TWI367533B - Low loop height ball bonding method and apparatus - Google Patents

Low loop height ball bonding method and apparatus

Info

Publication number
TWI367533B
TWI367533B TW093136568A TW93136568A TWI367533B TW I367533 B TWI367533 B TW I367533B TW 093136568 A TW093136568 A TW 093136568A TW 93136568 A TW93136568 A TW 93136568A TW I367533 B TWI367533 B TW I367533B
Authority
TW
Taiwan
Prior art keywords
bonding method
ball bonding
loop height
low loop
height ball
Prior art date
Application number
TW093136568A
Other languages
English (en)
Chinese (zh)
Other versions
TW200524068A (en
Inventor
Ivy W Qin
Robert Wise
Original Assignee
Kulicke & Soffa Ind Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kulicke & Soffa Ind Inc filed Critical Kulicke & Soffa Ind Inc
Publication of TW200524068A publication Critical patent/TW200524068A/zh
Application granted granted Critical
Publication of TWI367533B publication Critical patent/TWI367533B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
TW093136568A 2003-11-26 2004-11-26 Low loop height ball bonding method and apparatus TWI367533B (en)

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US52530503P 2003-11-26 2003-11-26
US10/988,053 US7347352B2 (en) 2003-11-26 2004-11-12 Low loop height ball bonding method and apparatus

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SG123792A1 (en) 2006-07-26
WO2005055282A2 (en) 2005-06-16
US7347352B2 (en) 2008-03-25
US7584881B2 (en) 2009-09-08
JP2007512714A (ja) 2007-05-17
TW200524068A (en) 2005-07-16
US20050109819A1 (en) 2005-05-26
US20080111252A1 (en) 2008-05-15
WO2005055282A3 (en) 2006-02-09

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