JPH0682801A - Defect inspecting and correcting device - Google Patents

Abstract

PURPOSE:To precisely find the position of a defect and automatically correct it, and to inspect even a pattern lead-out line part by providing a laser light detecting means which emits laser light and inspects the defect with its reflected light. CONSTITUTION:A prober 9 is lowered by a Z-axis table 4 and contacts the top of a body to be inspected. At the same time, a laser for autofocusing and inspection emits the laser light and inter-line inspection is performed while the body to be inspected being moved by an XY table 3. After the inspection, the object is moved to an inter-line inspection start position by the XY table 3 and the semiconductor laser 10 for autofocusing and inspection emits the laser light, so that autofocusing and laser inspection are started. Based on the inspection result, the position of the defect is detected with high precision by using image data inputted from a CCD camera 8 to an image processing board. Then the body is moved to a repairing position and a YAG laser 7 for repair emits laser light to correct the defect.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a defect inspection / correction apparatus, and more particularly to an IT formed on a glass substrate for a liquid crystal panel.
The present invention relates to a defect inspection / correction apparatus for inspecting and correcting O (STN simple matrix pattern) defects.

[0002]

2. Description of the Related Art Recently, a liquid crystal display panel has been widely used in various electronic devices. Moreover, the amount of information displayed on the liquid crystal panel is increasing, and a liquid crystal display panel with high display density is required. In order to increase the display density, it is necessary to make the wiring pattern of the liquid crystal display thin and, at the same time, narrow the gap between adjacent patterns. However, if the pattern density is increased, adjacent patterns may be electrically connected to each other due to insufficient etching in the pattern etching process. A defect inspection apparatus is used to detect the position of such a defect, particularly a defect position of a simple matrix pattern.

FIG. 5 is a diagram showing an example of a wiring pattern of a liquid crystal display. In FIG. 5, the wiring pattern includes a pattern straight line portion 22 and a pattern lead line portion 2 on a glass substrate 21.
3 is formed, and when inspecting such a wiring pattern, an interline inspection for inspecting whether adjacent patterns are electrically connected to each other and a pattern electrically connected A line-to-line inspection is performed to inspect at which position between them the connection (short-circuit) has occurred. The inter-line inspection uses a tracer inspection by the prober method, and the in-line inspection uses a resistance measurement method by the prober method. However, as shown in FIG.
When a defect that lines are connected to each other is found due to insufficient etching, the conventional defect inspection device does not have a function to repair (repair) this, and moreover, the defect position in the defect position inspection in the line It had the drawback of poor detection accuracy. Furthermore, the pattern lead-out line portion 2
There is also a drawback that the inspection of 3 cannot be performed.

Therefore, a main object of the present invention is to provide a defect inspection / correction apparatus capable of accurately finding a defect position, automatically correcting the defect, and further inspecting the pattern lead-out line portion. is there.

[0005]

SUMMARY OF THE INVENTION The present invention is a defect inspection / correction apparatus for inspecting and correcting defects in an object to be inspected,
Trace tracing means for inspecting a defect by tracing the inspection object, laser light detecting means for irradiating the inspection object with a laser beam and inspecting the defect by the reflected light, and capturing an image of the inspection object Then, an image processing means for performing image processing inspection (movement for centering the defect to the irradiation position of the repairing YAG laser in order to repair the defect) and its defect position in response to the inspection of the defect. A defect correcting means for irradiating and repairing the laser beam with a laser beam, and a transportation means for transporting the inspection object to the inspection position.

More preferably, the laser beam detecting means includes an autofocus means for automatically focusing on the inspection position of the object to be inspected. Furthermore, more preferably, a table capable of moving the inspection object on the XY plane, and a chuck table for positioning and fixing the inspection object on the table.
A Z-axis table fixed in the XY directions and movable in the Z-direction is provided, and the defect correcting means includes a laser light source attached to the Z-axis table and irradiating the defect position with laser light. The means includes a microscope optical system for capturing an image of the inspection object and a CCD camera for capturing the image captured by the microscope optical system.

