JP5143728B2 - 気密封止パッケージ - Google Patents
気密封止パッケージ Download PDFInfo
- Publication number
- JP5143728B2 JP5143728B2 JP2008515690A JP2008515690A JP5143728B2 JP 5143728 B2 JP5143728 B2 JP 5143728B2 JP 2008515690 A JP2008515690 A JP 2008515690A JP 2008515690 A JP2008515690 A JP 2008515690A JP 5143728 B2 JP5143728 B2 JP 5143728B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- electronic device
- organic electronic
- hermetically sealed
- disposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8423—Metallic sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/150,401 | 2005-06-10 | ||
| US11/150,401 US20060278965A1 (en) | 2005-06-10 | 2005-06-10 | Hermetically sealed package and methods of making the same |
| PCT/US2006/012781 WO2006135474A1 (en) | 2005-06-10 | 2006-04-05 | Hermetically sealed package and methods of making the same |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008546211A JP2008546211A (ja) | 2008-12-18 |
| JP2008546211A5 JP2008546211A5 (enExample) | 2009-05-28 |
| JP5143728B2 true JP5143728B2 (ja) | 2013-02-13 |
Family
ID=36889201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008515690A Expired - Fee Related JP5143728B2 (ja) | 2005-06-10 | 2006-04-05 | 気密封止パッケージ |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US20060278965A1 (enExample) |
| EP (1) | EP1894263B1 (enExample) |
| JP (1) | JP5143728B2 (enExample) |
| KR (1) | KR101269607B1 (enExample) |
| CN (1) | CN101218692B (enExample) |
| WO (1) | WO2006135474A1 (enExample) |
Families Citing this family (74)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8405193B2 (en) * | 2004-04-02 | 2013-03-26 | General Electric Company | Organic electronic packages having hermetically sealed edges and methods of manufacturing such packages |
| KR100673765B1 (ko) | 2006-01-20 | 2007-01-24 | 삼성에스디아이 주식회사 | 유기전계발광 표시장치 및 그 제조방법 |
| KR100688790B1 (ko) | 2006-01-27 | 2007-03-02 | 삼성에스디아이 주식회사 | 유기 전계 발광 표시장치 및 그 제조 방법 |
| WO2008005547A2 (en) * | 2006-07-05 | 2008-01-10 | Microstrain, Inc. | Rfid tag packaging system |
| JP5080838B2 (ja) * | 2007-03-29 | 2012-11-21 | 富士フイルム株式会社 | 電子デバイスおよびその製造方法 |
| KR101296650B1 (ko) * | 2007-05-31 | 2013-08-14 | 엘지디스플레이 주식회사 | 유기 발광 소자 및 이의 제조 방법 |
| ITMI20071903A1 (it) * | 2007-10-04 | 2009-04-05 | Getters Spa | Metodo per la produzione di pannelli solari mediante l'impiego di un tristrato polimerico comprendente un sistema getter composito |
| ITMI20071902A1 (it) * | 2007-10-04 | 2009-04-05 | Getters Spa | Getter composito per la produzione di pannelli solari |
| DE102008019900A1 (de) * | 2008-01-30 | 2009-08-06 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines organischen elektronischen Bauelements und organisches elektronisches Bauelement |
| TWI438953B (zh) | 2008-01-30 | 2014-05-21 | 歐斯朗奧托半導體股份有限公司 | 電子組件之製造方法及電子組件 |
| KR20090089010A (ko) * | 2008-02-18 | 2009-08-21 | 삼성전자주식회사 | 유기발광 표시장치 및 이의 제조방법 |
