wrapping the extension of the cover body around the side wall of the display element substrate, thereby achieving an ultra-narrow frame design .

Abstract

A display packaging structure and a manufacturing method therefor. The display packaging structure comprises: a cover body (10) and a display element substrate (20), the cover body (10) being combined with the display element substrate (20), such that an extension portion (11B) of the cover body (10) surrounds a side wall of the display element substrate (20), and a gap is formed between the extension portion (11B) and the side wall; and a sealant (30), filled in the gap. The extension portion (11B) of the cover body (10) surrounds the side wall of the display element substrate (20), so that the distance from an OLED device to an edge of a display panel is reduced without affecting the packaging effect, thereby achieving ultra-narrow bezel design.

Description

显示器封装结构及其制造方法Display packaging structure and manufacturing method thereof 技术领域Technical field
本发明是有关于一种显示器封装结构及其制造方法,特别是有关于一种窄边框的显示器封装结构及其制造方法。The present invention relates to a display packaging structure and a manufacturing method thereof, and in particular to a display packaging structure with a narrow frame and a manufacturing method thereof.
背景技术Background technique
近年来,有机发光二极管 (Organic Light Emitting Diode, OLED)具有自发光性、高对比度、快速响应时间以及柔性显示等优势,因而广泛的应用。OLED显示与传统的液晶显示不用之处就在于OLED显示不需要采用背光模组。OLED器件通过电子和空穴两种载流子注入有机薄膜材料并在有机材料发光。但是有机材料对水汽和氧气非常敏感,水/氧渗透会大大缩减器件寿命,为达到商业化对于器件使用寿命和稳定性的要求,OLED器件对于封装效果要求非常高,例如,水汽透过率小于10-6克/平方米/天,氧气穿透率小于10-5毫升/平方米/天(1大气压力下)。因此封装在OLED器件制作中处于重要的位置,是影响产品良率的关键因素之一。目前随着大尺寸OLED显示面板的广泛应用,窄边框的OLED产品也越来越多消费者喜欢。In recent years, Organic Light Emitting Diode (OLED) has the advantages of self-luminescence, high contrast, fast response time, and flexible display, so it is widely used. The difference between OLED display and traditional liquid crystal display is that OLED display does not require a backlight module. OLED devices inject into organic thin film materials through electron and hole carriers and emit light on the organic material. However, organic materials are very sensitive to water vapor and oxygen, and water/oxygen penetration will greatly reduce the device life. In order to meet the requirements of commercialization for device life and stability, OLED devices have very high requirements for packaging effects. For example, the water vapor transmission rate is less than 10-6 g/m²/day, oxygen transmission rate is less than 10-5 ml/m²/day (under 1 atmospheric pressure). Therefore, packaging plays an important role in the production of OLED devices and is one of the key factors affecting product yield. At present, with the widespread application of large-size OLED display panels, more and more consumers like OLED products with narrow bezels.
现有OLED器件的封装方式主要为玻璃封装,在基板上形成OLED器件及制作薄膜封装层,在盖体玻璃上涂覆可以紫外光(UV)固化的框胶、激光封装的玻璃胶(Laser sealing),或围堰填充(Dam & Fill)框胶后经过固化后为发光器件提供一个相对密闭的环境,在一定时间内可以达到良好的水/氧阻隔能力。The encapsulation method of the existing OLED devices is mainly glass encapsulation. The OLED device is formed on the substrate and the thin film encapsulation layer is made. The cover glass is coated with UV-curable sealant and laser encapsulated glass glue (Laser Sealing), or Dam & Fill sealant is cured to provide a relatively closed environment for the light emitting device, which can achieve good water/oxygen barrier capacity within a certain period of time.
但上述的封装方式中,OLED器件到基板边缘的距离是显示设备的边框。如欲达到窄边框的设计,需要牺牲封装框胶的宽度,从而影响封装效果,因此很难达到更窄的边框设计。However, in the aforementioned packaging method, the distance from the OLED device to the edge of the substrate is the frame of the display device. To achieve a narrow frame design, the width of the package sealant needs to be sacrificed, thereby affecting the packaging effect, so it is difficult to achieve a narrower frame design.
故,有必要提供一种显示器封装结构及其制造方法,以解决现有技术所存在的问题。Therefore, it is necessary to provide a display packaging structure and a manufacturing method thereof to solve the problems existing in the prior art.
技术问题technical problem
现有技术中OLED器件到基板边缘的距离是显示设备的边框。如欲达到窄边框的设计,需要牺牲封装框胶的宽度,从而影响封装效果,因此很难达到更窄的边框设计。In the prior art, the distance from the OLED device to the edge of the substrate is the frame of the display device. To achieve a narrow frame design, the width of the package sealant needs to be sacrificed, thereby affecting the packaging effect, so it is difficult to achieve a narrower frame design.
技术解决方案Technical solutions
有鉴于此,本发明提供一种显示器封装结构及其制造方法,以解决现有技术所存在的需要牺牲封装框胶的宽度,以达到窄边框设计的问题。In view of this, the present invention provides a display packaging structure and a manufacturing method thereof to solve the problem of sacrificing the width of the packaging sealant in the prior art to achieve a narrow frame design.
本发明的主要目的在于提供一种显示器封装结构及其制造方法,其可以不需要牺牲封装框胶的宽度,避免影响封装效果,从而达到更窄的边框设计。The main purpose of the present invention is to provide a display packaging structure and a manufacturing method thereof, which can avoid sacrificing the width of the packaging sealant and avoid affecting the packaging effect, thereby achieving a narrower frame design.