[0007]

The defect inspection / correction apparatus according to the present invention inspects a defect by tracing the object to be inspected, irradiates laser light, inspects the defect by the reflected light, and picks up an image of the object to be inspected. By doing so, not only can the defect position be inspected more accurately, but the defect position can be easily corrected by irradiating the inspected defect position with laser light.
Even in the pattern lead line portion, the defect can be easily inspected.

[0008]

1 is a diagram showing the structure of an embodiment of the present invention. Referring to FIG. 1, gantry 1 supports the main body and houses a control board and the like. Base 2 on stand 1
Is provided, and the base 2 serves as a base for fixing the XY table 3. The XY table 3 moves the inspection object in the XY directions. The Z-axis table 4 is fixed in the XY directions, is configured to be movable in the Z-axis direction, and is provided with an autofocus & inspection semiconductor laser and a light receiving unit. By moving in the Z-axis direction, during laser inspection, Focusing at the time of image processing inspection, focus position adjustment of laser light at the time of correcting a defective portion, and prober needle pressure adjustment at the time of prober inspection are performed. Inspection stage 5 is XY
It is mounted on the table 3 and adjusts the mounting position of the object to be inspected and chucks it.

Further, a microscope optical system 6 is provided on the Z-axis table 4, and the microscope optical system 6 is provided with epi-illumination, transmitted illumination,
Equipped with slit illumination, automatic slit mechanism, automatic laser power adjusting mechanism and electric revolver mechanism, the image of the inspection object is projected on the CCD camera 8 and the YAG laser light for defect correction is projected on the surface of the inspection object. On the object to be inspected, and then the autofocus & inspection light receiving unit 1
It works to collect light at 1. Further, a YAG laser for repair is attached to the Z-axis table 4 and emits YAG laser light for defect correction to an object to be inspected. The CCD camera 8 captures the image formed by the microscope optical system 6,
The image is captured on the image processing board (not shown) while being displayed on the monitor screen (not shown).

The prober 9 includes six position fine adjustment mechanisms and an inspection needle, and performs a prober type tracing inspection and a confirmation inspection after repair. The six position fine adjustment mechanisms are mounted on the air cylinder so that they can be moved up and down. Semiconductor laser for autofocus & inspection 1
0 emits a laser beam for autofocus & inspection. The autofocus / inspection light receiving unit 11 detects an autofocus signal and an inspection signal.

The loader / unloader hand 12 takes out the object to be inspected from the glass conveying device and carries it to the inspection repair device. The glass dropping mechanism 13 adjusts the position of the object to be inspected in the middle when the object to be inspected is moved from the glass cassette 15 to the inspection repair device and from the inspection repair device to the glass cassette 15. The cassette moving table 14 sequentially moves the glass cassettes in which the objects to be inspected are stored from the one after the inspection repair is completed. The glass cassette 15 stores the inspection object.

FIG. 2 is a flow chart for explaining the operation of an embodiment of the present invention, FIG. 3 is a detailed flow chart of the straight line defect position inspection shown in FIG. 2, and FIG. 4 is FIG. FIG. 6 is a detailed flowchart of the lead wire defect position inspection shown in FIG.

Next, the operation of the embodiment of the present invention will be described with reference to FIGS.

An object to be inspected is stored in a glass cassette and placed on the cassette moving table 14. Then, the object to be inspected is taken out from the glass cassette 15 by the loader / unloader hand 12, rotated by 180 °, and then adjusted in position by the glass dropping mechanism 13. The position-adjusted object to be inspected is placed on the inspection stage 5, repositioned on the inspection stage 5, and fixed by vacuum chucking. Fixed inspection object is X
The Y table 3 moves to the tracing system inspection start position by the prober 9, the prober 9 used for the inspection is selected, and the prober 9 descends by the air cylinder. Further, the prober 9 is lowered by the Z-axis table 4 and comes into contact with the object to be inspected. At this time, at the same time, laser light is emitted from the autofocus & inspection laser to perform autofocus. Then, the line-to-line inspection is performed while the object to be inspected is moved by the XY table 3.