| JP5780407B2 (ja) * | 2008-03-12 | 2015-09-16 | アクタール リミテッド | 薄層構造(thin−layeredstructure) |
| JP2009245893A (ja) * | 2008-03-31 | 2009-10-22 | Toshiba Corp | 発光装置封止構造及びその製造方法 |
| KR20090111151A (ko) * | 2008-04-21 | 2009-10-26 | 삼성전자주식회사 | 유기발광 표시장치 및 이의 제조 방법 |
| US20090284158A1 (en) * | 2008-05-16 | 2009-11-19 | General Electric Company | Organic light emitting device based lighting for low cost, flexible large area signage |
| US8362517B2 (en) * | 2008-06-11 | 2013-01-29 | Plextronics, Inc. | Encapsulation for organic optoelectronic devices |
| US20090308454A1 (en) * | 2008-06-12 | 2009-12-17 | General Electric Company, A New York Corporation | Insulating coating, methods of manufacture thereof and articles comprising the same |
| US8022623B2 (en) * | 2008-08-15 | 2011-09-20 | General Electric Company | Ultra-thin multi-substrate color tunable OLED device |
| US8102119B2 (en) * | 2008-12-17 | 2012-01-24 | General Electric Comapny | Encapsulated optoelectronic device and method for making the same |
| DK2400950T3 (da) | 2009-02-26 | 2019-07-29 | Glaxo Group Ltd | Farmaceutiske formuleringer omfattende 4-{(1 r)-2-[(6-{2-[(2,6-dichlorbenzyl)oxy]ethoxy}hexyl)amino]-1-hydroxyethyl}-2-(hydroxymethyl)phenol |
| JP5612658B2 (ja) * | 2009-03-23 | 2014-10-22 | ダウ グローバル テクノロジーズ エルエルシー | 光電子デバイス |
| JPWO2010143614A1 (ja) * | 2009-06-10 | 2012-11-22 | 旭硝子株式会社 | 太陽電池モジュールの製造方法 |
| KR101046390B1 (ko) * | 2009-06-29 | 2011-07-05 | 주식회사 하이닉스반도체 | 반도체 패키지 및 이의 제조 방법 |
| KR101074801B1 (ko) | 2009-09-09 | 2011-10-19 | 삼성모바일디스플레이주식회사 | 발광 표시 장치 |
| KR101621300B1 (ko) * | 2009-09-16 | 2016-05-17 | 엘지디스플레이 주식회사 | 유기전계발광소자의 제조방법 |
| KR101108157B1 (ko) | 2009-11-19 | 2012-01-31 | 삼성모바일디스플레이주식회사 | 유기 발광 디스플레이 장치 |
| GB0921075D0 (en) | 2009-12-01 | 2010-01-13 | Glaxo Group Ltd | Novel combination of the therapeutic agents |
| KR101107162B1 (ko) | 2009-12-02 | 2012-01-25 | 삼성모바일디스플레이주식회사 | 유기 발광 표시 장치 |
| US8253329B2 (en) * | 2010-01-21 | 2012-08-28 | General Electric Company | Enhanced edge seal design for organic light emitting diode (OLED) encapsulation |
| US8154183B2 (en) * | 2010-03-04 | 2012-04-10 | General Electric Company | Mitigating shorting risks in encapsulated organic light emitting devices (OLEDs) |
| EP2363905A1 (en) * | 2010-03-05 | 2011-09-07 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Opto-electrical device and method for manufacturing thereof |
| US8563113B2 (en) * | 2010-04-20 | 2013-10-22 | Corning Incorporated | Multi-laminate hermetic barriers and related structures and methods of hermetic sealing |
| CN101937974A (zh) * | 2010-07-06 | 2011-01-05 | 电子科技大学 | 一种柔性有机电致发光器件的封装结构及其封装方法 |
| US9935289B2 (en) * | 2010-09-10 | 2018-04-03 | Industrial Technology Research Institute Institute | Environmental sensitive element package and encapsulation method thereof |
