JP2007251176A - 陽極酸化金属基板モジュール - Google Patents
陽極酸化金属基板モジュール Download PDFInfo
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- JP2007251176A JP2007251176A JP2007067887A JP2007067887A JP2007251176A JP 2007251176 A JP2007251176 A JP 2007251176A JP 2007067887 A JP2007067887 A JP 2007067887A JP 2007067887 A JP2007067887 A JP 2007067887A JP 2007251176 A JP2007251176 A JP 2007251176A
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- JP
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- Prior art keywords
- anodized
- metal plate
- substrate module
- metal substrate
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0033—Means for improving the coupling-out of light from the light guide
- G02B6/0058—Means for improving the coupling-out of light from the light guide varying in density, size, shape or depth along the light guide
- G02B6/0061—Means for improving the coupling-out of light from the light guide varying in density, size, shape or depth along the light guide to provide homogeneous light output intensity
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0033—Means for improving the coupling-out of light from the light guide
- G02B6/005—Means for improving the coupling-out of light from the light guide provided by one optical element, or plurality thereof, placed on the light output side of the light guide
- G02B6/0053—Prismatic sheet or layer; Brightness enhancement element, sheet or layer
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
- G02B6/0068—Arrangements of plural sources, e.g. multi-colour light sources
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
- G02B6/0073—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Led Device Packages (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Planar Illumination Modules (AREA)
Abstract
【解決手段】本発明による陽極酸化金属基板モジュールは、金属プレートと、上記金属プレート上に形成された陽極酸化膜と、上記金属プレート上に実装された熱発生素子と、上記陽極酸化膜上に形成された電気的配線とを含む。金属プレートは、アルミニウムまたはアルミニウム合金からなってもよい。熱発生素子は、少なくとも一つのLEDを含んでもよい。
【選択図】図3
Description
103 陽極酸化膜
101、102 金属プレート
105 配線
113 陽極酸化膜パターン
104 開放部
106、107、108、109、110、111 実装素子
114 反射コップ
120 コネクタ
124 反射面
126 LED
130 金属層
140 絶縁層
Claims (12)
- 金属プレートと、
前記金属プレート上に形成された陽極酸化膜と、
前記金属プレート上に実装された熱発生素子と、
前記陽極酸化膜上に形成された電気的配線とを含む陽極酸化金属基板モジュール。 - 前記金属プレートは、アルミニウムまたはアルミニウム合金からなることを特徴とする請求項1に記載の陽極酸化金属基板モジュール。
- 前記熱発生素子は、少なくとも一つのLEDを含むことを特徴とする請求項1に記載の陽極酸化金属基板モジュール。
- 前記陽極酸化金属基板モジュールは、面光源装置またはバックライトユニットに使用されることを特徴とする請求項1に記載の陽極酸化金属基板モジュール。
- 前記陽極酸化膜は、前記金属プレートの上面を選択的に開放するよう前記金属プレート上に選択的に形成されていることを特徴とする請求項1に記載の陽極酸化金属基板モジュール。
- 前記熱発生素子は、前記陽極酸化膜により開放された領域の前記金属プレートの上面に実装されたことを特徴とする請求項5に記載の陽極酸化金属基板モジュール。
- 前記陽極酸化膜により開放された領域の前記金属プレートの上面に形成された金属層をさらに含むことを特徴とする請求項5に記載の陽極酸化金属基板モジュール。
- 前記金属層と前記金属プレートとの間に形成された絶縁層をさらに含むことを特徴とする請求項7に記載の陽極酸化金属基板モジュール。
- 前記陽極酸化膜は前記金属プレートの上面を選択的に開放するよう選択的に形成され、前記陽極酸化膜により開放された領域の前記金属プレートの上面には反射コップを有するよう一つ以上の溝が形成されており、
前記反射コップの底面にはLEDが実装されていることを特徴とする請求項1に記載の陽極酸化金属基板モジュール。 - 前記陽極酸化金属基板モジュールは、面光源装置またはバックライトユニットに使用されることを特徴とする請求項9に記載の陽極酸化金属基板モジュール。
- 前記金属プレートの下面には前記金属プレートと一体を成して空気との接触面積を広げることの出来る熱シンク構造が提供されることを特徴とする請求項1に記載の陽極酸化金属基板モジュール。
- 前記熱シンク構造は、前記金属プレートの下面に提供され前記金属プレートに垂直に延長された冷却フィンであることを特徴とする請求項11に記載の陽極酸化金属基板モジュール。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060025010A KR100764388B1 (ko) | 2006-03-17 | 2006-03-17 | 양극산화 금속기판 모듈 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011103288A Division JP5246970B2 (ja) | 2006-03-17 | 2011-05-02 | 陽極酸化金属基板モジュール |
Publications (1)
Publication Number | Publication Date |
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JP2007251176A true JP2007251176A (ja) | 2007-09-27 |
Family
ID=38517631
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007067887A Abandoned JP2007251176A (ja) | 2006-03-17 | 2007-03-16 | 陽極酸化金属基板モジュール |
JP2011103288A Active JP5246970B2 (ja) | 2006-03-17 | 2011-05-02 | 陽極酸化金属基板モジュール |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
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JP2011103288A Active JP5246970B2 (ja) | 2006-03-17 | 2011-05-02 | 陽極酸化金属基板モジュール |
Country Status (5)
Country | Link |
---|---|
US (1) | US8058781B2 (ja) |
JP (2) | JP2007251176A (ja) |
KR (1) | KR100764388B1 (ja) |
CN (1) | CN101039548B (ja) |
TW (1) | TWI328666B (ja) |
Cited By (7)
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JP2009267322A (ja) * | 2008-04-28 | 2009-11-12 | Samsung Electro Mech Co Ltd | 発光素子パッケージ及びその製造方法 |