本发明的次要目的在于提供一种显示器封装结构及其制造方法,其可以减少OLED器件到显示面板边缘的距离,且不影响封装效果,从而达到超窄的边框设计。The secondary objective of the present invention is to provide a display packaging structure and a manufacturing method thereof, which can reduce the distance from the OLED device to the edge of the display panel without affecting the packaging effect, thereby achieving an ultra-narrow frame design.
为达成本发明的前述目的,本发明一实施例提供一种显示器封装结构,包含:To achieve the foregoing objective of the present invention, an embodiment of the present invention provides a display packaging structure, including:
一盖体,所述盖体具有一主体部及与所述主体部相垂直的一延伸部;A cover, the cover has a main body and an extension perpendicular to the main body;
一显示器元件基板,设置有多个显示器元件;其中所述盖体与所述显示器元件基板相结合,使得所述延伸部环绕所述显示器元件基板的一侧壁,且所述主体部设置于所述显示器元件基板上,使得一间隙形成于所述延伸部与所述侧壁之间;A display element substrate is provided with a plurality of display elements; wherein the cover body is combined with the display element substrate so that the extension part surrounds a side wall of the display element substrate, and the main body part is arranged on the On the display element substrate, a gap is formed between the extension portion and the side wall;
一填充胶体设置于所述盖体内的所述主体部与所述延伸部形成的一显示器元件基板容置空间中;及A filling gel is arranged in a display element substrate accommodating space formed by the main body part and the extension part in the cover; and
一密封胶体,填充于所述间隙内。A sealant is filled in the gap.
本发明的一实施例中,所述多个显示器元件为多个有机发光二极管元件。In an embodiment of the present invention, the plurality of display elements are a plurality of organic light emitting diode elements.
本发明的一实施例中,所述显示器封装结构更包含:一封装薄膜层设置于所述显示器元件基板上,且封装所述多个显示器元件。In an embodiment of the present invention, the display packaging structure further includes: an packaging film layer is disposed on the display element substrate and encapsulates the plurality of display elements.
本发明的一实施例中,所述显示器封装结构更包含:所述填充胶体设置于所述显示器元件基板容置空间内的所述主体部的一表面上。In an embodiment of the present invention, the display packaging structure further includes: the filling compound is disposed on a surface of the main body in the accommodating space of the display element substrate.
本发明的一实施例中,所述填充胶体与所述封装薄膜层相接触,使得所述填充胶体抵靠所述封装薄膜层的一上表面。In an embodiment of the present invention, the filling colloid is in contact with the packaging film layer, so that the filling colloid abuts against an upper surface of the packaging film layer.
本发明的一实施例中,所述显示器封装结构更包含:一封装胶框设置于所述主体部上,且环绕所述延伸部的一侧壁设置而形成一填充胶体容置空间,其中所述填充胶体填充于所述填充胶体容置空间中。In an embodiment of the present invention, the display packaging structure further includes: a packaging plastic frame is disposed on the main body part, and is disposed around a side wall of the extension part to form a filling plastic containing space, wherein The filling colloid is filled in the filling colloid containing space.
本发明的一实施例中,所述封装胶框包含一吸气剂,分散于所述封装胶框中。In an embodiment of the present invention, the packaging plastic frame includes a getter dispersed in the packaging plastic frame.
本发明的一实施例中,所述封装薄膜层具有一阶梯部,环绕所述封装薄膜层设置;及In an embodiment of the present invention, the packaging film layer has a stepped portion, which is arranged around the packaging film layer; and
所述封装胶框具有一突出部,突出于所述填充胶体的一表面,The packaging plastic frame has a protruding part protruding from a surface of the filling plastic body,
其中所述封装胶框的所述突出部与所述封装薄膜层的所述阶梯部构成形状相匹配。Wherein, the protruding part of the encapsulating plastic frame matches the shape of the stepped part of the encapsulating film layer.
再者,本发明的另一实施例提供一种显示器封装结构,包含:Furthermore, another embodiment of the present invention provides a display packaging structure, including:
一盖体,所述盖体具有一主体部及一延伸部;A cover, the cover has a main body and an extension;
一显示器元件基板,设置有多个显示器元件;其中所述盖体与所述显示器元件基板相结合,使得所述延伸部环绕所述显示器元件基板的一侧壁,且所述主体部设置于所述显示器元件基板上,使得一间隙形成于所述延伸部与所述侧壁之间;及A display element substrate is provided with a plurality of display elements; wherein the cover body is combined with the display element substrate so that the extension part surrounds a side wall of the display element substrate, and the main body part is arranged on the On the display element substrate, a gap is formed between the extension portion and the side wall; and
一密封胶体,填充于所述间隙内。A sealant is filled in the gap.
本发明的一实施例中,所述多个显示器元件为多个有机发光二极管元件。In an embodiment of the present invention, the plurality of display elements are a plurality of organic light emitting diode elements.
本发明的一实施例中,所述显示器封装结构更包含:一封装薄膜层设置于所述显示器元件基板上,且封装所述多个显示器元件。In an embodiment of the present invention, the display packaging structure further includes: an packaging film layer is disposed on the display element substrate and encapsulates the plurality of display elements.
本发明的一实施例中,所述显示器封装结构更包含:一填充胶体设置于所述主体部与所述延伸部形成的一显示器元件基板容置空间中,且所述填充胶体设置于所述显示器元件基板容置空间内的所述主体部的一表面上。In an embodiment of the present invention, the display packaging structure further includes: a filler is disposed in a display element substrate accommodating space formed by the main body portion and the extension portion, and the filler is disposed on the On a surface of the main body in the accommodating space of the display element substrate.
