CN113203960A - Open-circuit and short-circuit testing device and method - Google Patents
Open-circuit and short-circuit testing device and method Download PDFInfo
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- CN113203960A CN113203960A CN202110452566.8A CN202110452566A CN113203960A CN 113203960 A CN113203960 A CN 113203960A CN 202110452566 A CN202110452566 A CN 202110452566A CN 113203960 A CN113203960 A CN 113203960A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/52—Testing for short-circuits, leakage current or ground faults
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/54—Testing for continuity
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1306—Details
- G02F1/1309—Repairing; Testing
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136259—Repairing; Defects
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- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Mathematical Physics (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Abstract
The application discloses open circuit short circuit testing arrangement and method, open circuit short circuit testing arrangement includes: the workbench is used for placing a substrate to be tested, and the substrate to be tested comprises a plurality of metal wires; the preliminary positioning unit is used for carrying out open-circuit and short-circuit tests on the metal wires in the plurality of metal wires and generating open-circuit information and short-circuit information of the metal wires when the metal wires are open-circuit or short-circuit; the accurate positioning unit is used for receiving the open circuit information and the short circuit information and generating open circuit position information and short circuit position information of the metal wire according to the open circuit information and the short circuit information; and the cutting unit is connected with the workbench in a sliding manner and is used for receiving the short circuit position information and cutting the short circuit position of the metal wire according to the short circuit position information so as to repair the short-circuited metal wire. This application is through the cutting unit, and the metal wire to taking place the short circuit is repaired, avoids repairing the metal wire that takes place the short circuit through special repair equipment, shortens the production cycle of base plate, improves the productivity.
Description
Technical Field
The application relates to the field of electrical testing of thin film transistor array substrates, in particular to an open-circuit short-circuit testing device and method.
Background
The current TFT-LCD (Thin Film Transistor-Liquid Crystal Display) manufacturing process can be roughly divided into three stages: array process, box making process and module process. In the array process, 5 layers of films are plated on a substrate, wherein one layer is a metal wire layer, and metal wires are transversely or longitudinally arranged on the substrate through processes such as etching and the like, the quality of the metal wires directly affects the quality of a final product, so the detection of the metal wires is of great importance.
Currently, the main device for testing the quality of the metal wire is an OS (Open-Short) testing device, which can detect whether the metal wire has an Open circuit or a Short circuit. And when the open circuit and short circuit of the metal wire are detected, positioning the open circuit and short circuit metal wire, transferring the substrate to post-site repairing equipment, and repairing the open circuit and short circuit metal wire. Namely: the conventional open-circuit short-circuit testing device is only used for detecting and positioning the open circuit short circuit of the metal wire, the short circuit metal wire cannot be repaired, and other equipment is needed to repair the short circuit metal wire, so that the production period of the substrate is too long, and the productivity is reduced.
Therefore, it is urgently needed to find an open-short circuit testing device and method to solve the technical problems of the prior art that the short-circuit metal line cannot be repaired by the open-short circuit testing device, so that the production cycle of the substrate is too long, the productivity is low, and the like.
Disclosure of Invention
The application provides an open-circuit short-circuit testing device and a method, and aims to solve the technical problems that in the prior art, the open-circuit short-circuit testing device cannot repair a short-circuit metal wire, so that the production cycle of a substrate is too long, the productivity is low, and the like.
In a first aspect, the present application provides an open-short circuit testing device, comprising:
the test device comprises a workbench, a test device and a test system, wherein the workbench is used for placing a substrate to be tested, and the substrate to be tested comprises a plurality of metal wires;
the preliminary positioning unit is connected with the workbench in a sliding manner and is used for carrying out open-circuit and short-circuit tests on the metal wires in the plurality of metal wires and generating open-circuit information and short-circuit information of the metal wires when the metal wires are open-circuit or short-circuit;
the accurate positioning unit is connected with the workbench in a sliding manner and is used for receiving the open circuit information and the short circuit information of the metal wire and generating the open circuit position information and the short circuit position information of the metal wire according to the open circuit information and the short circuit information;
and the cutting unit is connected with the workbench in a sliding manner and is used for receiving the short circuit position information and cutting the short circuit position of the metal wire according to the short circuit position information so as to repair the short-circuited metal wire.
In some implementations of the present application, the cutting unit includes a cutting mechanism and an industrial control device, and the industrial control device is configured to receive short-circuit position information, generate a cutting instruction according to the short-circuit position information, and instruct the cutting mechanism to cut the short-circuit position of the metal wire.
