JPS6217182U - - Google Patents
Info
- Publication number
- JPS6217182U JPS6217182U JP10864385U JP10864385U JPS6217182U JP S6217182 U JPS6217182 U JP S6217182U JP 10864385 U JP10864385 U JP 10864385U JP 10864385 U JP10864385 U JP 10864385U JP S6217182 U JPS6217182 U JP S6217182U
- Authority
- JP
- Japan
- Prior art keywords
- electronic circuit
- lead
- out conductor
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims description 4
- 239000011247 coating layer Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
第１図は本考案の一実施例を示す縦断面図であ
り、第２図は従来構成を示す第１図相当図である
。 図面中、１１はプリント配線基板、１１ａは下
面（一方の面）、１１ｂは上面（他方の面）、１
２は半導体チツプ（電子回路素子）、１３はワイ
ヤ（引き出し用導体）、１４はキヤツプ、１５は
樹脂コーテイング層を示す。
り、第２図は従来構成を示す第１図相当図である
。 図面中、１１はプリント配線基板、１１ａは下
面（一方の面）、１１ｂは上面（他方の面）、１
２は半導体チツプ（電子回路素子）、１３はワイ
ヤ（引き出し用導体）、１４はキヤツプ、１５は
樹脂コーテイング層を示す。
Claims (1)
- プリント配線基板の両面に配置された電子回路
素子にワイヤボンデイングにより引き出し用導体
を接続するようにした電子回路装置において、前
記プリント配線基板の一方の面に前記電子回路素
子及び前記引き出し用導体を覆うようにしてキヤ
ツプを取付けると共に、他方の面に前記電子回路
素子及び前記引き出し用導体を覆うようにして樹
脂コーテイング層を形成するようにしたことを特
徴とする電子回路装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985108643U JPH0346504Y2 (ja) | 1985-07-16 | 1985-07-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985108643U JPH0346504Y2 (ja) | 1985-07-16 | 1985-07-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6217182U true JPS6217182U (ja) | 1987-02-02 |
| JPH0346504Y2 JPH0346504Y2 (ja) | 1991-10-01 |
Family
ID=30986026
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985108643U Expired JPH0346504Y2 (ja) | 1985-07-16 | 1985-07-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0346504Y2 (ja) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5211551U (ja) * | 1975-07-15 | 1977-01-26 | ||
| JPS5696641U (ja) * | 1979-12-22 | 1981-07-31 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5211551B2 (ja) * | 1971-08-18 | 1977-03-31 |
-
1985
- 1985-07-16 JP JP1985108643U patent/JPH0346504Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5211551U (ja) * | 1975-07-15 | 1977-01-26 | ||
| JPS5696641U (ja) * | 1979-12-22 | 1981-07-31 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0346504Y2 (ja) | 1991-10-01 |