CN101611262B - 背光装置和使用该背光装置的平面显示装置 - Google Patents

背光装置和使用该背光装置的平面显示装置 Download PDF

Info

Publication number
CN101611262B
CN101611262B CN2007800514338A CN200780051433A CN101611262B CN 101611262 B CN101611262 B CN 101611262B CN 2007800514338 A CN2007800514338 A CN 2007800514338A CN 200780051433 A CN200780051433 A CN 200780051433A CN 101611262 B CN101611262 B CN 101611262B
Authority
CN
China
Prior art keywords
light
lighting device
back lighting
point source
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2007800514338A
Other languages
English (en)
Other versions
CN101611262A (zh
Inventor
滨田哲也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Publication of CN101611262A publication Critical patent/CN101611262A/zh
Application granted granted Critical
Publication of CN101611262B publication Critical patent/CN101611262B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0073Light emitting diode [LED]
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0083Details of electrical connections of light sources to drivers, circuit boards, or the like
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0085Means for removing heat created by the light source from the package
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • H05K1/0209External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0068Arrangements of plural sources, e.g. multi-colour light sources
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336Illuminating devices
    • G02F1/133615Edge-illuminating devices, i.e. illuminating from the side
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/189Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/0929Conductive planes
    • H05K2201/09363Conductive planes wherein only contours around conductors are removed for insulation
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10106Light emitting diode [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954Other details of electrical connections
    • H05K2201/10969Metallic case or integral heatsink of component electrically connected to a pad on PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2054Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Planar Illumination Modules (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)
  • Led Device Packages (AREA)

Abstract

利用导电性粘合剂将LED(3)的电极端子(33a、33b)与FPC(4)的装载用配线(42)粘合,并利用导电性粘合剂将LED(3)的金属块(31)与FPC(4)的散热用配线(43)粘合。并且,使散热用配线(43)与各LED(3)分别对应并且相互分离而不能导通。