In some implementations of the present application, the cutting mechanism includes a fixing member and a laser cutting head, one end of the fixing member is slidably connected to the worktable, the other end of the fixing member is fixedly connected to the laser cutting head, and the laser cutting head is used for generating a laser beam to cut the short circuit position.
In some implementations of the present application, the workstation includes placing portion and installation department, placing portion is used for placing the base plate of awaiting measuring, the installation department include at least one guide rail and with at least one crossbeam of at least one guide rail sliding connection, at least one guide rail fixed connection in placing portion, preliminary positioning unit accurate positioning unit with cutting unit all sliding connection in at least one crossbeam.
In some implementations of the present application, the mounting portion includes a first guide rail, a second guide rail, a first beam and a second beam, the first beam includes a first beam body, and a first connecting portion and a second connecting portion fixedly connected to two ends of the first beam body, the first connecting portion is slidably connected to the first guide rail, the second connecting portion is slidably connected to the second guide rail, and the first beam body is located above the placing portion; the second beam comprises a second beam body, a third connecting part and a fourth connecting part, wherein the third connecting part and the fourth connecting part are fixedly connected to two ends of the second beam body;
preliminary positioning element sliding connection in the first roof beam body, accurate positioning element with cutting unit sliding connection in the second roof beam body.
In some implementations of the present application, the preliminary positioning unit includes at least one set of test sensors and a first controller, each set of test sensors includes a sending sensor and a receiving sensor, the sending sensor is configured to send a test signal, and the receiving sensor is configured to receive a scanning signal formed by the test signal on the metal wire;
the first controller is used for receiving the scanning signal, comparing the scanning signal with a preset waveform signal, determining whether the metal wire is open-circuited or short-circuited according to a comparison result, and if so, generating open-circuit information or short-circuit information of the metal wire.
In some implementations of the present application, the fine positioning unit includes a second controller and an imaging sensor, the second controller is configured to receive the open circuit information and the short circuit information and generate a movement control signal; the imaging sensor is used for moving to the metal wire with the open circuit or the short circuit under the control of the movement control signal and acquiring a test image of the metal wire with the open circuit or the short circuit;
the second controller is further configured to receive the test image, compare the test image with a standard image preset in the second controller, and generate open-circuit position information and short-circuit position information of the metal line with an open circuit or a short circuit according to a comparison result.
In some implementations of the present application, the accurate positioning unit further includes a telescopic portion, one end of the telescopic portion is slidably connected to the second beam, the other end of the telescopic portion is fixedly connected to the imaging sensor, and the telescopic portion can extend or shorten along a direction perpendicular to the substrate to be tested; the second controller is further used for adjusting the distance between the imaging sensor and the substrate to be tested so as to ensure the definition of the test image.
In some implementations of the present application, the second controller is further configured to, after the cutting unit cuts the short-circuit position of the metal wire, control the imaging sensor to move to the short-circuit position of the metal wire according to the short-circuit position information to obtain a rechecking image of the metal wire, compare the rechecking image with the standard image, and determine whether the metal wire is cut according to a comparison result.
In a second aspect, the present application further provides an open-circuit and short-circuit testing method, which is applied to the open-circuit and short-circuit device described in any implementation manner of the first aspect, and the open-circuit and short-circuit testing method includes:
placing the substrate to be tested on the workbench, wherein the substrate to be tested comprises a plurality of metal wires;
performing an open-circuit short-circuit test on the metal wire through the primary positioning unit, and generating open-circuit information and short-circuit information of the metal wire when the metal wire is open-circuited or short-circuited;
receiving open circuit information and short circuit information of the metal wire through the accurate positioning unit, and generating open circuit position information and short circuit position information of the metal wire according to the open circuit information and the short circuit information;
and receiving the short circuit position information, and cutting the short circuit position of the metal wire through the cutting unit according to the short circuit position information so as to repair the short-circuited metal wire.
This application is including cutting the unit through setting up the short circuit testing arrangement that opens a way, cuts the metal wire that takes place the short circuit to repair the metal wire that takes place the short circuit, avoid repairing the metal wire that takes place the short circuit through special repair equipment, shorten the production cycle of base plate, improve the productivity.
