JPS6321038U - - Google Patents

Info

Publication number
JPS6321038U
JPS6321038U JP11353886U JP11353886U JPS6321038U JP S6321038 U JPS6321038 U JP S6321038U JP 11353886 U JP11353886 U JP 11353886U JP 11353886 U JP11353886 U JP 11353886U JP S6321038 U JPS6321038 U JP S6321038U
Authority
JP
Japan
Prior art keywords
hole
led
array
insulating substrate
array head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11353886U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11353886U priority Critical patent/JPS6321038U/ja
Publication of JPS6321038U publication Critical patent/JPS6321038U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Dot-Matrix Printers And Others (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
  • Laser Beam Printer (AREA)
  • Exposure Or Original Feeding In Electrophotography (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例によるＬＥＤアレイ
ヘツドの概略的断面構成を示す図、第２図は本考
案の他の実施例を示す図、第３図は従来のＬＥＤ
アレイヘツドの概略的断面構成を示す図、第４図
はＬＥＤアレイヘツドの基本的な回路構成を示す
図である。 図において、３はＬＥＤアレイチツプ、９はス
ルーホール、２１は支持基板、１は支持基体、５
４は裏面電極、５１は導体パターン、９１は導電
性部材である。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 絶縁基板上に複数のＬＥＤアレイヘツドと
    そのドライバＩＣとを搭載し、 ＬＥＤアレイチツプ配置部の導体パターンと上
    記絶縁基板の裏面導体とを電気的に接続するため
    のスルーホールを設けてなることを特徴とするＬ
    ＥＤアレイヘツド。 (2) 上記絶縁基板は、導電性支持基体上に搭載
    されていることを特徴とする実用新案登録請求の
    範囲第１項記載のＬＥＤアレイヘツド。 (3) 上記スルーホールは、ＬＥＤチツプアレイ
    直下以外の位置に設けられていることを特徴とす
    る実用新案登録請求の範囲第１項または第２項記
    載のＬＥＤアレイヘツド。 (4) 上記スルーホールは、ＬＥＤチツプアレイ
    直下に設けられており、その内部には導電性部材
    が、当該スルーホールによる開口面が平坦になる
    ように充填されていることを特徴とする実用新案
    登録請求の範囲第１項または第２項記載のＬＥＤ
    アレイヘツド。
JP11353886U 1986-07-23 1986-07-23 Pending JPS6321038U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11353886U JPS6321038U (ja) 1986-07-23 1986-07-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11353886U JPS6321038U (ja) 1986-07-23 1986-07-23

Publications (1)

Publication Number Publication Date
JPS6321038U true JPS6321038U (ja) 1988-02-12

Family

ID=30995439

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11353886U Pending JPS6321038U (ja) 1986-07-23 1986-07-23

Country Status (1)

Country Link
JP (1) JPS6321038U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63176164A (ja) * 1987-01-16 1988-07-20 Agency Of Ind Science & Technol 駆動装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58130581A (ja) * 1982-01-29 1983-08-04 Toshiba Corp デイスプレイ装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58130581A (ja) * 1982-01-29 1983-08-04 Toshiba Corp デイスプレイ装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63176164A (ja) * 1987-01-16 1988-07-20 Agency Of Ind Science & Technol 駆動装置

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