Description

背光装置和使用该背光装置的平面显示装置
技术领域
本发明涉及背光装置,更具体地,涉及使用点状光源的边光型背光装置。
背景技术
在液晶显示装置等自身不发光的显示装置中,通常设置从显示面板的背面进行照射的所谓背光装置。在这种背光装置中,有直下方式、边光方式以及面状光源方式等,随着显示装置的薄型化以及轻量化,目前广泛使用边光方式。
这种边光方式的背光装置使来自光源的光射入导光板的侧面,在导光板中使光进行全反射并前进。或者,背光装置通过安装在导光板背面的反射片使光的一部分反射,作为平面光源从主面射出并照射显示面板的背面。
可是,以往的光源使用作为线状光源的冷阴极管,但是,随着近年来环保意识的提高,开始使用作为点状光源的发光二极管(LED:Light Emitting Diode)。
但是,目前,LED元件的发光效率约为10%左右,其它的90%作为热而被排出。另一方面,已知LED元件的发光效率随着温度的上升而降低。据说,温度每上升1℃发光效率降低1%左右。
因此,如果对由LED元件产生的热置之不理,LED自身的发热会导致发光效率、寿命降低。特别是在为了谋求背光装置的高亮度化而增加LED的装载数量的情况下,LED的总发热变得相当大,上述问题明显体现出来。
因此,提出了如下技术:例如除了形成LED的装载用配线以外还在电路基板上形成散热用配线,并且,构成LED的容器利用绝缘性粘合剂与散热用配线连接,由此使LED元件产生的热通过容器和粘合剂传导到形成在电路基板上的散热用配线,并由此散发到大气中(例如专利文件1、2等)。专利文件1:日本特开2005-283852号公报专利文献2:日本特开2006-11239号公报
发明内容
发明要解决的问题
但是,在将LED的电极端子装载在电路基板上时,使用焊锡等导电性粘合剂。因此,当如上述提出的技术那样在LED的容器与电路基板的粘合中使用绝缘性粘合剂时,必须使用2种粘合剂。因此,在提案技术中,至少增加了一个向电路基板涂粘合剂的工序,有可能使工序繁杂化、生产性降低。
本发明是鉴于这些既有问题而完成的,目的在于提供不使制作工序繁杂化就能高效地散发由发光元件产生的热、发光效率高且寿命长的背光装置。
另外,本发明的目的在于,即使是将点状光源装载在柔性印刷基板上的光源装置,也不会由于折弯等而使点状光源从柔性印刷基板脱落。
另外。本发明的目的在于提供能稳定地获得较高图像显示质量的廉价的平面显示装置。
用于解决问题的方案
背光装置包括导光板以及装载在配置于该导光板的侧面附近的柔性印刷基板上的多个点状光源。
并且,在该背光装置中,点状光源包括半导体发光元件、安装该半导体元件的金属块以及电极端子,并且使金属块的一部分从装载面侧露出。柔性印刷基板包括与点状光源的电极端子连接的装载用配线以及与点状光源分别对应并且相互分离而不能导通的散热用配线。而且,点状光源的电极端子与柔性印刷基板的装载用配线利用导电性粘合剂粘合,点状光源的金属块与柔性印刷基板的散热用配线利用导电性粘合剂粘合。
在此,从即使在柔性印刷基板被弯曲的情况下也可使点状光源不易从柔性印刷基板脱落等的观点出发,优选使散热用配线在点状光源之间的大致中间位置分离。
另外,优选在柔性印刷基板的装载表面上形成白色的树脂层。
另外,优选在包括显示面板和安装在显示面板的背面侧的背光装置的平面显示装置中使用上述背光装置。即,包括上述背光装置以及接受从该背光装置射出的光的显示面板的平面显示装置也可称为本发明。
发明的效果
在本发明所涉及的背光装置中,由于使用FPC作为电路基板,因此重量较轻,与使用由玻璃环氧树脂等形成的电路基板的现有装置相比,能实现更高的散热性。另外,用与装载点状光源时使用的导电性粘合剂相同的导电性粘合剂来粘合点状光源的金属块与散热用配线,因此不增加新的制造工序也能进行生产,不会导致生产效率降低。另外,即使利用导电性粘合剂将金属块与散热用配线粘合,由于金属块所连接的散热用配线相互分离而不能导通,因此也不会发生短路。
另外,当散热用配线在点状光源之间的大致中间位置分离时,即使在柔性印刷基板被弯曲的情况下,点状光源也很难从柔性印刷基板脱落。
另外,在柔性印刷基板的装载表面上形成了白色的树脂层时,利用该白色树脂层反射来自点状光源发出的光,因此照明效率提高。
另外,在平面显示装置中使用上面记述的背光装置,因此能廉价地获得较高的图像显示质量。
附图说明
图1是表示平面显示装置的一个实施方式的概要图。图2是LED的概要截面图。图3是表示FPC的配线结构的平面图。图4是将LED和连接器装载在图3的FPC上的平面图。图5A是表示装载有LED的FPC被折弯时的缺陷示例的说明图。图5B是表示装载有LED的FPC被折弯时不产生缺陷的示例的说明图。图6是表示FPC的其它配线结构的平面图。附图标记说明
1:液晶面板(显示面板);2:背光装置;3:LED(点状光源);4:FPC(柔性印刷基板);32:LED元件(半导体发光元件);31:金属块;33a,33b:电极端子;42:装载用配线;43:散热用配线;44:散热用配线。
具体实施方式
下面,根据附图说明背光装置和平面显示装置。但是,本发明不局限于这些实施方式。
图1表示液晶显示装置(平面显示装置)以及背光装置的一例的截面概要图。如图1所示,液晶显示装置包括背光装置2和液晶面板1。
在背光装置2中,在顶面以及底面开口的长方体形状的下机壳(框体)21b上安装背面金属板26使其堵住底面的开口。并且,在背面金属板26上安装长方体形状的导光板22。
另外,在导光板22的背面安装反射片24,在导光板22的表面安装3张光学片25。此外,在与导光板22的侧面相对的下机壳21b的内侧壁上,沿长度方向按规定间隔装载有多个LED(点状光源)3的FPC(Flexible Printed Circuit:柔性印刷基板)4利用双面粘合剂b被固定在开口部朝向导光板22的侧面的、截面呈“コ”字形的反射箱C内。在后面说明该LED 3和FPC 4的结构。
