JPS63107483U - - Google Patents

Info

Publication number
JPS63107483U
JPS63107483U JP20098686U JP20098686U JPS63107483U JP S63107483 U JPS63107483 U JP S63107483U JP 20098686 U JP20098686 U JP 20098686U JP 20098686 U JP20098686 U JP 20098686U JP S63107483 U JPS63107483 U JP S63107483U
Authority
JP
Japan
Prior art keywords
semiconductor light
light emitting
emitting
display device
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20098686U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP20098686U priority Critical patent/JPS63107483U/ja
Publication of JPS63107483U publication Critical patent/JPS63107483U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Description

【図面の簡単な説明】
第１図は本考案の一実施例を示す要部断面図、
第２図は同実施例の取付け状態を示す断面図、第
３図は同実施例と従来品との比較説明図、第４図
ａは本考案の第２実施例を示す斜視図、第４図ｂ
は同図ａの部分拡大図、第５図ａ〜ｃはそれぞれ
本考案の第３実施例〜第５実施例を示す斜視図、
第６図ａ，ｂは従来の半導体発光表示装置を示す
図である。 １２，２７，４０，４３，４５…基材、１４…
凹部、１６…ＬＥＤ（半導体発光素子）、１７…
絶縁層、１８…回路パターンとしての配線導体、
２０，２９…樹脂、２１，２８…表示装置（半導
体発光表示装置）。

Claims (1)

  1. 【実用新案登録請求の範囲】 基材の一方の面に複数の半導体発光素子を取り
    付け、この複数の半導体発光素子を選択的に発光
    させることにより所望のパターンの図形を表示さ
    せる半導体発光表示装置において； 前記基材の一方の面に前記半導体発光素子を取
    付けるための複数の凹部を有し、該凹部の底面に
    半導体発光素子の一方の電極を電気的に接続し、
    前記一方の面の凹部以外の箇所又は他方の面に絶
    縁層を介して形成した回路パターンに、前記半導
    体発光素子の他方の電極を電気的に接続したこと
    を特徴とする半導体発光表示装置。
JP20098686U 1986-12-29 1986-12-29 Pending JPS63107483U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20098686U JPS63107483U (ja) 1986-12-29 1986-12-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20098686U JPS63107483U (ja) 1986-12-29 1986-12-29

Publications (1)

Publication Number Publication Date
JPS63107483U true JPS63107483U (ja) 1988-07-11

Family

ID=31164018

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20098686U Pending JPS63107483U (ja) 1986-12-29 1986-12-29

Country Status (1)

Country Link
JP (1) JPS63107483U (ja)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0492660U (ja) * 1990-12-28 1992-08-12
WO2006107011A1 (ja) * 2005-04-04 2006-10-12 Nippon Sheet Glass Company Limited 発光ユニット、該発光ユニットを用いた照明装置及び画像読取装置
JP2006351666A (ja) * 2005-06-14 2006-12-28 Fujikura Ltd 発光素子実装用基板とその製造方法、発光素子モジュール、照明装置、表示装置及び交通信号機
JP2007514320A (ja) * 2003-12-09 2007-05-31 ゲルコアー リミテッド ライアビリティ カンパニー 表面実装の発光チップパッケージ
JP2007251176A (ja) * 2006-03-17 2007-09-27 Samsung Electro-Mechanics Co Ltd 陽極酸化金属基板モジュール
JP2009081193A (ja) * 2007-09-25 2009-04-16 Sanyo Electric Co Ltd 発光モジュールおよびその製造方法
JP2009117788A (ja) * 2007-11-05 2009-05-28 Liangfeng Plastic Machinery Co 放熱基板を具えた発光ダイオード装置及びその製造方法
US7699500B2 (en) 2005-06-07 2010-04-20 Fujikura Ltd. Light-emitting element mounting board, light-emitting element module, lighting device, display device, and traffic signal equipment
JP2012190841A (ja) * 2011-03-08 2012-10-04 Panasonic Corp Ｌｅｄパッケージ及びｌｅｄ照明装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3821775A (en) * 1971-09-23 1974-06-28 Spectronics Inc Edge emission gaas light emitter structure
JPS5093586A (ja) * 1973-12-19 1975-07-25
JPS5549714A (en) * 1978-10-03 1980-04-10 Nec Corp Inducing unit
JPS5824180A (ja) * 1981-08-06 1983-02-14 キムラ電機株式会社 平板状表示装置の製造法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3821775A (en) * 1971-09-23 1974-06-28 Spectronics Inc Edge emission gaas light emitter structure
JPS5093586A (ja) * 1973-12-19 1975-07-25
JPS5549714A (en) * 1978-10-03 1980-04-10 Nec Corp Inducing unit
JPS5824180A (ja) * 1981-08-06 1983-02-14 キムラ電機株式会社 平板状表示装置の製造法

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0492660U (ja) * 1990-12-28 1992-08-12
JP2007514320A (ja) * 2003-12-09 2007-05-31 ゲルコアー リミテッド ライアビリティ カンパニー 表面実装の発光チップパッケージ
WO2006107011A1 (ja) * 2005-04-04 2006-10-12 Nippon Sheet Glass Company Limited 発光ユニット、該発光ユニットを用いた照明装置及び画像読取装置
US7699500B2 (en) 2005-06-07 2010-04-20 Fujikura Ltd. Light-emitting element mounting board, light-emitting element module, lighting device, display device, and traffic signal equipment
JP2006351666A (ja) * 2005-06-14 2006-12-28 Fujikura Ltd 発光素子実装用基板とその製造方法、発光素子モジュール、照明装置、表示装置及び交通信号機
JP2007251176A (ja) * 2006-03-17 2007-09-27 Samsung Electro-Mechanics Co Ltd 陽極酸化金属基板モジュール
JP2009081193A (ja) * 2007-09-25 2009-04-16 Sanyo Electric Co Ltd 発光モジュールおよびその製造方法
JP2009117788A (ja) * 2007-11-05 2009-05-28 Liangfeng Plastic Machinery Co 放熱基板を具えた発光ダイオード装置及びその製造方法
JP2012190841A (ja) * 2011-03-08 2012-10-04 Panasonic Corp Ｌｅｄパッケージ及びｌｅｄ照明装置

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