JP2008546211A5 - - Google Patents

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Publication number
JP2008546211A5
JP2008546211A5 JP2008515690A JP2008515690A JP2008546211A5 JP 2008546211 A5 JP2008546211 A5 JP 2008546211A5 JP 2008515690 A JP2008515690 A JP 2008515690A JP 2008515690 A JP2008515690 A JP 2008515690A JP 2008546211 A5 JP2008546211 A5 JP 2008546211A5
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JP
Japan
Prior art keywords
substrate
electronic device
organic electronic
package according
upper plate
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JP2008515690A
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English (en)
Japanese (ja)
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JP2008546211A (ja
JP5143728B2 (ja
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Priority claimed from US11/150,401 external-priority patent/US20060278965A1/en
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Publication of JP2008546211A5 publication Critical patent/JP2008546211A5/ja
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Publication of JP5143728B2 publication Critical patent/JP5143728B2/ja
Expired - Fee Related legal-status Critical Current
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JP2008515690A 2005-06-10 2006-04-05 気密封止パッケージ Expired - Fee Related JP5143728B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/150,401 US20060278965A1 (en) 2005-06-10 2005-06-10 Hermetically sealed package and methods of making the same
US11/150,401 2005-06-10
PCT/US2006/012781 WO2006135474A1 (en) 2005-06-10 2006-04-05 Hermetically sealed package and methods of making the same

Publications (3)

Publication Number Publication Date
JP2008546211A JP2008546211A (ja) 2008-12-18
JP2008546211A5 true JP2008546211A5 (enExample) 2009-05-28
JP5143728B2 JP5143728B2 (ja) 2013-02-13

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Family Applications (1)

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JP2008515690A Expired - Fee Related JP5143728B2 (ja) 2005-06-10 2006-04-05 気密封止パッケージ

Country Status (6)

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US (2) US20060278965A1 (enExample)
EP (1) EP1894263B1 (enExample)
JP (1) JP5143728B2 (enExample)
KR (1) KR101269607B1 (enExample)
CN (1) CN101218692B (enExample)
WO (1) WO2006135474A1 (enExample)