| TWI466243B (zh) * | 2010-09-10 | 2014-12-21 | Ind Tech Res Inst | 環境敏感電子元件之封裝體及其封裝方法 |
| KR101574686B1 (ko) | 2011-06-08 | 2015-12-07 | 엘지디스플레이 주식회사 | 유기 발광장치와 이의 제조방법 |
| JP2012255478A (ja) * | 2011-06-08 | 2012-12-27 | Denso Corp | シール装置およびシール方法 |
| CN102332536A (zh) * | 2011-09-29 | 2012-01-25 | 电子科技大学 | 一种有机电致发光器件的封装结构和封装方法 |
| JP5935120B2 (ja) * | 2012-06-22 | 2016-06-15 | 株式会社日立製作所 | 密封容器、電子装置及び太陽電池モジュール |
| KR101962851B1 (ko) | 2012-07-19 | 2019-03-28 | 삼성디스플레이 주식회사 | 플렉서블 유기 발광 표시 장치 및 그 제조 방법 |
| US8912018B2 (en) * | 2012-12-17 | 2014-12-16 | Universal Display Corporation | Manufacturing flexible organic electronic devices |
| US9847512B2 (en) | 2012-12-22 | 2017-12-19 | Industrial Technology Research Institute | Electronic device package structure and manufacturing method thereof |
| TWI552331B (zh) * | 2013-01-11 | 2016-10-01 | 財團法人工業技術研究院 | 電子元件之封裝結構 |
| WO2014115825A1 (ja) * | 2013-01-25 | 2014-07-31 | 富士フイルム株式会社 | 有機電子デバイス |
| US9188463B2 (en) * | 2013-02-05 | 2015-11-17 | General Electric Company | Hermetic electrically shielded connector |
| US10647091B2 (en) | 2013-04-27 | 2020-05-12 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Planar glass sealing structure and manufacturing method thereof |
| CN103274610B (zh) * | 2013-04-27 | 2016-03-30 | 深圳市华星光电技术有限公司 | 平板玻璃密封构造及其制造方法 |
| US9125380B2 (en) | 2013-05-22 | 2015-09-08 | Richard Deutsch | Systems and methods for monitoring and controlling animal behavior |
| KR102076838B1 (ko) * | 2013-06-26 | 2020-02-12 | 엘지디스플레이 주식회사 | 플렉서블 유기 발광 다이오드 표시장치 |
| DE102013106855B4 (de) * | 2013-07-01 | 2017-10-12 | Osram Oled Gmbh | Verfahren zum Herstellen eines optoelektronischen Bauelements und optoelektronisches Bauelement unter Verwendung einer flüssigen ersten Legierung |
| CN103337595B (zh) * | 2013-07-04 | 2016-04-06 | 上海和辉光电有限公司 | 柔性封装衬底及其制造方法和使用该衬底的oled封装方法 |
| CN105474425B (zh) * | 2013-09-30 | 2018-02-09 | 乐金显示有限公司 | 有机发光器件及其制备方法 |
| CN103560209A (zh) * | 2013-10-12 | 2014-02-05 | 深圳市华星光电技术有限公司 | 有机发光二极管装置以及其制造方法 |
| CN110085767A (zh) * | 2013-12-18 | 2019-08-02 | 上海天马有机发光显示技术有限公司 | 一种疏水有机薄膜封装的有机发光显示装置 |
| US9359161B2 (en) * | 2013-12-20 | 2016-06-07 | Industrial Technology Research Institute | Interleaving element for a roll of glass substrate |
| US20150226053A1 (en) * | 2014-02-12 | 2015-08-13 | Baker Hughes Incorporated | Reactive multilayer foil usage in wired pipe systems |
| US10712454B2 (en) | 2014-07-25 | 2020-07-14 | General Electric Company | X-ray detectors supported on a substrate having a metal barrier |
| US9513380B2 (en) | 2014-07-25 | 2016-12-06 | General Electric Company | X-ray detectors supported on a substrate having a surrounding metal barrier |
| CN105633296A (zh) * | 2014-11-07 | 2016-06-01 | 昆山国显光电有限公司 | 一种用于oled显示器的玻璃料密封装置及其制备方法 |
| KR102439040B1 (ko) * | 2014-12-01 | 2022-09-01 | 엘지디스플레이 주식회사 | 유기 발광 디스플레이 장치 및 이를 포함하는 롤러블 유기 발광 디스플레이 시스템 |