并且,形成有使来自导光板22的出射光通过的开口部的上机壳(框体)21a被安装为堵住下机壳21b的上面开口,背面金属板26、反射片24、导光板22以及光学片25被上机壳21a以及下机壳21b夹持。
另一方面,在液晶面板1中,在隔离对置的一对玻璃基板11、12之间封入液晶(未图示)。此外,玻璃基板12的外边缘部比玻璃基板11向外侧延伸,在该延伸部分上形成多个对形成在玻璃基板12的表面的像素电极施加电压的电极端子(未图示)。另外,在液晶面板1的表面以及背面上安装偏光板13a、13b。
并且,液晶面板1的边缘部被设置在形成于背光装置2的上机壳21a的开口部边缘的台阶部28上。并且,外壳5覆盖所述液晶面板1的边缘部,将该外壳5、上机壳21a以及下机壳21b固定,由此使液晶面板1结合到背光装置2上,形成液晶显示装置。
在图2中表示说明作为点状光源的LED 3的结构的概要图。在图2中示出的LED 3包括:由Cu、Al等金属形成的金属块31;用树脂类的导电性粘合剂(未图示)固定在金属块31的上表面的LED元件(半导体发光元件)32;以及一对电极端子33a、33b,该一对电极端子33a、33b位于隔着金属块31相对的位置上,与金属块31隔离配置。
并且,电极端子33a与金属块31通过接合线W1连接,电极端子33b与LED元件32的上面电极(未图示)通过接合线W2连接。此外,用绝缘性树脂34封住金属块31的外边缘部与一对电极端子33a、33b的一部分。另外,在金属块31的上面,利用透光性树脂35将LED元件32封成圆顶形状,所述圆顶形状的透光性树脂35也起透镜的作用。
另外,在图2中金属块31仅形成于LED 3的底面侧。但是并不限定于这种情况,金属块31也可延伸到绝缘性树脂34的侧面附近。这样的话,金属块31的表面积增大,因此会增大能散热的面积。而且,金属块31不仅位于靠近FPC 4的LED 3的底面侧,而且延伸到LED 3的光射出侧,因此可从LED 3的底面侧以及光射出侧这两侧进行散热。
此外,在该LED 3中,的一对电极端子33a、33b的一部分以及金属块31的底面从绝缘性树脂34延伸露出,这将在后面记述。
接着,在图3中示出表示FPC 4的一例的平面图。FPC 4包括具有柔性的带状FPC基底材料41、形成在FPC基底材料41表面的装载用配线42以及散热用配线43。此外,使装载用配线42和散热用配线43隔着规定的空隙分离。
另外,在装载用配线42上形成固定各LED的电极端子的区域(图中四边形的斜线部分),在散热用配线43上形成固定各LED的金属块的区域(图中圆形的斜线部分)。并且,在与各LED对应的各散热用配线43、43之间形成间隙、使其相互分离而不能导通。
在将LED 3装载到这种FPC 4上的情况下,通过丝网印刷等将焊锡等导电性粘合剂一次涂布到固定LED 3的电极端子33a、33b以及金属块31的区域(图中斜线区域)上。然后,如图4(装载有LED3和连接器C的FPC 4的平面图)所示,将LED 3配置在FPC 4上的规定位置上,并利用导电性粘合剂(未图示)进行固定(此外,将连接器C安装到外部电力的输入部分上)。
以往,使用导电性粘合剂以及绝缘性粘合剂这2种粘合剂来将这种LED 3的电极端子33a、33b以及金属块31固定到FPC 4上。因此,需要进行2次对FPC涂布粘合剂的工序。但是,在本发明中使用相同的导电性粘合剂,因此可使粘合剂的涂布工序变为1次,提高了生产性。
此外,为了提高照明效率,最好在FPC 4的装载表面上形成白色树脂层。这是由于从LED 3射出的光由白色树脂层反射并射入导光板22(在图1中示出)的侧面的缘故。
另外,由LED元件32产生的热通过金属块31经由导电性粘合剂传递到散热用配线43。从图3和图4可知,在FPC 4的表面上大面积形成散热用配线43。因此,由LED元件32产生的热从大面积分布的散热用配线43散发到大气中,能有效地抑制LED元件32的温度上升。
此外,如上所述,使用相同的导电性粘合剂将LED 3的电极端子33a、33b以及金属块31固定到FPC 4上。因此,在每个LED 3的各散热用配线43之间发生接触时,电流会通过金属块31流到散热用配线43而发生短路。因此,需要使各散热用配线43分离而不能导通。
此外,不特别限定各散热用配线43的分离位置,但是如图4所示,优选形成在LED间距离L的中间(L/2)的位置。
通常,FPC 4具有柔性,因此在没有形成散热用配线43的分离部分特别容易弯曲。因此,如图5A所示,当散热用配线43的分离部分靠近LED 3时,存在FPC 4在LED 3的附近弯曲并垂下、LED 3的焊接固定部分从FPC 4脱落的可能性。
另一方面,如图5B所示,如果散热用配线43的分离部分位于LED 3、3之间的中间位置,即使在分离部分FPC 4弯曲也不会影响到LED 3,LED 3不容易从FPC 4脱落。
此外,图6示出FPC 4的其它实施方式。图6示出的FPC 4’与图3示出FPC 4的不同点在于,连接到LED 3的电极端子33a的装载用配线42(在图3中示出)与散热用配线43(在图3中示出)一体化形成。
在图3示出的FPC 4中,通过金属块31使与LED 3的电极端子33a连接的装载用配线42与散热用配线43成为相同电位。因此,在图6的FPC 4’中,通过使这些装载用配线与散热用配线一体化来形成大面积的散热用配线44,增大散热。此外,关于导电性粘合剂的涂布以及LED 3与连接器C的装载,与上述实施方式相同,因此在此省略说明。
另外,除了使用上述的焊锡、Ag涂料以外,也可以使用以往公知的材料作为导电性粘合剂。其中,优选导热率高的导电性粘合剂,从这一点出发优选焊锡。

