CN101218692B - 气密性密封封装体及其制造方法 - Google Patents

气密性密封封装体及其制造方法 Download PDF

Info

Publication number
CN101218692B
CN101218692B CN2006800204943A CN200680020494A CN101218692B CN 101218692 B CN101218692 B CN 101218692B CN 2006800204943 A CN2006800204943 A CN 2006800204943A CN 200680020494 A CN200680020494 A CN 200680020494A CN 101218692 B CN101218692 B CN 101218692B
Authority
CN
China
Prior art keywords
substrate
hermetically sealed
electronic device
organic electronic
sealed package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2006800204943A
Other languages
English (en)
Chinese (zh)
Other versions
CN101218692A (zh
Inventor
唐纳德·F·福斯特
威廉·F·尼朗
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of CN101218692A publication Critical patent/CN101218692A/zh
Application granted granted Critical
Publication of CN101218692B publication Critical patent/CN101218692B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8423—Metallic sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
CN2006800204943A 2005-06-10 2006-04-05 气密性密封封装体及其制造方法 Expired - Fee Related CN101218692B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/150,401 2005-06-10
US11/150,401 US20060278965A1 (en) 2005-06-10 2005-06-10 Hermetically sealed package and methods of making the same
PCT/US2006/012781 WO2006135474A1 (en) 2005-06-10 2006-04-05 Hermetically sealed package and methods of making the same

Publications (2)

Publication Number Publication Date
CN101218692A CN101218692A (zh) 2008-07-09
CN101218692B true CN101218692B (zh) 2010-12-22

Family

ID=36889201

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2006800204943A Expired - Fee Related CN101218692B (zh) 2005-06-10 2006-04-05 气密性密封封装体及其制造方法

Country Status (6)

Country Link
US (2) US20060278965A1 (enExample)
EP (1) EP1894263B1 (enExample)
JP (1) JP5143728B2 (enExample)
KR (1) KR101269607B1 (enExample)
CN (1) CN101218692B (enExample)
WO (1) WO2006135474A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102814381A (zh) * 2011-06-08 2012-12-12 株式会社电装 密封系统和密封方法

