JPS62114451U - - Google Patents
Info
- Publication number
- JPS62114451U JPS62114451U JP1986001884U JP188486U JPS62114451U JP S62114451 U JPS62114451 U JP S62114451U JP 1986001884 U JP1986001884 U JP 1986001884U JP 188486 U JP188486 U JP 188486U JP S62114451 U JPS62114451 U JP S62114451U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- bump electrode
- semiconductor chip
- substrate
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
Description
第１図はこの考案の一実施例である半導体装置
の斜視図、第２図は同上半導体装置における半導
体チツプの製造過程を示す側面図でａはレジスト
塗布後、ｂは裏面パターンを付けたところ、Ｃは
完成後の状態を示すものである。 １：半導体チツプ、１ａ：溝、２：バンプ電極
、３：基板、３ａ：配線部。
の斜視図、第２図は同上半導体装置における半導
体チツプの製造過程を示す側面図でａはレジスト
塗布後、ｂは裏面パターンを付けたところ、Ｃは
完成後の状態を示すものである。 １：半導体チツプ、１ａ：溝、２：バンプ電極
、３：基板、３ａ：配線部。
Claims (1)
- 半導体チツプ表面のパツド上にバンプ電極を設
け、このバンプ電極をフエイスダウンボンデイン
グ法により基板の配線部に接続する半導体装置に
おいて、前記半導体チツプの裏面に細い溝を少な
くとも１本以上設けたことを特徴とする半導体装
置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986001884U JPS62114451U (ja) | 1986-01-10 | 1986-01-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986001884U JPS62114451U (ja) | 1986-01-10 | 1986-01-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62114451U true JPS62114451U (ja) | 1987-07-21 |
Family
ID=30780208
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986001884U Pending JPS62114451U (ja) | 1986-01-10 | 1986-01-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62114451U (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05275579A (ja) * | 1992-03-25 | 1993-10-22 | Matsushita Electric Works Ltd | 半導体装置における放熱構造 |
| JP2006332374A (ja) * | 2005-05-26 | 2006-12-07 | Rohm Co Ltd | 半導体装置 |
-
1986
- 1986-01-10 JP JP1986001884U patent/JPS62114451U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05275579A (ja) * | 1992-03-25 | 1993-10-22 | Matsushita Electric Works Ltd | 半導体装置における放熱構造 |
| JP2006332374A (ja) * | 2005-05-26 | 2006-12-07 | Rohm Co Ltd | 半導体装置 |