Drawings
Fig. 1 is a schematic structural diagram of an open-circuit and short-circuit testing apparatus according to an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of a cutting unit according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of a first cross beam provided in an embodiment of the present application;
fig. 4 is a schematic structural diagram of a second cross beam provided in the embodiment of the present application;
FIG. 5 is a schematic diagram of a preliminary positioning unit provided in an embodiment of the present application;
FIG. 6 is a schematic diagram of a fine positioning unit provided in an embodiment of the present application;
fig. 7 is a schematic structural diagram of a precise positioning unit provided in an embodiment of the present application;
FIG. 8 is a diagram illustrating a state change of a shorted metal line according to an embodiment of the present disclosure;
fig. 9 is a schematic flowchart of an open-short circuit testing method according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application.
The following description is presented to enable any person skilled in the art to make and use the application. In the following description, details are set forth for the purpose of explanation. It will be apparent to one of ordinary skill in the art that the present application may be practiced without these specific details. In other instances, well-known structures and processes are not set forth in detail in order to avoid obscuring the description of the present application with unnecessary detail. Thus, the present application is not intended to be limited to the embodiments shown, but is to be accorded the widest scope consistent with the principles and features disclosed herein.
The embodiment of the application provides an open-circuit short-circuit testing device and method. The details will be described below.
As shown in fig. 1, an embodiment of the present application provides an open-short circuit testing apparatus 10, where the open-short circuit testing apparatus 10 includes:
a worktable 100 for placing a substrate 1 to be tested, the substrate 1 to be tested including a plurality of metal wires 2;
the preliminary positioning unit 210 is connected to the workbench 100 in a sliding manner, and is configured to perform an open-circuit and short-circuit test on each metal wire 2, and generate open-circuit information and short-circuit information of the metal wires 2 when the metal wires 2 are open-circuited or short-circuited;
the accurate positioning unit 220 is connected with the workbench 100 in a sliding manner, and is used for receiving the open-circuit information and the short-circuit information of the metal wire 2 and generating the open-circuit position information and the short-circuit position information of the metal wire 2 according to the open-circuit information and the short-circuit information;
and a cutting unit 300 slidably connected to the table 100, for receiving the short-circuit position information, and cutting the short-circuit position of the metal wire 2 according to the short-circuit position information, so as to repair the short-circuited metal wire 2.
This application embodiment realizes fixing a position 2 short circuit and the position of opening a way through setting up preliminary positioning unit 210 and accurate positioning unit 220 to through setting up cutting unit 300, cut the metal wire 2 that takes place the short circuit through cutting unit 300, repair with the metal wire 2 that takes place the short circuit, avoid repairing the metal wire 2 that takes place the short circuit through special repair equipment, shorten the production cycle of base plate, improve the productivity.
Further, as shown in fig. 2, the cutting unit 300 includes a cutting mechanism 310 and an industrial control device 320, where the industrial control device 320 is configured to receive the short-circuit position information, generate a cutting instruction according to the short-circuit position information, and instruct the cutting mechanism 310 to cut the short-circuit position of the metal wire 2.
Specifically, in one embodiment of the present application, the cutting mechanism 310 includes a fixing member 311 and a laser cutting head 312, one end of the fixing member 311 is slidably connected to the worktable 100, the other end of the fixing member 311 is fixedly connected to the laser cutting head 312, and the laser cutting head 312 is used for generating a laser beam to cut at the short circuit position.
The energy released when the laser beam irradiates the surface to be cut melts and evaporates the part to be cut so as to achieve the purpose of cutting, and the laser beam cutting method has the technical effects of high precision, high cutting speed, smooth cut, low processing cost and the like.
Further, as shown in fig. 1, in some embodiments of the present application, the worktable 100 includes a placing part 110 and a mounting part 120, the placing part 110 is used for placing the substrate 1 to be tested, the mounting part 120 includes at least one guide rail 121 and at least one cross beam 122 slidably connected with the at least one guide rail 121, the at least one guide rail 121 is fixedly connected to the placing part 110, and the preliminary positioning unit 210, the precise positioning unit 220 and the cutting unit 300 are slidably connected to the at least one cross beam 122.
By arranging at least one cross beam 122 connected with at least one guide rail 121 in a sliding manner, and the preliminary positioning unit 210, the precise positioning unit 220 and the cutting unit 300 in a sliding manner, the preliminary positioning unit 210, the precise positioning unit 220 and the cutting unit 300 can move along the sliding direction of the cross beam 122 and along the direction of the cross beam 122, the moving range of the preliminary positioning unit 210, the precise positioning unit 220 and the cutting unit 300 is increased, and the applicability of the open-circuit short-circuit testing device 10 is further improved.
