JPS6130248U - 多層セラミツク基板 - Google Patents

多層セラミツク基板

Info

Publication number
JPS6130248U
JPS6130248U JP1984113811U JP11381184U JPS6130248U JP S6130248 U JPS6130248 U JP S6130248U JP 1984113811 U JP1984113811 U JP 1984113811U JP 11381184 U JP11381184 U JP 11381184U JP S6130248 U JPS6130248 U JP S6130248U
Authority
JP
Japan
Prior art keywords
multilayer ceramic
ceramic substrate
board
semiconductor chip
conductive pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984113811U
Other languages
English (en)
Inventor
正弘 吹野
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to JP1984113811U priority Critical patent/JPS6130248U/ja
Publication of JPS6130248U publication Critical patent/JPS6130248U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15192—Resurf arrangement of the internal vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来の多層セラミック基板に半導体チップを搭
載した構成を示す斜視図、第２図は、第１図の多層セラ
ミック基板及び半導体チップの断面図、第３図は、第１
図の多層セラミック基板の表面層を示す平面図、第４図
はこの考案の一実施例である多層セラミック基板に半導
体チップを搭載した構成を示す斜視図、第５図は、第４
図め多層セラミック基板の表面層を示す平面図、第６図
及び第７図は、それぞれ第４図の多層セラミック基板に
適用される、異なるバンプ配列、バンプ形状を有する半
導体チップを示す裏面図、第８図は、第４図の多層セラ
ミック基板及び半導体チップの断面図である。 図において、１．１０・・・多層セラミック基板、２，
１３・・・半導体チップ、３．１１・・・Ｉ／Ｏピン、
４，７．８・・・パッド、５．１４・・・はンタバン７
’、６．１２・・・スルホール、９・・・導電パターン
である。 なお、各図中、同一符号は同一、又は相当部分を示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. はんだバンプを有する半導体チップを搭載する基板にお
    いて、前記半導体チップと前記基板との接続点のパッド
    に接続されると共に、Ｉ／Ｏピンに接続される前記基板
    の表面の導電パターンの途中に別個のパッドを設け、前
    記基板に、異なるバンプ配列、・バンプ形状を有する他
    の半導体チップを搭載で碁る様に構成した多層セラミッ
    ク基板。
JP1984113811U 1984-07-26 1984-07-26 多層セラミツク基板 Pending JPS6130248U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984113811U JPS6130248U (ja) 1984-07-26 1984-07-26 多層セラミツク基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984113811U JPS6130248U (ja) 1984-07-26 1984-07-26 多層セラミツク基板

Publications (1)

Publication Number Publication Date
JPS6130248U true JPS6130248U (ja) 1986-02-24

Family

ID=30672836

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984113811U Pending JPS6130248U (ja) 1984-07-26 1984-07-26 多層セラミツク基板

Country Status (1)

Country Link
JP (1) JPS6130248U (ja)

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