KR101055558B1 (ko) * | 2010-01-11 | 2011-08-08 | 삼성전기주식회사 | 방열기판 및 그 제조방법 |
EP2384100A2 (en) | 2010-04-28 | 2011-11-02 | Fujifilm Corporation | Insulated light-reflective substrate |
WO2012008569A1 (ja) * | 2010-07-15 | 2012-01-19 | シャープ株式会社 | 放熱板、電子機器 |
JP2013016769A (ja) * | 2011-07-04 | 2013-01-24 | Samsung Electro-Mechanics Co Ltd | パワーモジュールパッケージ及びその製造方法 |
JP2014072314A (ja) * | 2012-09-28 | 2014-04-21 | Toyota Industries Corp | 半導体装置、及び半導体装置の製造方法 |
JP2015517226A (ja) * | 2012-05-04 | 2015-06-18 | アー.ベー.ミクロエレクトロニクゲゼルシャフト ミト ベシュレンクテル ハフツング | 回路板、特には、導電性基板を備える電力モジュールのための回路板 |
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US8854595B2 (en) | 2008-03-03 | 2014-10-07 | Manufacturing Resources International, Inc. | Constricted convection cooling system for an electronic display |
US8773633B2 (en) | 2008-03-03 | 2014-07-08 | Manufacturing Resources International, Inc. | Expanded heat sink for electronic displays |
US9173325B2 (en) | 2008-03-26 | 2015-10-27 | Manufacturing Resources International, Inc. | Heat exchanger for back to back electronic displays |
US8537302B2 (en) * | 2008-06-11 | 2013-09-17 | Manufacturing Resources International, Inc. | Liquid crystal display assembly comprising an LED backlight assembly and a movable element placed behind the LED backlight assembly having a hinge to allow access to a rear portion of the LED backlight assembly |
US8654302B2 (en) | 2008-03-03 | 2014-02-18 | Manufacturing Resources International, Inc. | Heat exchanger for an electronic display |
US8497972B2 (en) | 2009-11-13 | 2013-07-30 | Manufacturing Resources International, Inc. | Thermal plate with optional cooling loop in electronic display |
US8693185B2 (en) | 2008-03-26 | 2014-04-08 | Manufacturing Resources International, Inc. | System and method for maintaining a consistent temperature gradient across an electronic display |
JP2010073767A (ja) * | 2008-09-17 | 2010-04-02 | Jtekt Corp | 多層回路基板 |
US10827656B2 (en) | 2008-12-18 | 2020-11-03 | Manufacturing Resources International, Inc. | System for cooling an electronic image assembly with circulating gas and ambient gas |
US8749749B2 (en) | 2008-12-18 | 2014-06-10 | Manufacturing Resources International, Inc. | System for cooling an electronic image assembly with manifolds and ambient gas |
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US9257615B2 (en) | 2008-04-28 | 2016-02-09 | Samsung Electronics Co., Ltd. | Light emitting device package and method of manufacturing the same |
JP2009267322A (ja) * | 2008-04-28 | 2009-11-12 | Samsung Electro Mech Co Ltd | 発光素子パッケージ及びその製造方法 |
US8299692B2 (en) | 2008-04-28 | 2012-10-30 | Samsung Electronics Co., Ltd. | Light emitting device package and method of manufacturing the same |
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EP2384100A2 (en) | 2010-04-28 | 2011-11-02 | Fujifilm Corporation | Insulated light-reflective substrate |
WO2012008569A1 (ja) * | 2010-07-15 | 2012-01-19 | シャープ株式会社 | 放熱板、電子機器 |
JP2013254973A (ja) * | 2011-07-04 | 2013-12-19 | Samsung Electro-Mechanics Co Ltd | パワーモジュールパッケージの製造方法 |
JP2013016769A (ja) * | 2011-07-04 | 2013-01-24 | Samsung Electro-Mechanics Co Ltd | パワーモジュールパッケージ及びその製造方法 |
JP2015517226A (ja) * | 2012-05-04 | 2015-06-18 | アー.ベー.ミクロエレクトロニクゲゼルシャフト ミト ベシュレンクテル ハフツング | 回路板、特には、導電性基板を備える電力モジュールのための回路板 |
KR101603861B1 (ko) | 2012-05-04 | 2016-03-16 | 아베 미크로엘렉트로닉 게젤샤프트 미트 베슈렝크터 하프퉁 | 전도성 기판을 포함하는, 특히 전력전자모듈용 회로기판 |
US9648736B2 (en) | 2012-05-04 | 2017-05-09 | A.B. Mikroelektronik Gesellschaft Mit Beschraenkter Haftung | Circuit board, particularly for a power-electronic module, comprising an electrically-conductive substrate |
US10091874B2 (en) | 2012-05-04 | 2018-10-02 | Ab Mikroelektronik Gesellschaft Mit Beschraenkter Haftung | Circuit board, particulary for a power-electronic module, comprising an electrically-conductive substrate |
JP2014072314A (ja) * | 2012-09-28 | 2014-04-21 | Toyota Industries Corp | 半導体装置、及び半導体装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
KR100764388B1 (ko) | 2007-10-05 |
CN101039548A (zh) | 2007-09-19 |
TWI328666B (en) | 2010-08-11 |
US20070217221A1 (en) | 2007-09-20 |
US8058781B2 (en) | 2011-11-15 |
CN101039548B (zh) | 2012-03-21 |
JP5246970B2 (ja) | 2013-07-24 |
KR20070094384A (ko) | 2007-09-20 |
TW200809131A (en) | 2008-02-16 |
JP2011193015A (ja) | 2011-09-29 |
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