Further, in order to avoid the situation that the cross beam 122 vibrates, swings, etc. during sliding when the size of the table 100 is large, which results in inaccurate positioning, in some embodiments of the present application, as shown in fig. 1 and 3, the mounting part 120 includes a first guide rail 123, a second guide rail 124, and a first cross beam 125, the first cross beam 125 includes a first beam 1251, and a first connecting part 1252 and a second connecting part 1253 fixedly connected to both ends of the first beam 1251, the first connecting part 1252 is slidably connected to the first guide rail 123, the second connecting part 1253 is slidably connected to the second guide rail 124, the first beam 1251 is located above the placing part 110, and the preliminary positioning unit 210, the precise positioning unit 220, and the cutting unit 300 are slidably connected to the first beam 1251.
Through setting up first crossbeam 125 and including first roof beam body 1251 and fixed connection in first connecting portion 1252 and second connecting portion 1253 at first roof beam body 1251 both ends, first connecting portion 1252 sliding connection is in first guide rail 123, and second connecting portion 1253 sliding connection is in second guide rail 124, can avoid first crossbeam 125 to take place phenomenons such as vibration, swing at the slip in-process, improves the accuracy of location.
Further, as shown in fig. 1 and 4, in some embodiments of the present application, the mounting portion 120 further includes a second beam 126, the second beam 126 includes a second beam 1261, and a third connecting portion 1262 and a fourth connecting portion 1263 fixedly connected to two ends of the second beam 1261, the third connecting portion 1262 is slidably connected to the first rail 123, the fourth connecting portion 1263 is slidably connected to the second rail 124, and the second beam 1261 is located above the placing portion 110;
the preliminary positioning unit 210 is slidably coupled to the first beam 1251, and the fine positioning unit 220 and the cutting unit 300 are slidably coupled to the second beam 1261.
Through with accurate positioning unit 220 and cutting unit 300 sliding connection in second roof beam body 1261, with preliminary positioning unit 210 sliding connection in first roof beam body 1251, on the one hand can avoid when preliminary positioning unit 210, accurate positioning unit 220 and the equal sliding connection of cutting unit 300 are in first crossbeam 125, lead to first crossbeam 125 to need the repetitive motion, and then improve positioning efficiency, on the other hand can be after accurate positioning unit 220 fixes a position, directly cut through cutting unit 300, shorten cutting unit 300's stroke, improve cutting efficiency.
Further, as shown in fig. 1 and 5, in some embodiments of the present application, the preliminary positioning unit 210 includes at least one set of test sensors 211 and a first controller 212, each set of test sensors 211 includes a transmitting sensor 2111 and a receiving sensor 2112, the transmitting sensor 2111 is used for transmitting a test signal, and the receiving sensor 2112 is used for receiving a scanning signal formed by the test signal on the metal wire 2;
the first controller 212 is configured to receive the scan signal, compare the scan signal with a preset waveform signal, determine whether the metal line 2 is open-circuited or short-circuited according to a comparison result, and generate open-circuit information or short-circuit information of the metal line if the metal line 2 is open-circuited or short-circuited.
Specifically, the method comprises the following steps: the test signal is an alternating current signal, such as: the test signal is a sine wave or cosine wave signal, the preset waveform signal is completely the same as the test signal, the test signal can be directly obtained by the metal wire 2, when the metal wire 2 is open-circuited, the scanning signal is 0, and when the metal wire 2 is short-circuited, the signal value of the scanning signal is smaller than that of the test signal. Therefore, whether the metal line 2 is open or short can be determined by comparing the scan signal with the preset waveform signal.
Further, in order to improve the positioning efficiency of the preliminary positioning unit 210, in some embodiments of the present application, as shown in fig. 3, the transmitting sensor 2111 includes an emitting end surface 2113, the receiving sensor 2112 includes a receiving end surface 2114, and the emitting end surface 2113 and the receiving end surface 2114 are opposite to the substrate 1 to be tested.
Through the arrangement, the stroke of the test signal and the scanning signal can be shortened, the time for the test signal to reach the metal wire 2 and the time for the scanning signal to reach the receiving sensor 2112 are shortened, and the technical effect of improving the positioning efficiency of the primary positioning unit 210 is achieved.
It should be noted that: the number of groups of the test sensors 211 should be adjusted according to the number of the metal wires 2 and the size of the worktable 100, when the number of the metal wires 2 is large and the size of the worktable 100 is large, the number of the groups of the test sensors 211 needs to be increased correspondingly, and when the number of the metal wires 2 is large and the size of the worktable 100 is small, the number of the groups of the test sensors 211 needs to be decreased correspondingly, in the embodiment of the present application, the preliminary positioning unit 210 includes two groups of the test sensors 211.