Families Citing this family (73)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8405193B2 (en) * 2004-04-02 2013-03-26 General Electric Company Organic electronic packages having hermetically sealed edges and methods of manufacturing such packages
KR100673765B1 (ko) 2006-01-20 2007-01-24 삼성에스디아이 주식회사 유기전계발광 표시장치 및 그 제조방법
KR100688790B1 (ko) 2006-01-27 2007-03-02 삼성에스디아이 주식회사 유기 전계 발광 표시장치 및 그 제조 방법
WO2008005547A2 (en) * 2006-07-05 2008-01-10 Microstrain, Inc. Rfid tag packaging system
JP5080838B2 (ja) * 2007-03-29 2012-11-21 富士フイルム株式会社 電子デバイスおよびその製造方法
KR101296650B1 (ko) * 2007-05-31 2013-08-14 엘지디스플레이 주식회사 유기 발광 소자 및 이의 제조 방법
ITMI20071903A1 (it) * 2007-10-04 2009-04-05 Getters Spa Metodo per la produzione di pannelli solari mediante l'impiego di un tristrato polimerico comprendente un sistema getter composito
ITMI20071902A1 (it) * 2007-10-04 2009-04-05 Getters Spa Getter composito per la produzione di pannelli solari
DE102008019900A1 (de) * 2008-01-30 2009-08-06 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines organischen elektronischen Bauelements und organisches elektronisches Bauelement
TWI438953B (zh) 2008-01-30 2014-05-21 歐斯朗奧托半導體股份有限公司 電子組件之製造方法及電子組件
KR20090089010A (ko) * 2008-02-18 2009-08-21 삼성전자주식회사 유기발광 표시장치 및 이의 제조방법
JP5780407B2 (ja) * 2008-03-12 2015-09-16 アクタール リミテッド 薄層構造（ｔｈｉｎ−ｌａｙｅｒｅｄｓｔｒｕｃｔｕｒｅ）
JP2009245893A (ja) * 2008-03-31 2009-10-22 Toshiba Corp 発光装置封止構造及びその製造方法
KR20090111151A (ko) * 2008-04-21 2009-10-26 삼성전자주식회사 유기발광 표시장치 및 이의 제조 방법
US20090284158A1 (en) * 2008-05-16 2009-11-19 General Electric Company Organic light emitting device based lighting for low cost, flexible large area signage
US8362517B2 (en) * 2008-06-11 2013-01-29 Plextronics, Inc. Encapsulation for organic optoelectronic devices
US20090308454A1 (en) * 2008-06-12 2009-12-17 General Electric Company, A New York Corporation Insulating coating, methods of manufacture thereof and articles comprising the same
US8022623B2 (en) * 2008-08-15 2011-09-20 General Electric Company Ultra-thin multi-substrate color tunable OLED device
US8102119B2 (en) * 2008-12-17 2012-01-24 General Electric Comapny Encapsulated optoelectronic device and method for making the same
DK2400950T3 (da) 2009-02-26 2019-07-29 Glaxo Group Ltd Farmaceutiske formuleringer omfattende 4-{(1 r)-2-[(6-{2-[(2,6-dichlorbenzyl)oxy]ethoxy}hexyl)amino]-1-hydroxyethyl}-2-(hydroxymethyl)phenol
JP5612658B2 (ja) * 2009-03-23 2014-10-22 ダウ グローバル テクノロジーズ エルエルシー 光電子デバイス
JPWO2010143614A1 (ja) * 2009-06-10 2012-11-22 旭硝子株式会社 太陽電池モジュールの製造方法
KR101046390B1 (ko) * 2009-06-29 2011-07-05 주식회사 하이닉스반도체 반도체 패키지 및 이의 제조 방법
KR101074801B1 (ko) 2009-09-09 2011-10-19 삼성모바일디스플레이주식회사 발광 표시 장치
KR101621300B1 (ko) * 2009-09-16 2016-05-17 엘지디스플레이 주식회사 유기전계발광소자의 제조방법
KR101108157B1 (ko) 2009-11-19 2012-01-31 삼성모바일디스플레이주식회사 유기 발광 디스플레이 장치
GB0921075D0 (en) 2009-12-01 2010-01-13 Glaxo Group Ltd Novel combination of the therapeutic agents
KR101107162B1 (ko) 2009-12-02 2012-01-25 삼성모바일디스플레이주식회사 유기 발광 표시 장치
US8253329B2 (en) * 2010-01-21 2012-08-28 General Electric Company Enhanced edge seal design for organic light emitting diode (OLED) encapsulation
US8154183B2 (en) * 2010-03-04 2012-04-10 General Electric Company Mitigating shorting risks in encapsulated organic light emitting devices (OLEDs)
EP2363905A1 (en) * 2010-03-05 2011-09-07 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Opto-electrical device and method for manufacturing thereof
US8563113B2 (en) * 2010-04-20 2013-10-22 Corning Incorporated Multi-laminate hermetic barriers and related structures and methods of hermetic sealing
CN101937974A (zh) * 2010-07-06 2011-01-05 电子科技大学 一种柔性有机电致发光器件的封装结构及其封装方法
US9935289B2 (en) * 2010-09-10 2018-04-03 Industrial Technology Research Institute Institute Environmental sensitive element package and encapsulation method thereof
TWI466243B (zh) * 2010-09-10 2014-12-21 Ind Tech Res Inst 環境敏感電子元件之封裝體及其封裝方法