本发明的一实施例中,所述填充胶体与所述封装薄膜层相接触,使得所述填充胶体抵靠所述封装薄膜层的一上表面。In an embodiment of the present invention, the filling colloid is in contact with the packaging film layer, so that the filling colloid abuts against an upper surface of the packaging film layer.
本发明的一实施例中,所述显示器封装结构更包含:一封装胶框设置于所述主体部上,且环绕所述延伸部的一侧壁设置而形成一填充胶体容置空间,其中所述填充胶体填充于所述填充胶体容置空间中。In an embodiment of the present invention, the display packaging structure further includes: a packaging plastic frame is disposed on the main body part, and is disposed around a side wall of the extension part to form a filling plastic containing space, wherein The filling colloid is filled in the filling colloid containing space.
本发明的一实施例中,所述封装胶框包含一吸气剂,分散于所述封装胶框中。In an embodiment of the present invention, the packaging plastic frame includes a getter dispersed in the packaging plastic frame.
本发明的一实施例中,所述封装薄膜层具有一阶梯部,环绕所述封装薄膜层设置;及In an embodiment of the present invention, the packaging film layer has a stepped portion, which is arranged around the packaging film layer; and
所述封装胶框具有一突出部,突出于所述填充胶体的一表面,The packaging plastic frame has a protruding part protruding from a surface of the filling plastic body,
其中所述封装胶框的所述突出部与所述封装薄膜层的所述阶梯部构成形状相匹配。Wherein, the protruding part of the encapsulating plastic frame matches the shape of the stepped part of the encapsulating film layer.
另外,本发明的又一实施例提供一种显示器封装结构的制造方法,包含步骤:In addition, another embodiment of the present invention provides a manufacturing method of a display package structure, including the steps:
提供一盖体,所述盖体具有一主体部及一延伸部;Providing a cover having a main body and an extension;
提供一显示器元件基板,所述显示器元件基板上设置有多个显示器元件;Providing a display element substrate on which a plurality of display elements are arranged;
将所述盖体与所述显示器元件基板相结合,其中所述延伸部环绕所述显示器元件基板的一侧壁,且所述主体部设置于所述显示器元件基板上,使得一间隙形成于所述延伸部与所述侧壁之间;及The cover body is combined with the display element substrate, wherein the extension part surrounds a side wall of the display element substrate, and the main body part is disposed on the display element substrate, so that a gap is formed in the display element substrate. Between the extension part and the side wall; and
提供一密封胶体,填充于所述间隙内。A sealant is provided and filled in the gap.
本发明的一实施例中,所述显示器封装结构的制造方法包含:将所述盖体翻转,使得所述显示器元件基板的一显示器元件基板容置空间朝上;In an embodiment of the present invention, the manufacturing method of the display package structure includes: turning the cover over so that a display element substrate accommodation space of the display element substrate faces upward;
将所述显示器元件基板设置于所述显示器元件基板容置空间中,且抵靠设置在所述盖体上的一填充胶体,其中所述填充胶体未固化;Disposing the display element substrate in the accommodating space of the display element substrate and abutting against a filling colloid provided on the cover, wherein the filling colloid is not cured;
将所述密封胶体填充于所述间隙内;及Filling the sealant in the gap; and
固化所述填充胶体及所述密封胶体。Curing the filling colloid and the sealing colloid.
本发明的一实施例中,述填充胶体及所述密封胶体同时进行一固化步骤,使得所述填充胶体及所述密封胶体固化进而密封所述显示器封装结构。In an embodiment of the present invention, the filling gel and the sealing gel undergo a curing step at the same time, so that the filling gel and the sealing gel are cured to seal the display packaging structure.
本发明的一实施例中,将所述填充胶体填充于所述填充胶体容置空间中后,进行一预固化步骤,使得所述填充胶体转变为B阶段(B-stage)状态。In an embodiment of the present invention, after the filling colloid is filled in the filling colloid accommodating space, a pre-curing step is performed, so that the filling colloid is transformed into a B-stage state.
有益效果Beneficial effect
与现有技术相比较,本发明的显示器封装结构及其制造方法,可以通过将盖体的延伸部环绕显示器元件基板的侧壁,进而减少OLED器件到显示面板边缘的距离且不影响封装效果,从而达到超窄的边框设计。Compared with the prior art, the display packaging structure and manufacturing method of the present invention can reduce the distance from the OLED device to the edge of the display panel by wrapping the extension of the cover body around the side wall of the display element substrate without affecting the packaging effect. So as to achieve ultra-narrow frame design.
附图说明Description of the drawings
为让本发明的上述内容能更明显易懂,下文特举优选实施例,并配合所附图式,作详细说明如下:In order to make the above-mentioned content of the present invention more obvious and understandable, the following is a detailed description of preferred embodiments in conjunction with the accompanying drawings:
图1是本发明第一实施例的显示器封装结构示意图。FIG. 1 is a schematic diagram of the display package structure of the first embodiment of the present invention.
图2A至图2D是本发明第一实施例的显示器封装结构的制造方法流程示意图。2A to 2D are schematic diagrams of the manufacturing method of the display package structure according to the first embodiment of the present invention.
图3是本发明第二实施例的显示器封装结构示意图。3 is a schematic diagram of the display package structure of the second embodiment of the present invention.