Families Citing this family (74)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8405193B2 (en) * 2004-04-02 2013-03-26 General Electric Company Organic electronic packages having hermetically sealed edges and methods of manufacturing such packages
KR100673765B1 (ko) 2006-01-20 2007-01-24 삼성에스디아이 주식회사 유기전계발광 표시장치 및 그 제조방법
KR100688790B1 (ko) * 2006-01-27 2007-03-02 삼성에스디아이 주식회사 유기 전계 발광 표시장치 및 그 제조 방법
US7696621B2 (en) * 2006-07-05 2010-04-13 Microstrain, Inc. RFID tag packaging system
JP5080838B2 (ja) * 2007-03-29 2012-11-21 富士フイルム株式会社 電子デバイスおよびその製造方法
KR101296650B1 (ko) * 2007-05-31 2013-08-14 엘지디스플레이 주식회사 유기 발광 소자 및 이의 제조 방법
ITMI20071903A1 (it) * 2007-10-04 2009-04-05 Getters Spa Metodo per la produzione di pannelli solari mediante l'impiego di un tristrato polimerico comprendente un sistema getter composito
ITMI20071902A1 (it) * 2007-10-04 2009-04-05 Getters Spa Getter composito per la produzione di pannelli solari
TWI420722B (zh) 2008-01-30 2013-12-21 歐斯朗奧托半導體股份有限公司 具有封裝單元之裝置
DE102008019900A1 (de) * 2008-01-30 2009-08-06 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines organischen elektronischen Bauelements und organisches elektronisches Bauelement
KR20090089010A (ko) * 2008-02-18 2009-08-21 삼성전자주식회사 유기발광 표시장치 및 이의 제조방법
EP2100988B1 (en) * 2008-03-12 2019-06-12 Acktar Ltd. Thin-layered structure
JP2009245893A (ja) * 2008-03-31 2009-10-22 Toshiba Corp 発光装置封止構造及びその製造方法
KR20090111151A (ko) * 2008-04-21 2009-10-26 삼성전자주식회사 유기발광 표시장치 및 이의 제조 방법
US20090284158A1 (en) * 2008-05-16 2009-11-19 General Electric Company Organic light emitting device based lighting for low cost, flexible large area signage
WO2009152275A1 (en) * 2008-06-11 2009-12-17 Plextronics, Inc. Encapsulation for organic optoelectronic devices
US20090308454A1 (en) * 2008-06-12 2009-12-17 General Electric Company, A New York Corporation Insulating coating, methods of manufacture thereof and articles comprising the same
US8022623B2 (en) * 2008-08-15 2011-09-20 General Electric Company Ultra-thin multi-substrate color tunable OLED device
US8102119B2 (en) * 2008-12-17 2012-01-24 General Electric Comapny Encapsulated optoelectronic device and method for making the same
EP3578169B1 (en) 2009-02-26 2024-06-26 Glaxo Group Limited Pharmaceutical formulations comprising 4-{(1 r)-2-[(6-{2-[(2,6-dichlorobenzyl)oxy]ethoxy}hexyl)amino]-1-hydroxyethyl}-2-(hydroxymethyl)phenol
JP5612658B2 (ja) * 2009-03-23 2014-10-22 ダウ グローバル テクノロジーズ エルエルシー 光電子デバイス
WO2010143614A1 (ja) * 2009-06-10 2010-12-16 旭硝子株式会社 太陽電池モジュールの製造方法
KR101046390B1 (ko) * 2009-06-29 2011-07-05 주식회사 하이닉스반도체 반도체 패키지 및 이의 제조 방법
KR101074801B1 (ko) 2009-09-09 2011-10-19 삼성모바일디스플레이주식회사 발광 표시 장치
KR101621300B1 (ko) * 2009-09-16 2016-05-17 엘지디스플레이 주식회사 유기전계발광소자의 제조방법
KR101108157B1 (ko) 2009-11-19 2012-01-31 삼성모바일디스플레이주식회사 유기 발광 디스플레이 장치
GB0921075D0 (en) 2009-12-01 2010-01-13 Glaxo Group Ltd Novel combination of the therapeutic agents
KR101107162B1 (ko) * 2009-12-02 2012-01-25 삼성모바일디스플레이주식회사 유기 발광 표시 장치
US8253329B2 (en) * 2010-01-21 2012-08-28 General Electric Company Enhanced edge seal design for organic light emitting diode (OLED) encapsulation
US8154183B2 (en) * 2010-03-04 2012-04-10 General Electric Company Mitigating shorting risks in encapsulated organic light emitting devices (OLEDs)
EP2363905A1 (en) * 2010-03-05 2011-09-07 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Opto-electrical device and method for manufacturing thereof
US8563113B2 (en) * 2010-04-20 2013-10-22 Corning Incorporated Multi-laminate hermetic barriers and related structures and methods of hermetic sealing
CN101937974A (zh) * 2010-07-06 2011-01-05 电子科技大学 一种柔性有机电致发光器件的封装结构及其封装方法
TWI466243B (zh) * 2010-09-10 2014-12-21 Ind Tech Res Inst 環境敏感電子元件之封裝體及其封裝方法
