JP2007512714A - 低いループ高さのボールボンディング方法およびその装置 - Google Patents

低いループ高さのボールボンディング方法およびその装置 Download PDF

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JP2007512714A
JP2007512714A JP2006541443A JP2006541443A JP2007512714A JP 2007512714 A JP2007512714 A JP 2007512714A JP 2006541443 A JP2006541443 A JP 2006541443A JP 2006541443 A JP2006541443 A JP 2006541443A JP 2007512714 A JP2007512714 A JP 2007512714A
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wire
bond
capillary
ball
site
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JP2007512714A5 (enExample
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キン，アイヴィー，ダブリュー．
ワイズ，ロバート
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キューリック アンド ソファ インダストリーズ， インコーポレイテッド
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
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    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

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TW200524068A (en) 2005-07-16
US20050109819A1 (en) 2005-05-26
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