| GB2533185B (en) | 2014-12-10 | 2017-01-04 | Eight19 Ltd | A flexible, thin film electronic device |
| US9847509B2 (en) | 2015-01-22 | 2017-12-19 | Industrial Technology Research Institute | Package of flexible environmental sensitive electronic device and sealing member |
| WO2016166958A1 (ja) * | 2015-04-15 | 2016-10-20 | シャープ株式会社 | 有機el表示装置 |
| JP6505507B2 (ja) * | 2015-06-01 | 2019-04-24 | ソーラーフロンティア株式会社 | 太陽電池モジュール |
| CN105098099A (zh) * | 2015-06-16 | 2015-11-25 | 京东方科技集团股份有限公司 | 有机发光二极管封装方法和封装结构及具有该结构的器件 |
| JP6499532B2 (ja) * | 2015-06-30 | 2019-04-10 | ファナック株式会社 | 吸湿剤の吸湿量を取得する機能を備えた回転エンコーダ |
| CN104993063A (zh) | 2015-07-17 | 2015-10-21 | 京东方科技集团股份有限公司 | 一种封装件及其制作方法、oled装置 |
| EP3351062A1 (en) * | 2015-09-15 | 2018-07-25 | Philips Lighting Holding B.V. | Barrier layer delaying oxygen depletion in sealed gas-filled led lamps |
| CN106935724B (zh) * | 2015-12-29 | 2018-12-07 | 昆山国显光电有限公司 | Oled显示面板的封装结构及封装方法 |
| WO2017130955A1 (ja) * | 2016-01-26 | 2017-08-03 | 住友化学株式会社 | 有機el素子 |
| CN207068882U (zh) * | 2017-07-06 | 2018-03-02 | 北京铂阳顶荣光伏科技有限公司 | 具有双层玻璃的路面发电组件 |
| CN107731876B (zh) * | 2017-10-19 | 2020-12-04 | 京东方科技集团股份有限公司 | 一种显示面板及其制作方法、显示装置 |
| TWI754829B (zh) * | 2019-07-17 | 2022-02-11 | 瑩耀科技股份有限公司 | 有機發光二極體封裝結構及其製造方法 |
| CN114824130B (zh) * | 2022-04-15 | 2025-08-22 | 昆山国显光电有限公司 | 显示模组及显示模组的制作方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05242966A (ja) * | 1992-02-26 | 1993-09-21 | Nec Kansai Ltd | 電界発光灯及びその製造方法 |
| JP3456257B2 (ja) * | 1994-05-27 | 2003-10-14 | 株式会社デンソー | 電子素子用パッケージ |
| DE69707233T2 (de) * | 1996-05-28 | 2002-07-11 | Koninklijke Philips Electronics N.V., Eindhoven | Organische elektrolumineszente vorrichtung |
| US5874804A (en) * | 1997-03-03 | 1999-02-23 | Motorola, Inc. | Organic electroluminescent device hermetic encapsulation package and method of fabrication |
| GB2335884A (en) * | 1998-04-02 | 1999-10-06 | Cambridge Display Tech Ltd | Flexible substrates for electronic or optoelectronic devices |
| JP2002522884A (ja) * | 1998-08-03 | 2002-07-23 | ユニアックス コーポレイション | 無機材料によるポリマー系固体デバイスのカプセル封入 |
| JP2002175877A (ja) * | 2000-09-27 | 2002-06-21 | Seiko Epson Corp | 有機エレクトロルミネッセンス装置、有機エレクトロルミネッセンス装置の製造方法、電子機器 |
| US6537688B2 (en) * | 2000-12-01 | 2003-03-25 | Universal Display Corporation | Adhesive sealed organic optoelectronic structures |
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| US6992439B2 (en) * | 2001-02-22 | 2006-01-31 | Semiconductor Energy Laboratory Co., Ltd. | Display device with sealing structure for protecting organic light emitting element |
| US6706316B2 (en) * | 2001-05-08 | 2004-03-16 | Eastman Kodak Company | Ultrasonically sealing the cover plate to provide a hermetic enclosure for OLED displays |
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| US6825054B2 (en) * | 2001-11-21 | 2004-11-30 | Paul Valentine | Light emitting ceramic device and method for fabricating the same |