Claims (4)

1.一种背光装置,具备导光板和装载在配置于该导光板的侧面附近的柔性印刷基板上的多个点状光源,所述背光装置的特征在于:
上述点状光源具备半导体发光元件、安装该半导体元件的金属块以及电极端子,并且使金属块的一部分在装载面侧露出,
上述柔性印刷基板包括与上述点状光源的电极端子连接的装载用配线以及分别对应上述点状光源的、相互分离而不能导通的散热用配线,
上述点状光源的电极端子与上述柔性印刷基板的装载用配线利用导电性粘合剂粘合,
上述点状光源的金属块与上述柔性印刷基板的散热用配线利用导电性粘合剂粘合。
2.根据权利要求1所述的背光装置,其特征在于:
在点状光源之间的中间位置上,上述散热用配线相互分离。
3.根据权利要求1所述的背光装置,其特征在于:
在柔性印刷基板的装载表面上形成白色树脂层。
4.一种平面显示装置,具备显示面板以及安装在显示面板的背面侧的背光装置,其特征在于:
使用权利要求1~3中的任一项所述的背光装置作为上述背光装置。
CN2007800514338A 2007-02-16 2007-10-10 背光装置和使用该背光装置的平面显示装置 Expired - Fee Related CN101611262B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP035625/2007 2007-02-16
JP2007035625 2007-02-16
PCT/JP2007/069731 WO2008099531A1 (ja) 2007-02-16 2007-10-10 バックライト装置およびそれを用いた平面表示装置

Publications (2)

Publication Number Publication Date
CN101611262A CN101611262A (zh) 2009-12-23
CN101611262B true CN101611262B (zh) 2011-01-26

Family

ID=39689786

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2007800514338A Expired - Fee Related CN101611262B (zh) 2007-02-16 2007-10-10 背光装置和使用该背光装置的平面显示装置

Country Status (4)

