JP2007206641A - Repair device and method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a repair device capable of detecting and repairing a defect while performing efficient access to the whole region of electric lines on an LCD substrate without detaching and re-attaching the substrate. <P>SOLUTION: A main gantry 3 and a sub gantry 9 which are movable in the Y-axis direction according to guides 2 are disposed on a surface plate 1 and an optical system 4 which performs repair working and is movable in the X-axis direction is attached to the main gantry 3. The LCD substrate 6 as a body to be inspected is disposed on a moving holder 50. Probe sensor heads 10a, 10b which are movable in the X-axis direction and are rotatable in the XY-flat plane are attached to the main gantry 3 and the sub gantry 9. Each probe sensor head is constituted such that a probe part of supplying an electric current to an electrode and a sensor part of determining open/short defect by detecting the electric current supplied to the line are integrally formed. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention detects defects in electrical wiring provided on a substrate of an FPD (Flat Panel Display) such as a liquid crystal display (LCD) and a plasma display panel (PDP). The present invention relates to a repair device to be corrected.

  Recently, the FPD substrate has become larger, and it is in a situation where the cost can be reduced by correcting it rather than discarding the defective substrate that appeared in the manufacturing process. An electric wiring correction device (repair device) is used to correct this substrate defect.

  The manufacturing process before and after the process in which the repair device is used is as follows. Upstream, a dedicated electrical defect inspection device (OS (Open Short) tester) or automatic image inspection device (AOI device: Automatic Optical Inspection device) that inspects open and short defects in the FPD electrical wiring over the entire area of the substrate ), The defect is detected and its position is specified, and is stored as data in the computer. The repair device corrects the defect based on the data. Thereafter, it is verified again by the OS tester or the AOI apparatus whether or not the defect is correctly corrected. For this reason, the process is reversed and the throughput of the product is reduced.

  In order to improve the throughput, a repair device equipped with an OS tester has recently been developed. However, the space that can be allocated to the repair device arranged in the manufacturing process is limited, and the device is required to be miniaturized as much as possible. There is also a demand for improvement in apparatus throughput and cost reduction.

  As an example of a conventional repair device equipped with an OS tester, there is a repair device disclosed in Patent Document 1. The repair device equipped with the OS tester according to the conventional example is capable of driving and controlling the object to be inspected and rotating in the orthogonal three-axis direction and the direction of rotating the two-dimensional plane, and spans the probing position and the repair position. A movable stage, an inspection device that inspects the electrical characteristics of the object to be inspected by energizing the electrodes of the object to be inspected at the probing position, and a memory that stores defect contents and addresses measured by the inspection device The laser spot is made to coincide with a defective portion including at least a short-circuited portion and repaired by irradiating a laser beam by stage driving based on an address that is fixed at a repair position and stored in a memory.

  FIG. 14 is a plan view showing a repair device equipped with another conventional OS tester function. In addition, as shown in the figure, for the sake of convenience, the X-axis direction and the Y-axis direction are set and described.

  As shown in FIG. 14A, a guide 102 is provided on the surface plate 101, and a main gantry 103 and a sub gantry 109 are installed on the guide 102, and these follow the guide 102 in the Y-axis direction. It is movable. The main gantry 103 is equipped with an optical system 104 that carries a repair process by mounting a laser oscillator, a lens, and the like, and the optical system 104 is movable in the X-axis direction. The sub gantry 109 is equipped with a sensor head 107 and a power supply probe head 108, both of which are movable in the X-axis direction, and are mounted so that the head portions face each other. A holder 105 is disposed on the surface plate 101, and an LCD substrate 106 on which a plurality of (six in the illustrated example) LCD panels 160 are formed is placed on the holder 105.

  There are roughly two types of functions of the OS tester. One is an open defect detection function, and the other is an adjacent pattern short defect detection function. In detecting an open defect, first, one probe pin provided on the power supply probe head 108 contacts an electrode (pad) of the LCD substrate, and a high frequency current is supplied to the pattern of the LCD substrate through the probe. The sensor head 107 detects the current value in a non-contact state by an electromagnetic action from the pattern. Here, when the pattern of the LCD substrate is in an open state, the current flowing through the pattern is interrupted, and the current cannot be detected from the sensor head 107. In addition, the sensor head 107 has a method in which the position of the open defect in the pattern can be specified by moving in the X-axis direction.

  On the other hand, short-circuit defects are detected by bringing two probe pins provided on the power supply probe head 108 into contact with adjacent electrode pads and applying a voltage to both probe pins to energize them, so This is a method for detecting a short circuit between patterns.

  Usually, pads are arranged in two directions on the LCD substrate, but the arrangement is in various directions depending on the type of the LCD substrate. Therefore, in order to detect all open defects and short defects, it is necessary to bring the power supply probe head 108 into contact with all electrode pads. Therefore, in this conventional apparatus, it is necessary to remove the LCD substrate once from the holder 105, rotate it, and attach it to the repair apparatus again. FIG. 14B shows a state in which the LCD substrate is once removed from the holder 105 and rotated by 90 degrees and then mounted on the repair device again.

Japanese Patent Laid-Open No. 02-02947

  However, the above-described prior art has the following problems.