KR101574686B1 (ko) 2011-06-08 2015-12-07 엘지디스플레이 주식회사 유기 발광장치와 이의 제조방법
CN102332536A (zh) * 2011-09-29 2012-01-25 电子科技大学 一种有机电致发光器件的封装结构和封装方法
JP5935120B2 (ja) * 2012-06-22 2016-06-15 株式会社日立製作所 密封容器、電子装置及び太陽電池モジュール
KR101962851B1 (ko) 2012-07-19 2019-03-28 삼성디스플레이 주식회사 플렉서블 유기 발광 표시 장치 및 그 제조 방법
US8912018B2 (en) * 2012-12-17 2014-12-16 Universal Display Corporation Manufacturing flexible organic electronic devices
US9847512B2 (en) 2012-12-22 2017-12-19 Industrial Technology Research Institute Electronic device package structure and manufacturing method thereof
TWI552331B (zh) * 2013-01-11 2016-10-01 財團法人工業技術研究院 電子元件之封裝結構
WO2014115825A1 (ja) * 2013-01-25 2014-07-31 富士フイルム株式会社 有機電子デバイス
US9188463B2 (en) * 2013-02-05 2015-11-17 General Electric Company Hermetic electrically shielded connector
US10647091B2 (en) 2013-04-27 2020-05-12 Shenzhen China Star Optoelectronics Technology Co., Ltd. Planar glass sealing structure and manufacturing method thereof
CN103274610B (zh) * 2013-04-27 2016-03-30 深圳市华星光电技术有限公司 平板玻璃密封构造及其制造方法
US9125380B2 (en) 2013-05-22 2015-09-08 Richard Deutsch Systems and methods for monitoring and controlling animal behavior
KR102076838B1 (ko) * 2013-06-26 2020-02-12 엘지디스플레이 주식회사 플렉서블 유기 발광 다이오드 표시장치
DE102013106855B4 (de) * 2013-07-01 2017-10-12 Osram Oled Gmbh Verfahren zum Herstellen eines optoelektronischen Bauelements und optoelektronisches Bauelement unter Verwendung einer flüssigen ersten Legierung
CN103337595B (zh) * 2013-07-04 2016-04-06 上海和辉光电有限公司 柔性封装衬底及其制造方法和使用该衬底的oled封装方法
CN105474425B (zh) * 2013-09-30 2018-02-09 乐金显示有限公司 有机发光器件及其制备方法
CN103560209A (zh) * 2013-10-12 2014-02-05 深圳市华星光电技术有限公司 有机发光二极管装置以及其制造方法
CN110085767A (zh) * 2013-12-18 2019-08-02 上海天马有机发光显示技术有限公司 一种疏水有机薄膜封装的有机发光显示装置
US9359161B2 (en) * 2013-12-20 2016-06-07 Industrial Technology Research Institute Interleaving element for a roll of glass substrate
US20150226053A1 (en) * 2014-02-12 2015-08-13 Baker Hughes Incorporated Reactive multilayer foil usage in wired pipe systems
US10712454B2 (en) 2014-07-25 2020-07-14 General Electric Company X-ray detectors supported on a substrate having a metal barrier
US9513380B2 (en) 2014-07-25 2016-12-06 General Electric Company X-ray detectors supported on a substrate having a surrounding metal barrier
CN105633296A (zh) * 2014-11-07 2016-06-01 昆山国显光电有限公司 一种用于oled显示器的玻璃料密封装置及其制备方法
KR102439040B1 (ko) * 2014-12-01 2022-09-01 엘지디스플레이 주식회사 유기 발광 디스플레이 장치 및 이를 포함하는 롤러블 유기 발광 디스플레이 시스템
GB2533185B (en) 2014-12-10 2017-01-04 Eight19 Ltd A flexible, thin film electronic device
US9847509B2 (en) 2015-01-22 2017-12-19 Industrial Technology Research Institute Package of flexible environmental sensitive electronic device and sealing member
WO2016166958A1 (ja) * 2015-04-15 2016-10-20 シャープ株式会社 有機ｅｌ表示装置
JP6505507B2 (ja) * 2015-06-01 2019-04-24 ソーラーフロンティア株式会社 太陽電池モジュール
CN105098099A (zh) * 2015-06-16 2015-11-25 京东方科技集团股份有限公司 有机发光二极管封装方法和封装结构及具有该结构的器件
JP6499532B2 (ja) * 2015-06-30 2019-04-10 ファナック株式会社 吸湿剤の吸湿量を取得する機能を備えた回転エンコーダ
CN104993063A (zh) 2015-07-17 2015-10-21 京东方科技集团股份有限公司 一种封装件及其制作方法、oled装置
EP3351062A1 (en) * 2015-09-15 2018-07-25 Philips Lighting Holding B.V. Barrier layer delaying oxygen depletion in sealed gas-filled led lamps
CN106935724B (zh) * 2015-12-29 2018-12-07 昆山国显光电有限公司 Oled显示面板的封装结构及封装方法
WO2017130955A1 (ja) * 2016-01-26 2017-08-03 住友化学株式会社 有機ｅｌ素子
CN207068882U (zh) * 2017-07-06 2018-03-02 北京铂阳顶荣光伏科技有限公司 具有双层玻璃的路面发电组件
CN107731876B (zh) * 2017-10-19 2020-12-04 京东方科技集团股份有限公司 一种显示面板及其制作方法、显示装置
TWI754829B (zh) * 2019-07-17 2022-02-11 瑩耀科技股份有限公司 有機發光二極體封裝結構及其製造方法
CN114824130B (zh) * 2022-04-15 2025-08-22 昆山国显光电有限公司 显示模组及显示模组的制作方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6160346A (en) * 1996-05-28 2000-12-12 U.S. Philips Corporation Organic electroluminescent device with housing
US6635989B1 (en) * 1998-08-03 2003-10-21 E. I. Du Pont De Nemours And Company Encapsulation of polymer-based solid state devices with inorganic materials