Further, as shown in fig. 1 and 6, the fine positioning unit 220 includes a second controller 221 and an imaging sensor 222, the second controller 221 being configured to receive the open circuit information and the short circuit information and generate a movement control signal; the imaging sensor 222 is configured to move to the metal line 2 where the open circuit or the short circuit occurs under the control of the movement control signal, and acquire a test image of the metal line 2 where the open circuit or the short circuit occurs;
the second controller 221 is further configured to receive the test image, compare the test image with a standard image preset in the second controller 221, and generate open-circuit position information and short-circuit position information of the metal line 2 in which an open circuit or a short circuit occurs according to a comparison result.
Further, in order to improve the reliability of the open-short circuit testing device 10, in some embodiments of the present application, as shown in fig. 7, the precise positioning unit 220 further includes a telescopic portion 223, one end of the telescopic portion 223 is slidably connected to the second beam 126, the other end of the telescopic portion 223 is fixedly connected to the imaging sensor 222, and the telescopic portion 223 extends or shortens in a direction perpendicular to the substrate 1 to be tested; the second controller 221 is also used to adjust the distance between the imaging sensor 222 and the substrate 1 to be tested to ensure the sharpness of the test image.
Through the arrangement, the definition of the test image can be improved, so that the situation that when the test image is not clear, the comparison result of the second controller 221 is wrong, and the reliability of the open-circuit short-circuit test device 10 is reduced is avoided.
It should be understood that: the expansion part 223 may be any mechanism capable of expanding and contracting, and is not limited herein.
In order to further improve the reliability of the open-circuit and short-circuit testing device 10, in some embodiments of the present application, the second controller 221 is further configured to, after the cutting unit 300 cuts the short-circuit position of the metal wire 2, control the imaging sensor 222 to move to the short-circuit position of the metal wire 2 according to the short-circuit position information to obtain a rechecking image of the metal wire 2, compare the rechecking image with the standard image, and determine whether the cutting of the metal wire 2 is completed according to the comparison result.
With the above arrangement, after the cutting unit 300 finishes cutting, the cutting result can be rechecked to ensure that the metal wire 2 is not short-circuited, thereby further improving the reliability of the open-circuit and short-circuit testing device 10.
Specifically, the working principle of the open-circuit short-circuit testing device 10 according to the embodiment of the present application is as follows: first, the substrate 1 to be tested is placed on the stage 100 and positioned such that one end of the metal wire 2 on the substrate 1 to be tested is positioned directly below the transmitting sensor 2111. When the transmitting end face 2113 of the transmitting sensor 2111 sends out a test signal, the metal line 2 closest to the transmitting sensor 2111 receives the test signal, and the receiving end face 2114 of the receiving sensor 2112 receives the scanning information formed by the metal line 2 closest to the receiving end face 2114 according to the test signal, so that the open-circuit short-circuit testing device 10 detects that the metal lines 2 are detected one by one; meanwhile, the receiving end face 2114 of the receiving sensor 2112 sends the received scanning information to the first controller 212, and when the metal wire 2 is not open-circuited or short-circuited, the scanning signal is the same as the preset waveform signal; when the metal wire 2 is open-circuited, the scanning signal is 0; when the metal wire 2 is short-circuited, the signal value of the scanning signal is smaller than that of the preset waveform signal, so as to determine whether the metal wire 2 has a defect and a defect type, and the position of the defective metal wire 2 on the substrate 1 to be tested, which is found by scanning, is automatically generated and recorded in the first controller 212. The receiving sensor 2112 moves from one end to the other end of the first beam 125, receives a scanning signal formed by each metal line 2 based on the test signal, and thus completes the detection of one row of metal lines 2. And then adjusting the position of the first beam 125 to enable one end of the second row of metal wires 2 to be below the emission end face 2113 of the sending sensor 2111, and then continuing the test, and thus circularly completing the test of the whole substrate 1 to be tested.
After the preliminary positioning unit 210 finishes positioning, it is necessary to determine bad specific coordinates through the precise positioning unit 220, and the second controller 221 is configured to receive open-circuit information and short-circuit information and generate a mobile control signal; the imaging sensor 222 is configured to move to the metal line 2 where the open circuit or the short circuit occurs under the control of the movement control signal, acquire a test image of the metal line 2 where the open circuit or the short circuit occurs, compare the test image with a standard image preset in the second controller 221, and generate open-circuit position information and short-circuit position information of the metal line 2 where the open circuit or the short circuit occurs according to a comparison result.