本发明的实施方式Embodiments of the invention
以下各实施例的说明是参考附加的图式,用以例示本发明可用以实施的特定实施例。再者,本发明所提到的方向用语,例如上、下、顶、底、前、后、左、右、内、外、侧面、周围、中央、水平、横向、垂直、纵向、轴向、径向、最上层或最下层等,仅是参考附加图式的方向。因此,使用的方向用语是用以说明及理解本发明,而非用以限制本发明。The description of the following embodiments refers to the attached drawings to illustrate specific embodiments that the present invention can be implemented. Furthermore, the directional terms mentioned in the present invention, such as up, down, top, bottom, front, back, left, right, inside, outside, side, surrounding, center, horizontal, horizontal, vertical, vertical, axial, The radial direction, the uppermost layer or the lowermost layer, etc., are only the direction of reference to the attached drawings. Therefore, the directional terms used are used to describe and understand the present invention, rather than to limit the present invention.
请参照图1所示,本发明第一实施例为达成本发明的前述目的,提供一种显示器结构。所述显示器结构包含:一盖体10,所述盖体10具有一主体部11A及一延伸部11B;及一显示器元件基板20,具有一基板21,所述基板21设置有多个显示器元件22。下文将利用图1逐一详细说明本发明的第一实施例的上述各元件的细部构造、组装关系及其运作原理。Please refer to FIG. 1, the first embodiment of the present invention provides a display structure in order to achieve the foregoing objective of the present invention. The display structure includes: a cover 10 having a main body portion 11A and an extension portion 11B; and a display element substrate 20 having a substrate 21 provided with a plurality of display elements 22 . Hereinafter, the detailed structure, assembly relationship and operation principle of the above-mentioned components of the first embodiment of the present invention will be described in detail by using FIG. 1.
请参照图1所示,本发明实施例为达成本发明的前述目的,提供一种显示器封装结构。本实施例中,所述盖体10具有平板状的所述主体部11A及与所述主体部11A相垂直的所述延伸部11B,所述延伸部11B环绕所述主体部11A设置,以形成一显示器元件基板容置空间。优选地,所述盖体10为一透明玻璃盖体10。Please refer to FIG. 1, an embodiment of the present invention provides a display packaging structure in order to achieve the foregoing objective of the present invention. In this embodiment, the cover 10 has the main body portion 11A in the shape of a flat plate and the extension portion 11B perpendicular to the main body portion 11A. The extension portion 11B is arranged around the main body portion 11A to form A accommodating space for a display element substrate. Preferably, the cover 10 is a transparent glass cover 10.
可选地,一填充胶体12设置于所述主体部11A与所述延伸部11B形成的所述显示器元件基板容置空间中,且所述填充胶体12设置于所述显示器元件基板容置空间内的所述主体部11A的一表面上。优选地,所述填充胶体12为一透明光学胶体。替代地,所述填充胶体12为包含可激发蓝光、红光、或绿光的一萤光粉的填充胶体12。再者,替代地,所述填充胶体12为一量子点薄膜。Optionally, a filler 12 is disposed in the display device substrate accommodating space formed by the main body portion 11A and the extension portion 11B, and the filler 12 is disposed in the display device substrate accommodating space On a surface of the main body portion 11A. Preferably, the filling colloid 12 is a transparent optical colloid. Alternatively, the filled colloid 12 is a filled colloid 12 containing a phosphor that can excite blue, red, or green light. Furthermore, alternatively, the filled colloid 12 is a quantum dot film.
可选地,所述盖体10更包含:一封装胶框13设置于所述主体部11A上,且环绕所述延伸部11B的一侧壁设置而形成一填充胶体容置空间。优选地,所述填充胶体12填充于所述填充胶体容置空间中。可选地,所述封装胶框13具有一突出部13A,突出于所述填充胶体12的一表面。本实施例中,所述封装胶框13的一厚度大于所述填充胶体12的一厚度。例如,所述封装胶框13的所述厚度为所述填充胶体12的所述厚度的两倍。Optionally, the cover 10 further includes: an encapsulating plastic frame 13 arranged on the main body portion 11A and arranged around a side wall of the extension portion 11B to form a filling gel containing space. Preferably, the filling gel 12 is filled in the filling gel containing space. Optionally, the packaging plastic frame 13 has a protrusion 13A protruding from a surface of the filling plastic body 12. In this embodiment, a thickness of the encapsulating plastic frame 13 is greater than a thickness of the filling plastic body 12. For example, the thickness of the packaging plastic frame 13 is twice the thickness of the filling plastic body 12.
优选地,所述封装胶框13包含一吸气剂,分散于所述封装胶框13中。替代地,所述封装胶框13包含一干燥剂,分散于所述封装胶框13中。Preferably, the packaging plastic frame 13 includes a getter dispersed in the packaging plastic frame 13. Alternatively, the plastic encapsulation frame 13 includes a desiccant dispersed in the plastic encapsulation frame 13.
本实施例中,所述基板21为一玻璃基板。优选地,所述多个显示器元件22为多个有机发光二极管元件。本实施例中,所述显示器元件基板20包含:一第一电极层、一空穴传输层(HTL)、一发光层(EL)、一电子传输层(ETL)及一第二电极层。所述空穴传输层设置于所述第一电极层上;所述发光层设置于所述空穴传输层上;所述电子传输层设置于所述发光层上;所述第二电极层设置于所述电子传输层上。优选地,所述第一电极层为一透明阳极层且所述第二电极层为一透明阴极层。优选地,所述第一电极层及所述第二电极层为铟锡氧化物(ITO)构成。In this embodiment, the substrate 21 is a glass substrate. Preferably, the plurality of display elements 22 are a plurality of organic light emitting diode elements. In this embodiment, the display element substrate 20 includes: a first electrode layer, a hole transport layer (HTL), a light emitting layer (EL), an electron transport layer (ETL), and a second electrode layer. The hole transport layer is provided on the first electrode layer; the light emitting layer is provided on the hole transport layer; the electron transport layer is provided on the light emitting layer; the second electrode layer is provided On the electron transport layer. Preferably, the first electrode layer is a transparent anode layer and the second electrode layer is a transparent cathode layer. Preferably, the first electrode layer and the second electrode layer are made of indium tin oxide (ITO).