  As described above, conventionally, the defect position of the FPD substrate is detected in advance by the OS tester apparatus installed in the previous process, and the repair apparatus moves to the defect position based on the data to correct the defect. Further, the correction result is returned to the OS tester apparatus in the previous process again to check whether or not the defect has been corrected correctly. However, in the case of such a method, there is a problem that an operation for returning the FPD substrate that has been corrected once to the previous process occurs, the operation time increases, and the tact time increases.

  Recently, some manufacturers have announced a concept of mounting the OS tester function in the repair device to solve the above-mentioned problems. However, as in the repair apparatus equipped with the conventional OS tester function shown in FIG. 14, the conventional method requires a process of once removing the LCD substrate from the holder and reattaching it, such as a loader apparatus having a rotation mechanism outside. However, there is a problem that the installation area is increased, the cost is increased, and the tact time is further reduced.

  The present invention has been made in view of such problems, and can efficiently access the entire area of the electrical wiring on the substrate without removing and reattaching the LCD substrate to detect and correct defects. An object of the present invention is to provide a repair device that can be used.

  The repair apparatus according to the present invention includes a stage on which a substrate is placed, first and second gantry movable in a first direction along the surface of the stage, and the first and second gantry. A first and a second probe sensor unit that can be moved in a second direction that intersects the first direction with respect to each gantry, and is installed in the first gantry so as to be movable in the second direction. A repair portion for repairing the portion to be inspected of the substrate, and the first and second probe sensor portions are respectively movable on the base portion and movable on the base portion. A probe unit that is juxtaposed to apply a voltage to the inspected portion of the substrate, a sensor unit that detects a current flowing through the inspected portion, and a base that rotationally drives the base portion about a direction orthogonal to the surface of the stage. A drive unit The features.

  The repair unit is installed on the opposite side of the first gantry from the second gantry side, the first probe sensor unit is installed on the second gantry side of the first gantry, and the second probe sensor unit May be installed on the first gantry side of the second gantry.

  The repair portion is installed on the second gantry side of the first gantry, the first probe sensor portion is arranged in parallel with the repair portion, and the second probe sensor portion is the second gantry. It may be installed on the first gantry side.

  The repair apparatus according to the present invention includes a stage on which a substrate is placed, first, second and third gantry movable in a first direction along the surface of the stage, and the first and second The first and second probe sensor units respectively installed in the gantry and movable in a second direction crossing the first direction with respect to each gantry, and moved in the second direction to the third gantry A repair unit configured to repair the inspected part of the substrate, and the first and second probe sensor units are respectively movable in the second direction, and the platform A probe unit that is juxtaposed on the substrate and that applies a voltage to the inspected part of the substrate, a sensor unit that detects a current flowing through the inspected part, and the base unit that rotates in a direction perpendicular to the surface of the stage. A platform drive unit for driving And wherein the Rukoto.

  The first probe sensor unit is installed on the second gantry side of the first gantry, the second probe sensor unit is installed on the first gantry side of the second gantry, and the third gantry is The repair unit may not be disposed between the first gantry and the second gantry, and the repair unit may be installed on the first and second gantry sides of the third gantry.

  The first probe sensor unit is installed on the second gantry side of the first gantry, and the second probe sensor unit is installed on the first gantry side of the second gantry. May not be disposed between the first gantry and the second gantry, and the repair unit may be disposed on the opposite side of the third gantry from the first and second gantry sides.

  A stage plate on which the stage and the first, second, and third gantry are installed, and a stage drive unit that moves the stage in the first direction with respect to the platen can be provided.

  The inspected part of the substrate is an electrical wiring provided on the substrate, and the probe part of the first or second probe sensor part contacts the inspected part of the substrate at two points and a voltage is applied between these two points. Then, it is possible to detect a short circuit in the electrical wiring by detecting whether or not a current flows through the part to be inspected.

  The inspected portion of the substrate is an electrical wiring provided on the substrate, and either one of the first and second probe sensor portions contacts the inspected portion of the substrate at one point to supply current. The disconnection of the electrical wiring can be detected by detecting whether or not a current flows through the electrical wiring connected to the inspected portion of the substrate by the sensor unit of the other probe sensor unit.

  The inspected portion of the substrate is an electrical wiring provided on the substrate, and the repair portion can repair the defect by irradiating the shorted portion of the inspected portion with a laser beam.

  The inspected portion of the substrate is an electrical wiring provided on the substrate, and the repair portion can be repaired by irradiating a laser beam to the disconnection portion of the inspected portion by chemical vapor deposition.

  The substrate may be a flat panel display substrate. Further, the flat panel display substrate may be a substrate in which data lines and gate lines are wired in a matrix. The flat panel display substrate may be a liquid crystal display device or a plasma display panel substrate.

  A repair method according to the present invention uses the repair device to detect and repair a short circuit of a substrate placed on the stage and formed with a plurality of electrical wirings in the first and second directions. In the step of moving either one of the first and second probe sensor units to the inspected portion, and when inspecting a short circuit of the wiring along the first direction, it is arranged in the inspected portion. After rotating the probe sensor unit in the first direction, the probe unit is brought into contact with the part to be inspected of the substrate at two points, a voltage is applied between the two points, and a current flowing between the two points is detected. In the step of determining whether or not there is a short circuit, and when inspecting the short circuit of the wiring along the second direction, the probe sensor unit disposed in the inspected part is rotated in the second direction. After the probe part A process of determining whether or not a short circuit is detected by contacting a point to be inspected on the plate, applying a voltage between the two points, and detecting a current flowing between the two points, and when a short circuit is detected. Includes a step of moving the repair portion to a short position and repairing it.

