JPS6217148U - - Google Patents
Info
- Publication number
- JPS6217148U JPS6217148U JP10791685U JP10791685U JPS6217148U JP S6217148 U JPS6217148 U JP S6217148U JP 10791685 U JP10791685 U JP 10791685U JP 10791685 U JP10791685 U JP 10791685U JP S6217148 U JPS6217148 U JP S6217148U
- Authority
- JP
- Japan
- Prior art keywords
- pins
- terminal pins
- top surface
- substrate
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 2
- 238000005452 bending Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図ａ，ｂは本考案の一実施例に於ける混成
集積回路基板の平面図及び断面図、第２図ａ，ｂ
は従来の混成集積回路基板を示す平面図及び断面
図である。 １……セラミツク基板、３……基板上面、４…
…基板下面、５……端子ピン接続用半田、８……
上面端子ピン、９……下面端子ピン。
集積回路基板の平面図及び断面図、第２図ａ，ｂ
は従来の混成集積回路基板を示す平面図及び断面
図である。 １……セラミツク基板、３……基板上面、４…
…基板下面、５……端子ピン接続用半田、８……
上面端子ピン、９……下面端子ピン。
Claims (1)
- セラミツク基板の相対する側面の基板の上面及
び下面より外部回路接続用の端子ピンを設け、上
面からの端子ピンの間に下面からの端子ピンを配
置し、且つ上面からの端子ピンと下面からの端子
ピンとを基板側面から異なる位置で曲げて形成し
た混成集積回路基板。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10791685U JPS6217148U (ja) | 1985-07-15 | 1985-07-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10791685U JPS6217148U (ja) | 1985-07-15 | 1985-07-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6217148U true JPS6217148U (ja) | 1987-02-02 |
Family
ID=30984634
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10791685U Pending JPS6217148U (ja) | 1985-07-15 | 1985-07-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6217148U (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03149772A (ja) * | 1989-11-02 | 1991-06-26 | Matsushiro Kogyo Kk | クリップ式リードフレーム |
| KR20030025166A (ko) * | 2001-09-19 | 2003-03-28 | 미쓰비시덴키 가부시키가이샤 | 표면실장용 커넥터 및 이것을 사용한 반도체 모듈 |
-
1985
- 1985-07-15 JP JP10791685U patent/JPS6217148U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03149772A (ja) * | 1989-11-02 | 1991-06-26 | Matsushiro Kogyo Kk | クリップ式リードフレーム |
| KR20030025166A (ko) * | 2001-09-19 | 2003-03-28 | 미쓰비시덴키 가부시키가이샤 | 표면실장용 커넥터 및 이것을 사용한 반도체 모듈 |