The cutting unit 300 cuts the short-circuit position of the metal wire 2 according to the short-circuit position information, so as to repair the short-circuited metal wire 2.
It should be understood that: the second controller 221 may transmit the open-circuit position information to an open-circuit repair apparatus that performs open-circuit repair on the metal line 2 for reference of the open-circuit repair.
As shown in fig. 8, when a short circuit occurs between two metal wires 2 due to the redundant portion 3, the cutting unit 300 cuts the redundant portion 3 in the cut region 301 to cut the redundant portion 3, and repairs the two metal wires 2 having the short circuit, thereby preventing the short circuit from occurring between the two metal wires 2.
It should be noted that: the cutting area 301 may be determined by the size of the cutting unit 300 and the number of times of cutting, and is not limited herein, as long as the two metal lines 2 are not short-circuited.
In a second aspect, the present application further provides an open-short circuit testing method, which is applied to the open-short circuit testing apparatus 10 described in any embodiment of the first aspect, and as shown in fig. 9, the open-short circuit testing method includes:
step S100, a substrate 1 to be tested is placed on a workbench 100, and the substrate 1 to be tested comprises a plurality of metal wires 2;
step S200, performing an open-circuit and short-circuit test on the metal wire 2 through the primary positioning unit 210, and generating open-circuit information and short-circuit information of the metal wire 2 when the metal wire 2 is open-circuit or short-circuit;
step S300, receiving the open circuit information and the short circuit information of the metal wire 2 through the accurate positioning unit 220, and generating the open circuit position information and the short circuit position information of the metal wire 2 according to the open circuit information and the short circuit information;
step S400, receiving the short-circuit position information, and cutting the short-circuit position of the metal line 2 through the cutting unit 300 according to the short-circuit position information, so as to repair the short-circuited metal line 2.
According to the embodiment of the application, after the open-circuit position information and the short-circuit position information of the metal wire 2 are generated, the short-circuit position of the metal wire 2 is cut through the cutting unit 300, so that the short-circuit metal wire 2 can be repaired, extra equipment for repairing the short-circuit metal wire 2 can be reduced, and the productivity is improved.
Further, in order to improve the reliability of the open-short circuit testing method, in some embodiments of the present application, the open-short circuit testing method further includes, after step S300:
and acquiring a rechecking image of the repaired metal wire 2, comparing the rechecking image with the standard image, and judging whether the metal wire 2 is cut completely according to a comparison result.
In summary, the open-circuit and short-circuit testing device 10 includes the cutting unit 300, and cuts the short-circuited metal wire 2 to repair the short-circuited metal wire 2, so as to avoid repairing the short-circuited metal wire 2 by using special repairing equipment, shorten the production cycle of the substrate, and improve the productivity; meanwhile, by slidably connecting the precise positioning unit 220 and the cutting unit 300 to the second beam 126 and slidably connecting the preliminary positioning unit 210 to the first beam 125, the positioning efficiency is improved and the cutting efficiency is improved; further, the reliability of the open-circuit short-circuit testing device 10 is further improved by setting the rechecking image obtained after the short-circuit metal wire 2 is cut.
The open-circuit and short-circuit testing device and method provided by the present application are described in detail above. It should be understood that the exemplary embodiments described herein should be considered merely descriptive to assist in understanding the core concepts of the present application and not limiting the present application. Descriptions of features or aspects in each exemplary embodiment should generally be considered as applicable to similar features or aspects in other exemplary embodiments. While the present application has been described with reference to exemplary embodiments, various changes and modifications may be suggested to one skilled in the art. The present application is intended to cover such changes and modifications as fall within the spirit and scope of the appended claims, and any changes, equivalents, and improvements made therein as fall within the true spirit and scope of the present application are intended to be covered thereby.
Claims (10)
1. An open circuit short circuit test device, comprising:
the test device comprises a workbench, a test device and a test system, wherein the workbench is used for placing a substrate to be tested, and the substrate to be tested comprises a plurality of metal wires;
the preliminary positioning unit is connected with the workbench in a sliding manner and is used for carrying out open-circuit and short-circuit tests on the metal wires in the plurality of metal wires and generating open-circuit information and short-circuit information of the metal wires when the metal wires are open-circuit or short-circuit;
the accurate positioning unit is connected with the workbench in a sliding manner and is used for receiving the open circuit information and the short circuit information of the metal wire and generating the open circuit position information and the short circuit position information of the metal wire according to the open circuit information and the short circuit information;
and the cutting unit is connected with the workbench in a sliding manner and is used for receiving the short circuit position information and cutting the short circuit position of the metal wire according to the short circuit position information so as to repair the short-circuited metal wire.