  The substrate may be a flat panel display substrate in which data lines and gate lines are wired in a matrix.

  The location where the probe of the probe sensor unit applies the voltage by contacting the point to be inspected of the substrate with two points is preferably an adjacent electrode pad provided at the end of the data line or the gate line.

  The repair unit can repair a short circuit defect by irradiating a laser beam to the short part.

  A repair method according to the present invention uses the repair device to detect and repair a disconnection of a substrate placed on the stage and having a plurality of electrical wirings formed in the first and second directions. The step of moving one of the first and second probe sensor units to the inspected portion and the inspection of the disconnection of the wiring along the first direction are arranged in the inspected portion. Rotating the probe sensor unit in the first direction and then supplying a current by contacting the probe unit to the inspected part of the substrate at one point; and connecting the other probe sensor part to the inspected part of the inspected part. Whether or not there is a disconnection failure by detecting the value of the current flowing in the electrical wiring below the sensor unit after rotating the other probe sensor unit in the first direction after moving the other probe sensor unit in the first direction. Or When inspecting the disconnection of the wiring along the second direction and the step of separating, the probe sensor portion disposed in the inspected portion is rotated in the second direction and then the probe portion is moved to the substrate. Supplying a current to the inspected part in contact with one point; moving the other probe sensor part to a coordinate position in the first direction of the inspected part; and A step of determining whether or not the disconnection is defective by detecting a value of a current flowing in the electrical wiring below the sensor unit after rotating in the second direction, and if the disconnection is detected, the repair unit is And a step of repairing by moving to the disconnection position.

  The substrate may be a flat panel display substrate in which data lines and gate lines are wired in a matrix.

  The portion where the probe of the probe sensor portion contacts the point to be inspected on the substrate and supplies current is preferably an electrode pad provided at the end of the data line or gate line.

  The repair portion can be repaired by a chemical vapor deposition method by irradiating a laser beam to the disconnection portion.

  The repair device according to the present invention includes a stage on which a substrate is placed, a gantry movable in a first direction along the surface of the stage, and the first direction with respect to the gantry installed in the gantry. A probe sensor unit movable in a second direction intersecting the substrate, and a repair unit installed in the gantry so as to be movable in the second direction and repairing the inspected part of the substrate. A portion that is movable in the second direction, a probe portion that is juxtaposed on the base portion and applies a voltage to the portion to be inspected of the substrate, and a sensor portion that detects a current flowing through the portion to be inspected And a platform drive unit that rotationally drives the platform with a direction orthogonal to the surface of the stage as a rotation axis.

  The repair device according to the present invention includes a stage on which a substrate is placed, first and second gantry movable in a first direction along a surface of the stage, and the second gantry on the first gantry. A repair unit that is movably installed in the direction of the substrate and that repairs the inspected part of the substrate; and a second unit that is installed in the second gantry and moves in a second direction that intersects the first direction with respect to the second gantry. A probe unit that is movable in the second direction, and a probe unit that is juxtaposed on the platform and applies a voltage to the part to be inspected of the substrate. And a sensor unit that detects a current flowing through the part to be inspected, and a platform drive unit that rotationally drives the platform with a direction orthogonal to the surface of the stage as a rotation axis.

  The inspected portion of the substrate is an electrical wiring provided on the substrate, and the probe portion of the probe sensor portion contacts the inspected portion of the substrate at two points, and a voltage is applied between the two points to the inspected portion. By detecting whether or not current flows, it is possible to detect a short circuit in the electrical wiring.

  The inspected portion of the substrate is an electrical wiring provided on the substrate, and the repair portion can repair the defect by irradiating the shorted portion of the inspected portion with a laser beam.

  The substrate may be a flat panel display substrate. Further, the flat panel display substrate may be a substrate in which data lines and gate lines are wired in a matrix. The flat panel display substrate may be a liquid crystal display device or a plasma display panel substrate.

  A repair method according to the present invention uses the repair device to detect and repair a short circuit of a substrate placed on the stage and formed with a plurality of electrical wirings in the first and second directions. In the step of moving the probe sensor part to the part to be inspected and when inspecting a short circuit of the wiring along the first direction, the probe sensor part arranged in the part to be inspected is moved to the first part. After rotating in the direction, the probe part is brought into contact with the inspected part of the substrate at two points, a voltage is applied between the two points, and a current flowing between the two points is detected to determine whether or not there is a short circuit. And when inspecting a short circuit of the wiring along the second direction, after the probe sensor unit disposed in the inspected part is rotated in the second direction, the probe part is inspected on the substrate. Touch two points A step of determining whether or not a short circuit is detected by applying a voltage between two points and detecting a current flowing between the two points. If a short circuit is detected, the repair unit is moved to a short circuit position and repaired. And a step of performing.

  The substrate may be a flat panel display substrate in which data lines and gate lines are wired in a matrix.

  The location where the probe of the probe sensor unit applies the voltage by contacting the point to be inspected of the substrate with two points is preferably an adjacent electrode pad provided at the end of the data line or the gate line.

  According to the present invention, it is possible to obtain a repair device equipped with an OS tester function for detecting an open defect, a short defect, and the like of the electric wiring of the FPD substrate. This device integrates a pair of power supply probe unit and sensor unit into one unit, and attaches the units to the main gantry and sub gantry, respectively, so that they can rotate around an axis perpendicular to the substrate. As a result, the electrode pad of the inspected substrate can be accessed regardless of the direction of the FPD substrate, and defect detection and correction can be performed efficiently.