同样参照图1所示,所述盖体10与所述显示器元件基板20相结合,使得所述延伸部11B环绕所述显示器元件基板20的一侧壁,且所述主体部11A设置于所述显示器元件基板20上,使得一间隙形成于所述延伸部11B与所述侧壁之间;及一密封胶体30,填充于所述间隙内。优选地,所述密封胶体30在一大气压下水汽透过率小于10-6克/平方米/天,氧气穿透率小于10-5毫升/平方米/天。1, the cover 10 is combined with the display element substrate 20, so that the extension portion 11B surrounds a side wall of the display element substrate 20, and the main body portion 11A is disposed on the On the display element substrate 20, a gap is formed between the extension portion 11B and the side wall; and a sealing compound 30 is filled in the gap. Preferably, the water vapor transmission rate of the sealant 30 at atmospheric pressure is less than 10-6 g/m²/day, and the oxygen transmission rate is less than 10-5 ml/m²/day.
优选地,所述显示器元件基板20的一投影面积小于所述主体部11A的一投影面积,使得所述显示器元件基板20能够整体嵌入所述盖体10的所述显示器元件基板容置空间中。本发明可以通过所述延伸部11B的厚度及所述间隙的调整显示器的边框,当欲实现极窄边框的显示器设计时,可以减少所述延伸部11B的厚度及所述间隙的宽度,以缩短所述多个显示元件边缘至所述延伸部11B的距离。Preferably, a projection area of the display element substrate 20 is smaller than a projection area of the main body portion 11A, so that the display element substrate 20 can be embedded in the display element substrate accommodating space of the cover 10 as a whole. The present invention can adjust the frame of the display through the thickness of the extension 11B and the gap. When a display design with a very narrow frame is to be realized, the thickness of the extension 11B and the width of the gap can be reduced to shorten The distance from the edge of the plurality of display elements to the extension portion 11B.
本实施例中,所述显示器封装结构更包含:所述显示器元件基板20上设置有一封装薄膜层23以封装所述多个显示器元件22。In this embodiment, the display packaging structure further includes: an packaging film layer 23 is disposed on the display element substrate 20 to package the plurality of display elements 22.
优选地,所述填充胶体12与所述封装薄膜层23相接触,使得所述填充胶体12抵靠所述封装薄膜层23的一上表面。Preferably, the filling gel 12 is in contact with the packaging film layer 23 so that the filling gel 12 abuts against an upper surface of the packaging film layer 23.
可选地,所述封装胶框13与所述封装薄膜层23的构成形状相匹配。优选地,所述封装薄膜层23具有一阶梯部23A,环绕所述封装薄膜层23设置;及所述封装胶框13具有一突出部13A,突出于所述填充胶体12的一表面,其中所述封装胶框13的所述突出部13A与所述封装薄膜层23的所述阶梯部23A构成形状相匹配。Optionally, the encapsulation plastic frame 13 and the encapsulation film layer 23 have a structural shape matching. Preferably, the packaging film layer 23 has a stepped portion 23A disposed around the packaging film layer 23; and the packaging rubber frame 13 has a protruding portion 13A protruding from a surface of the filling gel 12, wherein The protruding portion 13A of the encapsulating plastic frame 13 and the step portion 23A of the encapsulating film layer 23 have a shape matching.
请参照图2A至图2D所示,示出了本发明第一实施例的显示器封装结构的制造方法流程示意图。所述制造方法,包含步骤:Please refer to FIGS. 2A to 2D, which show a schematic flow chart of a manufacturing method of a display package structure according to a first embodiment of the present invention. The manufacturing method includes the steps:
(S11)提供一盖体10,所述盖体10具有一主体部11A及一延伸部11B;(S11) Provide a cover body 10 having a main body portion 11A and an extension portion 11B;
(S12)提供一显示器元件基板20,所述显示器元件基板20上设置有多个显示器元件22;(S12) A display element substrate 20 is provided, and a plurality of display elements 22 are provided on the display element substrate 20;
(S13)将所述盖体10与所述显示器元件基板20相结合,其中所述延伸部11B环绕所述显示器元件基板20的一侧壁,且所述主体部11A设置于所述显示器元件基板20上,使得一间隙形成于所述延伸部11B与所述侧壁之间;及(S13) Combine the cover 10 with the display element substrate 20, wherein the extension portion 11B surrounds a side wall of the display element substrate 20, and the main body portion 11A is disposed on the display element substrate 20, so that a gap is formed between the extension portion 11B and the side wall; and
(S14)提供一密封胶体30,填充于所述间隙内。(S14) Provide a sealant 30 to fill the gap.
优选地,所述多个显示器元件22为多个有机发光二极管元件。Preferably, the plurality of display elements 22 are a plurality of organic light emitting diode elements.
所述显示器封装结构的制造方法更包含:提供一封装薄膜层23于所述显示器元件基板20上,且封装所述多个显示器元件22。The manufacturing method of the display packaging structure further includes: providing a packaging film layer 23 on the display element substrate 20 and packaging the plurality of display elements 22.
上述的提供所述盖体10的步骤中,更包含:提供一填充胶体12于所述主体部11A与所述延伸部11B形成的一显示器元件基板容置空间中,且所述填充胶体12设置于所述显示器元件基板容置空间内的所述主体部11A的一表面上。In the above step of providing the cover 10, it further includes: providing a filler 12 in a display element substrate accommodating space formed by the main body portion 11A and the extension portion 11B, and the filler 12 is disposed On a surface of the main body 11A in the accommodating space of the display element substrate.