| TWI271833B (en) * | 2001-12-10 | 2007-01-21 | Delta Optoelectronics Inc | Packaging structure of display device and method thereof |
| US6743524B2 (en) * | 2002-05-23 | 2004-06-01 | General Electric Company | Barrier layer for an article and method of making said barrier layer by expanding thermal plasma |
| US7649674B2 (en) * | 2002-06-10 | 2010-01-19 | E Ink Corporation | Electro-optic display with edge seal |
| US7372069B2 (en) * | 2003-01-14 | 2008-05-13 | Osram Opto Semiconductors Gmbh | Interface for UV-curable adhesives |
| US7018713B2 (en) * | 2003-04-02 | 2006-03-28 | 3M Innovative Properties Company | Flexible high-temperature ultrabarrier |
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| US7282749B2 (en) * | 2003-12-26 | 2007-10-16 | Lg.Philips Lcd Co., Ltd. | Organic electroluminescent device and method of fabricating the same |
| TWI228942B (en) * | 2004-03-30 | 2005-03-01 | Au Optronics Corp | Active matrix organic electroluminescent device and fabrication method thereof |
| US8405193B2 (en) * | 2004-04-02 | 2013-03-26 | General Electric Company | Organic electronic packages having hermetically sealed edges and methods of manufacturing such packages |
| US7316756B2 (en) * | 2004-07-27 | 2008-01-08 | Eastman Kodak Company | Desiccant for top-emitting OLED |
| US7078726B2 (en) * | 2004-09-09 | 2006-07-18 | Osram Opto Semiconductors Gmbh | Sealing of electronic device using absorbing layer for glue line |
| US7541671B2 (en) * | 2005-03-31 | 2009-06-02 | General Electric Company | Organic electronic devices having external barrier layer |
| US9123663B2 (en) * | 2008-06-10 | 2015-09-01 | Stats Chippac, Ltd. | Semiconductor device and method of forming shielding layer grounded through metal pillars formed in peripheral region of the semiconductor |
-
2005
- 2005-06-10 US US11/150,401 patent/US20060278965A1/en not_active Abandoned
-
2006
- 2006-04-05 WO PCT/US2006/012781 patent/WO2006135474A1/en not_active Ceased
- 2006-04-05 JP JP2008515690A patent/JP5143728B2/ja not_active Expired - Fee Related
- 2006-04-05 KR KR1020077028819A patent/KR101269607B1/ko not_active Expired - Fee Related
- 2006-04-05 EP EP06758276A patent/EP1894263B1/en not_active Not-in-force
- 2006-04-05 CN CN2006800204943A patent/CN101218692B/zh not_active Expired - Fee Related
-
2008
- 2008-04-03 US US12/062,364 patent/US7816676B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN101218692B (zh) | 2010-12-22 |
| WO2006135474A1 (en) | 2006-12-21 |
| US20060278965A1 (en) | 2006-12-14 |
| US20080185701A1 (en) | 2008-08-07 |
| EP1894263A1 (en) | 2008-03-05 |
| JP2008546211A (ja) | 2008-12-18 |
| EP1894263B1 (en) | 2011-06-22 |
| CN101218692A (zh) | 2008-07-09 |
| KR20080021650A (ko) | 2008-03-07 |
| KR101269607B1 (ko) | 2013-06-05 |
| US7816676B2 (en) | 2010-10-19 |
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