US9935289B2 (en) * 2010-09-10 2018-04-03 Industrial Technology Research Institute Institute Environmental sensitive element package and encapsulation method thereof
KR101574686B1 (ko) * 2011-06-08 2015-12-07 엘지디스플레이 주식회사 유기 발광장치와 이의 제조방법
JP2012255478A (ja) * 2011-06-08 2012-12-27 Denso Corp シール装置およびシール方法
CN102332536A (zh) * 2011-09-29 2012-01-25 电子科技大学 一种有机电致发光器件的封装结构和封装方法
JP5935120B2 (ja) * 2012-06-22 2016-06-15 株式会社日立製作所 密封容器、電子装置及び太陽電池モジュール
KR101962851B1 (ko) 2012-07-19 2019-03-28 삼성디스플레이 주식회사 플렉서블 유기 발광 표시 장치 및 그 제조 방법
US8912018B2 (en) * 2012-12-17 2014-12-16 Universal Display Corporation Manufacturing flexible organic electronic devices
US9847512B2 (en) 2012-12-22 2017-12-19 Industrial Technology Research Institute Electronic device package structure and manufacturing method thereof
TWI552331B (zh) * 2013-01-11 2016-10-01 財團法人工業技術研究院 電子元件之封裝結構
WO2014115825A1 (ja) * 2013-01-25 2014-07-31 富士フイルム株式会社 有機電子デバイス
US9188463B2 (en) * 2013-02-05 2015-11-17 General Electric Company Hermetic electrically shielded connector
US10647091B2 (en) 2013-04-27 2020-05-12 Shenzhen China Star Optoelectronics Technology Co., Ltd. Planar glass sealing structure and manufacturing method thereof
CN103274610B (zh) * 2013-04-27 2016-03-30 深圳市华星光电技术有限公司 平板玻璃密封构造及其制造方法
US9125380B2 (en) 2013-05-22 2015-09-08 Richard Deutsch Systems and methods for monitoring and controlling animal behavior
KR102076838B1 (ko) * 2013-06-26 2020-02-12 엘지디스플레이 주식회사 플렉서블 유기 발광 다이오드 표시장치
DE102013106855B4 (de) 2013-07-01 2017-10-12 Osram Oled Gmbh Verfahren zum Herstellen eines optoelektronischen Bauelements und optoelektronisches Bauelement unter Verwendung einer flüssigen ersten Legierung
CN103337595B (zh) 2013-07-04 2016-04-06 上海和辉光电有限公司 柔性封装衬底及其制造方法和使用该衬底的oled封装方法
KR20150037713A (ko) 2013-09-30 2015-04-08 주식회사 엘지화학 유기 발광 소자 및 이의 제조방법
CN103560209A (zh) * 2013-10-12 2014-02-05 深圳市华星光电技术有限公司 有机发光二极管装置以及其制造方法
CN110085767A (zh) * 2013-12-18 2019-08-02 上海天马有机发光显示技术有限公司 一种疏水有机薄膜封装的有机发光显示装置
US9359161B2 (en) * 2013-12-20 2016-06-07 Industrial Technology Research Institute Interleaving element for a roll of glass substrate
US20150226053A1 (en) * 2014-02-12 2015-08-13 Baker Hughes Incorporated Reactive multilayer foil usage in wired pipe systems
US9513380B2 (en) 2014-07-25 2016-12-06 General Electric Company X-ray detectors supported on a substrate having a surrounding metal barrier
US10712454B2 (en) 2014-07-25 2020-07-14 General Electric Company X-ray detectors supported on a substrate having a metal barrier
CN105633296A (zh) * 2014-11-07 2016-06-01 昆山国显光电有限公司 一种用于oled显示器的玻璃料密封装置及其制备方法
KR102439040B1 (ko) * 2014-12-01 2022-09-01 엘지디스플레이 주식회사 유기 발광 디스플레이 장치 및 이를 포함하는 롤러블 유기 발광 디스플레이 시스템
GB2533185B (en) * 2014-12-10 2017-01-04 Eight19 Ltd A flexible, thin film electronic device
US9847509B2 (en) 2015-01-22 2017-12-19 Industrial Technology Research Institute Package of flexible environmental sensitive electronic device and sealing member
US10249694B2 (en) * 2015-04-15 2019-04-02 Sharp Kabushiki Kaisha Organic EL display device
JP6505507B2 (ja) * 2015-06-01 2019-04-24 ソーラーフロンティア株式会社 太陽電池モジュール
CN105098099A (zh) * 2015-06-16 2015-11-25 京东方科技集团股份有限公司 有机发光二极管封装方法和封装结构及具有该结构的器件
JP6499532B2 (ja) * 2015-06-30 2019-04-10 ファナック株式会社 吸湿剤の吸湿量を取得する機能を備えた回転エンコーダ
CN104993063A (zh) * 2015-07-17 2015-10-21 京东方科技集团股份有限公司 一种封装件及其制作方法、oled装置
CN108029194A (zh) * 2015-09-15 2018-05-11 飞利浦照明控股有限公司 在密封的充气led灯中延迟氧耗尽的阻挡层
CN106935724B (zh) * 2015-12-29 2018-12-07 昆山国显光电有限公司 Oled显示面板的封装结构及封装方法
JPWO2017130955A1 (ja) 2016-01-26 2018-11-15 住友化学株式会社 有機ｅｌ素子
CN207068882U (zh) * 2017-07-06 2018-03-02 北京铂阳顶荣光伏科技有限公司 具有双层玻璃的路面发电组件
CN107731876B (zh) * 2017-10-19 2020-12-04 京东方科技集团股份有限公司 一种显示面板及其制作方法、显示装置
TWI754829B (zh) * 2019-07-17 2022-02-11 瑩耀科技股份有限公司 有機發光二極體封裝結構及其製造方法
CN114824130B (zh) * 2022-04-15 2025-08-22 昆山国显光电有限公司 显示模组及显示模组的制作方法