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05242966A (ja) * 1992-02-26 1993-09-21 Nec Kansai Ltd 電界発光灯及びその製造方法
JP3456257B2 (ja) * 1994-05-27 2003-10-14 株式会社デンソー 電子素子用パッケージ
US5874804A (en) * 1997-03-03 1999-02-23 Motorola, Inc. Organic electroluminescent device hermetic encapsulation package and method of fabrication
GB2335884A (en) * 1998-04-02 1999-10-06 Cambridge Display Tech Ltd Flexible substrates for electronic or optoelectronic devices
JP2002175877A (ja) * 2000-09-27 2002-06-21 Seiko Epson Corp 有機エレクトロルミネッセンス装置、有機エレクトロルミネッセンス装置の製造方法、電子機器
US6537688B2 (en) * 2000-12-01 2003-03-25 Universal Display Corporation Adhesive sealed organic optoelectronic structures
US6576351B2 (en) * 2001-02-16 2003-06-10 Universal Display Corporation Barrier region for optoelectronic devices
US6822391B2 (en) * 2001-02-21 2004-11-23 Semiconductor Energy Laboratory Co., Ltd. Light emitting device, electronic equipment, and method of manufacturing thereof
US6992439B2 (en) * 2001-02-22 2006-01-31 Semiconductor Energy Laboratory Co., Ltd. Display device with sealing structure for protecting organic light emitting element
US6706316B2 (en) * 2001-05-08 2004-03-16 Eastman Kodak Company Ultrasonically sealing the cover plate to provide a hermetic enclosure for OLED displays
US6878973B2 (en) * 2001-08-23 2005-04-12 Lumileds Lighting U.S., Llc Reduction of contamination of light emitting devices
US6737753B2 (en) * 2001-09-28 2004-05-18 Osram Opto Semiconductor Gmbh Barrier stack
US6825054B2 (en) * 2001-11-21 2004-11-30 Paul Valentine Light emitting ceramic device and method for fabricating the same
TWI271833B (en) * 2001-12-10 2007-01-21 Delta Optoelectronics Inc Packaging structure of display device and method thereof
US6743524B2 (en) * 2002-05-23 2004-06-01 General Electric Company Barrier layer for an article and method of making said barrier layer by expanding thermal plasma
US7649674B2 (en) * 2002-06-10 2010-01-19 E Ink Corporation Electro-optic display with edge seal
US7372069B2 (en) * 2003-01-14 2008-05-13 Osram Opto Semiconductors Gmbh Interface for UV-curable adhesives
US7018713B2 (en) * 2003-04-02 2006-03-28 3M Innovative Properties Company Flexible high-temperature ultrabarrier
US7202602B2 (en) * 2003-04-08 2007-04-10 Organic Lighting Technologies Llc Metal seal packaging for organic light emitting diode device
US20050093134A1 (en) * 2003-10-30 2005-05-05 Terry Tarn Device packages with low stress assembly process
US7282749B2 (en) * 2003-12-26 2007-10-16 Lg.Philips Lcd Co., Ltd. Organic electroluminescent device and method of fabricating the same
TWI228942B (en) * 2004-03-30 2005-03-01 Au Optronics Corp Active matrix organic electroluminescent device and fabrication method thereof
US8405193B2 (en) * 2004-04-02 2013-03-26 General Electric Company Organic electronic packages having hermetically sealed edges and methods of manufacturing such packages
US7316756B2 (en) * 2004-07-27 2008-01-08 Eastman Kodak Company Desiccant for top-emitting OLED
US7078726B2 (en) * 2004-09-09 2006-07-18 Osram Opto Semiconductors Gmbh Sealing of electronic device using absorbing layer for glue line
US7541671B2 (en) * 2005-03-31 2009-06-02 General Electric Company Organic electronic devices having external barrier layer
US9123663B2 (en) * 2008-06-10 2015-09-01 Stats Chippac, Ltd. Semiconductor device and method of forming shielding layer grounded through metal pillars formed in peripheral region of the semiconductor

