JPH0170345U - - Google Patents
Info
- Publication number
- JPH0170345U JPH0170345U JP16470887U JP16470887U JPH0170345U JP H0170345 U JPH0170345 U JP H0170345U JP 16470887 U JP16470887 U JP 16470887U JP 16470887 U JP16470887 U JP 16470887U JP H0170345 U JPH0170345 U JP H0170345U
- Authority
- JP
- Japan
- Prior art keywords
- chip carrier
- leadless chip
- integrated circuit
- semiconductor integrated
- circuit element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案のリードレスチツプキヤリアの
斜視図、第２図は第１図のリードレスチツプキヤ
リアを実装した基板の縦断面図、第３図は従来の
リードレスチツプキヤリアの斜視図である。 １，１４……リードレスチツプキヤリア、２…
…凸部、３，１７……底部、４，１６……半導体
集積回路素子接続電極、５，６，１５……外部接
続用電極、７……フタ、８，９……半田、１０…
…基板、１３……回路配線パターン、１１……半
導体集積回路素子、１２……ワイヤー。
斜視図、第２図は第１図のリードレスチツプキヤ
リアを実装した基板の縦断面図、第３図は従来の
リードレスチツプキヤリアの斜視図である。 １，１４……リードレスチツプキヤリア、２…
…凸部、３，１７……底部、４，１６……半導体
集積回路素子接続電極、５，６，１５……外部接
続用電極、７……フタ、８，９……半田、１０…
…基板、１３……回路配線パターン、１１……半
導体集積回路素子、１２……ワイヤー。
Claims (1)
- 半導体集積回路素子を収容するリードレスチツ
プキヤリアにおいて、底部に複数の外部接続用電
極を周囲に配置した凸部を有することを特徴とす
るリードレスチツプキヤリア。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16470887U JPH0170345U (ja) | 1987-10-27 | 1987-10-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16470887U JPH0170345U (ja) | 1987-10-27 | 1987-10-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0170345U true JPH0170345U (ja) | 1989-05-10 |
Family
ID=31450553
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16470887U Pending JPH0170345U (ja) | 1987-10-27 | 1987-10-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0170345U (ja) |
-
1987
- 1987-10-27 JP JP16470887U patent/JPH0170345U/ja active Pending