JP2007294514A5 - - Google Patents
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- Publication number
- JP2007294514A5 JP2007294514A5 JP2006117720A JP2006117720A JP2007294514A5 JP 2007294514 A5 JP2007294514 A5 JP 2007294514A5 JP 2006117720 A JP2006117720 A JP 2006117720A JP 2006117720 A JP2006117720 A JP 2006117720A JP 2007294514 A5 JP2007294514 A5 JP 2007294514A5
- Authority
- JP
- Japan
- Prior art keywords
- contact plug
- interlayer insulating
- insulating film
- hole
- lower electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011229 interlayer Substances 0.000 claims 12
- 239000004065 semiconductor Substances 0.000 claims 9
- 230000004888 barrier function Effects 0.000 claims 8
- 229910052751 metal Inorganic materials 0.000 claims 8
- 239000002184 metal Substances 0.000 claims 8
- 239000003990 capacitor Substances 0.000 claims 6
- 238000004519 manufacturing process Methods 0.000 claims 4
- 230000000149 penetrating effect Effects 0.000 claims 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 3
- 229910052721 tungsten Inorganic materials 0.000 claims 3
- 239000010937 tungsten Substances 0.000 claims 3
- 239000004020 conductor Substances 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- 238000000151 deposition Methods 0.000 claims 1
- 238000005498 polishing Methods 0.000 claims 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006117720A JP2007294514A (ja) | 2006-04-21 | 2006-04-21 | 半導体装置 |
| US11/733,975 US20070246799A1 (en) | 2006-04-21 | 2007-04-11 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006117720A JP2007294514A (ja) | 2006-04-21 | 2006-04-21 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007294514A JP2007294514A (ja) | 2007-11-08 |
| JP2007294514A5 true JP2007294514A5 (enExample) | 2009-05-14 |
Family
ID=38618698
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006117720A Pending JP2007294514A (ja) | 2006-04-21 | 2006-04-21 | 半導体装置 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20070246799A1 (enExample) |
| JP (1) | JP2007294514A (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008300676A (ja) * | 2007-05-31 | 2008-12-11 | Rohm Co Ltd | 半導体装置およびその製造方法 |
| JP7197001B2 (ja) * | 2019-05-13 | 2022-12-27 | 株式会社村田製作所 | キャパシタ |
| CN114203442B (zh) * | 2021-12-03 | 2023-11-03 | 灿芯半导体(上海)股份有限公司 | 一种用于高精度电容阵列的电容单元 |
| US20240170529A1 (en) * | 2022-11-17 | 2024-05-23 | Microchip Technology Incorporated | Metal-insulator-metal (mim) capacitors with curved electrode |
| DE112023004797T5 (de) * | 2022-11-17 | 2025-09-11 | Microchip Technology Incorporated | Metall-isolator-metall (mim)-kondensatoren mit gekrümmter elektrode |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3212136B2 (ja) * | 1992-06-12 | 2001-09-25 | 川崎製鉄株式会社 | 溶接缶胴を有する缶体 |
| JP2000164812A (ja) * | 1998-11-27 | 2000-06-16 | Sharp Corp | 半導体装置及びその製造方法 |
| US6504205B1 (en) * | 2001-06-15 | 2003-01-07 | Silicon Integrated Systems Corp. | Metal capacitors with damascene structures |
| JP4076131B2 (ja) * | 2002-06-07 | 2008-04-16 | 富士通株式会社 | 半導体装置の製造方法 |
| JP2004022694A (ja) * | 2002-06-14 | 2004-01-22 | Renesas Technology Corp | 半導体装置の製造方法 |
| JP2004079924A (ja) * | 2002-08-22 | 2004-03-11 | Renesas Technology Corp | 半導体装置 |
| US6867447B2 (en) * | 2003-05-20 | 2005-03-15 | Texas Instruments Incorporated | Ferroelectric memory cell and methods for fabricating the same |
| US6876028B1 (en) * | 2003-09-30 | 2005-04-05 | International Business Machines Corporation | Metal-insulator-metal capacitor and method of fabrication |
-
2006
- 2006-04-21 JP JP2006117720A patent/JP2007294514A/ja active Pending
-
2007
- 2007-04-11 US US11/733,975 patent/US20070246799A1/en not_active Abandoned
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