  Next, embodiments of the present invention will be specifically described with reference to the accompanying drawings. First, a first embodiment of the present invention will be described. Fig.1 (a) and FIG.1 (b) are top views which show this embodiment. FIG. 1A shows a case where the OS test of the gate pattern on the LCD substrate is performed, and FIG. 1B shows a case where the OS test of the data pattern on the LCD substrate is performed. For convenience, the X-axis direction and the Y-axis direction are set and described as indicated by arrows in the drawing. A direction orthogonal to both XY axes is taken as a Z axis.

  As shown in FIG. 1A, in the OS tester mounting repair device according to the present embodiment, guides 2 are arranged on the surface plate 1 along two peripheral edges in the Y-axis direction. A main gantry 3 is mounted on the guide 2 so as to extend in the X-axis direction. The main gantry 3 has a structure that can move on the guide 2 in the Y-axis direction. Similarly, the sub gantry 9 is attached to the guide 2 so as to extend in the X-axis direction, and has a structure that can move on the guide 2 in the Y-axis direction. The surface plate 1 is the base of all units mounted on the apparatus.

  An optical system 4 is disposed on the main gantry 3, and the optical system 4 is movable in the X-axis direction according to the main gantry 3. The optical system 4 is an optical unit that performs repair processing equipped with a laser oscillator, a lens, and the like.

  A movable holder 50 movable in the Y-axis direction is disposed between the two guides 2 on the surface plate 1, and an LCD substrate 6 as an object to be inspected is placed on the movable holder 50. By moving 50, the LCD substrate 6 also moves. The LCD substrate has a structure as shown in FIG.

  FIG. 3 is a schematic diagram of an LCD substrate 6 having an active matrix TFT (Thin Film Transistor) structure. As shown in FIG. 3A, the LCD substrate 6 includes a plurality of LCD panels 60 provided on a glass substrate, and each LCD panel 60 serves as a display panel. FIG. 3B is an enlarged view of the LCD panel 60. A grid-like wiring pattern is formed on the LCD panel 60, and the gate pattern and the data pattern are configured to be orthogonal to each other. A gate pad is provided at an end portion of the gate pattern, and a data pad is provided at an end portion of the data pattern. These are power supply pads for electrically driving each pattern. .

  As shown in FIG. 1A, the sub gantry 9 is mounted on the opposite side of the main gantry 3 from the side where the optical system 4 is installed. A probe sensor head 10a is mounted on the main gantry 3, and the mounting portion is on the side opposite to the side on which the optical system 4 of the main gantry 3 is installed. On the other hand, a probe sensor head 10b is similarly provided on the main gantry 3 side of the sub gantry 9 as well. The probe sensor heads 10a and 10b are configured by providing a sensor head for detecting the electrical connection state of each pattern of the LCD panel 60 in a non-contact manner and a probe head provided with two probe pins in the same unit. ing. The probe sensor heads 10a and 10b are both configured to be movable in the X-axis direction, and further configured to be rotatable in the XY plane.

  Here, the structure of the probe sensor head will be described in detail with reference to FIG. As shown in FIG. 4, the probe sensor head is configured such that the sensor head 7 and the probe head 8 are provided on the same support plate 20, and this support plate 20 is connected to a rotation mechanism 90 of the probe sensor head. Thus, the sensor head 7 and the probe head 8 are both rotated. The sensor head 7 is disposed immediately above the LCD substrate so that the tip thereof does not contact the LCD substrate, and detects the high-frequency current supplied to the pattern on the LCD substrate in a non-contact manner. The probe head 8 is provided with two probe pins 81 and 82, and supplies current to each pattern through a pad.

  FIG. 2A is a perspective view when the present embodiment configured as described above is viewed from the front, and FIG. 2B is a perspective view when viewed from the back. In this specification, the side on which the optical system 4 is installed is the front side of the repair device, and the opposite side is the back side. As shown in FIG. 2A, a guide 2 is provided on the surface plate 1 along the periphery of the surface plate 1 from the front surface to the back surface, and the main gantry is orthogonal to these guides 2. 3 and a sub gantry 9 are installed on the guide 2. The optical system 4 is provided on the side surface of the main gantry 3 on the front side of the drawing, and the probe sensor head 10b is provided on the side surface of the sub gantry 9 on the front side of the drawing. As shown in FIG. 2B, a probe sensor head 10a is provided on the side surface of the main gantry 3 opposite to the side on which the optical system 4 is attached.

  Next, the operation of this embodiment will be described. First, the operation of the sensor head 7 and the probe head 8 will be described with reference to FIG. FIG. 5A shows a case where an open defect is inspected, and FIG. 5B shows a case where a short defect is inspected.

  In FIG. 5A, the probe pin 81 provided in the probe head 8 is connected to a high frequency current circuit, and the high frequency current is supplied from the probe pin 81 to the data pattern through the data pad. A sensor electrode 71 is built in the sensor head 7, and a high-frequency current flowing through the data pattern is detected by electrical coupling with the data pattern. In the example shown in FIG. 5A, a part of the data pattern is disconnected in the middle and an open defect is formed, and the sensor head 7 is in a state where it cannot detect the high-frequency current flowing through the data pattern. On the other hand, when the sensor head 7 moves to the probe pin side from the data pattern cutting portion, a high frequency current is detected and it can be determined that the data pattern is not cut.