2. The open-circuit short-circuit testing device according to claim 1, wherein the cutting unit comprises a cutting mechanism and an industrial control device, the industrial control device is configured to receive short-circuit position information, generate a cutting instruction according to the short-circuit position information, and instruct the cutting mechanism to cut the short-circuit position of the metal wire.
3. The open-circuit short-circuit testing device according to claim 2, wherein the cutting mechanism comprises a fixing member and a laser cutting head, one end of the fixing member is slidably connected to the worktable, the other end of the fixing member is fixedly connected to the laser cutting head, and the laser cutting head is used for generating a laser beam to cut at the short-circuit position.
4. The open-circuit short-circuit testing device according to claim 1, wherein the worktable comprises a placing part and an installation part, the placing part is used for placing the substrate to be tested, the installation part comprises at least one guide rail and at least one cross beam slidably connected with the at least one guide rail, the at least one guide rail is fixedly connected with the placing part, and the preliminary positioning unit, the precise positioning unit and the cutting unit are slidably connected with the at least one cross beam.
5. The open-circuit short-circuit testing device according to claim 4, wherein the mounting portion comprises a first rail, a second rail, a first beam and a second beam, the first beam comprises a first beam body, and a first connecting portion and a second connecting portion fixedly connected to two ends of the first beam body, the first connecting portion is slidably connected to the first rail, the second connecting portion is slidably connected to the second rail, and the first beam body is located above the placing portion; the second beam comprises a second beam body, a third connecting part and a fourth connecting part, wherein the third connecting part and the fourth connecting part are fixedly connected to two ends of the second beam body;
preliminary positioning element sliding connection in the first roof beam body, accurate positioning element with cutting unit sliding connection in the second roof beam body.
6. The open-circuit short-circuit testing device according to claim 5, wherein the preliminary positioning unit comprises at least one set of testing sensors and a first controller, each set of testing sensors comprises a transmitting sensor and a receiving sensor, the transmitting sensor is used for transmitting a testing signal, and the receiving sensor is used for receiving a scanning signal formed by the testing signal on the metal wire;
the first controller is used for receiving the scanning signal, comparing the scanning signal with a preset waveform signal, determining whether the metal wire is open-circuited or short-circuited according to a comparison result, and if so, generating open-circuit information or short-circuit information of the metal wire.
7. The open-short testing device according to claim 5, wherein the fine positioning unit comprises a second controller and an imaging sensor, the second controller is configured to receive the open-circuit information and the short-circuit information and generate a movement control signal; the imaging sensor is used for moving to the metal wire with the open circuit or the short circuit under the control of the movement control signal and acquiring a test image of the metal wire with the open circuit or the short circuit;
the second controller is further configured to receive the test image, compare the test image with a standard image preset in the second controller, and generate open-circuit position information and short-circuit position information of the metal line with an open circuit or a short circuit according to a comparison result.
8. The open-circuit short-circuit testing device according to claim 7, wherein the precise positioning unit further comprises a telescopic part, one end of the telescopic part is slidably connected with the second beam, the other end of the telescopic part is fixedly connected with the imaging sensor, and the telescopic part can be extended or shortened along a direction perpendicular to the substrate to be tested; the second controller is further used for adjusting the distance between the imaging sensor and the substrate to be tested so as to ensure the definition of the test image.
9. The open-circuit short-circuit testing device according to claim 7, wherein the second controller is further configured to, after the cutting unit cuts the short-circuit position of the metal wire, control the imaging sensor to move to the short-circuit position of the metal wire according to the short-circuit position information to obtain a rechecking image of the metal wire, compare the rechecking image with the standard image, and determine whether the metal wire is cut according to the comparison result.
