JPH0459944U - - Google Patents
Info
- Publication number
- JPH0459944U JPH0459944U JP10230190U JP10230190U JPH0459944U JP H0459944 U JPH0459944 U JP H0459944U JP 10230190 U JP10230190 U JP 10230190U JP 10230190 U JP10230190 U JP 10230190U JP H0459944 U JPH0459944 U JP H0459944U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor substrate
- semiconductor device
- subjected
- connected via
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Semiconductor Integrated Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
第１図乃至第３図は本考案の実施例を説明する
ためのもので、第１図及び第２図は本考案のＰＮ
接合の具体的二例を示す回路模式図、第３図は本
考案のＰＮ接合を示す半導体基板の部分断面図で
ある。第４図は半導体装置の内部構造を示す正面
図、第５図は第４図の平面図である。第６図は従
来の半導体装置における半導体基板を示す部分断
面図である。 １……半導体基板、３′……電極パツド、１１
……配線パターン、１３……ＰＮ接合。
ためのもので、第１図及び第２図は本考案のＰＮ
接合の具体的二例を示す回路模式図、第３図は本
考案のＰＮ接合を示す半導体基板の部分断面図で
ある。第４図は半導体装置の内部構造を示す正面
図、第５図は第４図の平面図である。第６図は従
来の半導体装置における半導体基板を示す部分断
面図である。 １……半導体基板、３′……電極パツド、１１
……配線パターン、１３……ＰＮ接合。
Claims (1)
- 半導体基板の表面に形成されてワイヤボンデイ
ングされない電極パツドと、上記半導体基板に構
成された内部回路に延びる配線パターンとをＰＮ
接合構造を介して接続したことを特徴とする半導
体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10230190U JPH0459944U (ja) | 1990-09-29 | 1990-09-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10230190U JPH0459944U (ja) | 1990-09-29 | 1990-09-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0459944U true JPH0459944U (ja) | 1992-05-22 |
Family
ID=31846425
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10230190U Pending JPH0459944U (ja) | 1990-09-29 | 1990-09-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0459944U (ja) |
-
1990
- 1990-09-29 JP JP10230190U patent/JPH0459944U/ja active Pending