  In FIG. 5B, a voltage is applied between the probe pin 81 and the probe pin 82 provided on the probe head 8, and the electrical resistance between the probe pins can be measured from the voltage and current of both probe pins. In the example shown in FIG. 5B, short-circuit defects are formed between the data patterns, so that it is possible to determine that the electrical resistance is reduced and short-circuited. In the case of detecting a short defect, the circuit configuration can be separated by a switch from the high frequency current circuit used when detecting an open defect. Further, the probe pin 81 and the probe pin 82 are provided with a moving mechanism movable in the Z-axis direction so that the probe pin 81 and the probe pin 82 can come into contact with the power supply pad of the LCD panel.

  Next, a case where defects are repaired in the configuration of FIG. For repair processing, the optical system 4 needs to be able to access all areas of the LCD substrate. Therefore, first, the moving holder 50 is moved to the left end. This allows the optical system 4 to access all areas of the LCD substrate. If the moving holder 50 does not exist, an extra movable area corresponding to the width in the Y-axis direction including the main gantry 3 and the optical system 4 is required, resulting in an increase in size of the apparatus. That is, the moving holder 50 has an effect of reducing the size of the apparatus.

  Next, defect information is acquired from an upstream process. The defect information includes a data pattern, a defect line number of the gate pattern, defect coordinate information, and information on a defect type that identifies an open defect or a short defect. The main gantry 3 operates based on Y-axis defect coordinate information, the optical system 4 operates based on the X-axis defect coordinate information, and the optical system 4 moves to the defect position. Further, depending on the type of defect, when a short defect occurs, the short portion is cut by laser irradiation. In the case of an open defect, the open portion is connected using CVD (Chemical Vapor Deposition) or the like to correct the defect. In the case where there are a plurality of defects, defect correction is similarly performed on the plurality of positions.

  Next, a method for performing an OS test after repairing a short defect in the gate pattern with a repair device will be described. However, it is assumed that the gate pattern is formed in the Y-axis direction. When performing the OS test, the probe sensor heads 10 a and 10 b need to be able to access all areas of the LCD substrate 6. Therefore, the moving holder 50 is moved to the right end. Thereby, the probe sensor heads 10 a and 10 b can access all areas of the LCD substrate 6.

  Then, the sub gantry 9 is moved to the Y-axis coordinates calculated based on the defect information from the upstream process. Further, the probe sensor head 10b is moved to the X-axis coordinate of the pad position calculated based on the defect information, and the probe pins 81 and 82 are moved downward in the Z-axis to contact different pads. Then, a current is passed between the two probe pins 81 and 82, and the electrical resistance between the patterns is calculated from the voltage and current between them. to decide. On the other hand, if it is smaller than the threshold value, a short state is indicated, and it is determined that the repair has failed. In this case, the repair operation is performed again.

  Next, a method for performing an OS test after repairing an open defect of a gate pattern with a repair device will be described. The sub gantry 9 is moved to the Y-axis coordinates calculated based on the defect information from the upstream process. Next, the probe sensor head 10b mounted on the sub gantry 9 is moved to the X-axis coordinate of the pad position calculated based on the defect information, and the probe pin 81 connected to the high-frequency current source is moved downward in the Z-axis. And touch the pad of the correction pattern. Next, the probe sensor head 10a mounted on the main gantry 3 is moved along the X axis and moved to the correction pattern position where the probe sensor head 10b is disposed. The main gantry 3 moves in the Y-axis direction toward the probe sensor head 10b and performs a detection operation. If the defect is corrected correctly at this time, a high-frequency current is detected over the entire stroke on the defect pattern, and it is determined that the repair is successful. On the other hand, if no high-frequency current is detected on the defect pattern, it is determined that the repair has failed. In this case, the repair operation is performed again. When the probe sensor head moves, the probe pin is retracted above the Z axis in order to avoid contact between the probe pin and the substrate surface.

  Next, a method for performing an OS test on a data pattern will be described. In FIG. 1A, the data pattern is formed along the X axis. Therefore, when the probe sensor heads 10a and 10b are rotated 90 degrees to the left in the XY plane, the state shown in FIG. 1B is obtained, and the data pattern and the data pad can be accessed. Accordingly, the repair result of the short defect and the open defect can be checked in the same manner as the gate pattern OS test method.

  The direction of the data pad and the direction of the gate pad are various depending on the type of the LCD substrate. However, by rotating the probe sensor heads 10a and 10b in the XY plane, they can be accessed in any direction. Become.

  Next, the effect of this embodiment will be described. In the present embodiment, the feeding probe head and the sensor head are integrated as a probe sensor head, which are arranged in the main gantry and the sub gantry so that the probe sensor head can be rotated in the range of 180 degrees in the XY plane. Thus, the wiring can be checked without taking out the FPD substrate regardless of the direction of the electrode pad of the substrate to be inspected. In the present embodiment, the number of probe sensor heads arranged in the main gantry and the sub gantry is one, but a plurality of probe sensor heads may be arranged.

  Also, by adding a sub gantry with a probe sensor head behind the main gantry, that is, on the side opposite to the side where the optical system of the main gantry is installed, the conventional repair device is only slightly enlarged. An OS tester function can be easily added. Furthermore, by attaching the probe sensor head behind the main gantry and moving the holder holding the FPD board back and forth in the Y-axis direction, when using the repair function, the holder position is moved forward and the OS tester function is used. Sometimes, moving to the back can maintain compatibility with the convenience of the conventional repair function.