本实施例中,上述将所述盖体10与所述显示器元件基板20相结合的步骤中,更包含:将所述填充胶体12与所述封装薄膜层23相接触,使得所述填充胶体12抵靠所述封装薄膜层23的一上表面。In this embodiment, the step of combining the cover body 10 with the display element substrate 20 further includes: contacting the filling gel 12 with the packaging film layer 23, so that the filling gel 12 Abut against an upper surface of the packaging film layer 23.
可选地,在提供所述填充胶体12的步骤前,更包含:Optionally, before providing the step of filling the colloid 12, it further comprises:
提供一封装胶框13于所述主体部11A上,且环绕所述延伸部11B的一侧壁设置,以形成一填充胶体容置空间;及Providing an encapsulating plastic frame 13 on the main body portion 11A and surrounding a side wall of the extension portion 11B to form a filling gel containing space; and
将所述填充胶体12填充于所述填充胶体容置空间中。The filling gel 12 is filled in the filling gel containing space.
可选地,所述封装胶框13包含一吸气剂,分散于所述封装胶框13中。Optionally, the packaging plastic frame 13 includes a getter dispersed in the packaging plastic frame 13.
可选地,所述封装薄膜层23具有一阶梯部23A,环绕所述封装薄膜层23设置;及所述封装胶框13具有一突出部13A,突出于所述填充胶体12的一表面,其中所述封装胶框13的所述突出部13A与所述封装薄膜层23的所述阶梯部23A构成形状相匹配。Optionally, the packaging film layer 23 has a stepped portion 23A disposed around the packaging film layer 23; and the packaging rubber frame 13 has a protruding portion 13A protruding from a surface of the filling gel 12, wherein The protruding portion 13A of the encapsulating plastic frame 13 and the step portion 23A of the encapsulating film layer 23 have a shape matching.
优选地,所述显示器封装结构的制造方法包含:Preferably, the manufacturing method of the display packaging structure includes:
将所述盖体10翻转,使得所述显示器元件基板20的所述显示器元件基板容置空间朝上;Turn the cover body 10 over so that the display element substrate accommodation space of the display element substrate 20 faces upward;
将所述显示器元件基板20设置于所述显示器元件基板容置空间中,且抵靠设置在所述盖体10上的所述填充胶体12,其中所述填充胶体12未固化;Placing the display element substrate 20 in the accommodating space of the display element substrate, and abutting against the filling gel 12 provided on the cover 10, wherein the filling gel 12 is not cured;
将所述密封胶体30填充于所述间隙内;及Filling the sealant 30 in the gap; and
固化所述填充胶体12及所述密封胶体30。The filling gel 12 and the sealing gel 30 are cured.
优选地,将所述填充胶体12填充于所述填充胶体容置空间中后,进行一预固化步骤,使得所述填充胶体12转变为B阶段(B-stage)状态。将所述密封胶体30填充于所述间隙内后,所述填充胶体12及所述密封胶体30同时进行一固化步骤,使得所述填充胶体12及所述密封胶体30固化进而密封所述显示器封装结构。Preferably, after the filled colloid 12 is filled in the filled colloid accommodating space, a pre-curing step is performed, so that the filled colloid 12 is transformed into a B-stage state. After the sealing compound 30 is filled in the gap, the filling compound 12 and the sealing compound 30 undergo a curing step at the same time, so that the filling compound 12 and the sealing compound 30 are cured to seal the display package structure.
请参照图3所示,示出了本发明第二实施例的显示器封装结构示意图。本发明第二实施例的显示器结构与第一实施例相似,并大致沿用相同元件名称及图号,其差异在于:提供具有多个盖体单元10的一阵列盖体,所述阵列盖体中的所述多个盖体单元10中的每一个具有一显示器元件基板容置空间,每个所述显示器元件基板容置空间中分别设置有一显示器元件基板20。再者,每个所述盖体单元10与每个所述显示器元件基板20间的一间隙填充有一密封胶体30。当每个所述盖体单元10与每个所述显示器元件基板20封装完成后,对所述阵列盖体进行一切单步骤,以形成多个第一实施例的显示器封装结构。Please refer to FIG. 3, which shows a schematic diagram of a display package structure according to a second embodiment of the present invention. The display structure of the second embodiment of the present invention is similar to that of the first embodiment, and generally uses the same component names and drawing numbers. The difference is that an array cover with a plurality of cover units 10 is provided, and the array cover Each of the plurality of cover units 10 has a display element substrate accommodating space, and each of the display element substrate accommodating spaces is provided with a display element substrate 20 respectively. Furthermore, a gap between each cover unit 10 and each display element substrate 20 is filled with a sealant 30. After each cover unit 10 and each display element substrate 20 are packaged, all single steps are performed on the array cover to form multiple display packaging structures of the first embodiment.
如上所述,相较于现有OLED器件的封装方式主要为玻璃封装,在基板上形成OLED器件及制作薄膜封装层,在盖体玻璃上涂覆可以紫外光(UV)固化的框胶、激光封装的玻璃胶(Laser sealing),或围堰填充(Dam & Fill)框胶后经过固化后为发光器件提供一个相对密闭的环境,在一定时间内可以达到良好的水/氧阻隔能力。但现有封装方式中,OLED器件如欲达到窄边框的设计,需要牺牲封装框胶的宽度,从而影响封装效果。本发明的显示器封装结构及其制造方法,可以通过将盖体的延伸部环绕显示器元件基板的侧壁,进而减少OLED器件到显示面板边缘的距离且不影响封装效果,从而达到超窄的边框设计。As mentioned above, compared with the existing OLED device encapsulation method is mainly glass encapsulation, the OLED device is formed on the substrate and the thin film encapsulation layer is made, and the cover glass is coated with UV-curable sealant and laser Encapsulated glass glue (Laser Sealing), or Dam & Fill sealant is cured to provide a relatively closed environment for the light emitting device, which can achieve good water/oxygen barrier capacity within a certain period of time. However, in the existing packaging methods, if the OLED device wants to achieve a narrow frame design, it is necessary to sacrifice the width of the packaging sealant, thereby affecting the packaging effect. The display packaging structure and the manufacturing method thereof of the present invention can reduce the distance from the OLED device to the edge of the display panel without affecting the packaging effect by wrapping the extension of the cover body around the side wall of the display element substrate, thereby achieving an ultra-narrow frame design .