After the inter-line inspection is completed, the process moves to the in-line inspection (inspection by the inspection laser beam and image processing) based on the inter-line inspection result. First, the inspection object is moved to the in-line inspection start position by the XY table 3. Laser light is emitted from the semiconductor laser 10 for autofocus and inspection, and autofocus and laser inspection are started. The inspected object is moved to the in-line inspection end position by the XY table 3. The inspection with the inspection laser beam is completed, and the inspection with the image processing is started next.

Semiconductor laser 1 for autofocus and inspection
Based on the inspection result by the laser light from 0, the inspected object is moved to the approximate defect position by the XY table 3.
The CCD camera 8 detects a defect with high accuracy from the image data captured on the image processing board. After the position detection, the defect position is moved to the repairing position by the XY table 3, laser light is emitted from the repairing YAG laser 7, and the defect is corrected. After the defect is repaired, in order to confirm whether or not the defect is normally repaired, the inspected object is moved to the prober inspection position by the XY table 3, the prober 9 is selected, and the probe is lowered by the air cylinder and the Z-axis table 4. The insulation resistance test is performed by the prober 9 coming into contact with the object to be inspected. Normal,
The insulation resistance test is performed after repairing all the defects at the defect detection points in the straight line portion of the line. This explanation is for the case where there is one defect in the straight line portion. As a result of this inspection, it is confirmed that the defect is normally corrected, and when there is no defect between the other lines, the XY table 3 moves the inspection object to the discharge position, The procedure is the reverse of the insertion of the above, and is returned to the original cassette position.

In the confirmation inspection (insulation resistance inspection) after the above defect correction, if it is further determined that the insulation resistance is defective, it is assumed that the pattern lead-out line portion 23 shown in FIG. The process moves to the inspection of the pattern lead wire portion 23.

The pattern lead-out line portion 23 is inspected on both left and right (or up and down) sides. First, the object to be inspected is moved to the left (or upper) side leader line inspection position by the XY table 3. Here, the inclination of the leader line is measured by image processing, laser light is emitted from the autofocus / inspection laser 10, and autofocus and laser inspection are started.

Based on the tilt measurement result of the object to be inspected,
The XY table 3 moves the object to be inspected to the end of the leader line. As a result, if a defect is detected by laser inspection, image processing inspection and repairing are performed as described above, and then confirmation inspection (insulation resistance inspection) is performed. As a result, if there is no insulation resistance defect, the object to be inspected is discharged to the original cassette position as described above. When no defect is detected, or when it is determined that the insulation resistance is defective in the confirmation inspection (insulation resistance inspection), the other pattern lead-out wire portion 23 is inspected. Here, the same inspection as that of the above-mentioned pattern lead-out line portion 23 is performed, and when it is finally determined that the defective portion is normally corrected, it is carried out to the original cassette position. However, if the insulation resistance is still judged to be defective even at this stage, the object to be inspected is judged to be incapable of defect inspection and is ejected to the original cassette position in that case. However, when discharging the inspection object, the data of the result as to whether the inspection object has been normally subjected to the inspection repair is filed and stored for each inspection object.

[0020]

As described above, according to the present invention, the defect is inspected by tracing the object to be inspected, the object to be inspected is irradiated with laser light, and the defect is inspected by the reflected light. Furthermore, image processing is performed to perform highly accurate defect position inspection and irradiate laser light to correct the defect location. For example, the defect inspection of the wiring pattern generated on the glass substrate for liquid crystal can be performed at high speed and with high accuracy. It becomes possible to perform with accuracy. In addition, it is possible to inspect the leader line portion, which has been impossible in the past. As a result, all the defect inspection repairs including the lead-out lines of the liquid crystal simple matrix ITO pattern, which have been impossible in the past, can be automatically performed in a short time.

[Brief description of drawings]

FIG. 1 is a diagram showing a configuration of an embodiment of the present invention.

FIG. 2 is a flow chart for explaining a specific operation of the embodiment of the present invention.

FIG. 3 is a specific flow chart of the linear line defect position inspection shown in FIG.

4 is a specific flow chart of the defect line defect position inspection shown in FIG.

FIG. 5 is a diagram showing an example of an ITO pattern which is the background of the present invention and to which the present invention is applied.