  Next, a repair device equipped with an OS tester function according to the second embodiment of the present invention will be described. FIG. 6 is a plan view showing this embodiment. As shown in FIG. 6, this embodiment has another sub gantry 91 behind the main gantry 3 in addition to the sub gantry 9. Further, the probe sensor head 10a mounted on the main gantry 3 in FIG. 1 is mounted on the sub gantry 91, and other configurations are the same as those in FIG. Therefore, the same components are denoted by the same reference numerals and detailed description thereof is omitted. The basic operation of this embodiment is the same as that of the first embodiment. In this embodiment, in addition to the same effects as those of the first embodiment, the OS tester function can be realized without changing the repair mechanism of the main gantry by adding another sub gantry. There is an effect that a function can be easily added. 7A is a perspective view of the second embodiment as viewed from the front, and FIG. 7B is a perspective view of the second embodiment as viewed from the back. FIG. 7 is the same as FIG. 2 except for the features of the present embodiment described above. Therefore, the same components are denoted by the same reference numerals and detailed description thereof is omitted.

  Next, a third embodiment of the present invention will be described. FIG. 8 is a plan view showing this embodiment. As shown in FIG. 8, this embodiment has a configuration in which two sub gantry 9, 91 are mounted in front of the main gantry 3, and the other configuration is the same as FIG. Therefore, the same components are denoted by the same reference numerals and detailed description thereof is omitted. The basic operation of this embodiment is the same as that of the second embodiment. FIG. 9 is a perspective view of the present embodiment as viewed from the front. FIG. 9 is the same as FIG. 7 except for the features of the present embodiment described above. Therefore, the same components are denoted by the same reference numerals, and detailed description thereof is omitted.

  Next, a fourth embodiment of the present invention will be described. FIG. 10 is a plan view showing this embodiment. As shown in FIG. 10, in this embodiment, the sub gantry 9 is mounted in front of the main gantry 3, and the probe sensor head 10 b is mounted on the optical unit 4 of the main gantry 3. It has become. Since other configurations are the same as those of the first embodiment, the same components are denoted by the same reference numerals, and detailed description thereof is omitted. The operation and effect of the present embodiment are basically the same as the operation and effect of the first embodiment. FIG. 11 is a perspective view of the present embodiment as viewed from the front. Since FIG. 11 is the same as FIG. 2 except for the features of the present embodiment described above, the same components are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIGS. 12 and 13, even when the number of probe sensor heads provided in the repair device is only one, short defects can be detected without remounting the substrate to be inspected. Can do. 12 and 13 show the fifth and sixth embodiments of the present invention, respectively. FIG. 12 is the same as the configuration of FIG. 1A except that there is no sub gantry and a probe sensor head attached to the sub gantry. Further, FIG. 13 is the same as the configuration of FIG. 1B except that there is no probe sensor head attached to the main gantry. Therefore, the same components are denoted by the same reference numerals and detailed description thereof is omitted. Further, the operation and effect of the embodiment shown in FIGS. 12 and 13 are the same as those in the case of detecting and correcting the short-circuit defect of the substrate using the embodiment shown in FIG.

  The present invention can be suitably used for FPD manufacturing apparatuses such as liquid crystal display panels and plasma display panels.

It is a top view which shows the repair apparatus carrying the OS tester function which concerns on the 1st Embodiment of this invention. (A) When performing an OS test of a gate pattern on an LCD substrate, (b) When performing an OS test of a data pattern on an LCD substrate. (A) It is a perspective view at the time of seeing 1st Embodiment from the front, (b) It is a perspective view at the time of seeing 1st Embodiment from the back. (A) It is a schematic diagram which shows the structure of an LCD substrate. (B) It is an enlarged view of an LCD panel. It is a perspective view which shows the structure of a probe sensor head part. (A) It is a top view explaining operation | movement of the probe sensor head at the time of test | inspecting an open defect. (B) It is a top view explaining operation | movement of the probe sensor head at the time of test | inspecting a short defect. It is a top view which shows the repair apparatus carrying the OS tester function which concerns on the 2nd Embodiment of this invention. (A) It is a perspective view at the time of seeing 2nd Embodiment from the front, (b) It is a perspective view at the time of seeing 2nd Embodiment from the back. It is a top view which shows the repair apparatus carrying the OS tester function which concerns on the 3rd Embodiment of this invention. It is a perspective view at the time of seeing from 3rd Embodiment. It is a top view which shows the repair apparatus carrying the OS tester function which concerns on the 4th Embodiment of this invention. It is a perspective view at the time of seeing a 4th embodiment from the front. It is a top view which shows the repair apparatus carrying the short tester function which concerns on the 5th Embodiment of this invention. It is a top view which shows the repair apparatus carrying the short tester function which concerns on the 6th Embodiment of this invention. (A) It is a top view which shows the repair apparatus carrying the conventional OS tester function. (B) This is an example in which the LCD substrate is rotated 90 degrees in a plane and the pattern direction on the substrate is changed with the same configuration as (a).