本发明已由上述相关实施例加以描述,然而上述实施例仅为实施本发明的范例。必需指出的是,已公开的实施例并未限制本发明的范围。相反地,包含于权利要求书的精神及范围的修改及均等设置均包括于本发明的范围内。The present invention has been described in the above-mentioned related embodiments, but the above-mentioned embodiments are only examples for implementing the present invention. It must be pointed out that the disclosed embodiments do not limit the scope of the present invention. On the contrary, modifications and equivalent arrangements included in the spirit and scope of the claims are all included in the scope of the present invention.

Claims (20)

  1. 一种显示器封装结构,包含:A display packaging structure, including:
    一盖体,所述盖体具有一主体部及与所述主体部相垂直的一延伸部;A cover, the cover has a main body and an extension perpendicular to the main body;
    一显示器元件基板,设置有多个显示器元件;其中所述盖体与所述显示器元件基板相结合,使得所述延伸部环绕所述显示器元件基板的一侧壁,且所述主体部设置于所述显示器元件基板上,使得一间隙形成于所述延伸部与所述侧壁之间;A display element substrate is provided with a plurality of display elements; wherein the cover body is combined with the display element substrate so that the extension part surrounds a side wall of the display element substrate, and the main body part is arranged on the On the display element substrate, a gap is formed between the extension portion and the side wall;
    一填充胶体设置于所述盖体内的所述主体部与所述延伸部形成的一显示器元件基板容置空间中;及A filling gel is arranged in a display element substrate accommodating space formed by the main body part and the extension part in the cover; and
    一密封胶体,填充于所述间隙内。A sealant is filled in the gap.
  2. 如权利要求1所述的显示器封装结构,其中所述多个显示器元件为多个有机发光二极管元件。8. The display packaging structure of claim 1, wherein the plurality of display elements are a plurality of organic light emitting diode elements.
  3. 如权利要求1所述的显示器封装结构,其中所述显示器封装结构更包含:一封装薄膜层设置于所述显示器元件基板上,且封装所述多个显示器元件。2. The display packaging structure of claim 1, wherein the display packaging structure further comprises: an packaging film layer is disposed on the display element substrate and encapsulates the plurality of display elements.
  4. 如权利要求1所述的显示器封装结构,其中所述显示器封装结构更包含:所述填充胶体设置于所述显示器元件基板容置空间内的所述主体部的一表面上。3. The display packaging structure of claim 1, wherein the display packaging structure further comprises: the filling compound is disposed on a surface of the main body in the accommodating space of the display element substrate.
  5. 如权利要求4所述的显示器封装结构,其中所述填充胶体与所述封装薄膜层相接触,使得所述填充胶体抵靠所述封装薄膜层的一上表面。7. The display packaging structure of claim 4, wherein the filling gel is in contact with the packaging film layer, so that the filling gel abuts against an upper surface of the packaging film layer.
  6. 如权利要求4所述的显示器封装结构,其中所述显示器封装结构更包含:一封装胶框设置于所述主体部上,且环绕所述延伸部的一侧壁设置而形成一填充胶体容置空间,其中所述填充胶体填充于所述填充胶体容置空间中。4. The display packaging structure of claim 4, wherein the display packaging structure further comprises: a packaging plastic frame is disposed on the main body portion, and is disposed around a side wall of the extension portion to form a filling plastic housing Space, wherein the filling colloid is filled in the filling colloid containing space.
  7. 如权利要求6所述的显示器封装结构,其中所述封装胶框包含一吸气剂,分散于所述封装胶框中。7. The display packaging structure of claim 6, wherein the packaging plastic frame includes a getter dispersed in the packaging plastic frame.
  8. 如权利要求6所述的显示器封装结构,其中所述封装薄膜层具有一阶梯部,环绕所述封装薄膜层设置;及7. The display packaging structure of claim 6, wherein the packaging film layer has a stepped portion disposed around the packaging film layer; and
    所述封装胶框具有一突出部,突出于所述填充胶体的一表面,The packaging plastic frame has a protruding part protruding from a surface of the filling plastic body,
    其中所述封装胶框的所述突出部与所述封装薄膜层的所述阶梯部构成形状相匹配。Wherein, the protruding part of the encapsulating plastic frame matches the shape of the stepped part of the encapsulating film layer.
  9. 一种显示器封装结构,包含:A display packaging structure, including:
    一盖体,所述盖体具有一主体部及一延伸部;A cover, the cover has a main body and an extension;
    一显示器元件基板,设置有多个显示器元件;其中所述盖体与所述显示器元件基板相结合,使得所述延伸部环绕所述显示器元件基板的一侧壁,且所述主体部设置于所述显示器元件基板上,使得一间隙形成于所述延伸部与所述侧壁之间;及A display element substrate is provided with a plurality of display elements; wherein the cover body is combined with the display element substrate so that the extension part surrounds a side wall of the display element substrate, and the main body part is arranged on the On the display element substrate, a gap is formed between the extension portion and the side wall; and
    一密封胶体,填充于所述间隙内。A sealant is filled in the gap.