[Explanation of symbols]

 1 Stand 2 Base 3 XY Table 4 Z-axis Table 5 Inspection Stage 6 Microscope Optical System 7 Repair YAG Laser 8 CCD Camera 9 Prober 10 Auto Focus & Inspection Semiconductor Laser 11 Auto Focus & Inspection Light Receiver 12 Loader / Unloader Hand 13 Glass drop mechanism 14 Cassette moving table 15 Glass cassette 21 Glass substrate 22 Pattern straight line portion 23 Pattern lead wire portion

─────────────────────────────────────────────────── ───

[Procedure amendment]

[Submission date] April 7, 1993

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be corrected] 0003

[Correction method] Change

[Correction content]

FIG. 5 is a diagram showing an example of a wiring pattern of a liquid crystal display. In FIG. 5, the wiring pattern includes a pattern straight line portion 22 and a pattern lead line portion 2 on a glass substrate 21.
3 is formed, and when such a wiring pattern is inspected, it is electrically connected with an inter-line inspection for inspecting whether adjacent patterns are electrically connected or not. in-line inspection for inspecting whether or not the connection at any position between the patterns (short) has occurred is performed. The inter-line inspection uses a tracer inspection by the prober method, and the in-line inspection uses a resistance measurement method by the prober method. However, as shown in FIG.
When a defect that lines are connected to each other due to insufficient etching is found, the conventional defect inspection device does not have a function to repair (repair) the defect and the defect position in the defect position inspection in the line It had the drawback of poor detection accuracy. Furthermore, the pattern lead-out line portion 2
There is also a drawback that the inspection of 3 cannot be performed.

[Procedure Amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0008

[Correction method] Change

[Correction content]

[0008]

1 is a diagram showing the structure of an embodiment of the present invention. Referring to FIG. 1, gantry 1 supports the main body and houses a control board and the like. Base 2 on stand 1
Is provided, and the base 2 serves as a base for fixing the XY table 3. The XY table 3 moves the inspection object in the XY directions. The Z-axis table 4 is fixed in the XY directions, is configured to be movable in the Z-axis direction, and is provided with an autofocus & inspection semiconductor laser and a light receiving section. By moving in the Z-axis direction, laser inspection is possible .
Focusing at the time of image processing inspection, focus position adjustment of laser light at the time of correcting a defective portion, and prober needle pressure adjustment at the time of prober inspection are performed. The inspection stage 5 is mounted on the XY table 3, and adjusts the mounting position of the inspection object and chucks it.

[Procedure 3]

[Document name to be corrected] Drawing

[Name of item to be corrected] Figure 1

[Correction method] Change

[Correction content]

[Figure 1]

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification number Office reference number FI technical display location G02F 1/13 101 9315-2K H04N 7/18 B // H01L 21/66 J 7377-4M 21 / 3205

Claims (3)

[Claims] 1. A defect inspection / correction apparatus for inspecting and correcting a defect of an object to be inspected, wherein a trace inspection means for inspecting a defect by tracing the object to be inspected, a laser beam for the object to be inspected Laser beam detection means for irradiating the image with the reflected light, an image processing means for picking up an image of the object to be inspected, and image processing the imaged output, and the laser light inspection means for inspecting the defect. Accordingly, the defect inspection / correction apparatus is provided with defect correction means for irradiating the defect position with laser light to correct the defect position, and conveyance means for conveying the object to be inspected to the inspection position. 2. The defect inspection / correction apparatus according to claim 1, wherein the laser light detection means also serves as an autofocus means for automatically focusing on an inspection position of the inspection object. 3. A table capable of moving the object to be inspected in the XY plane, a chuck table for positioning and fixing the object to be inspected on the table, and a table fixed in the XY direction and in the Z direction. A movable Z-axis table, wherein the defect correction means is attached to the Z-axis table,
The image processing unit includes a laser light source for irradiating the laser beam to a defect position, and the image processing unit captures an image captured by the microscope optical system and a microscope optical system for capturing an image of the inspection object. The defect inspection / correction apparatus according to claim 1, further comprising a CCD camera.