Explanation of symbols

1, 101; Surface plate 2, 102; Guide 3, 103; Main gantry 4, 104; Optical system 6, 106; LCD substrate 7, 107; Sensor head 8, 108; Feed probe head 9, 91, 109; 10a, 10b; probe sensor head 20; support plate 50; moving holders 60 and 160; LCD panel 71; sensor electrodes 81 and 82; probe pins 90;

Claims (32)

A stage on which a substrate is placed, first and second gantry movable in a first direction along the surface of the stage, and each of the first and second gantry installed on the first and second gantry. A first and a second probe sensor unit movable in a second direction intersecting the first direction; and a portion to be inspected of the substrate installed in the first gantry so as to be movable in the second direction. A repair portion for repairing, and the first and second probe sensor portions are each movable in the second direction, and are placed side by side on the base portion and the inspected portion of the substrate A probe unit that applies a voltage to the sensor, a sensor unit that detects a current flowing through the inspected unit, and a platform drive unit that rotationally drives the platform with a direction orthogonal to the surface of the stage as a rotation axis. A repair device characterized by the above. The repair unit is installed on the opposite side of the first gantry from the second gantry side, and the first probe sensor unit is installed on the second gantry side of the first gantry, The repair apparatus according to claim 1, wherein the second probe sensor unit is installed on the first gantry side of the second gantry. The repair unit is installed on the second gantry side of the first gantry, and the first probe sensor unit is juxtaposed with the repair unit, and the second probe sensor unit The repair device according to claim 1, wherein the repair device is installed on the first gantry side of the second gantry. A stage on which the substrate is placed, first, second and third gantry movable in the first direction along the surface of the stage, and each gantry installed in the first and second gantry respectively. The first and second probe sensor units are movable in a second direction intersecting the first direction, and are installed in the third gantry so as to be movable in the second direction. A repair unit that repairs the inspection unit, and the first and second probe sensor units are each arranged in parallel with the base unit movable in the second direction and on the base unit. A probe part for applying a voltage to the part to be inspected, a sensor part for detecting a current flowing in the part to be inspected, a base part driving part for rotationally driving the base part around a direction perpendicular to the surface of the stage, and Repair characterized by having Location. The first probe sensor unit is installed on the second gantry side of the first gantry, and the second probe sensor unit is installed on the first gantry side of the second gantry, The third gantry is not disposed between the first gantry and the second gantry, and the repair unit is installed on the first and second gantry sides of the third gantry. The repair device according to claim 4, wherein the repair device is provided. The first probe sensor unit is installed on the second gantry side of the first gantry, and the second probe sensor unit is installed on the first gantry side of the second gantry, The third gantry is not disposed between the first gantry and the second gantry, and the repair portion is opposite to the first and second gantry sides of the third gantry. The repair device according to claim 4, wherein the repair device is installed on a side. A stage plate on which the stage and the first, second, and third gantry are installed, and a stage drive unit that moves the stage in the first direction with respect to the platen. Item 7. The repair device according to any one of Items 1 to 6. The inspected portion of the substrate is an electrical wiring provided on the substrate, and the probe portion of the first or second probe sensor portion contacts the inspected portion of the substrate at two points, and the two points The short circuit of the said electrical wiring is detected by applying a voltage and detecting whether an electric current flows into the said to-be-inspected part, The any one of Claim 1 thru | or 7 characterized by the above-mentioned. Repair device. The inspected portion of the substrate is an electrical wiring provided on the substrate, and one of the probe portions of the first and second probe sensor portions contacts the inspected portion of the substrate at one point and the current The sensor part of the other probe sensor part detects whether or not a current flows through the electrical wiring connected to the part to be inspected of the substrate, thereby detecting disconnection of the electrical wiring. The repair device according to claim 1, wherein the repair device is characterized. The inspected portion of the substrate is an electrical wiring provided on the substrate, and the repair portion irradiates a laser beam to a short portion of the inspected portion to repair a defect. 10. The repair device according to any one of 1 to 9. The inspected portion of the substrate is an electrical wiring provided on the substrate, and the repaired portion is repaired by chemical vapor deposition by irradiating a laser beam to the disconnection portion of the inspected portion. The repair device according to any one of claims 1 to 10. The repair device according to claim 1, wherein the substrate is a flat panel display substrate. The repair apparatus according to claim 12, wherein data lines and gate lines are wired in a matrix on the flat panel display substrate. The repair device according to claim 12, wherein the flat panel display substrate is a liquid crystal display device or a plasma display panel substrate. A repair device according to any one of claims 1 to 7, wherein a short circuit of a substrate placed on the stage and having a plurality of electrical wirings formed in the first and second directions is detected. In the repair method for repairing, when inspecting a short circuit of the wiring along the first direction and the step of moving one of the first and second probe sensor portions to the portion to be inspected, After the probe sensor unit disposed in the inspection unit is rotated in the first direction, the probe unit is brought into contact with the part to be inspected on the substrate at two points, a voltage is applied between the two points, and the two points flow. In the step of determining whether or not a short circuit has occurred by detecting a current, and when inspecting a short circuit of the wiring along the second direction, the probe sensor unit disposed in the inspected unit is connected to the second sensor unit. Probe part after rotating in the direction A step of determining whether or not a short-circuit is detected by contacting a point on the substrate to be inspected with two points, applying a voltage between the two points, and detecting a current flowing between the two points; Includes a step of moving the repair portion to a short position and repairing the repair portion. The repair method according to claim 15, wherein the substrate is a flat panel display substrate in which data lines and gate lines are