Country Link
US (1) US8157430B2 (zh)
CN (1) CN101611262B (zh)
RU (1) RU2419740C1 (zh)
WO (1) WO2008099531A1 (zh)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101545939B1 (ko) * 2008-10-27 2015-08-21 삼성디스플레이 주식회사 광원 모듈, 이의 제조방법 및 이를 갖는 백라이트 어셈블리
CN102170747B (zh) * 2010-02-26 2013-04-03 佳必琪国际股份有限公司 押出式软性电路板、其制作方法及具有该电路板的条灯
US8710525B2 (en) * 2010-03-15 2014-04-29 Nichia Corporation Light emitting device
US20130009190A1 (en) * 2010-04-07 2013-01-10 Yuhichi Memida Light emitting device and method for manufacturing same
US8419203B1 (en) * 2010-09-03 2013-04-16 Rockwell Collins, Inc. Single card multi mode LCD backlight
EP2437581A1 (de) * 2010-09-30 2012-04-04 Odelo GmbH Leuchtdiode auf Keramiksubstratbasis
JP2012113919A (ja) * 2010-11-24 2012-06-14 Toshiba Corp 照明装置
AU2014200021B2 (en) * 2010-12-28 2015-07-09 Nichia Corporation Light emitting device
WO2012090576A1 (ja) * 2010-12-28 2012-07-05 日亜化学工業株式会社 発光装置及びその製造方法
DE102011110799A1 (de) * 2011-08-22 2013-02-28 Heraeus Materials Technology Gmbh & Co. Kg Substrat für den Aufbau elektronischer Elemente
US8851736B2 (en) 2011-08-30 2014-10-07 Lg Innotek Co., Ltd. Light emitting module with heatsink plate having coupling protrusions
US20130100694A1 (en) * 2011-10-24 2013-04-25 Kocam International Co., Ltd. LED Backlight Module
TWI460495B (zh) * 2011-11-07 2014-11-11 Au Optronics Corp 顯示模組
JP5587949B2 (ja) * 2011-11-10 2014-09-10 京セラコネクタプロダクツ株式会社 半導体発光素子取付用モジュール、及び、半導体発光素子モジュール
RU2633391C2 (ru) * 2011-11-17 2017-10-12 Филипс Лайтинг Холдинг Б.В. Светильник прямого обзора на основе светодиодов (сид) с однородным смешиванием выходного света
KR102030382B1 (ko) * 2011-11-22 2019-10-11 삼성디스플레이 주식회사 발광 모듈, 이를 포함하는 백라이트 어셈블리 및 이를 포함하는 표시 장치
EP2837875A4 (de) * 2012-04-13 2015-04-22 With Ltd Liability Dis Plus Soc Verfahren zur montage eines blocks aus strahlenquellen und led-beleuchtungsvorrichtung mit einem derartigen block
CN102686020A (zh) * 2012-06-11 2012-09-19 深圳市华星光电技术有限公司 背光模块的印刷电路板结构、背光模块及其液晶显示器
JP6079159B2 (ja) 2012-11-16 2017-02-15 日亜化学工業株式会社 発光装置
US10257932B2 (en) * 2016-02-16 2019-04-09 Microsoft Technology Licensing, Llc. Laser diode chip on printed circuit board
JP6941794B2 (ja) * 2017-02-09 2021-09-29 パナソニックIpマネジメント株式会社 画像表示装置、および、部品実装基板
CN107247364B (zh) * 2017-07-27 2021-01-26 京东方科技集团股份有限公司 一种背光模组及显示装置
US10852583B2 (en) * 2018-09-17 2020-12-01 Sharp Kabushiki Kaisha Lighting device, display device, and method of producing lighting device
RU191979U1 (ru) * 2018-12-19 2019-08-29 Юрий Борисович Соколов Печатная плата для освещения торцовой поверхности световода
CN110045541B (zh) 2019-03-28 2021-02-26 武汉华星光电技术有限公司 背光结构、液晶显示面板和电子设备
RU200958U1 (ru) * 2020-07-22 2020-11-20 Станислав Владимирович Степанов Декоративный блок зеркала

