JP2007503527A - 金属有機電解液から金属及び/又は金属合金を沈積する装置及び/又は方法 - Google Patents

金属有機電解液から金属及び/又は金属合金を沈積する装置及び/又は方法 Download PDF

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Publication number
JP2007503527A
JP2007503527A JP2006524288A JP2006524288A JP2007503527A JP 2007503527 A JP2007503527 A JP 2007503527A JP 2006524288 A JP2006524288 A JP 2006524288A JP 2006524288 A JP2006524288 A JP 2006524288A JP 2007503527 A JP2007503527 A JP 2007503527A
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JP
Japan
Prior art keywords
solvent
product
coating
rinsing
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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JP2006524288A
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English (en)
Japanese (ja)
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JP2007503527A5 (enExample
Inventor
イェルク ヘラー
フリース ハンス ドゥ
Original Assignee
アルミナル オーベルフレッヒェンテヒニク ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー コマンディトゲゼルシャフト
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Application filed by アルミナル オーベルフレッヒェンテヒニク ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー コマンディトゲゼルシャフト filed Critical アルミナル オーベルフレッヒェンテヒニク ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー コマンディトゲゼルシャフト
Publication of JP2007503527A publication Critical patent/JP2007503527A/ja
Publication of JP2007503527A5 publication Critical patent/JP2007503527A5/ja
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02Tanks; Installations therefor
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/003Electroplating using gases, e.g. pressure influence
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/42Electroplating: Baths therefor from solutions of light metals

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Chemical Vapour Deposition (AREA)
JP2006524288A 2003-08-26 2004-08-17 金属有機電解液から金属及び/又は金属合金を沈積する装置及び/又は方法 Pending JP2007503527A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP03019235A EP1510600A1 (de) 2003-08-26 2003-08-26 Verfahren und Vorrichtung zum Abscheiden von Metallen und Metalllegierungen aus Metallorganischen Elektrolyten
PCT/EP2004/009192 WO2005021840A1 (de) 2003-08-26 2004-08-17 Vorrichtung und verfahren zum abscheiden von metallen und/oder metalllegierungen aus metallorganischen elektrolyten

Publications (2)

Publication Number Publication Date
JP2007503527A true JP2007503527A (ja) 2007-02-22
JP2007503527A5 JP2007503527A5 (enExample) 2009-06-04

Family

ID=34089604

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006524288A Pending JP2007503527A (ja) 2003-08-26 2004-08-17 金属有機電解液から金属及び/又は金属合金を沈積する装置及び/又は方法

Country Status (7)

Country Link
US (1) US20070114132A1 (enExample)
EP (2) EP1510600A1 (enExample)
JP (1) JP2007503527A (enExample)
AT (1) ATE398195T1 (enExample)
DE (1) DE502004007361D1 (enExample)
DK (1) DK1658393T3 (enExample)
WO (1) WO2005021840A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004032659B4 (de) 2004-07-01 2008-10-30 Atotech Deutschland Gmbh Vorrichtung und Verfahren zum chemischen oder elektrolytischen Behandeln von Behandlungsgut sowie die Verwendung der Vorrichtung
CN103938239A (zh) * 2014-05-11 2014-07-23 山东建筑大学 一种钢带连续镀铜ⅰ
CN103938238B (zh) * 2014-05-11 2016-08-03 山东建筑大学 一种钢带连续镀铜方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3044975C2 (de) * 1980-11-28 1985-10-31 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zum galvanischen Abscheiden von Aluminium
DE3133232A1 (de) * 1981-08-21 1983-03-10 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zum galvanischen abscheiden von aluminium
DE3133162C2 (de) * 1981-08-21 1984-08-02 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zum galvanischen Abscheiden von Aluminium
DE3231855A1 (de) * 1982-08-26 1984-03-01 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zum galvanischen abscheiden von aluminium
US4759831A (en) * 1986-07-04 1988-07-26 Siemens Aktiengesellschaft Electroplating apparatus particularly for electro-deposition of aluminum

Also Published As

Publication number Publication date
EP1510600A1 (de) 2005-03-02
WO2005021840A1 (de) 2005-03-10
DK1658393T3 (da) 2008-10-20
US20070114132A1 (en) 2007-05-24
ATE398195T1 (de) 2008-07-15
EP1658393A1 (de) 2006-05-24
DE502004007361D1 (de) 2008-07-24
EP1658393B1 (de) 2008-06-11

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