10. An open-short circuit test method, characterized in that the open-short circuit test method comprises:
placing a substrate to be tested on a workbench, wherein the substrate to be tested comprises a plurality of metal wires;
performing an open-circuit short-circuit test on the metal wire through a primary positioning unit, and generating open-circuit information and short-circuit information of the metal wire when the metal wire is open-circuited or short-circuited;
receiving open circuit information and short circuit information of the metal wire through a precise positioning unit, and generating open circuit position information and short circuit position information of the metal wire according to the open circuit information and the short circuit information;
and receiving the short circuit position information, and cutting the short circuit position of the metal wire through a cutting unit according to the short circuit position information so as to repair the short-circuited metal wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110452566.8A CN113203960A (en) | 2021-04-26 | 2021-04-26 | Open-circuit and short-circuit testing device and method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110452566.8A CN113203960A (en) | 2021-04-26 | 2021-04-26 | Open-circuit and short-circuit testing device and method |
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| CN113203960A true CN113203960A (en) | 2021-08-03 |
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| CN202110452566.8A Pending CN113203960A (en) | 2021-04-26 | 2021-04-26 | Open-circuit and short-circuit testing device and method |
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Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005230885A (en) * | 2004-02-20 | 2005-09-02 | Bridgestone Corp | Sheet metal processing method |
| CN1768999A (en) * | 2004-11-05 | 2006-05-10 | Lg.菲利浦Lcd株式会社 | Apparatus for cutting substrate and method using the same |
| CN1895831A (en) * | 2005-11-09 | 2007-01-17 | 中国科学院长春光学精密机械与物理研究所 | Laser cutter for liquid-crystal screen short-circuit loop |
| CN1952751A (en) * | 2005-12-29 | 2007-04-25 | 塔工程有限公司 | Device for cutting substrate |
| TW200722218A (en) * | 2005-12-05 | 2007-06-16 | Foxsemicon Integrated Tech Inc | Laser cutting apparatus |
| CN101017256A (en) * | 2006-02-06 | 2007-08-15 | 激光先进技术股份公司 | Repair device and repair method |
| CN102626829A (en) * | 2011-08-16 | 2012-08-08 | 北京京东方光电科技有限公司 | Laser repairing device and laser repairing method for substrate |
| CN202712130U (en) * | 2012-07-26 | 2013-01-30 | 北京京东方光电科技有限公司 | Open-short (OS) circuit testing apparatus |
| CN103713409A (en) * | 2013-12-27 | 2014-04-09 | 合肥京东方光电科技有限公司 | Liquid crystal display panel cutting device and method |
| CN104923924A (en) * | 2015-06-05 | 2015-09-23 | 江苏塞维斯数控科技有限公司 | Dedusting laser cutting machine |
| CN106475690A (en) * | 2016-10-31 | 2017-03-08 | 东莞市北扬工业设计有限公司 | A kind of pinpoint circuit board cuts clamping device |
| CN206764142U (en) * | 2017-04-01 | 2017-12-19 | 江西众城环保设备有限公司 | A kind of laser cutting machine |
-
2021
- 2021-04-26 CN CN202110452566.8A patent/CN113203960A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005230885A (en) * | 2004-02-20 | 2005-09-02 | Bridgestone Corp | Sheet metal processing method |
| CN1768999A (en) * | 2004-11-05 | 2006-05-10 | Lg.菲利浦Lcd株式会社 | Apparatus for cutting substrate and method using the same |
| CN1895831A (en) * | 2005-11-09 | 2007-01-17 | 中国科学院长春光学精密机械与物理研究所 | Laser cutter for liquid-crystal screen short-circuit loop |
| TW200722218A (en) * | 2005-12-05 | 2007-06-16 | Foxsemicon Integrated Tech Inc | Laser cutting apparatus |
| CN1952751A (en) * | 2005-12-29 | 2007-04-25 | 塔工程有限公司 | Device for cutting substrate |
| CN101017256A (en) * | 2006-02-06 | 2007-08-15 | 激光先进技术股份公司 | Repair device and repair method |
| CN102626829A (en) * | 2011-08-16 | 2012-08-08 | 北京京东方光电科技有限公司 | Laser repairing device and laser repairing method for substrate |
| CN202712130U (en) * | 2012-07-26 | 2013-01-30 | 北京京东方光电科技有限公司 | Open-short (OS) circuit testing apparatus |
| CN103713409A (en) * | 2013-12-27 | 2014-04-09 | 合肥京东方光电科技有限公司 | Liquid crystal display panel cutting device and method |
| CN104923924A (en) * | 2015-06-05 | 2015-09-23 | 江苏塞维斯数控科技有限公司 | Dedusting laser cutting machine |
| CN106475690A (en) * | 2016-10-31 | 2017-03-08 | 东莞市北扬工业设计有限公司 | A kind of pinpoint circuit board cuts clamping device |
| CN206764142U (en) * | 2017-04-01 | 2017-12-19 | 江西众城环保设备有限公司 | A kind of laser cutting machine |
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