JPS6265835U - - Google Patents
Info
- Publication number
- JPS6265835U JPS6265835U JP1985157530U JP15753085U JPS6265835U JP S6265835 U JPS6265835 U JP S6265835U JP 1985157530 U JP1985157530 U JP 1985157530U JP 15753085 U JP15753085 U JP 15753085U JP S6265835 U JPS6265835 U JP S6265835U
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- substrate
- locations
- flip
- secure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8119—Arrangement of the bump connectors prior to mounting
- H01L2224/81191—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8119—Arrangement of the bump connectors prior to mounting
- H01L2224/81193—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
Landscapes
- Wire Bonding (AREA)
Description
第１図は、本考案の一実施例の平面図、第２図
は、同上の工程説明図、第３図ａ〜ｅは、それぞ
れ従来例の工程説明図、第４図は、同上の平面図
である。 １…基板、２…ボンデイングパターン、３，３
ａ，３ｂ，３ｃ…ＬＳＩ、４，４ａ，４ｂ，４ｃ
…バンプ部、５…残留物、２１…ボンデイング部
。
は、同上の工程説明図、第３図ａ〜ｅは、それぞ
れ従来例の工程説明図、第４図は、同上の平面図
である。 １…基板、２…ボンデイングパターン、３，３
ａ，３ｂ，３ｃ…ＬＳＩ、４，４ａ，４ｂ，４ｃ
…バンプ部、５…残留物、２１…ボンデイング部
。
Claims (1)
- 基板上に形成される各ボンデイングパターンを
それぞれ複数のボンデイング箇所を確保できる面
積を有するものとし、これらの各ボンデイング部
をすべて同一方向に向けて揃えて形成してなるフ
リツプチツプＬＳＩボンデイング用基板。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985157530U JPS6265835U (ja) | 1985-10-14 | 1985-10-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985157530U JPS6265835U (ja) | 1985-10-14 | 1985-10-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6265835U true JPS6265835U (ja) | 1987-04-23 |
Family
ID=31080163
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985157530U Pending JPS6265835U (ja) | 1985-10-14 | 1985-10-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6265835U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010010611A (ja) * | 2008-06-30 | 2010-01-14 | Toshiba Corp | プリント回路板及び電子機器 |
-
1985
- 1985-10-14 JP JP1985157530U patent/JPS6265835U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010010611A (ja) * | 2008-06-30 | 2010-01-14 | Toshiba Corp | プリント回路板及び電子機器 |