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1325036A (zh) * 2000-05-23 2001-12-05 精工爱普生株式会社 液晶装置和电子装置
JP2002232009A (ja) * 2001-01-30 2002-08-16 Harison Toshiba Lighting Corp 発光ダイオードアレイ及び光源装置
JP2002368285A (ja) * 2001-06-11 2002-12-20 Omron Corp 発光器、発光モジュール及びその製造方法
JP2006310123A (ja) * 2005-04-28 2006-11-09 Minebea Co Ltd 面状照明装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005283852A (ja) 2004-03-29 2005-10-13 Kyocera Corp 液晶表示装置
JP4359195B2 (ja) 2004-06-11 2009-11-04 株式会社東芝 半導体発光装置及びその製造方法並びに半導体発光ユニット
JP2006011239A (ja) 2004-06-29 2006-01-12 Kyocera Corp 液晶表示装置
TWI333576B (en) * 2005-08-17 2010-11-21 Au Optronics Corp Bottom lighting module
JP4470906B2 (ja) 2006-05-11 2010-06-02 株式会社デンソー 照明装置
KR100764388B1 (ko) * 2006-03-17 2007-10-05 삼성전기주식회사 양극산화 금속기판 모듈
KR101294008B1 (ko) * 2006-07-24 2013-08-07 삼성디스플레이 주식회사 백라이트 어셈블리, 이의 제조 방법 및 이를 갖는 표시장치
US20080049164A1 (en) * 2006-08-22 2008-02-28 Samsung Electronics Co., Ltd., Backlight assembly, manufacturing method thereof, and liquid crystal display device
KR100844757B1 (ko) * 2006-08-24 2008-07-07 엘지이노텍 주식회사 광원 장치 및 이를 이용한 디스플레이 장치
US20090103295A1 (en) * 2007-10-17 2009-04-23 Keeper Technology Co., Ltd. LED unit and LED module
KR101535064B1 (ko) * 2008-01-17 2015-07-09 삼성디스플레이 주식회사 표시 장치용 광원 모듈 및 이를 포함하는 표시 장치
CN101539278B (zh) * 2008-03-19 2010-11-10 富准精密工业(深圳)有限公司 发光二极管组合
CN101645478A (zh) * 2008-08-08 2010-02-10 鸿富锦精密工业(深圳)有限公司 发光二极管散热结构

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1325036A (zh) * 2000-05-23 2001-12-05 精工爱普生株式会社 液晶装置和电子装置
JP2002232009A (ja) * 2001-01-30 2002-08-16 Harison Toshiba Lighting Corp 発光ダイオードアレイ及び光源装置
JP2002368285A (ja) * 2001-06-11 2002-12-20 Omron Corp 発光器、発光モジュール及びその製造方法
JP2006310123A (ja) * 2005-04-28 2006-11-09 Minebea Co Ltd 面状照明装置

Also Published As

Publication number Publication date
US20100027291A1 (en) 2010-02-04
CN101611262A (zh) 2009-12-23
US8157430B2 (en) 2012-04-17
WO2008099531A1 (ja) 2008-08-21
RU2419740C1 (ru) 2011-05-27
RU2009134481A (ru) 2011-03-27

Similar Documents

Publication Publication Date Title
CN101611262B (zh) 背光装置和使用该背光装置的平面显示装置
RU2595298C2 (ru) Блок схем источника света, устройство подсветки и дисплей
US8687142B2 (en) Backlight unit comprising a bottom cover including an embossing portion that overlaps with a portion of an LED package and liquid crystal display using the same
US7168842B2 (en) Light emitting diode backlight package
US8439513B2 (en) Light emitting diode module and back light assembly
CN102147080B (zh) 背光单元和使用该背光单元的显示装置
CN101340777A (zh) 柔性印刷电路板和使用其的液晶显示装置及其制造方法
CN202182365U (zh) 一种led灯条、侧光式背光模组及显示器
US20120112237A1 (en) Led package structure
KR20140020446A (ko) 백라이트 어셈블리 및 이를 갖는 표시 장치
US20230326421A1 (en) Light-emitting assembly
US20200064689A1 (en) Lighting device and display device including the same
CN101315489A (zh) 侧向式发光模组
KR20060019653A (ko) 백라이트 어셈블리 및 이를 갖는 액정표시장치
CN102479911B (zh) 发光器件封装
KR101093179B1 (ko) 백라이트 유닛용 브라켓 일체형 방열 인쇄회로기판과 이를 구비한 샤시구조물
CN101082392A (zh) 背光源装置
CN102933023A (zh) 发光器件阵列和照明系统
KR102056832B1 (ko) 인쇄회로기판 및 그 인쇄회로기판을 포함하는 조명 유닛
US7724339B2 (en) Liquid crystal display with electrical connector
CN205790041U (zh) Led模组
US10295731B2 (en) Display device
US20060221607A1 (en) Backlight assembly for liquid crystal display
KR101272014B1 (ko) 백라이트 구조 및 이를 구비한 액정표시장치
CN100443984C (zh) 液晶显示器

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110126

Termination date: 20211010

CF01 Termination of patent right due to non-payment of annual fee