arranged in a matrix. The location where the probe of the probe sensor unit applies a voltage by contacting two points to the inspected portion of the substrate is an adjacent electrode pad provided at an end of the data line or the gate line. The repair method according to claim 16. A repair device according to any one of claims 1 to 7 is used to detect disconnection of a substrate placed on the stage and having a plurality of electrical wirings formed in the first and second directions. In the repair method to be repaired, when inspecting the disconnection of the wiring along the first direction and the step of moving one of the first and second probe sensor units to the inspection target, The probe sensor unit disposed in the inspection unit is rotated in the first direction and then the probe unit is brought into contact with the inspection target part of the substrate at one point to supply current, and the other probe sensor unit is connected to the inspection target unit. A step of moving the inspection unit to the coordinate position in the second direction, and detecting the value of the current flowing through the electrical wiring below the sensor unit after the other probe sensor unit is rotated in the first direction. Disconnection failure And inspecting the disconnection of the wiring along the second direction, the probe sensor unit disposed in the inspected unit is rotated in the second direction, and then the probe unit is moved to the second direction. A step of supplying a current to the inspection target portion of the substrate in contact with one point, a step of moving the other probe sensor portion to the coordinate position in the first direction of the inspection target portion, and the other probe sensor portion A step of determining whether or not the disconnection is defective by detecting the value of the current flowing in the electrical wiring below the sensor unit after the sensor unit is rotated in the second direction, and if the disconnection is detected, the repair And a step of moving the part to the disconnection position and repairing the repaired part. 19. The repair method according to claim 18, wherein the substrate is a flat panel display substrate in which data lines and gate lines are wired in a matrix. A portion where the probe of the probe sensor unit contacts the point to be inspected on the substrate at one point and supplies current is an electrode pad provided at an end of the data line or the gate line. The repair method according to claim 19. 18. The repair method according to claim 15, wherein the repair unit irradiates a short spot with a laser beam to repair a short defect. The repair method according to any one of claims 18 to 20, wherein the repair portion is repaired by irradiating a laser beam to a broken portion and using chemical vapor deposition. A stage on which the substrate is placed, a gantry movable in a first direction along the surface of the stage, and a second direction installed on the gantry and intersecting the first direction with respect to the gantry A movable probe sensor unit; and a repair unit that is installed in the gantry so as to be movable in the second direction, and repairs the inspected part of the substrate. The probe sensor unit has the second direction. A movable base part, a probe part juxtaposed on the base part for applying a voltage to the part to be inspected, a sensor part for detecting a current flowing through the part to be inspected, and the base part of the stage. A repair device, comprising: a platform drive unit that rotationally drives with a direction orthogonal to the surface as a rotation axis. A stage on which the substrate is placed, first and second gantry movable in the first direction along the surface of the stage, and movably installed in the second direction on the first gantry. A repair part for repairing the inspected part of the substrate; and a probe sensor part installed in the second gantry and movable in a second direction intersecting the first direction with respect to the second gantry. The probe sensor unit includes: a base unit movable in the second direction; a probe unit that is juxtaposed on the base unit and applies a voltage to the inspected part of the substrate; and a current that flows in the inspected part A repairing apparatus comprising: a sensor unit that detects the rotation of the base unit; and a base unit driving unit that rotationally drives the base unit about a direction orthogonal to the surface of the stage. The inspected portion of the substrate is an electrical wiring provided on the substrate, the probe portion of the probe sensor portion contacts the inspected portion of the substrate at two points, and a voltage is applied between the two points, 25. The repair device according to claim 23, wherein a short circuit of the electrical wiring is detected by detecting whether or not a current flows through the part to be inspected. The inspected portion of the substrate is an electrical wiring provided on the substrate, and the repair portion irradiates a laser beam to a short portion of the inspected portion to repair a defect. 26. The repair device according to any one of 23 to 25. 27. The repair device according to claim 23, wherein the substrate is a flat panel display substrate. 28. The repair device according to claim 27, wherein data lines and gate lines are wired in a matrix on the flat panel display substrate. The repair apparatus according to claim 27, wherein the flat panel display substrate is a liquid crystal display device or a plasma display panel substrate. 25. A repair method using the repair device according to claim 23 or 24 to detect and repair a short circuit of a substrate placed on the stage and formed with a plurality of electrical wirings in the first and second directions. In the step of moving the probe sensor part to the part to be inspected and the inspection of the short circuit of the wiring along the first direction, the probe sensor part arranged in the part to be inspected is moved in the first direction. The probe part is brought into contact with the part to be inspected of the substrate after being rotated, the voltage is applied between the two points, and the current flowing between the two points is detected to determine whether or not there is a short circuit; When inspecting the short circuit of the wiring along the second direction, the probe sensor unit disposed in the inspected part is rotated in the second direction, and then the probe part is used as the inspected part of the substrate. 2 in contact with two points A step of determining whether or not a short circuit is detected by applying a voltage between the two points and detecting a current flowing between the two points, and a step of moving the repair portion to a short position and repairing if a short circuit is detected A repair method comprising: The repair method according to claim 30, wherein the substrate is a flat panel display substrate in which data lines and gate lines are arranged in a matrix. The location where the probe of the probe sensor unit applies a voltage by contacting two points to the inspected portion of the substrate is an adjacent electrode pad provided at an end of the data line or the gate line. The repair method according to claim 31.

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