  10. 如权利要求9所述的显示器封装结构,其中所述多个显示器元件为多个有机发光二极管元件。9. The display packaging structure of claim 9, wherein the plurality of display elements are a plurality of organic light emitting diode elements.
  11. 如权利要求9所述的显示器封装结构,其中所述显示器封装结构更包含:一封装薄膜层设置于所述显示器元件基板上,且封装所述多个显示器元件。9. The display packaging structure of claim 9, wherein the display packaging structure further comprises: an packaging film layer disposed on the display element substrate and packaging the plurality of display elements.
  12. 如权利要求9所述的显示器封装结构,其中所述显示器封装结构更包含:一填充胶体设置于所述主体部与所述延伸部形成的一显示器元件基板容置空间中,且所述填充胶体设置于所述显示器元件基板容置空间内的所述主体部的一表面上。9. The display packaging structure of claim 9, wherein the display packaging structure further comprises: a filler is disposed in a display element substrate accommodating space formed by the main portion and the extension portion, and the filler is It is arranged on a surface of the main body in the accommodating space of the display element substrate.
  13. 如权利要求12所述的显示器封装结构,其中所述填充胶体与所述封装薄膜层相接触,使得所述填充胶体抵靠所述封装薄膜层的一上表面。12. The display packaging structure of claim 12, wherein the filling gel is in contact with the packaging film layer, so that the filling gel abuts against an upper surface of the packaging film layer.
  14. 如权利要求12所述的显示器封装结构,其中所述显示器封装结构更包含:一封装胶框设置于所述主体部上,且环绕所述延伸部的一侧壁设置而形成一填充胶体容置空间,其中所述填充胶体填充于所述填充胶体容置空间中。The display packaging structure of claim 12, wherein the display packaging structure further comprises: a packaging plastic frame is disposed on the main body portion, and is disposed around a side wall of the extension portion to form a filling plastic housing Space, wherein the filling colloid is filled in the filling colloid containing space.
  15. 如权利要求14所述的显示器封装结构,其中所述封装胶框包含一吸气剂,分散于所述封装胶框中。15. The display packaging structure of claim 14, wherein the packaging plastic frame contains a getter dispersed in the packaging plastic frame.
  16. 如权利要求14所述的显示器封装结构,其中所述封装薄膜层具有一阶梯部,环绕所述封装薄膜层设置;及14. The display packaging structure of claim 14, wherein the packaging film layer has a stepped portion and is disposed around the packaging film layer; and
    所述封装胶框具有一突出部,突出于所述填充胶体的一表面,The packaging plastic frame has a protruding part protruding from a surface of the filling plastic body,
    其中所述封装胶框的所述突出部与所述封装薄膜层的所述阶梯部构成形状相匹配。Wherein, the protruding part of the encapsulating plastic frame matches the shape of the stepped part of the encapsulating film layer.
  17. 一种显示器封装结构的制造方法,包含步骤:A manufacturing method of a display packaging structure includes the steps:
    提供一盖体,所述盖体具有一主体部及一延伸部;Providing a cover having a main body and an extension;
    提供一显示器元件基板,所述显示器元件基板上设置有多个显示器元件;Providing a display element substrate on which a plurality of display elements are arranged;
    将所述盖体与所述显示器元件基板相结合,其中所述延伸部环绕所述显示器元件基板的一侧壁,且所述主体部设置于所述显示器元件基板上,使得一间隙形成于所述延伸部与所述侧壁之间;及The cover body is combined with the display element substrate, wherein the extension part surrounds a side wall of the display element substrate, and the main body part is disposed on the display element substrate, so that a gap is formed in the display element substrate. Between the extension part and the side wall; and
    提供一密封胶体,填充于所述间隙内。A sealant is provided and filled in the gap.
  18. 如权利要求17所述的显示器封装结构的制造方法,其中所述显示器封装结构的制造方法包含:将所述盖体翻转,使得所述显示器元件基板的一显示器元件基板容置空间朝上;17. The method of manufacturing a display package structure according to claim 17, wherein the method of manufacturing the display package structure comprises: turning the cover over so that a display element substrate accommodation space of the display element substrate faces upward;
    将所述显示器元件基板设置于所述显示器元件基板容置空间中,且抵靠设置在所述盖体上的一填充胶体,其中所述填充胶体未固化;Disposing the display element substrate in the accommodating space of the display element substrate and abutting against a filling colloid provided on the cover, wherein the filling colloid is not cured;
    将所述密封胶体填充于所述间隙内;及Filling the sealant in the gap; and
    固化所述填充胶体及所述密封胶体。Curing the filling colloid and the sealing colloid.
  19. 如权利要求18所述的显示器封装结构的制造方法,其中述填充胶体及所述密封胶体同时进行一固化步骤,使得所述填充胶体及所述密封胶体固化进而密封所述显示器封装结构。18. The method of manufacturing a display packaging structure according to claim 18, wherein the filling glue and the sealing glue undergo a curing step at the same time, so that the filling glue and the sealing glue are cured to seal the display packaging structure.
  20. 如权利要求18所述的显示器封装结构的制造方法,其中将所述填充胶体填充于所述填充胶体容置空间中后,进行一预固化步骤,使得所述填充胶体转变为B阶段(B-stage)状态。17. The manufacturing method of the display packaging structure of claim 18, wherein after the filling colloid is filled in the filling colloid accommodating space, a pre-curing step is performed, so that the filling colloid is transformed into a B-stage (B- stage) state.
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