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05242966A (ja) * 1992-02-26 1993-09-21 Nec Kansai Ltd 電界発光灯及びその製造方法
JP3456257B2 (ja) * 1994-05-27 2003-10-14 株式会社デンソー 電子素子用パッケージ
WO1997046052A1 (en) * 1996-05-28 1997-12-04 Philips Electronics N.V. Organic electroluminescent device
US5874804A (en) * 1997-03-03 1999-02-23 Motorola, Inc. Organic electroluminescent device hermetic encapsulation package and method of fabrication
GB2335884A (en) * 1998-04-02 1999-10-06 Cambridge Display Tech Ltd Flexible substrates for electronic or optoelectronic devices
EP1121838A4 (en) * 1998-08-03 2004-10-27 Dupont Displays Inc ENCAPSULATION OF SOLID STATE DEVICES BASED ON POLYMERS WITH INORGANIC MATERIALS
JP2002175877A (ja) * 2000-09-27 2002-06-21 Seiko Epson Corp 有機エレクトロルミネッセンス装置、有機エレクトロルミネッセンス装置の製造方法、電子機器
US6537688B2 (en) * 2000-12-01 2003-03-25 Universal Display Corporation Adhesive sealed organic optoelectronic structures
US6576351B2 (en) * 2001-02-16 2003-06-10 Universal Display Corporation Barrier region for optoelectronic devices
US6822391B2 (en) * 2001-02-21 2004-11-23 Semiconductor Energy Laboratory Co., Ltd. Light emitting device, electronic equipment, and method of manufacturing thereof
US6992439B2 (en) * 2001-02-22 2006-01-31 Semiconductor Energy Laboratory Co., Ltd. Display device with sealing structure for protecting organic light emitting element
US6706316B2 (en) * 2001-05-08 2004-03-16 Eastman Kodak Company Ultrasonically sealing the cover plate to provide a hermetic enclosure for OLED displays
US6878973B2 (en) * 2001-08-23 2005-04-12 Lumileds Lighting U.S., Llc Reduction of contamination of light emitting devices
US6737753B2 (en) * 2001-09-28 2004-05-18 Osram Opto Semiconductor Gmbh Barrier stack
US6825054B2 (en) * 2001-11-21 2004-11-30 Paul Valentine Light emitting ceramic device and method for fabricating the same
TWI271833B (en) * 2001-12-10 2007-01-21 Delta Optoelectronics Inc Packaging structure of display device and method thereof
US6743524B2 (en) * 2002-05-23 2004-06-01 General Electric Company Barrier layer for an article and method of making said barrier layer by expanding thermal plasma
US7649674B2 (en) * 2002-06-10 2010-01-19 E Ink Corporation Electro-optic display with edge seal
US7372069B2 (en) * 2003-01-14 2008-05-13 Osram Opto Semiconductors Gmbh Interface for UV-curable adhesives
US7018713B2 (en) * 2003-04-02 2006-03-28 3M Innovative Properties Company Flexible high-temperature ultrabarrier
US7202602B2 (en) * 2003-04-08 2007-04-10 Organic Lighting Technologies Llc Metal seal packaging for organic light emitting diode device
US20050093134A1 (en) * 2003-10-30 2005-05-05 Terry Tarn Device packages with low stress assembly process
US7282749B2 (en) * 2003-12-26 2007-10-16 Lg.Philips Lcd Co., Ltd. Organic electroluminescent device and method of fabricating the same
TWI228942B (en) * 2004-03-30 2005-03-01 Au Optronics Corp Active matrix organic electroluminescent device and fabrication method thereof
US8405193B2 (en) * 2004-04-02 2013-03-26 General Electric Company Organic electronic packages having hermetically sealed edges and methods of manufacturing such packages
US7316756B2 (en) * 2004-07-27 2008-01-08 Eastman Kodak Company Desiccant for top-emitting OLED
US7078726B2 (en) * 2004-09-09 2006-07-18 Osram Opto Semiconductors Gmbh Sealing of electronic device using absorbing layer for glue line
US7541671B2 (en) * 2005-03-31 2009-06-02 General Electric Company Organic electronic devices having external barrier layer
US9123663B2 (en) * 2008-06-10 2015-09-01 Stats Chippac, Ltd. Semiconductor device and method of forming shielding layer grounded through metal pillars formed in peripheral region of the semiconductor

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