JPS6418752U - - Google Patents

Info

Publication number
JPS6418752U
JPS6418752U JP11442887U JP11442887U JPS6418752U JP S6418752 U JPS6418752 U JP S6418752U JP 11442887 U JP11442887 U JP 11442887U JP 11442887 U JP11442887 U JP 11442887U JP S6418752 U JPS6418752 U JP S6418752U
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
circuit board
bumps
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11442887U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11442887U priority Critical patent/JPS6418752U/ja
Publication of JPS6418752U publication Critical patent/JPS6418752U/ja
Pending legal-status Critical Current

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  • Combinations Of Printed Boards (AREA)

Description

【図面の簡単な説明】
第１図ａは本考案の一実施例の平面図、同図ｂ
は側面図、第２図は第１図のセラミツク基板の裏
面図、第３図ａは本考案の他の実施例の平面図、
同図ｂは側面図、第４図ａは従来の集積回路の平
面図、同図ｂは側面図である。 １ａ，１ｂ，１ｃ……混成集積回路（セラミツ
ク）基板、３……リード、４……チツプコンデン
サ、５……ミニモールドＴｒ、６……ミニフラツ
トＩＣ、７……はんだバンプ、８……フラツトパ
ツクＩＣ。

Claims (1)

    【実用新案登録請求の範囲】
  1. 混成集積回路基板の一面に多数のバンプが設け
    られ、このバンプにより、他の混成集積回路基板
    と腹合せに接続されていることを特徴とする混成
    集積回路。
JP11442887U 1987-07-24 1987-07-24 Pending JPS6418752U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11442887U JPS6418752U (ja) 1987-07-24 1987-07-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11442887U JPS6418752U (ja) 1987-07-24 1987-07-24

Publications (1)

Publication Number Publication Date
JPS6418752U true JPS6418752U (ja) 1989-01-30

Family

ID=31355168

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11442887U Pending JPS6418752U (ja) 1987-07-24 1987-07-24

Country Status (1)

Country Link
JP (1) JPS6418752U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003005445A1 (fr) * 2001-07-04 2003-01-16 Sony Corporation Dispositif a semiconducteur et module a semiconducteur

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003005445A1 (fr) * 2001-07-04 2003-01-16 Sony Corporation Dispositif a semiconducteur et module a semiconducteur

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