JP2648883B2 - Laser processing equipment - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing apparatus, for example, a laser processing apparatus for inspecting a defect of a liquid crystal display panel.

[Related Art] Recently, liquid crystal display panels have been frequently used in various electronic devices. Moreover, the amount of information displayed on the liquid crystal display panel is increasing, and a liquid crystal display panel with a high display density is required. In order to increase the display density, it is necessary to make the wiring pattern between the liquid crystal display and the terminal thinner, and to make the interval between adjacent patterns narrower.

However, when the pattern density is increased, adjacent patterns may be electrically connected to each other due to insufficient etching in the pattern etching process.
A liquid crystal repair device is used to detect such a defect and make it a good product. In the conventional liquid crystal repair device, a liquid crystal display panel to be inspected was arranged on a stage, a head movable in X, Y, Z directions was provided thereon, and a CCD camera and a laser light source were arranged on this head. Things. Then, while capturing the wiring pattern with a CCD camera and monitoring it with a monitor TV, a portion where adjacent patterns are connected to each other is found, and the portion is irradiated with laser light emitted from a laser light source. Burn off the pieces.

[Problems to be Solved by the Invention] However, the liquid crystal repair device described above has a disadvantage that the holding rigidity is weak because the head in which the CCD camera and the laser light source are arranged can be moved in the X, Y, and Z directions. is there.

Therefore, a main object of the present invention is to provide a stable laser processing apparatus in which the optical axis of a laser light source is fixed to increase the holding rigidity and is stable.

Means for Solving the Problems The present invention relates to a laser processing apparatus having a function of detecting a defect position of a workpiece, an XY table capable of moving the workpiece to an XY plane, and a Y coordinate of the XY table. Y coordinate output means for outputting the position, the optical axis is fixed in the XY direction,
A laser light source that irradiates laser light for removing defects on the work piece on the table, and fixed on the X axis of the XY coordinates, inspects the work piece for defects on the XY table, A linear image sensor for detecting the X coordinate of the defect,
A drive means for moving the XY table in the Y direction each time the presence or absence of a defect on the X coordinate is detected by the linear image sensor;
Based on the X coordinate of the defect detected by the linear image sensor and the Y coordinate output from the Y coordinate output means at the time of the detection,
Specifying means for specifying a defect position on the workpiece.

[Operation] A laser processing apparatus according to the present invention enables a XY table on which a workpiece is placed to be movable in an XY plane, and irradiates a laser beam for irradiating a laser beam for removing a defect of the workpiece. Since the axis is fixed in the XY direction, the holding rigidity of the laser light source can be increased and stabilized.Furthermore, the defect of the workpiece is inspected by the linear image sensor, and the X coordinate of the defect is quickly detected. Since the defect position is determined by the determining means according to the X coordinate of the detected defect and the Y coordinate of the XY table at the time of the detection, the defect position on the workpiece can be easily determined.

Embodiment FIG. 1 is an external perspective view of an embodiment of the present invention, and FIG. 2 is a front view of the embodiment.