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6160346A (en) * 1996-05-28 2000-12-12 U.S. Philips Corporation Organic electroluminescent device with housing
US6635989B1 (en) * 1998-08-03 2003-10-21 E. I. Du Pont De Nemours And Company Encapsulation of polymer-based solid state devices with inorganic materials

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
同上.

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102814381A (zh) * 2011-06-08 2012-12-12 株式会社电装 密封系统和密封方法

Also Published As

Publication number Publication date
WO2006135474A1 (en) 2006-12-21
US20060278965A1 (en) 2006-12-14
US20080185701A1 (en) 2008-08-07
EP1894263A1 (en) 2008-03-05
JP2008546211A (ja) 2008-12-18
EP1894263B1 (en) 2011-06-22
CN101218692A (zh) 2008-07-09
KR20080021650A (ko) 2008-03-07
KR101269607B1 (ko) 2013-06-05
US7816676B2 (en) 2010-10-19
JP5143728B2 (ja) 2013-02-13

Similar Documents

Publication Publication Date Title
CN101218692B (zh) 气密性密封封装体及其制造方法
CN1957485B (zh) 具有密封边沿的有机电子封装及其制造方法
JP5840338B2 (ja) 外部バリア層を有する有機電子デバイス
EP2374173B1 (en) Method for encapsulating environmentally sensitive devices
JP5313328B2 (ja) 気密シールパーケージ用のゲッタ前駆体
US20100148661A1 (en) Encapsulation structure and method of organic electroluminescence device
JP2005235743A (ja) 拡散障壁を有する複合材物品及び該物品を組み込んだ素子
CN221632598U (zh) 发光器件及显示面板
US20240023409A1 (en) Display panel and method of manufacturing the same

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20101222

Termination date: 20170405

CF01 Termination of patent right due to non-payment of annual fee