With reference to FIG. 1 and FIG. 2, an XY stage 3 that can move in the X and Y directions is arranged on a base 2 of a housing 1. A liquid crystal panel as a workpiece is placed on the XY stage 3. In order to inspect a work placed on the XY stage 3, a Z-axis table 4 is provided which is prohibited from moving in the XY direction and is movable only in the Z direction (up and down directions). The Z-axis table 4 is provided with an electric revolver 5, a microscope illumination light source 6, a CCD camera 7, a defect inspection device 8, and a laser head 9. The motorized revolver 5 switches between lenses having different magnifications, and a light source 6 for illuminating a microscope.
Illuminates the workpiece. CCD camera 7 is an electric revolver 5
The surface of the workpiece is imaged via the lens. The defect inspection device 8 is to inspect the surface of the workpiece for defects.
It is composed of a linear image sensor. The laser head 9 irradiates the surface of the workpiece with laser light to perform processing for removing defects. As shown in FIG. 2, a light source 10 for transmitting and illuminating the workpiece is provided below the XY stage 3. FIG. 3 is a schematic block diagram of one embodiment of the present invention. Next, an electrical configuration of an embodiment of the present invention will be described with reference to FIG. The CPU 21 performs overall control according to a program stored in a built-in memory. That is, CPU 21 is X
A command signal for moving the Y stage 3 in the X direction is given by I
It is given to the X pulse controller 23 via / O22. The X pulse controller 23 generates an X pulse according to the command signal. This X pulse is given to the X motor driver 24. The X motor driver 24 outputs X pulses for the given number of pulses.
The motor 25 is rotated. X motor 25 moves XY table 3
Move in the direction. The rotation speed of X motor 25 is X encoder
Detected by 26. The X encoder 26 generates a pulse signal corresponding to the rotation of the X motor 25 and supplies it to the X counter 27. The X counter 27 counts the pulse signal, and the count output is supplied to the CPU 21 via the X counter circuit 28 and the I / O 22.

Similarly, the CPU 21 gives a command signal for moving the XY stage 3 in the Y direction to the Y pulse controller 30 via the I / O 29. The Y pulse controller 30 generates a Y pulse in response to the command signal and supplies the Y pulse to the Y motor driver 31. Y motor driver 31 has Y motors 32 for the number of Y pulses.
To rotate. The Y motor 32 is provided to move the XY stage 3 in the Y direction. The rotation speed of the Y motor 32 is detected by a Y encoder 33, and a pulse signal corresponding to the rotation speed is supplied to a Y counter. The Y counter 34 counts the pulse signals, and supplies the count output to the CPU 21 via the Y counter circuit 35 and the I / O 29. The CPU 21 determines the positions of the XY stage 3 in the X and Y directions based on the count outputs of the X counter circuit 28 and the Y counter circuit 35.

The linear image sensor 8 as the defect inspection device 8 outputs as defect pixel information of the workpiece and supplies it to the image processing circuit 36. The image processing circuit 36 performs image processing on the output of the defect inspection device 8, and supplies defective pixel information to the CPU 21 via the I / O 37.
The CPU 21 calculates the defective pixel information and the count output of the Y counter circuit 35, calculates the defect position information, and stores it in the storage device 38. The defect position information is also displayed on the monitor 40.

FIG. 4 is a flowchart for explaining a specific operation of one embodiment of the present invention, and FIG. 5 is a diagram for explaining a method of inspecting a defect according to one embodiment of the present invention.

Next, a specific operation of one embodiment of the present invention will be described with reference to FIGS. In step SP1 in FIG. 4 (abbreviated as SP in the drawing), C
The PU 21 outputs a command signal for moving the XY stage 3 in the X direction and the Y direction, and moves the workpiece to the measurement start position. At this time, the defect inspection device 8 reads an image on the surface of the workpiece. This image signal is subjected to image processing by the image processing circuit 36, and is provided to the CPU 21 via the I / O 37. In step SP2, the CPU 21 reads image data for one line in the X direction on the workpiece 11 as shown in FIG.

In step SP3, the CPU 21 determines whether or not there is a defective portion in one line based on the read image data. If there is no defect, in step SP6, the CPU 21 outputs a command signal for moving the workpiece by one line. If the CPU 21 determines that there is a defective portion in one line, in step SP4, it stores the pixel position of the defective portion on the linear image sensor. That is, as shown in FIG. 5 (b), when the defect inspection device 8 detects the defect 12 on the workpiece 11, the pixel 81 at the position corresponding to that position changes. The CPU 21 recognizes the X coordinate of the defect position from the position of the pixel 81.

Further, in step SP5, the CPU 21 determines the current position of the XY stage 3 based on the count output of the Y counter circuit 35, and stores this. Then, the CPU 21 proceeds to step SP6
Outputs a command signal to move the workpiece by one line in the Y direction. In step SP7, the CPU 21
Determines whether or not the XY stage 3 has been moved to the measurement end position.
Returning to SP2, the operation of steps SP2 to SP7 is repeated. This operation is repeated, and when it is determined that the pixel has moved to the measurement end position, the defect position coordinates are determined based on the pixel position of the defect point on the sensor in the X direction and the position of the XY stage 3 in the Y direction stored in step SP8. Is calculated, stored in the storage device 38, and displayed on the monitor 40. By irradiating a laser beam to the workpiece by the laser head 9 while watching this display, it is possible to remove unnecessary defect patterns of the liquid crystal display, for example.

As described above, according to this embodiment, the Z-axis table 4 provided with the CCD camera 8, the laser head 9, and the like is moved only in the Z direction, and the XY table 3 on which the workpiece is placed is moved in the X and Y directions. , The workpiece is inspected for defects, so that the rigidity of holding the Z-axis table 4 can be increased. Moreover, by moving the XY stage 3 and scanning the workpiece with a defect inspection device including a linear image sensor to detect the pixel at the defect position,
The CPU 21 can digitally detect and store a defect position on the workpiece.

[Effects of the Invention] As described above, according to the present invention, the XY table for mounting the workpiece is moved in the Y direction, and the workpiece is scanned by the linear image sensor that scans one line at a time in the X direction. The X coordinate of the above defect is quickly detected, and the
The defect position is determined by the determining means according to the Y coordinate of the XY table and the X coordinate of the defect on the workpiece detected by the linear image sensor, so that the defect position of the workpiece can be easily and quickly determined. Not only that, the optical axis of the laser light source is fixed in the XY direction, so that the holding rigidity of the laser light source can be increased and stabilized.

[Brief description of the drawings]

FIG. 1 is an external photograph of an embodiment of the present invention. Second
The figure is also a front view. FIG. 3 is a schematic block diagram of one embodiment of the present invention. FIG. 4 is a flowchart for explaining a specific operation of one embodiment of the present invention. Fifth
FIG. 1 is a diagram for explaining a defect inspection method according to one embodiment of the present invention. In the figure, 3 is an XY stage, 4 is a Z-axis table, 5 is an electric revolver, 6 is a light source for illuminating a microscope, 7 is a CCD camera, 8 is a defect inspection device, 9 is a laser head, 10 is a light source for transmitted illumination, 21 Is a CPU, 22 and 29 are I / O, 23 is an X pulse controller, 24 is an X motor driver, 25 is an X motor, and 26 is an X motor.
Encoder, 27 is X counter, 28 is X counter circuit, 30
Is a Y pulse controller, 31 is a Y motor driver, 32 is a Y motor, 33 is a Y encoder, 34 is a Y counter, 35 is Y
A counter circuit, 36 is an image processing circuit, and 38 is a storage device.

 ──────────────────────────────────────────────────続 き Continuation of front page (56) References JP-A-61-269992 (JP, A)

Claims (1)

(57) [Claims] 1. A laser processing apparatus having a function of detecting a defect position of a workpiece, an XY table capable of moving the workpiece to an XY plane, and a Y coordinate for outputting a Y coordinate position of the XY table. An output unit, a laser light source for irradiating a laser beam for removing a defect of a workpiece on the XY table, an optical axis fixed in the XY direction, and a laser light source arranged and fixed on the X axis of XY coordinates, A linear image sensor that inspects the defect of the workpiece on the X-coordinate of the defect on the workpiece, and detects the presence or absence of the defect on the X-coordinate by the linear image sensor. Driving means for moving the defect in the Y direction, and a defect position on the workpiece based on the X coordinate of the defect detected by the linear image sensor and the Y coordinate output from the Y coordinate output means at the time of the detection. Identify Laser processing apparatus provided with a specific means for performing the operation.